Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35280) > Seite 287 nach 588
Foto | Bezeichnung | Hersteller | Beschreibung |
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A3T21H450W23SR6 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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A7003CGHN1/T1AGBEL | NXP USA Inc. | Description: AU10TICS |
Produkt ist nicht verfügbar |
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A7004CGHN1/T1AGBEL | NXP USA Inc. | Description: AU10TICS |
Produkt ist nicht verfügbar |
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A7004CIHN1/T1AGBAJ | NXP USA Inc. | Description: AU10TICS |
Produkt ist nicht verfügbar |
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A7004CMHN1/T1AGBEL | NXP USA Inc. | Description: AU10TICS |
Produkt ist nicht verfügbar |
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A7006CGHN1/T1AGBEL | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I²C RAM Size: 3.2kB Operating Temperature: -40°C ~ 90°C (TA) Voltage - Supply: 1.62V ~ 5.5V Controller Series: A700x Program Memory Type: EEPROM (76.4kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 32-HVQFN (5x5) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ADK-IAS-LICENSE | NXP USA Inc. | Description: ADK-INTELLIGENT APPLICATION ACCE |
Produkt ist nicht verfügbar |
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ADK-IVS-LICENSE | NXP USA Inc. | Description: ADK-INTELLIGENT VIRTUALIZATION A |
Produkt ist nicht verfügbar |
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ADK-NSP-LICENSE | NXP USA Inc. | Description: ADK-NETWORK SECURITY PACKAGE SOF |
Produkt ist nicht verfügbar |
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ADK-NSS-LICENSE | NXP USA Inc. | Description: ADK-NETWORK SERVICES SWITCH SOFT |
Produkt ist nicht verfügbar |
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ADK-OFB-LICENSE | NXP USA Inc. | Description: ADK-OPENFLOW SWITCH BASE SOFTWAR |
Produkt ist nicht verfügbar |
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ADK-OFP-LICENSE | NXP USA Inc. | Description: ADK-OPENFLOW SWITCH PREMIUM SOFT |
Produkt ist nicht verfügbar |
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ADK-POP-LICENSE | NXP USA Inc. | Description: ADK-PROTOCOL OFFLOAD PACKAGE SOF |
Produkt ist nicht verfügbar |
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ADK-SSP-LICENSE | NXP USA Inc. | Description: ADK-SWITCH SUPPLEMENTARY PACKAGE |
Produkt ist nicht verfügbar |
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AFIC31025NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 2.7GHz ~ 3.1GHz Power - Output: 25W Gain: 30dB Technology: LDMOS Supplier Device Package: TO-270WB-17 Voltage - Rated: 32 V |
Produkt ist nicht verfügbar |
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AFIC901N-135MHZ | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: AFIC901N Frequency: 136MHz ~ 174MHz Type: Amplifier Supplied Contents: Board(s) |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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AFIC901N-350MHZ | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: AFIC901N Frequency: 350MHz ~ 520MHz Type: Amplifier Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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AFIC901N-760MHZ | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: AFIC901N Frequency: 760MHz ~ 870MHz Type: Amplifier Supplied Contents: Board(s) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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AFM906NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 2µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Power - Output: 6.8W Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Part Status: Active Voltage - Rated: 30 V Voltage - Test: 10.8 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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AFT27S012NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: PLD-1.5W Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 728MHz ~ 2.7GHz Power - Output: 13W Gain: 20.9dB Technology: LDMOS Supplier Device Package: PLD-1.5W Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 90 mA |
Produkt ist nicht verfügbar |
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ASK-RYLT1043-1K | NXP USA Inc. |
Description: ROYALTY PREPAYMENT 1K UNITS - LS Packaging: Bulk Type: License |
Produkt ist nicht verfügbar |
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ASL2417SHNY | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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ASL3417SHNY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Voltage - Output: 2.5V ~ 70V Mounting Type: Surface Mount Number of Outputs: 3 Frequency: 100kHz ~ 2MHz Type: Linear Operating Temperature: -40°C ~ 125°C (TA) Applications: Lighting Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Buck Supplier Device Package: 32-HVQFN (5x5) Dimming: PWM Voltage - Supply (Min): 10V Voltage - Supply (Max): 80V Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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BATT-14AAAPACK | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: MC3377x Accessory Type: Battery Holder |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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BGS8H5UKZ | NXP USA Inc. |
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auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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BRKTSTBC-A8451 | NXP USA Inc. |
![]() Packaging: Bulk Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451Q Supplied Contents: Board(s) Sensing Range: ±2g, 4g, 8g Part Status: Active |
Produkt ist nicht verfügbar |
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BRKTSTBCDP5004 | NXP USA Inc. |
![]() Packaging: Bulk Sensitivity: 1v/kPa Interface: Analog Voltage - Supply: 4.75V ~ 5.25V Sensor Type: Pressure Utilized IC / Part: MPXV5004DP Supplied Contents: Board(s) Embedded: No Sensing Range: 0 ~ 3.92 kPa Part Status: Active |
Produkt ist nicht verfügbar |
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BSC9131NJN7HHHB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BSC9131NSE7KHKB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator Part Status: Obsolete |
Produkt ist nicht verfügbar |
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CBTL02GP023HOZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C Applications: USB On-State Resistance (Max): 15Ohm -3db Bandwidth: 7GHz Supplier Device Package: 14-DHX2QFN (2.1x1.5) Voltage - Supply, Single (V+): 2.7V ~ 3.5V Switch Circuit: SPST Multiplexer/Demultiplexer Circuit: 1:1 Part Status: Obsolete Number of Channels: 4 |
Produkt ist nicht verfügbar |
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CLRC66303HNK | NXP USA Inc. |
![]() Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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DEVKIT-MOTORGD | NXP USA Inc. |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC5744P Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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DSPB56362AG120R2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Interface: Host Interface, I²C, SAI, SPI Type: Audio Processor Operating Temperature: 0°C ~ 70°C (TA) Non-Volatile Memory: ROM (126kB) On-Chip RAM: 42kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 120MHz Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FRDM-08XSF4-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD MC08XSF Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC08XS6421, MC08XSF421 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-17511EVB | NXP USA Inc. |
Description: FRDM-17511EVB Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC17511 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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FRDM-17529EVB | NXP USA Inc. |
Description: FRDM-17529EVB Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC17529 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-17C724EVB | NXP USA Inc. |
Description: FRDM-17C724EVB Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MPC17C724 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-17XSF5-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD MC17XSF Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC17XS6500, MC17XSF500 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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FRDM-20XSDBEVB | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FRDM-24XSMBEVB | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FRDM-32XSG-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD 32V EXT Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC17XSG500 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-33879A-EVB | NXP USA Inc. |
![]() Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC33879 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-40XSF5-EVB | NXP USA Inc. |
Description: FREEDOM EXPANSION BOARD MC40XSF Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC40XS6500, MC40XSF500 Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-50XSDBEVB | NXP USA Inc. |
Description: FREEDOM PLATFORM DAUGHTER BOARD Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC50XS4200 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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FRDM-HB2000-EVM | NXP USA Inc. | Description: FREEDOM EXPANSION BOARD- HB2000 |
Produkt ist nicht verfügbar |
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FRDM-HB2000ESEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33HB2000 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-HB2000FEVM | NXP USA Inc. | Description: FREEDOM EXPANSION BOARD HB2000 |
Produkt ist nicht verfügbar |
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FRDM-HB2001FEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Utilized IC / Part: MC33HB2001 Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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FRDM-K64F-AGM02 | NXP USA Inc. |
Description: DEMO KIT CONTAINING THE FRDM-K64 Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-K64F-AGM04 | NXP USA Inc. |
![]() Packaging: Bulk Sensor Type: Accelerometer, Gyroscope, Magnetometer Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
Produkt ist nicht verfügbar |
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FRDM-KV11Z | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KV1x Platform: Freedom Part Status: Active |
auf Bestellung 83 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-MC36XSD-EVB | NXP USA Inc. |
Description: FRDM EXP BD - 36 V MULTIPURPOSE Packaging: Bulk Function: Power Distribution Switch (Load Switch) Type: Power Management Utilized IC / Part: MC36XSD Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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FRDMFS6522LAEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS6500 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes, MCU, 32-Bit |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDMSTBC-A8451 | NXP USA Inc. |
![]() Packaging: Bulk Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g Interface: I2C, Serial Voltage - Supply: 1.95V ~ 3.6V Sensor Type: Accelerometer, 3 Axis Utilized IC / Part: MMA8451Q Supplied Contents: Board(s) Sensing Range: ±2g, 4g, 8g Part Status: Active |
Produkt ist nicht verfügbar |
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FS32K144HAT0CLHT | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FS32K144HAT0MLHR | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FS32K144HFT0CLHT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Obsolete Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K144HFT0MLHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 58 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K144HFT0MLLR | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FS32K144HFT0VLLR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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A3T21H450W23SR6 |
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Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Description: AIRFAST RF POWER LDMOS TRANSISTO
Produkt ist nicht verfügbar
A7006CGHN1/T1AGBEL |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
RAM Size: 3.2kB
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I²C
RAM Size: 3.2kB
Operating Temperature: -40°C ~ 90°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ADK-IAS-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-INTELLIGENT APPLICATION ACCE
Description: ADK-INTELLIGENT APPLICATION ACCE
Produkt ist nicht verfügbar
ADK-IVS-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-INTELLIGENT VIRTUALIZATION A
Description: ADK-INTELLIGENT VIRTUALIZATION A
Produkt ist nicht verfügbar
ADK-NSP-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-NETWORK SECURITY PACKAGE SOF
Description: ADK-NETWORK SECURITY PACKAGE SOF
Produkt ist nicht verfügbar
ADK-NSS-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-NETWORK SERVICES SWITCH SOFT
Description: ADK-NETWORK SERVICES SWITCH SOFT
Produkt ist nicht verfügbar
ADK-OFB-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-OPENFLOW SWITCH BASE SOFTWAR
Description: ADK-OPENFLOW SWITCH BASE SOFTWAR
Produkt ist nicht verfügbar
ADK-OFP-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-OPENFLOW SWITCH PREMIUM SOFT
Description: ADK-OPENFLOW SWITCH PREMIUM SOFT
Produkt ist nicht verfügbar
ADK-POP-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-PROTOCOL OFFLOAD PACKAGE SOF
Description: ADK-PROTOCOL OFFLOAD PACKAGE SOF
Produkt ist nicht verfügbar
ADK-SSP-LICENSE |
Hersteller: NXP USA Inc.
Description: ADK-SWITCH SUPPLEMENTARY PACKAGE
Description: ADK-SWITCH SUPPLEMENTARY PACKAGE
Produkt ist nicht verfügbar
AFIC31025NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.1GHz
Power - Output: 25W
Gain: 30dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Voltage - Rated: 32 V
Description: RF MOSFET LDMOS TO270-17
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 2.7GHz ~ 3.1GHz
Power - Output: 25W
Gain: 30dB
Technology: LDMOS
Supplier Device Package: TO-270WB-17
Voltage - Rated: 32 V
Produkt ist nicht verfügbar
AFIC901N-135MHZ |
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Hersteller: NXP USA Inc.
Description: AFIC901N REF BRD 174MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 136MHz ~ 174MHz
Type: Amplifier
Supplied Contents: Board(s)
Description: AFIC901N REF BRD 174MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 136MHz ~ 174MHz
Type: Amplifier
Supplied Contents: Board(s)
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 954.91 EUR |
AFIC901N-350MHZ |
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Hersteller: NXP USA Inc.
Description: AFIC901N REF BRD 520MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 350MHz ~ 520MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Active
Description: AFIC901N REF BRD 520MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 350MHz ~ 520MHz
Type: Amplifier
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 533.14 EUR |
AFIC901N-760MHZ |
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Hersteller: NXP USA Inc.
Description: AFIC901N REF BRD 870MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 760MHz ~ 870MHz
Type: Amplifier
Supplied Contents: Board(s)
Description: AFIC901N REF BRD 870MHZ 1W
Packaging: Bulk
For Use With/Related Products: AFIC901N
Frequency: 760MHz ~ 870MHz
Type: Amplifier
Supplied Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 531.29 EUR |
AFM906NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 2µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 6.8W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
AFT27S012NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 2.7GHz
Power - Output: 13W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Description: RF MOSFET LDMOS 28V PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 728MHz ~ 2.7GHz
Power - Output: 13W
Gain: 20.9dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 90 mA
Produkt ist nicht verfügbar
ASK-RYLT1043-1K |
Produkt ist nicht verfügbar
ASL2417SHNY |
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Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Produkt ist nicht verfügbar
ASL3417SHNY |
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Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 3
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC LED DRVR LIN PWM 1.5A 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Voltage - Output: 2.5V ~ 70V
Mounting Type: Surface Mount
Number of Outputs: 3
Frequency: 100kHz ~ 2MHz
Type: Linear
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Lighting
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Buck
Supplier Device Package: 32-HVQFN (5x5)
Dimming: PWM
Voltage - Supply (Min): 10V
Voltage - Supply (Max): 80V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
BATT-14AAAPACK |
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Hersteller: NXP USA Inc.
Description: BATTERY PACK - 14 AAA CELLS
Packaging: Bulk
For Use With/Related Products: MC3377x
Accessory Type: Battery Holder
Description: BATTERY PACK - 14 AAA CELLS
Packaging: Bulk
For Use With/Related Products: MC3377x
Accessory Type: Battery Holder
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 368.17 EUR |
BGS8H5UKZ |
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Hersteller: NXP USA Inc.
Description: SIGE:C LOW-NOISE AMPLIFIER MMIC
Description: SIGE:C LOW-NOISE AMPLIFIER MMIC
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
20000+ | 0.82 EUR |
BRKTSTBC-A8451 |
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Hersteller: NXP USA Inc.
Description: BRKTSTBC-A8451
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: BRKTSTBC-A8451
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Produkt ist nicht verfügbar
BRKTSTBCDP5004 |
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Hersteller: NXP USA Inc.
Description: SENSOR BREAKOUT BOARD FOR THE MP
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Description: SENSOR BREAKOUT BOARD FOR THE MP
Packaging: Bulk
Sensitivity: 1v/kPa
Interface: Analog
Voltage - Supply: 4.75V ~ 5.25V
Sensor Type: Pressure
Utilized IC / Part: MPXV5004DP
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 0 ~ 3.92 kPa
Part Status: Active
Produkt ist nicht verfügbar
BSC9131NJN7HHHB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
BSC9131NSE7KHKB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Tray
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850, Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
CBTL02GP023HOZ |
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Hersteller: NXP USA Inc.
Description: USB ON/OFF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: 14-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Applications: USB
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 7GHz
Supplier Device Package: 14-DHX2QFN (2.1x1.5)
Voltage - Supply, Single (V+): 2.7V ~ 3.5V
Switch Circuit: SPST
Multiplexer/Demultiplexer Circuit: 1:1
Part Status: Obsolete
Number of Channels: 4
Description: USB ON/OFF SWITCH
Packaging: Tape & Reel (TR)
Package / Case: 14-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Applications: USB
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 7GHz
Supplier Device Package: 14-DHX2QFN (2.1x1.5)
Voltage - Supply, Single (V+): 2.7V ~ 3.5V
Switch Circuit: SPST
Multiplexer/Demultiplexer Circuit: 1:1
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
CLRC66303HNK |
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Produkt ist nicht verfügbar
DEVKIT-MOTORGD |
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Hersteller: NXP USA Inc.
Description: DEVKIT FOR MOTORGD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC5744P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DEVKIT FOR MOTORGD
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC5744P
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 120.81 EUR |
DSPB56362AG120R2 |
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Hersteller: NXP USA Inc.
Description: LEAD FREE DSP56362
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (126kB)
On-Chip RAM: 42kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 120MHz
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Description: LEAD FREE DSP56362
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Interface: Host Interface, I²C, SAI, SPI
Type: Audio Processor
Operating Temperature: 0°C ~ 70°C (TA)
Non-Volatile Memory: ROM (126kB)
On-Chip RAM: 42kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 120MHz
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
FRDM-08XSF4-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC08XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD MC08XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC08XS6421, MC08XSF421
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-17511EVB |
Hersteller: NXP USA Inc.
Description: FRDM-17511EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17511
Supplied Contents: Board(s)
Description: FRDM-17511EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17511
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
FRDM-17529EVB |
Hersteller: NXP USA Inc.
Description: FRDM-17529EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17529
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM-17529EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17529
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-17C724EVB |
Hersteller: NXP USA Inc.
Description: FRDM-17C724EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM-17C724EVB
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MPC17C724
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-17XSF5-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XS6500, MC17XSF500
Supplied Contents: Board(s)
Description: FREEDOM EXPANSION BOARD MC17XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XS6500, MC17XSF500
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
FRDM-20XSDBEVB |
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Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM DAUGHTER BOARD
Description: FREEDOM PLATFORM DAUGHTER BOARD
Produkt ist nicht verfügbar
FRDM-24XSMBEVB |
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Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM MOTHER BOARD FO
Description: FREEDOM PLATFORM MOTHER BOARD FO
Produkt ist nicht verfügbar
FRDM-32XSG-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD 32V EXT
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSG500
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD 32V EXT
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC17XSG500
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-33879A-EVB |
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Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION KIT - MC33879
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC33879
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION KIT - MC33879
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC33879
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-40XSF5-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD MC40XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC40XS6500, MC40XSF500
Supplied Contents: Board(s)
Part Status: Active
Description: FREEDOM EXPANSION BOARD MC40XSF
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC40XS6500, MC40XSF500
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDM-50XSDBEVB |
Hersteller: NXP USA Inc.
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Description: FREEDOM PLATFORM DAUGHTER BOARD
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC50XS4200
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
FRDM-HB2000-EVM |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD- HB2000
Description: FREEDOM EXPANSION BOARD- HB2000
Produkt ist nicht verfügbar
FRDM-HB2000ESEVM |
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Hersteller: NXP USA Inc.
Description: FRDM EXP BD HB2000
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2000
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM EXP BD HB2000
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2000
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 237.44 EUR |
FRDM-HB2000FEVM |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD HB2000
Description: FREEDOM EXPANSION BOARD HB2000
Produkt ist nicht verfügbar
FRDM-HB2001FEVM |
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Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD HB2001
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2001
Supplied Contents: Board(s)
Description: FREEDOM EXPANSION BOARD HB2001
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: MC33HB2001
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
FRDM-K64F-AGM02 |
Hersteller: NXP USA Inc.
Description: DEMO KIT CONTAINING THE FRDM-K64
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DEMO KIT CONTAINING THE FRDM-K64
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, FXLS8952C, MAG3110, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
FRDM-K64F-AGM04 |
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Hersteller: NXP USA Inc.
Description: KIT CONTAINING THE FRDM-K64F AND
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: KIT CONTAINING THE FRDM-K64F AND
Packaging: Bulk
Sensor Type: Accelerometer, Gyroscope, Magnetometer
Utilized IC / Part: K24, K63, K64, FXAS21002C, MAG3110, MMA8652FC, mbed-Enabled Development
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
FRDM-KV11Z |
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Hersteller: NXP USA Inc.
Description: FREEDOM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Freedom
Part Status: Active
Description: FREEDOM KV1X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: Freedom
Part Status: Active
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 49.51 EUR |
FRDM-MC36XSD-EVB |
Hersteller: NXP USA Inc.
Description: FRDM EXP BD - 36 V MULTIPURPOSE
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC36XSD
Supplied Contents: Board(s)
Part Status: Active
Description: FRDM EXP BD - 36 V MULTIPURPOSE
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC36XSD
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
FRDMFS6522LAEVM |
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Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION KIT FS6522 SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6500
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
Description: FREEDOM EXPANSION KIT FS6522 SY
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6500
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 243.72 EUR |
FRDMSTBC-A8451 |
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Hersteller: NXP USA Inc.
Description: FREEDOM SENSOR SHIELD BOARD FOR
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Description: FREEDOM SENSOR SHIELD BOARD FOR
Packaging: Bulk
Sensitivity: 4096 count/g, 2048 count/g, 1024 count/g
Interface: I2C, Serial
Voltage - Supply: 1.95V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA8451Q
Supplied Contents: Board(s)
Sensing Range: ±2g, 4g, 8g
Part Status: Active
Produkt ist nicht verfügbar
FS32K144HAT0CLHT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
FS32K144HAT0MLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Produkt ist nicht verfügbar
FS32K144HFT0CLHT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K144HFT0MLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K144HFT0MLLR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
FS32K144HFT0VLLR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 10.64 EUR |