Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35280) > Seite 285 nach 588
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| JN5179-001-T06Z | NXP USA Inc. |
 Description: DEMO OM15027+ OM15026 |
Produkt ist nicht verfügbar |
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| JN5179DB/01Z | NXP USA Inc. |
Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179KIT/03Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179MOD/02Z | NXP USA Inc. | Description: DEMO BOARD MCU WIRELESS |
Produkt ist nicht verfügbar |
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| JN5179-SMA-EVAL1Z | NXP USA Inc. | Description: DEMO OM15025 + OM15026 |
Produkt ist nicht verfügbar |
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| E1TDA19978/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA19978RX+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E1TDA19988AET/KIT, | NXP USA Inc. |
Description: KIT MB+DBTDA19988+TDA19978 Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E1TDA9984A/KIT,598 | NXP USA Inc. |
Description: EVALKIT TDA9984AHWC1HLD+19978N2T Packaging: Box Function: Video Processing Type: Video Utilized IC / Part: TDA19978 Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| E2TDA19998/BOARD,5 | NXP USA Inc. | Description: EVAL BOARD TDA19998 |
Produkt ist nicht verfügbar |
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| MC33663BSEF | NXP USA Inc. | Description: IC TRANSCEIVER HALF 2/2 14SOIC |
Produkt ist nicht verfügbar |
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MC33901SNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33901SNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33909D3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909D5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909L5ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N5AD | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909N5ADR2 | NXP USA Inc. |
Description: SBC SG 1 CAN 0 LIN HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q3AD | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q3ADR2 | NXP USA Inc. |
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q5AD | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33909Q5ADR2 | NXP USA Inc. |
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48 Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3.5V ~ 28V Applications: System Basis Chip Current - Supply: 7mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC34901WNEF | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC34901WNEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 8-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MFRC53101W/X3E,005 | NXP USA Inc. | Description: CL READER SYSTEMS UNCASED |
Produkt ist nicht verfügbar |
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| OM15031Z | NXP USA Inc. | Description: BOARD LIGHTING DVR SLN61 |
Produkt ist nicht verfügbar |
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| OM15035Z | NXP USA Inc. | Description: DEMO RASPBERRY PI MODEL |
Produkt ist nicht verfügbar |
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| OM15036Z | NXP USA Inc. | Description: DEMO DR1128 |
Produkt ist nicht verfügbar |
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| OM15039Z | NXP USA Inc. |
Description: DEMO BD CONNECTOR RPSMA Packaging: Box Supplied Contents: Board(s) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| OM15042Z | NXP USA Inc. | Description: DEMO SMART PLUG ZIGBEE NFC |
Produkt ist nicht verfügbar |
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| OM15050Z | NXP USA Inc. | Description: DEMO LARGE SIGNAL SSL8001DB1324 |
Produkt ist nicht verfügbar |
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| PC33663BJEFR2 | NXP USA Inc. | Description: DUAL LINCELL 14SOIC |
Produkt ist nicht verfügbar |
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| PC33663LEFR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED SO14 Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| PC33901WNEF | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 8SOIC |
Produkt ist nicht verfügbar |
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| PC33909AD | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tube |
Produkt ist nicht verfügbar |
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| PC33909ADR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| PC33909AE | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 64HLQFP |
Produkt ist nicht verfügbar |
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| PC33909AER2 | NXP USA Inc. | Description: IC INTERFACE SPECIALIZED 64HLQFP |
Produkt ist nicht verfügbar |
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| PC34909AD | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tube |
Produkt ist nicht verfügbar |
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| PC34909ADR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED HLQFP48 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| PREV601M/01M | NXP USA Inc. | Description: BOARD EV B READER FOR PRH601 |
Produkt ist nicht verfügbar |
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| SAF7741HV/N115YK | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7741HV/N115YY | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7741HV/N125YK | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tray Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| SAF7741HV/N125YY | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDA18274HN/C1,551 | NXP USA Inc. | Description: IC VIDEO TUNER 40HVQFN |
Produkt ist nicht verfügbar |
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MKE15Z128VLL7 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 28x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 6570 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3152DBUL | NXP USA Inc. |
Description: NHS3152 EVALUATION BOARD Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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NHS3152TEMOADKUL | NXP USA Inc. |
Description: NHS3152 STARTER KIT Packaging: Bulk For Use With/Related Products: NHS3152 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6V7DVN10AB | NXP USA Inc. |
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Supplier Device Package: 432-MAPBGA (13x13) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: EPDC, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6SLL-EVK | NXP USA Inc. |
Description: I.MX 6SLL EVAL BRD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-A9 Board Type: Evaluation Platform Utilized IC / Part: i.MX 6SLL Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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ACP-CYCLONE | NXP USA Inc. |
Description: CYCLONE ARM CORTEX PROGRAMMER Packaging: Bulk For Use With/Related Products: ARM® Cortex® Devices Type: Programmer (In-Circuit/In-System) Contents: Board(s), Cable(s), Power Supply, Accessories Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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OM23221ARD | NXP USA Inc. |
Description: EVAL BOARD FOR NT3H2111 NT3H2211 Packaging: Bulk For Use With/Related Products: NT3H2111, NT3H2211 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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LPC844M201JBD64E | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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| JN5179-001-T06Z |
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Hersteller: NXP USA Inc.
Description: DEMO OM15027+ OM15026
Description: DEMO OM15027+ OM15026
Produkt ist nicht verfügbar
| JN5179DB/01Z |
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Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179KIT/03Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179MOD/02Z |
Hersteller: NXP USA Inc.
Description: DEMO BOARD MCU WIRELESS
Description: DEMO BOARD MCU WIRELESS
Produkt ist nicht verfügbar
| JN5179-SMA-EVAL1Z |
Hersteller: NXP USA Inc.
Description: DEMO OM15025 + OM15026
Description: DEMO OM15025 + OM15026
Produkt ist nicht verfügbar
| E1TDA19978/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA19978RX+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E1TDA19988AET/KIT, |
Hersteller: NXP USA Inc.
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: KIT MB+DBTDA19988+TDA19978
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E1TDA9984A/KIT,598 |
Hersteller: NXP USA Inc.
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVALKIT TDA9984AHWC1HLD+19978N2T
Packaging: Box
Function: Video Processing
Type: Video
Utilized IC / Part: TDA19978
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| E2TDA19998/BOARD,5 |
Hersteller: NXP USA Inc.
Description: EVAL BOARD TDA19998
Description: EVAL BOARD TDA19998
Produkt ist nicht verfügbar
| MC33663BSEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Description: IC TRANSCEIVER HALF 2/2 14SOIC
Produkt ist nicht verfügbar
| MC33901SNEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC33901SNEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC33909D3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909D5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 2LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 1LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909L5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N5AD |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909N5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC SG 1 CAN 0 LIN HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q3AD |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q3ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q5AD |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33909Q5ADR2 |
Hersteller: NXP USA Inc.
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 5V 1CAN 4LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC34901WNEF |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC34901WNEFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MFRC53101W/X3E,005 |
Hersteller: NXP USA Inc.
Description: CL READER SYSTEMS UNCASED
Description: CL READER SYSTEMS UNCASED
Produkt ist nicht verfügbar
| OM15039Z |
Hersteller: NXP USA Inc.
Description: DEMO BD CONNECTOR RPSMA
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Description: DEMO BD CONNECTOR RPSMA
Packaging: Box
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
| OM15042Z |
Hersteller: NXP USA Inc.
Description: DEMO SMART PLUG ZIGBEE NFC
Description: DEMO SMART PLUG ZIGBEE NFC
Produkt ist nicht verfügbar
| OM15050Z |
Hersteller: NXP USA Inc.
Description: DEMO LARGE SIGNAL SSL8001DB1324
Description: DEMO LARGE SIGNAL SSL8001DB1324
Produkt ist nicht verfügbar
| PC33663LEFR2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED SO14
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED SO14
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| PC33901WNEF |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Description: IC INTERFACE SPECIALIZED 8SOIC
Produkt ist nicht verfügbar
| PC33909AD |
Produkt ist nicht verfügbar
| PC33909ADR2 |
Produkt ist nicht verfügbar
| PC33909AE |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64HLQFP
Description: IC INTERFACE SPECIALIZED 64HLQFP
Produkt ist nicht verfügbar
| PC33909AER2 |
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 64HLQFP
Description: IC INTERFACE SPECIALIZED 64HLQFP
Produkt ist nicht verfügbar
| PC34909AD |
Produkt ist nicht verfügbar
| PC34909ADR2 |
Produkt ist nicht verfügbar
| PREV601M/01M |
Hersteller: NXP USA Inc.
Description: BOARD EV B READER FOR PRH601
Description: BOARD EV B READER FOR PRH601
Produkt ist nicht verfügbar
| SAF7741HV/N115YK |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7741HV/N115YY |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7741HV/N125YK |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
| SAF7741HV/N125YY |
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
| TDA18274HN/C1,551 |
Hersteller: NXP USA Inc.
Description: IC VIDEO TUNER 40HVQFN
Description: IC VIDEO TUNER 40HVQFN
Produkt ist nicht verfügbar
| MKE15Z128VLL7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 28x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 6570 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.44 EUR |
| 10+ | 8.99 EUR |
| 90+ | 7.44 EUR |
| 990+ | 6.49 EUR |
| 2430+ | 6.25 EUR |
| NHS3152DBUL |
|
Hersteller: NXP USA Inc.
Description: NHS3152 EVALUATION BOARD
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3152 EVALUATION BOARD
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 100 EUR |
| NHS3152TEMOADKUL |
|
Hersteller: NXP USA Inc.
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NHS3152 STARTER KIT
Packaging: Bulk
For Use With/Related Products: NHS3152
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 230.21 EUR |
| MCIMX6V7DVN10AB |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Description: IC MPU I.MX6SLL 1GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 432-MAPBGA (13x13)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: EPDC, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.27 EUR |
| 10+ | 14.6 EUR |
| MCIMX6SLL-EVK |
|
Hersteller: NXP USA Inc.
Description: I.MX 6SLL EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SLL
Part Status: Active
Description: I.MX 6SLL EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-A9
Board Type: Evaluation Platform
Utilized IC / Part: i.MX 6SLL
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 377.98 EUR |
| ACP-CYCLONE |
|
Hersteller: NXP USA Inc.
Description: CYCLONE ARM CORTEX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM® Cortex® Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
Description: CYCLONE ARM CORTEX PROGRAMMER
Packaging: Bulk
For Use With/Related Products: ARM® Cortex® Devices
Type: Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply, Accessories
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1312.15 EUR |
| OM23221ARD |
|
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR NT3H2111 NT3H2211
Packaging: Bulk
For Use With/Related Products: NT3H2111, NT3H2211
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Description: EVAL BOARD FOR NT3H2111 NT3H2211
Packaging: Bulk
For Use With/Related Products: NT3H2111, NT3H2211
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| LPC844M201JBD64E |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.72 EUR |
| 10+ | 4.46 EUR |
| 160+ | 3.66 EUR |