Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35280) > Seite 286 nach 588
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LPC845M301JBD64E | NXP USA Inc. |
 Description: IC MCU 32BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 132 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC844M201JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
auf Bestellung 5896 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC845M301JHI33Y | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32HVQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC844M201JHI48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 124 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC845M301JHI48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC844M201JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 250 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC845M301JBD48E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 2x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 5466 Stücke: Lieferzeit 10-14 Tag (e) |
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OM13097UL | NXP USA Inc. |
Description: LPCXPRESSO LPC84X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: LPC84x Platform: LPCXpresso™ |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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| QN9083CUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA Packaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I²C, SPI, UART, USART, USB Part Status: Active |
Produkt ist nicht verfügbar |
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QN9080-DK | NXP USA Inc. |
Description: QN9080-DK Packaging: Bulk For Use With/Related Products: QN908x Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5.x Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 286 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1021ATSN-PA | NXP USA Inc. |
Description: LS1021A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A7 Board Type: Evaluation Platform Utilized IC / Part: LS1021A Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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OL2385AHN/001A0Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48VFQFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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OM2385/SF001 | NXP USA Inc. |
Description: OL2385 SIGFOX DEV KIT W/ KL43Z Packaging: Bulk For Use With/Related Products: OL2385 Type: Transceiver Supplied Contents: Board(s), Cable(s) |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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OL2385AHN/00100Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 48HVQFN Packaging: Cut Tape (CT) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -124dBm Mounting Type: Surface Mount Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 5.5V Power - Output: 14dBm Current - Transmitting: 29mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 12 Modulation: ASK, FSK Serial Interfaces: SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 1739 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54606J256ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54606J512ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54616J512ET100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 136 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54628J512ET180E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 180TFBGA Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 220MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 4445 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54606J256BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54606J512BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 489 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54616J512BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 852 Stücke: Lieferzeit 10-14 Tag (e) |
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OM13098UL | NXP USA Inc. |
Description: LPCXPRESSO LPC54628 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC54628 Platform: LPCXpresso™ Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54618J512BD208E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDM33926PNBEVM | NXP USA Inc. |
Description: BOARD EVALUATION Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33926 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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S912ZVML32F2WKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP |
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S912ZVML12F2VKH | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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S912ZVMC64F2MKH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP |
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BF1108/L,215 | NXP USA Inc. |
Description: IC RF SWITCH Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Current Rating (Amps): 10mA Mounting Type: Surface Mount Configuration: N-Channel Technology: MOSFET Supplier Device Package: SOT-143B Part Status: Obsolete Voltage - Rated: 3 V |
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MC32PF3001A7EP | NXP USA Inc. |
Description: IC PWR MGMT I.MX7 6LDO QFN 48 Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.8V ~ 5.5V Applications: Processor Supplier Device Package: 48-HVQFN (7x7) Part Status: Active |
auf Bestellung 2835 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1021A-IOT-B | NXP USA Inc. |
Description: LS1021A EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A7 Utilized IC / Part: LS1021A Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-STBC-AGM04 | NXP USA Inc. |
Description: FRDM BOARD FORMMA8652/MAG311 Packaging: Box Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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BRKT-STBC-AGM04 | NXP USA Inc. |
Description: FRDM BOARD FORMMA8652/ MAG3110 Packaging: Box Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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DEVKIT-MPC5744P | NXP USA Inc. |
Description: MPC5744P EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Board Type: Evaluation Platform Utilized IC / Part: MPC5744P Part Status: Active |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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DEMOAX9S12XEP100 | NXP USA Inc. |
Description: MC9S12XEP100 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 16-Bit Contents: Board(s) Core Processor: HCS12X Utilized IC / Part: MC9S12XEP100 |
Produkt ist nicht verfügbar |
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A1006TL/TA1NXZ | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 6HXSON Packaging: Tape & Reel (TR) Package / Case: 6-XDFN Exposed Pad Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 6-HXSON (2x2) DigiKey Programmable: Not Verified |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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A2G22S251-01SR3 | NXP USA Inc. |
Description: RF MOSFET GAN 48V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.2GHz Power - Output: 52dBm Gain: 17.7dB Technology: GaN Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 200 mA |
Produkt ist nicht verfügbar |
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| A2G26H280-04SR3 | NXP USA Inc. | Description: AIRFAST RF POWER GAN TRANSISTOR |
Produkt ist nicht verfügbar |
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A2G26H281-04SR3 | NXP USA Inc. |
Description: RF MOSFET GAN 48V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz Power - Output: 50W Gain: 14.2dB Technology: GaN Supplier Device Package: NI-780S-4L Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 150 mA |
Produkt ist nicht verfügbar |
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A2G35S160-01SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 51dBm Gain: 15.7dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 190 mA |
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A2G35S200-01SR3 | NXP USA Inc. |
Description: RF MOSFET GAN HEMT 48V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 180W Gain: 16.1dB Technology: GaN HEMT Supplier Device Package: NI-400S-2S Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 291 mA |
Produkt ist nicht verfügbar |
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A2I09VD030NR1 | NXP USA Inc. |
Description: IC RF AMP TO270WB-15 |
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| A2I20H080GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
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| A2I20H080NR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
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A2I35H060GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
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| A2I35H060NR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
Produkt ist nicht verfügbar |
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| A2T08VD020NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz Power - Output: 18W Gain: 19.1dB Technology: LDMOS Supplier Device Package: 24-PQFN-EP (8x8) Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 40 mA |
Produkt ist nicht verfügbar |
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| A2T09D400-23NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 716MHz ~ 960MHz Power - Output: 400W Gain: 17.8dB Technology: LDMOS Supplier Device Package: OM-1230-4L2S Voltage - Rated: 70 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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| A2T14H450-23NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 31V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.452GHz ~ 1.511GHz Gain: 18.8dB Technology: LDMOS Supplier Device Package: OM-1230-4L2S Voltage - Rated: 65 V Voltage - Test: 31 V Current - Test: 1 A |
Produkt ist nicht verfügbar |
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| A2T18S165-12SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
Produkt ist nicht verfügbar |
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| A2T18S260-12SR3 | NXP USA Inc. |
Description: AIRFAST RF POWER LDMOS TRANSISTO |
Produkt ist nicht verfügbar |
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| A2T18S261W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 280W Gain: 18.2dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
Produkt ist nicht verfügbar |
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| A2T18S262W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 1.88GHz Power - Output: 231W Gain: 19.3dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.6 A |
Produkt ist nicht verfügbar |
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| A2T20H330W24NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM1230-42 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.88GHz ~ 2.025GHz Power - Output: 229W Gain: 15.9dB Technology: LDMOS Supplier Device Package: OM-1230-4L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 700 mA |
Produkt ist nicht verfügbar |
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| A2T21S260W12NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM880X-2L2L Packaging: Tape & Reel (TR) Package / Case: OM-880X-2L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.11GHz ~ 2.2GHz Power - Output: 218W Gain: 17.9dB Technology: LDMOS Supplier Device Package: OM-880X-2L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.6 A |
Produkt ist nicht verfügbar |
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 |
A2T27S007NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 16DFN Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Mounting Type: Surface Mount Frequency: 728MHz ~ 3.6GHz Power - Output: 28.8dBm Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Voltage - Rated: 28 V |
Produkt ist nicht verfügbar |
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| A2T27S020GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270BA Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 400MHz ~ 2.7GHz Power - Output: 20W Gain: 21dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 185 mA |
Produkt ist nicht verfügbar |
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| A2T27S020NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270-2 Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 400MHz ~ 2.7GHz Power - Output: 20W Gain: 21dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 185 mA |
Produkt ist nicht verfügbar |
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| A2V07H525-04NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM1230-4 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 595MHz ~ 851MHz Power - Output: 120W Gain: 17.5dB Technology: LDMOS Supplier Device Package: OM-1230-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 700 mA |
Produkt ist nicht verfügbar |
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| A2V09H300-04NR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM780G-4 Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 720MHz ~ 960MHz Power - Output: 53dBm Gain: 19.7dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 400 mA |
Produkt ist nicht verfügbar |
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| A2V09H525-04NR6 | NXP USA Inc. |
Description: RF MOSFET LDMOS 48V OM1230-4 Packaging: Tape & Reel (TR) Package / Case: OM-1230-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 720MHz ~ 960MHz Power - Output: 120W Gain: 18.9dB Technology: LDMOS Supplier Device Package: OM-1230-4L Part Status: Active Voltage - Rated: 105 V Voltage - Test: 48 V Current - Test: 688 mA |
Produkt ist nicht verfügbar |
| LPC845M301JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.07 EUR |
| 10+ | 4.75 EUR |
| LPC844M201JHI33Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
auf Bestellung 5896 Stücke:
Lieferzeit 10-14 Tag (e)| LPC845M301JHI33Y |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC844M201JHI48E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 124 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.71 EUR |
| 10+ | 2.9 EUR |
| 80+ | 2.38 EUR |
| LPC845M301JHI48E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC844M201JBD48E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.21 EUR |
| 10+ | 4.07 EUR |
| 80+ | 3.34 EUR |
| LPC845M301JBD48E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Capacitive Touch, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 5466 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.56 EUR |
| 10+ | 4.34 EUR |
| 80+ | 3.56 EUR |
| 500+ | 3.48 EUR |
| 1000+ | 2.94 EUR |
| 2500+ | 2.79 EUR |
| 5000+ | 2.69 EUR |
| OM13097UL |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Platform: LPCXpresso™
Description: LPCXPRESSO LPC84X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC84x
Platform: LPCXpresso™
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.58 EUR |
| QN9083CUKZ |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
Description: IC RF TXRX+MCU BLUETOOTH 47XFBGA
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I²C, SPI, UART, USART, USB
Part Status: Active
Produkt ist nicht verfügbar
| QN9080-DK |
|
Hersteller: NXP USA Inc.
Description: QN9080-DK
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
Description: QN9080-DK
Packaging: Bulk
For Use With/Related Products: QN908x
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 286 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 198.53 EUR |
| LS1021ATSN-PA |
|
Hersteller: NXP USA Inc.
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: LS1021A
Part Status: Active
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Board Type: Evaluation Platform
Utilized IC / Part: LS1021A
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1595.14 EUR |
| OL2385AHN/001A0Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| OM2385/SF001 |
|
Hersteller: NXP USA Inc.
Description: OL2385 SIGFOX DEV KIT W/ KL43Z
Packaging: Bulk
For Use With/Related Products: OL2385
Type: Transceiver
Supplied Contents: Board(s), Cable(s)
Description: OL2385 SIGFOX DEV KIT W/ KL43Z
Packaging: Bulk
For Use With/Related Products: OL2385
Type: Transceiver
Supplied Contents: Board(s), Cable(s)
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 172.66 EUR |
| OL2385AHN/00100Y |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -124dBm
Mounting Type: Surface Mount
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 5.5V
Power - Output: 14dBm
Current - Transmitting: 29mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 12
Modulation: ASK, FSK
Serial Interfaces: SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1739 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.87 EUR |
| 10+ | 8.82 EUR |
| 25+ | 7.94 EUR |
| 100+ | 7.23 EUR |
| 250+ | 6.53 EUR |
| 500+ | 5.86 EUR |
| 1000+ | 4.94 EUR |
| LPC54606J256ET100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54606J512ET100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54616J512ET100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 136 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.17 EUR |
| 10+ | 16.11 EUR |
| 80+ | 13.61 EUR |
| LPC54628J512ET180E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 220MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 4445 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.72 EUR |
| 10+ | 17.35 EUR |
| 189+ | 14.65 EUR |
| 567+ | 14.56 EUR |
| 945+ | 13.75 EUR |
| LPC54606J256BD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC54606J512BD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 489 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.84 EUR |
| 10+ | 17.16 EUR |
| 90+ | 14.21 EUR |
| LPC54616J512BD100E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 852 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.28 EUR |
| 10+ | 17.5 EUR |
| 90+ | 14.49 EUR |
| OM13098UL |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54628 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54628
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC54628 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54628
Platform: LPCXpresso™
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 136.52 EUR |
| LPC54618J512BD208E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.23 EUR |
| 10+ | 17.76 EUR |
| FRDM33926PNBEVM |
|
Hersteller: NXP USA Inc.
Description: BOARD EVALUATION
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926
Supplied Contents: Board(s)
Part Status: Active
Description: BOARD EVALUATION
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33926
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| S912ZVML32F2WKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
| S912ZVML12F2VKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
| S912ZVMC64F2MKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
| BF1108/L,215 |
|
Hersteller: NXP USA Inc.
Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 10mA
Mounting Type: Surface Mount
Configuration: N-Channel
Technology: MOSFET
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 3 V
Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Current Rating (Amps): 10mA
Mounting Type: Surface Mount
Configuration: N-Channel
Technology: MOSFET
Supplier Device Package: SOT-143B
Part Status: Obsolete
Voltage - Rated: 3 V
Produkt ist nicht verfügbar
| MC32PF3001A7EP |
|
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
auf Bestellung 2835 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.93 EUR |
| 10+ | 6.22 EUR |
| 25+ | 5.88 EUR |
| 80+ | 5.09 EUR |
| 260+ | 4.83 EUR |
| 520+ | 4.6 EUR |
| LS1021A-IOT-B |
|
Hersteller: NXP USA Inc.
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Part Status: Active
Description: LS1021A EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Part Status: Active
Produkt ist nicht verfügbar
| FRDM-STBC-AGM04 |
|
Hersteller: NXP USA Inc.
Description: FRDM BOARD FORMMA8652/MAG311
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM BOARD FORMMA8652/MAG311
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| BRKT-STBC-AGM04 |
|
Hersteller: NXP USA Inc.
Description: FRDM BOARD FORMMA8652/ MAG3110
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM BOARD FORMMA8652/ MAG3110
Packaging: Box
Sensor Type: Accelerometer, Gyroscope, Magnetometer, 3 Axis
Utilized IC / Part: FXAS21002C, MAG3110, MMA8652FC
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| DEVKIT-MPC5744P |
|
Hersteller: NXP USA Inc.
Description: MPC5744P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5744P
Part Status: Active
Description: MPC5744P EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5744P
Part Status: Active
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 187.53 EUR |
| DEMOAX9S12XEP100 |
|
Hersteller: NXP USA Inc.
Description: MC9S12XEP100 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Utilized IC / Part: MC9S12XEP100
Description: MC9S12XEP100 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 16-Bit
Contents: Board(s)
Core Processor: HCS12X
Utilized IC / Part: MC9S12XEP100
Produkt ist nicht verfügbar
| A1006TL/TA1NXZ |
Hersteller: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
Description: IC SECURE AUTHENTICATOR 6HXSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XDFN Exposed Pad
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 6-HXSON (2x2)
DigiKey Programmable: Not Verified
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 1.27 EUR |
| 8000+ | 1.26 EUR |
| 12000+ | 1.22 EUR |
| A2G22S251-01SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 52dBm
Gain: 17.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 200 mA
Description: RF MOSFET GAN 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
Power - Output: 52dBm
Gain: 17.7dB
Technology: GaN
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 200 mA
Produkt ist nicht verfügbar
| A2G26H280-04SR3 |
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Description: AIRFAST RF POWER GAN TRANSISTOR
Produkt ist nicht verfügbar
| A2G26H281-04SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 50W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Description: RF MOSFET GAN 48V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 50W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: NI-780S-4L
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
| A2G35S160-01SR3 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 51dBm
Gain: 15.7dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 190 mA
Produkt ist nicht verfügbar
| A2G35S200-01SR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
Description: RF MOSFET GAN HEMT 48V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 180W
Gain: 16.1dB
Technology: GaN HEMT
Supplier Device Package: NI-400S-2S
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 291 mA
Produkt ist nicht verfügbar
| A2I20H080GNR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
| A2I20H080NR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
| A2I35H060GNR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
| A2I35H060NR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
| A2T08VD020NT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Power - Output: 18W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: 24-PQFN-EP (8x8)
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 48V 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Power - Output: 18W
Gain: 19.1dB
Technology: LDMOS
Supplier Device Package: 24-PQFN-EP (8x8)
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
| A2T09D400-23NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 716MHz ~ 960MHz
Power - Output: 400W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 716MHz ~ 960MHz
Power - Output: 400W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| A2T14H450-23NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 31V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.452GHz ~ 1.511GHz
Gain: 18.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 31V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.452GHz ~ 1.511GHz
Gain: 18.8dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2S
Voltage - Rated: 65 V
Voltage - Test: 31 V
Current - Test: 1 A
Produkt ist nicht verfügbar
| A2T18S165-12SR3 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
| A2T18S260-12SR3 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
| A2T18S261W12NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 280W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
| A2T18S262W12NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 231W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Power - Output: 231W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
| A2T20H330W24NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.88GHz ~ 2.025GHz
Power - Output: 229W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 28V OM1230-42
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.88GHz ~ 2.025GHz
Power - Output: 229W
Gain: 15.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
| A2T21S260W12NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 218W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 28V OM880X-2L2L
Packaging: Tape & Reel (TR)
Package / Case: OM-880X-2L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 218W
Gain: 17.9dB
Technology: LDMOS
Supplier Device Package: OM-880X-2L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
| A2T27S007NT1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 28.8dBm
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 28 V
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 728MHz ~ 3.6GHz
Power - Output: 28.8dBm
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
| A2T27S020GNR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
Power - Output: 20W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 185 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270BA
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
Power - Output: 20W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 185 mA
Produkt ist nicht verfügbar
| A2T27S020NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
Power - Output: 20W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 185 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.7GHz
Power - Output: 20W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 185 mA
Produkt ist nicht verfügbar
| A2V07H525-04NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Power - Output: 120W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
Description: RF MOSFET LDMOS 48V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 595MHz ~ 851MHz
Power - Output: 120W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 700 mA
Produkt ist nicht verfügbar
| A2V09H300-04NR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Power - Output: 53dBm
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 400 mA
Description: RF MOSFET LDMOS 48V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Power - Output: 53dBm
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 400 mA
Produkt ist nicht verfügbar
| A2V09H525-04NR6 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 48V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Power - Output: 120W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
Description: RF MOSFET LDMOS 48V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 720MHz ~ 960MHz
Power - Output: 120W
Gain: 18.9dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Part Status: Active
Voltage - Rated: 105 V
Voltage - Test: 48 V
Current - Test: 688 mA
Produkt ist nicht verfügbar