Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35275) > Seite 406 nach 588
Foto | Bezeichnung | Hersteller | Beschreibung |
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MKL17Z256CAL4R098 | NXP USA Inc. |
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MKL17Z32VFM4 | NXP USA Inc. |
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MKL17Z64VFM4557 | NXP USA Inc. | Description: KINETIS KL17: 48MHZ CORTEX-M0+ U |
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MKL17Z128VLH4R528 | NXP USA Inc. |
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MKL17Z32VFM4R | NXP USA Inc. |
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MKL17Z64VFM4R | NXP USA Inc. |
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MKL17Z64VLH4R | NXP USA Inc. |
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MKL17Z128VLH4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
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MKL17Z256VFT4R | NXP USA Inc. |
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MKL17Z256VLH4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL17Z256CAL4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 36-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 36-WLCSP (2.82x2.67) Number of I/O: 26 DigiKey Programmable: Not Verified |
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PEMX1,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 2 NPN (Dual) Operating Temperature: 150°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V Frequency - Transition: 100MHz Supplier Device Package: SOT-666 Part Status: Active |
auf Bestellung 704929 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF5014H-200MHZ | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: MMRF5014H Frequency: 200MHz ~ 2.5GHz Type: Transistor Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MMRF5015NR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 2.5GHz Power - Output: 125W Gain: 16.6dB Technology: HEMT Supplier Device Package: OM-270-2 Part Status: Obsolete Voltage - Rated: 125 V Voltage - Test: 50 V Current - Test: 350 mA |
Produkt ist nicht verfügbar |
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MMRF5016HSR5 | NXP USA Inc. |
Description: AIRFAST RF POWER GAN TRANSISTOR Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 1.8GHz ~ 2.2GHz Power - Output: 32W Technology: HEMT Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 48 V |
Produkt ist nicht verfügbar |
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TDF8554J/N3112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 37-SIP Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm Part Status: Active |
auf Bestellung 14664 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908EY16ACFJE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 3750 Stücke: Lieferzeit 10-14 Tag (e) |
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MC908EY16ACFJER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC157D-Q100,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 10465 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9629PW118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: I²C Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Pre-Driver - Half Bridge (4) Voltage - Supply: 4.5V ~ 5.5V Applications: General Purpose Technology: CMOS Supplier Device Package: 16-TSSOP Motor Type - Stepper: Bipolar, Unipolar Step Resolution: 1 ~ 1/128 |
auf Bestellung 571 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS6600M0ES | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCU Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Safety Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
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MFRC50001T/0FE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74LV14PW/S400118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LV14PW/AU118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 2300 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV14N,112 | NXP USA Inc. |
![]() Packaging: Tube Features: Schmitt Trigger Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Current - Output High, Low: 12mA, 12mA Number of Inputs: 1 Supplier Device Package: 14-DIP Input Logic Level - High: 1.4V ~ 3.85V Input Logic Level - Low: 0.3V ~ 1.1V Max Propagation Delay @ V, Max CL: 15ns @ 3.3V, 50pF Part Status: Obsolete Number of Circuits: 6 Current - Quiescent (Max): 40 µA |
auf Bestellung 6063 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G04GW-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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LPC822M101JHI33K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 30MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
auf Bestellung 53 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV55-B7V5,135 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: DO-213AC, MINI-MELF, SOD-80 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 200°C Voltage - Zener (Nom) (Vz): 7.5 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: LLDS; MiniMelf Part Status: Active Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 5 V |
auf Bestellung 106500 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI1QFN/RT,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-101, SOT-883 Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 27dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Part Status: Obsolete Number of Channels: 1 |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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P60D080MX1G/9C021J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
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P60D080MX30/9A0901 | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
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P60D080MX30/9C021J | NXP USA Inc. |
Description: IC SMART CARD CTLR PLLCC8 Packaging: Tape & Reel (TR) Part Status: Obsolete DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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P60D080MX30/9C980J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
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P60D080MX34/9C980J | NXP USA Inc. | Description: IC SMART CARD CTLR PLLCC8 |
Produkt ist nicht verfügbar |
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PESD9X7.0L,315 | NXP USA Inc. |
Description: TVS DIODE 7VWM 18VC DFN1006-2 Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Capacitance @ Frequency: 62pF @ 1MHz Current - Peak Pulse (10/1000µs): 10A (8/20µs) Voltage - Reverse Standoff (Typ): 7V (Max) Supplier Device Package: DFN1006-2 Unidirectional Channels: 1 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 18V Power - Peak Pulse: 150W Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 25685 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XHY128F0CLM557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XHY256F0CLM557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC755CVT350LE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 360-BBGA, FCBGA Mounting Type: Surface Mount Speed: 350MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 360-FCPBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC755CVT350LE557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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TDA8024TT/C1/S1118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX84J-B3V0,115 | NXP USA Inc. |
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auf Bestellung 23497 Stücke: Lieferzeit 10-14 Tag (e) |
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BFG93A/X,215 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 35mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Frequency - Transition: 6GHz Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz Supplier Device Package: SOT-143B Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFG93A,215 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 35mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Frequency - Transition: 6GHz Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz Supplier Device Package: SOT-143B Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BFG93A,215 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 300mW Current - Collector (Ic) (Max): 35mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V Frequency - Transition: 6GHz Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz Supplier Device Package: SOT-143B Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BB173X | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-523 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 15.0 |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC123JU | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PDTC123JU/ZLX | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PESD3V3X1BL315 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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HEC40106BT,112 | NXP USA Inc. |
Description: IC INVERT SCHMITT 6CH 1-INP 14SO Packaging: Bulk Features: Schmitt Trigger Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -55°C ~ 125°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 3.4mA, 3.4mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 3.5V ~ 11V Input Logic Level - Low: 1.5V ~ 4V Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Part Status: Active Number of Circuits: 6 Current - Quiescent (Max): 1 µA |
auf Bestellung 6840 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4066DB118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 20Ohm (Typ) -3db Bandwidth: 200MHz Supplier Device Package: 14-SSOP Voltage - Supply, Single (V+): 4.5V ~ 5.5V Crosstalk: -60dB @ 1MHz Switch Circuit: SPST - NO Multiplexer/Demultiplexer Circuit: 1:1 Channel-to-Channel Matching (ΔRon): 3Ohm Switch Time (Ton, Toff) (Max): 20ns, 30ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 1µA Number of Circuits: 4 |
Produkt ist nicht verfügbar |
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NXQ1TXH5DB1355 | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: LPC824 Accessory Type: Interface Board Part Status: Active |
Produkt ist nicht verfügbar |
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PBSS4021NT/WD215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 200mV @ 400mA, 4A Current - Collector Cutoff (Max): 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 2A, 2V Frequency - Transition: 165MHz Supplier Device Package: SOT23-3 (TO-236) Current - Collector (Ic) (Max): 4.3 A Voltage - Collector Emitter Breakdown (Max): 20 V Power - Max: 1.1 W |
Produkt ist nicht verfügbar |
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PBSS4032NX/DG/B2115 | NXP USA Inc. |
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auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08RN32W1VLF | NXP USA Inc. |
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PMEG4030ER115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74ALVC16245DGG/C1118 | NXP USA Inc. |
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auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC27DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.2V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 40 µA |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC27DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.2V ~ 3.6V Current - Output High, Low: 24mA, 24mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 40 µA |
auf Bestellung 4368 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC4088FBD144,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX7S5EVK08SD | NXP USA Inc. |
Description: IC MPU I.MX7S 800MHZ 488TFBGA Packaging: Bulk Package / Case: 488-TFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 488-TFBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, MIPI Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
auf Bestellung 1033 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL17Z256CAL4R098 |
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Hersteller: NXP USA Inc.
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
MKL17Z32VFM4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Description: IC MCU 32BIT 32KB FLASH 32QFN
Produkt ist nicht verfügbar
MKL17Z64VFM4557 |
Hersteller: NXP USA Inc.
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
MKL17Z128VLH4R528 |
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Hersteller: NXP USA Inc.
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
MKL17Z32VFM4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Description: IC MCU 32BIT 32KB FLASH 32QFN
Produkt ist nicht verfügbar
MKL17Z64VFM4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Description: IC MCU 32BIT 64KB FLASH 32QFN
Produkt ist nicht verfügbar
MKL17Z64VLH4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
MKL17Z128VLH4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKL17Z256VFT4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Description: IC MCU 32BIT 256KB FLASH 48QFN
Produkt ist nicht verfügbar
MKL17Z256VLH4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKL17Z256CAL4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 36WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 36-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 36-WLCSP (2.82x2.67)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 36WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 36-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 36-WLCSP (2.82x2.67)
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PEMX1,315 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMX1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-666
Part Status: Active
Description: NOW NEXPERIA PEMX1 - SMALL SIGNA
Packaging: Bulk
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 2 NPN (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 200mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 1mA, 6V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-666
Part Status: Active
auf Bestellung 704929 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4699+ | 0.11 EUR |
MMRF5014H-200MHZ |
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Hersteller: NXP USA Inc.
Description: MMRF5014H REF BOARD 2500MHZ 100W
Packaging: Bulk
For Use With/Related Products: MMRF5014H
Frequency: 200MHz ~ 2.5GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Description: MMRF5014H REF BOARD 2500MHZ 100W
Packaging: Bulk
For Use With/Related Products: MMRF5014H
Frequency: 200MHz ~ 2.5GHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 1980 EUR |
MMRF5015NR5 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V OM270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.5GHz
Power - Output: 125W
Gain: 16.6dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: RF MOSFET HEMT 50V OM270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.5GHz
Power - Output: 125W
Gain: 16.6dB
Technology: HEMT
Supplier Device Package: OM-270-2
Part Status: Obsolete
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
MMRF5016HSR5 |
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Power - Output: 32W
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 48 V
Description: AIRFAST RF POWER GAN TRANSISTOR
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
Power - Output: 32W
Technology: HEMT
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 48 V
Produkt ist nicht verfügbar
TDF8554J/N3112 |
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Hersteller: NXP USA Inc.
Description: AUDIO AMPLIFIER 4X50 W I2C-BUS C
Packaging: Bulk
Package / Case: 37-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Part Status: Active
Description: AUDIO AMPLIFIER 4X50 W I2C-BUS C
Packaging: Bulk
Package / Case: 37-SIP Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 4 @ 2Ohm, 45W x 4 @ 4Ohm
Part Status: Active
auf Bestellung 14664 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
58+ | 9.17 EUR |
MC908EY16ACFJE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 3750 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
132+ | 6.69 EUR |
MC908EY16ACFJER |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
99+ | 8.92 EUR |
74HC157D-Q100,118 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC MULTIPLEXER 4 X 2:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 10465 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1571+ | 0.31 EUR |
PCA9629PW118 |
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Hersteller: NXP USA Inc.
Description: FM PLUS I2C-BUS STEPPER MOTOR CO
Packaging: Bulk
Part Status: Active
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
Description: FM PLUS I2C-BUS STEPPER MOTOR CO
Packaging: Bulk
Part Status: Active
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I²C
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (4)
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Purpose
Technology: CMOS
Supplier Device Package: 16-TSSOP
Motor Type - Stepper: Bipolar, Unipolar
Step Resolution: 1 ~ 1/128
auf Bestellung 571 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
275+ | 1.75 EUR |
MC33FS6600M0ES |
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.48 EUR |
10+ | 16.98 EUR |
25+ | 16.27 EUR |
80+ | 14.34 EUR |
MFRC50001T/0FE |
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Produkt ist nicht verfügbar
74LV14PW/S400118 |
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Produkt ist nicht verfügbar
74LV14PW/AU118 |
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auf Bestellung 2300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2300+ | 0.26 EUR |
74LV14N,112 |
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Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 6CH 1INP 14DIP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.4V ~ 3.85V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 15ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
Description: IC INVERT SCHMITT 6CH 1INP 14DIP
Packaging: Tube
Features: Schmitt Trigger
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.4V ~ 3.85V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 15ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
auf Bestellung 6063 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
650+ | 0.75 EUR |
74LVC2G04GW-Q100125 |
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Produkt ist nicht verfügbar
LPC822M101JHI33K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 30MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
auf Bestellung 53 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.87 EUR |
10+ | 3.01 EUR |
BZV55-B7V5,135 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 7.5V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: LLDS; MiniMelf
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
Description: DIODE ZENER 7.5V 500MW LLDS
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 7.5 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: LLDS; MiniMelf
Part Status: Active
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 5 V
auf Bestellung 106500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13172+ | 0.032 EUR |
PEMI1QFN/RT,315 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
Description: FILTER RC(PI) 100 OHM/23PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 27dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3806+ | 0.13 EUR |
P60D080MX1G/9C021J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
P60D080MX30/9A0901 |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
P60D080MX30/9C021J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Packaging: Tape & Reel (TR)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC SMART CARD CTLR PLLCC8
Packaging: Tape & Reel (TR)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
P60D080MX30/9C980J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
P60D080MX34/9C980J |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR PLLCC8
Description: IC SMART CARD CTLR PLLCC8
Produkt ist nicht verfügbar
PESD9X7.0L,315 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 7VWM 18VC DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 62pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 7V (Max)
Supplier Device Package: DFN1006-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 18V
Power - Peak Pulse: 150W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 7VWM 18VC DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 62pF @ 1MHz
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 7V (Max)
Supplier Device Package: DFN1006-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 18V
Power - Peak Pulse: 150W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 25685 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4438+ | 0.12 EUR |
S912XHY128F0CLM557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
S912XHY256F0CLM557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 256KB FLAS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 16-BIT MCU, S12 CORE, 256KB FLAS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC755CVT350LE |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC7XX 350MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC755CVT350LE557 |
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Produkt ist nicht verfügbar
TDA8024TT/C1/S1118 |
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Hersteller: NXP USA Inc.
Description: STANDARD SMART CARD INTERFACE
Packaging: Bulk
Part Status: Active
Description: STANDARD SMART CARD INTERFACE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
BZX84J-B3V0,115 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 3V 550MW SOD323F
Description: DIODE ZENER 3V 550MW SOD323F
auf Bestellung 23497 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10051+ | 0.054 EUR |
BFG93A/X,215 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Produkt ist nicht verfügbar
BFG93A,215 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Tape & Reel (TR)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Produkt ist nicht verfügbar
BFG93A,215 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Description: RF TRANS NPN 12V 6GHZ SOT143B
Packaging: Cut Tape (CT)
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 300mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 30mA, 5V
Frequency - Transition: 6GHz
Noise Figure (dB Typ @ f): 1.7dB ~ 2.3dB @ 1GHz ~ 2GHz
Supplier Device Package: SOT-143B
Part Status: Obsolete
Produkt ist nicht verfügbar
BB173X |
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Hersteller: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15.0
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
27+ | 0.67 EUR |
31+ | 0.58 EUR |
100+ | 0.4 EUR |
PDTC123JU |
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Hersteller: NXP USA Inc.
Description: PDTC123J SERIES - NPN RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTC123J SERIES - NPN RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PESD3V3X1BL315 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PESD3V3X1BL TRANS V
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PESD3V3X1BL TRANS V
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
HEC40106BT,112 |
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 6CH 1-INP 14SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Description: IC INVERT SCHMITT 6CH 1-INP 14SO
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Part Status: Active
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
auf Bestellung 6840 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2420+ | 0.2 EUR |
74HCT4066DB118 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT4066DB - SPST,
Packaging: Bulk
Part Status: Active
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 20Ohm (Typ)
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Description: NOW NEXPERIA 74HCT4066DB - SPST,
Packaging: Bulk
Part Status: Active
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 20Ohm (Typ)
-3db Bandwidth: 200MHz
Supplier Device Package: 14-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 3Ohm
Switch Time (Ton, Toff) (Max): 20ns, 30ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Number of Circuits: 4
Produkt ist nicht verfügbar
NXQ1TXH5DB1355 |
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Hersteller: NXP USA Inc.
Description: NXQ1TXH5 PLUG IN
Packaging: Bulk
For Use With/Related Products: LPC824
Accessory Type: Interface Board
Part Status: Active
Description: NXQ1TXH5 PLUG IN
Packaging: Bulk
For Use With/Related Products: LPC824
Accessory Type: Interface Board
Part Status: Active
Produkt ist nicht verfügbar
PBSS4021NT/WD215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 400mA, 4A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 2A, 2V
Frequency - Transition: 165MHz
Supplier Device Package: SOT23-3 (TO-236)
Current - Collector (Ic) (Max): 4.3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 1.1 W
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 200mV @ 400mA, 4A
Current - Collector Cutoff (Max): 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 300 @ 2A, 2V
Frequency - Transition: 165MHz
Supplier Device Package: SOT23-3 (TO-236)
Current - Collector (Ic) (Max): 4.3 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 1.1 W
Produkt ist nicht verfügbar
PBSS4032NX/DG/B2115 |
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auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1268+ | 0.4 EUR |
S9S08RN32W1VLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
PMEG4030ER115 |
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Produkt ist nicht verfügbar
74ALVC16245DGG/C1118 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCVR
Description: BUS TRANSCVR
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
545+ | 0.93 EUR |
74LVC27DB,118 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
74LVC27DB,112 |
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Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
Description: IC GATE NOR 3CH 3-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Current - Output High, Low: 24mA, 24mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 2.4ns @ 3.3V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 40 µA
auf Bestellung 4368 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
LPC4088FBD144,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCIMX7S5EVK08SD |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 1033 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
16+ | 31.58 EUR |