Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35282) > Seite 283 nach 589
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TDF8599BTH/N1/S6,5 | NXP USA Inc. |
Description: IC AMP D MONO/STEREO 150W 36HSOP Packaging: Bulk Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Voltage - Supply: 8V ~ 24V Max Output Power x Channels @ Load: 150W x 1 @ 2Ohm; 70W x 2 @ 4Ohm Supplier Device Package: 36-HSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TEA1721A3T/N1/S1J | NXP USA Inc. |
Description: TEA1721A3T/N1/S1J Packaging: Bulk Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TEA1721A3T/N1/S2J | NXP USA Inc. |
Description: TEA1721A3T/N1/S2J Packaging: Bulk Part Status: Obsolete DigiKey Programmable: Not Verified |
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TEF6657HN/V101,518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Obsolete |
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TEF6657HN/V101,557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Obsolete |
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TEF6686HN/V101,518 | NXP USA Inc. |
Description: TEF6686HN/V101,518 Packaging: Bulk Part Status: Obsolete |
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TEF6686HN/V101,557 | NXP USA Inc. |
Description: TEF6686HN/V101,557 Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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UBA2033TS/N4,118 | NXP USA Inc. | Description: UBA2033TS/N4,118 |
Produkt ist nicht verfügbar |
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JN5179-001-M10Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5179-001-M13Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5179-001-M16Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5179-001-M10Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5179-001-M13Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5179-001-M16Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.6V Power - Output: 8.5dBm Protocol: Zigbee® Current - Receiving: 16.4mA Current - Transmitting: 114mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN517X-XK030UL | NXP USA Inc. |
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JN517X-XK040UL | NXP USA Inc. |
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JN517X-DK005Z | NXP USA Inc. |
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OM15021Z | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: JN5179 Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, ZigBee®) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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MRF1K50H-TF4 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: MRF1K50H Frequency: 230MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active |
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MC33662BJEF | NXP USA Inc. |
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MC33662BSEF | NXP USA Inc. |
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MC33662BJEFR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 10kbps Protocol: LINbus Supplier Device Package: 8-SOIC |
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MC33662BLEFR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 20kbps Protocol: LINbus Supplier Device Package: 8-SOIC Part Status: Active |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33662BSEFR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 20kbps Protocol: LINbus Supplier Device Package: 8-SOIC |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33662BLEF | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Number of Drivers/Receivers: 1/1 Data Rate: 20kbps Protocol: LINbus Supplier Device Package: 8-SOIC Part Status: Discontinued at Digi-Key |
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JN5169-001-M00-2Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 27-SMD Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 10dBm Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 25mA Antenna Type: Integrated, Trace RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART Part Status: Obsolete DigiKey Programmable: Not Verified |
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JN5169-001-M03-2Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 27-SMD Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 10dBm Protocol: Zigbee® Current - Receiving: 17mA Current - Transmitting: 25mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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JN5169-001-M06-2Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 27-SMD Module Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.5GHz Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.6V Power - Output: 10dBm Protocol: Zigbee® Current - Receiving: 21.5mA Current - Transmitting: 153mA Antenna Type: Antenna Not Included, U.FL RF Family/Standard: 802.15.4 Serial Interfaces: I2C, SPI, UART DigiKey Programmable: Not Verified |
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LPC54605J256ET180E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 95 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54605J512ET180E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
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LPC54606J256ET180E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 256KB (256K x 8) RAM Size: 136K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
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LPC54606J512BD208E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 171 DigiKey Programmable: Not Verified |
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LPC54607J512ET180E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 379 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54608J512BD208E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Discontinued at Digi-Key Number of I/O: 171 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC54608J512ET180E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 200K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 180-TFBGA (12x12) Part Status: Active Number of I/O: 145 DigiKey Programmable: Not Verified |
auf Bestellung 486 Stücke: Lieferzeit 10-14 Tag (e) |
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OM13092UL | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC54608 Platform: LPCXpresso™ Part Status: Active |
Produkt ist nicht verfügbar |
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74HC151D,118 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
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MC17XS6400BEK | NXP USA Inc. |
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auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT1403DR,112 | NXP USA Inc. |
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74LVT1403DR,118 | NXP USA Inc. |
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S912ZVMC12F1MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
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S912ZVMC64F1MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 |
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S912ZVML12F1MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
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S912ZVML12F1WKHR | NXP USA Inc. |
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S912ZVML32F1MKH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVML32F1MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVML64F1MKH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 |
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S912ZVML64F1MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
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S912ZVML64F1WKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
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S912ZVML64F2MKHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
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MC8640DTHJ1067NE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1023-BCBGA, FCBGA Mounting Type: Surface Mount Speed: 1.067GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e600 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1023-FCCBGA (33x33) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, RapidIO |
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MC8640THJ1067NE | NXP USA Inc. | Description: IC MPU MPC86XX 1.067GHZ 994BGA |
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MC8640THJ1250HE | NXP USA Inc. | Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA |
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S32K144EVB-Q100X | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4F Utilized IC / Part: S32K144 |
Produkt ist nicht verfügbar |
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S08SU16-EVK | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 8-Bit Contents: Board(s) Core Processor: HCS08 Board Type: Evaluation Platform Utilized IC / Part: MC9S08SU Part Status: Active |
Produkt ist nicht verfügbar |
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OM13094UL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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TWR-LS1021A-PC | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A7 Utilized IC / Part: LS1021A Platform: Tower System Part Status: Active |
auf Bestellung 42 Stücke: Lieferzeit 10-14 Tag (e) |
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MK27FN2M0VMI15 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I²S, PWM, WDT Supplier Device Package: 169-MAPBGA (9x9) Part Status: Discontinued at Digi-Key Number of I/O: 120 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDM-K28F | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: K27, K28 Platform: Freedom Part Status: Active |
Produkt ist nicht verfügbar |
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MK28FN2M0VMI15 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: 169-MAPBGA (9x9) Part Status: Not For New Designs Number of I/O: 120 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
TDF8599BTH/N1/S6,5 |
Hersteller: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Packaging: Bulk
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 8V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 2Ohm; 70W x 2 @ 4Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Description: IC AMP D MONO/STEREO 150W 36HSOP
Packaging: Bulk
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Voltage - Supply: 8V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 2Ohm; 70W x 2 @ 4Ohm
Supplier Device Package: 36-HSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
TEA1721A3T/N1/S1J |
Hersteller: NXP USA Inc.
Description: TEA1721A3T/N1/S1J
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: TEA1721A3T/N1/S1J
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEA1721A3T/N1/S2J |
Hersteller: NXP USA Inc.
Description: TEA1721A3T/N1/S2J
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: TEA1721A3T/N1/S2J
Packaging: Bulk
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEF6657HN/V101,518 |
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Produkt ist nicht verfügbar
TEF6657HN/V101,557 |
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Produkt ist nicht verfügbar
TEF6686HN/V101,518 |
Produkt ist nicht verfügbar
TEF6686HN/V101,557 |
Produkt ist nicht verfügbar
JN5179-001-M10Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5179-001-M13Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5179-001-M16Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5179-001-M10Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TH SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5179-001-M13Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5179-001-M16Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4U.FL SMD
Packaging: Cut Tape (CT)
Package / Case: Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.6V
Power - Output: 8.5dBm
Protocol: Zigbee®
Current - Receiving: 16.4mA
Current - Transmitting: 114mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN517X-XK030UL |
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Hersteller: NXP USA Inc.
Description: ZIGBEE GENERIC NODE EXPANSION KI
Description: ZIGBEE GENERIC NODE EXPANSION KI
Produkt ist nicht verfügbar
JN517X-XK040UL |
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Hersteller: NXP USA Inc.
Description: JN5179 ZIGBEE LIGHTING EXPANSION
Description: JN5179 ZIGBEE LIGHTING EXPANSION
Produkt ist nicht verfügbar
JN517X-DK005Z |
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Hersteller: NXP USA Inc.
Description: JN5179 ZIGBEE DEVELOPMENT KIT
Description: JN5179 ZIGBEE DEVELOPMENT KIT
Produkt ist nicht verfügbar
OM15021Z |
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Hersteller: NXP USA Inc.
Description: JN5179 USB DONGLE FOR ZIGBEE
Packaging: Bulk
For Use With/Related Products: JN5179
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®)
Supplied Contents: Board(s)
Description: JN5179 USB DONGLE FOR ZIGBEE
Packaging: Bulk
For Use With/Related Products: JN5179
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MRF1K50H-TF4 |
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Hersteller: NXP USA Inc.
Description: MRF1K50H REF BRD 230MHZ 1500W
Packaging: Bulk
For Use With/Related Products: MRF1K50H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Description: MRF1K50H REF BRD 230MHZ 1500W
Packaging: Bulk
For Use With/Related Products: MRF1K50H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
MC33662BJEF |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Description: IC TRANSCEIVER 1/1 8SOIC
Produkt ist nicht verfügbar
MC33662BSEF |
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Hersteller: NXP USA Inc.
Description: IC TXRX LIN 2.1 10KBPS 8SOIC
Description: IC TXRX LIN 2.1 10KBPS 8SOIC
Produkt ist nicht verfügbar
MC33662BJEFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 10kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
MC33662BLEFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Part Status: Active
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.4 EUR |
5000+ | 1.35 EUR |
MC33662BSEFR2 |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.4 EUR |
MC33662BLEF |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Part Status: Discontinued at Digi-Key
Description: IC TRANSCEIVER 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LINbus
Supplier Device Package: 8-SOIC
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
JN5169-001-M00-2Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 25mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TXRX MOD 802.15.4 TRC ANT SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 25mA
Antenna Type: Integrated, Trace
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5169-001-M03-2Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4 U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 25mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4 U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Current - Transmitting: 25mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5169-001-M06-2Z |
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Hersteller: NXP USA Inc.
Description: RF TXRX MODULE 802.15.4 U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 21.5mA
Current - Transmitting: 153mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Description: RF TXRX MODULE 802.15.4 U.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 27-SMD Module
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Memory Size: 512kB Flash, 4kB EEPROM, 32kB RAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 10dBm
Protocol: Zigbee®
Current - Receiving: 21.5mA
Current - Transmitting: 153mA
Antenna Type: Antenna Not Included, U.FL
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54605J256ET180E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 95 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 19.69 EUR |
10+ | 15.47 EUR |
LPC54605J512ET180E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54606J256ET180E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54606J512BD208E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54607J512ET180E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 379 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.33 EUR |
10+ | 17.05 EUR |
189+ | 14.4 EUR |
LPC54608J512BD208E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 171
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Discontinued at Digi-Key
Number of I/O: 171
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54608J512ET180E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 180TFBGA
Packaging: Tray
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Part Status: Active
Number of I/O: 145
DigiKey Programmable: Not Verified
auf Bestellung 486 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.33 EUR |
10+ | 17.04 EUR |
189+ | 14.39 EUR |
OM13092UL |
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Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54608 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54608
Platform: LPCXpresso™
Part Status: Active
Description: LPCXPRESSO LPC54608 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC54608
Platform: LPCXpresso™
Part Status: Active
Produkt ist nicht verfügbar
74HC151D,118 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 8:1 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 1 X 8:1 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
MC17XS6400BEK |
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Hersteller: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Description: IC SWITCH HIGH SIDE 32SOIC
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)74LVT1403DR,112 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER/DRIVER 32TSSOP
Description: IC BUFFER/DRIVER 32TSSOP
Produkt ist nicht verfügbar
74LVT1403DR,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER/DRIVER 32TSSOP
Description: IC BUFFER/DRIVER 32TSSOP
Produkt ist nicht verfügbar
S912ZVMC12F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVMC64F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Produkt ist nicht verfügbar
S912ZVML12F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVML12F1WKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
S912ZVML32F1MKH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVML32F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVML64F1MKH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
Produkt ist nicht verfügbar
S912ZVML64F1MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVML64F1WKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912ZVML64F2MKHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC8640DTHJ1067NE |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
Produkt ist nicht verfügbar
MC8640THJ1067NE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 994BGA
Description: IC MPU MPC86XX 1.067GHZ 994BGA
Produkt ist nicht verfügbar
MC8640THJ1250HE |
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA
Description: IC MPU MPC86XX 1.25GHZ 994FCCBGA
Produkt ist nicht verfügbar
S32K144EVB-Q100X |
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Hersteller: NXP USA Inc.
Description: S32K144 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144
Description: S32K144 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Utilized IC / Part: S32K144
Produkt ist nicht verfügbar
S08SU16-EVK |
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Hersteller: NXP USA Inc.
Description: MC9S08SU EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SU
Part Status: Active
Description: MC9S08SU EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08SU
Part Status: Active
Produkt ist nicht verfügbar
OM13094UL |
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Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC54618 EVAL BRD
Description: LPCXPRESSO LPC54618 EVAL BRD
Produkt ist nicht verfügbar
TWR-LS1021A-PC |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM LS1021A EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A7
Utilized IC / Part: LS1021A
Platform: Tower System
Part Status: Active
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 2623.86 EUR |
MK27FN2M0VMI15 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Discontinued at Digi-Key
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FRDM-K28F |
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Hersteller: NXP USA Inc.
Description: FREEDOM K27/K28 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K27, K28
Platform: Freedom
Part Status: Active
Description: FREEDOM K27/K28 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K27, K28
Platform: Freedom
Part Status: Active
Produkt ist nicht verfügbar
MK28FN2M0VMI15 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 120
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: 169-MAPBGA (9x9)
Part Status: Not For New Designs
Number of I/O: 120
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar