Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35275) > Seite 402 nach 588
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SA615D/01 | NXP USA Inc. |
 Description: AUDIO SINGLE CHIP RECEIVER, FM, |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74AUP1G04GM184 | NXP USA Inc. |
Description: IC INVERTER 1CH 1-INP 6XSON |
auf Bestellung 1807815 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| A2T08VD021NT1 | NXP USA Inc. |
Description: RF MOSFET PQFN8X8 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
| CA/DI-PAYSHIELD-OZ | NXP USA Inc. | Description: SMART CARD ATHENA PROJ |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N331D,51 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N331D,55 | NXP USA Inc. |
Description: IC HD RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Type: Car Signal Processor Operating Temperature: -40°C ~ 85°C (TA) Clock Rate: 400MHz Supplier Device Package: 144-HLQFP (20x20) |
Produkt ist nicht verfügbar |
||||||||||||||||
| PUSB3TB6471 | NXP USA Inc. |
Description: NOW NEXPERIA PUSB3TB6 - TRANS VO Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
BUK753R1-40B,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 75A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V |
auf Bestellung 294 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| BUK765R2-40B118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK765R2-40B 75A, 4 |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
MCIMX536AVP8C2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Active Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
MCIMX536AVP8C2R2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR2, DDR3, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Active Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74HC594D/S400118 | NXP USA Inc. |
Description: SERIAL IN PARALLEL OUT Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Part Status: Obsolete Number of Bits per Element: 8 |
auf Bestellung 2944 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
74HC594DB/S400118 | NXP USA Inc. |
Description: SERIAL IN PARALLEL OUT Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Part Status: Obsolete Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74HC594D-Q100,118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, HC/UH SE Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Grade: Automotive Part Status: Active Number of Bits per Element: 8 Qualification: AEC-Q100 |
auf Bestellung 1455 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
CBTD3861PW,118 | NXP USA Inc. |
Description: IC BUS SWITCH 10 X 1:1 24TSSOP Packaging: Bulk Package / Case: 24-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 24-TSSOP |
auf Bestellung 3818 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
74LVC3G34DP/S400125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 8-TSSOP |
auf Bestellung 5832 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
|
74LVC1G74DP/S400125 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 8TSSOP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
BUK9E6R1-100E,127 | NXP USA Inc. |
Description: MOSFET N-CH 100V 120A I2PAK Packaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 5.9mOhm @ 25A, 10V Power Dissipation (Max): 349W (Tc) Vgs(th) (Max) @ Id: 2.1V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 17460 pF @ 25 V |
auf Bestellung 285 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
MCSPTE1AK144 | NXP USA Inc. |
Description: S32K144 DEV KIT FOR BLDC PMSM MO Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), Power Supply, Accessories Core Processor: ARM® Cortex®-M4F Board Type: Evaluation Platform Utilized IC / Part: GD3000, S32K144 Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| TJA1043ATK/0Y | NXP USA Inc. |
Description: IC TRANSCEIVER 14HVSON Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
||||||||||||||||
|
|
74HCT597D/AU118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, 8-BIT Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SO Part Status: Active Number of Bits per Element: 8 |
auf Bestellung 179012 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
74HCT597DB,112-NXP | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, HCT SERI Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel or Serial to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 16-SSOP Part Status: Active Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74HC7030N,652 | NXP USA Inc. |
Description: IC FIFO ASYNC/SYNC 64X9 28DIP Packaging: Tube Package / Case: 28-DIP (0.600", 15.24mm) Mounting Type: Through Hole Function: Asynchronous, Synchronous Memory Size: 576 (64 x 9) Operating Temperature: -40°C ~ 125°C Data Rate: 33MHz Access Time: 36ns Supplier Device Package: 28-DIP Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Part Status: Obsolete Voltage - Supply: 2 V ~ 6 V DigiKey Programmable: Not Verified |
auf Bestellung 272 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| NCF2957MHN4/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
| NCF29A7XHN4/0200IY | NXP USA Inc. |
Description: TOKEN PLUS Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
| NCF29A7VHN4/0200IY | NXP USA Inc. | Description: TOKEN PLUS |
Produkt ist nicht verfügbar |
||||||||||||||||
| LPC11U37FBD48/401 | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
TEA1723AT/N1118 | NXP USA Inc. |
Description: IC CTLR SMPS W/PWR SWITCH 7-SOIC Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
| BAS56/DG/B2215 | NXP USA Inc. |
Description: BAS56 - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
BAS56/DG/B2235 | NXP USA Inc. |
Description: DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
BAV20143 | NXP USA Inc. |
Description: NOW NEXPERIA BAV20 - RECTIFIER D Packaging: Bulk Part Status: Active Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 50 ns Technology: Standard Capacitance @ Vr, F: 5pF @ 0V, 1MHz Current - Average Rectified (Io): 250mA Supplier Device Package: ALF2 Operating Temperature - Junction: 175°C (Max) Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 150 V |
Produkt ist nicht verfügbar |
|||||||||||||||
| SAF7730HV/N312D518 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
auf Bestellung 750 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
 |
SAF7730HV/N336D518 | NXP USA Inc. |
Description: CAR RADIO DIGITAL SIGNAL PROCESS Packaging: Bulk Part Status: Active |
auf Bestellung 18750 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
| SAF7730HV/N221D,51 | NXP USA Inc. | Description: SAF7730HV/N221D,51 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N221D,55 | NXP USA Inc. | Description: SAF7730HV/N221D,55 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N233D,51 | NXP USA Inc. | Description: SAF7730HV/N233D,51 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N233D,55 | NXP USA Inc. | Description: SAF7730HV/N233D,55 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N233D/S3 | NXP USA Inc. | Description: SAF7730HV/N233D/S3 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N235D,51 | NXP USA Inc. | Description: SAF7730HV/N235D,51 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N235D,55 | NXP USA Inc. | Description: SAF7730HV/N235D,55 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N323D,51 | NXP USA Inc. | Description: SAF7730HV/N323D,51 |
Produkt ist nicht verfügbar |
||||||||||||||||
| SAF7730HV/N323D,55 | NXP USA Inc. | Description: SAF7730HV/N323D,55 |
Produkt ist nicht verfügbar |
||||||||||||||||
| PESD18VF1BSF315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk |
auf Bestellung 1197000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
 |
74LV165D-Q100118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, 8-BIT Packaging: Bulk |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
74LV165APW-Q100118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, 8-BIT Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74LV165D-Q100.118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, 8-BIT |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74LV165D/AU118 | NXP USA Inc. |
Description: PARALLEL IN SERIAL OUT, 8-BIT Packaging: Bulk |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
74LVC139PW/AU118 | NXP USA Inc. |
Description: 74LVC139PW - DECODER/DRIVER Packaging: Bulk |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
74AHC139PW,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X2:4 16TSSOP |
auf Bestellung 15416 Stücke: Lieferzeit 10-14 Tag (e) |
|||||||||||||||
| PHM10030DLS115 | NXP USA Inc. | Description: SMALL SIGNAL N-CHANNEL MOSFET |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||||||
| PH2230DLS115 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
 |
TJA1044GT/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
|||||||||||||||
|
|
TJA1044GT/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 300 mV Duplex: Half Part Status: Active |
auf Bestellung 1928 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
MPC563CVR40 | NXP USA Inc. | Description: IC MCU 32BIT 512KB FLASH 388PBGA |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
LD6816CX4/22P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2.2V 150MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2.2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 72000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
|
LD6806CX4/22P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2.2V 200MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2.2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
LPC4078FET208551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 208TFBGA Packaging: Bulk Package / Case: 208-TFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 208-TFBGA (15x15) Part Status: Active Number of I/O: 165 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
 |
LPC4078FBD100551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
| LPC4078FBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||||||
 |
LPC4078FBD100K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 69 DigiKey Programmable: Not Verified |
auf Bestellung 159 Stücke: Lieferzeit 10-14 Tag (e) |
|
| SA615D/01 |
|
Hersteller: NXP USA Inc.
Description: AUDIO SINGLE CHIP RECEIVER, FM,
Description: AUDIO SINGLE CHIP RECEIVER, FM,
Produkt ist nicht verfügbar
| 74AUP1G04GM184 |
|
Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Description: IC INVERTER 1CH 1-INP 6XSON
auf Bestellung 1807815 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4121+ | 0.11 EUR |
| A2T08VD021NT1 |
Produkt ist nicht verfügbar
| CA/DI-PAYSHIELD-OZ |
Hersteller: NXP USA Inc.
Description: SMART CARD ATHENA PROJ
Description: SMART CARD ATHENA PROJ
Produkt ist nicht verfügbar
| SAF7730HV/N331D,51 |
|
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Description: IC HD RADIO PROCESSOR 144HLQFP
Produkt ist nicht verfügbar
| SAF7730HV/N331D,55 |
|
Hersteller: NXP USA Inc.
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Description: IC HD RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Car Signal Processor
Operating Temperature: -40°C ~ 85°C (TA)
Clock Rate: 400MHz
Supplier Device Package: 144-HLQFP (20x20)
Produkt ist nicht verfügbar
| PUSB3TB6471 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PUSB3TB6 - TRANS VO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA PUSB3TB6 - TRANS VO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BUK753R1-40B,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 94 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6808 pF @ 25 V
auf Bestellung 294 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 294+ | 2.02 EUR |
| BUK765R2-40B118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK765R2-40B 75A, 4
Description: NOW NEXPERIA BUK765R2-40B 75A, 4
Produkt ist nicht verfügbar
| MCIMX536AVP8C2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| MCIMX536AVP8C2R2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR2, DDR3, LPDDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| 74HC594D/S400118 |
|
Hersteller: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Part Status: Obsolete
Number of Bits per Element: 8
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Part Status: Obsolete
Number of Bits per Element: 8
auf Bestellung 2944 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1110+ | 0.45 EUR |
| 74HC594DB/S400118 |
|
Hersteller: NXP USA Inc.
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Number of Bits per Element: 8
Description: SERIAL IN PARALLEL OUT
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
| 74HC594D-Q100,118 |
|
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, HC/UH SE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Grade: Automotive
Part Status: Active
Number of Bits per Element: 8
Qualification: AEC-Q100
Description: PARALLEL IN SERIAL OUT, HC/UH SE
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Grade: Automotive
Part Status: Active
Number of Bits per Element: 8
Qualification: AEC-Q100
auf Bestellung 1455 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1067+ | 0.46 EUR |
| CBTD3861PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
Description: IC BUS SWITCH 10 X 1:1 24TSSOP
Packaging: Bulk
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-TSSOP
auf Bestellung 3818 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1438+ | 0.34 EUR |
| 74LVC3G34DP/S400125 |
|
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
auf Bestellung 5832 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1480+ | 0.32 EUR |
| 74LVC1G74DP/S400125 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 8TSSOP
Packaging: Bulk
Part Status: Active
Description: IC FF D-TYPE SNGL 1BIT 8TSSOP
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BUK9E6R1-100E,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 120A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 5.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 17460 pF @ 25 V
Description: MOSFET N-CH 100V 120A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 5.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 133 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 17460 pF @ 25 V
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 285+ | 2.22 EUR |
| MCSPTE1AK144 |
|
Hersteller: NXP USA Inc.
Description: S32K144 DEV KIT FOR BLDC PMSM MO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-M4F
Board Type: Evaluation Platform
Utilized IC / Part: GD3000, S32K144
Part Status: Active
Description: S32K144 DEV KIT FOR BLDC PMSM MO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: ARM® Cortex®-M4F
Board Type: Evaluation Platform
Utilized IC / Part: GD3000, S32K144
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 596.53 EUR |
| TJA1043ATK/0Y |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 74HCT597D/AU118 |
|
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Part Status: Active
Number of Bits per Element: 8
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 179012 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 807+ | 0.6 EUR |
| 74HCT597DB,112-NXP |
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, HCT SERI
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Part Status: Active
Number of Bits per Element: 8
Description: PARALLEL IN SERIAL OUT, HCT SERI
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SSOP
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
| 74HC7030N,652 |
|
Hersteller: NXP USA Inc.
Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
Description: IC FIFO ASYNC/SYNC 64X9 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Function: Asynchronous, Synchronous
Memory Size: 576 (64 x 9)
Operating Temperature: -40°C ~ 125°C
Data Rate: 33MHz
Access Time: 36ns
Supplier Device Package: 28-DIP
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Part Status: Obsolete
Voltage - Supply: 2 V ~ 6 V
DigiKey Programmable: Not Verified
auf Bestellung 272 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 102+ | 4.78 EUR |
| NCF2957MHN4/0200IY |
Produkt ist nicht verfügbar
| NCF29A7XHN4/0200IY |
Produkt ist nicht verfügbar
| LPC11U37FBD48/401 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TEA1723AT/N1118 |
|
Hersteller: NXP USA Inc.
Description: IC CTLR SMPS W/PWR SWITCH 7-SOIC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC CTLR SMPS W/PWR SWITCH 7-SOIC
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BAS56/DG/B2215 |
|
Produkt ist nicht verfügbar
| BAV20143 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAV20 - RECTIFIER D
Packaging: Bulk
Part Status: Active
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 175°C (Max)
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 150 V
Description: NOW NEXPERIA BAV20 - RECTIFIER D
Packaging: Bulk
Part Status: Active
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 175°C (Max)
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 150 V
Produkt ist nicht verfügbar
| SAF7730HV/N312D518 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 29+ | 18.76 EUR |
| SAF7730HV/N336D518 |
|
Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 18750 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 22.35 EUR |
| SAF7730HV/N221D,51 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N221D,51
Description: SAF7730HV/N221D,51
Produkt ist nicht verfügbar
| SAF7730HV/N221D,55 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N221D,55
Description: SAF7730HV/N221D,55
Produkt ist nicht verfügbar
| SAF7730HV/N233D,51 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N233D,51
Description: SAF7730HV/N233D,51
Produkt ist nicht verfügbar
| SAF7730HV/N233D,55 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N233D,55
Description: SAF7730HV/N233D,55
Produkt ist nicht verfügbar
| SAF7730HV/N233D/S3 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N233D/S3
Description: SAF7730HV/N233D/S3
Produkt ist nicht verfügbar
| SAF7730HV/N235D,51 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N235D,51
Description: SAF7730HV/N235D,51
Produkt ist nicht verfügbar
| SAF7730HV/N235D,55 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N235D,55
Description: SAF7730HV/N235D,55
Produkt ist nicht verfügbar
| SAF7730HV/N323D,51 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N323D,51
Description: SAF7730HV/N323D,51
Produkt ist nicht verfügbar
| SAF7730HV/N323D,55 |
Hersteller: NXP USA Inc.
Description: SAF7730HV/N323D,55
Description: SAF7730HV/N323D,55
Produkt ist nicht verfügbar
| PESD18VF1BSF315 |
|
auf Bestellung 1197000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4133+ | 0.12 EUR |
| 74LV165D-Q100118 |
|
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1857+ | 0.27 EUR |
| 74LV165APW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Part Status: Active
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LV165D-Q100.118 |
|
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, 8-BIT
Description: PARALLEL IN SERIAL OUT, 8-BIT
Produkt ist nicht verfügbar
| 74LV165D/AU118 |
|
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1902+ | 0.27 EUR |
| 74AHC139PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
auf Bestellung 15416 Stücke:
Lieferzeit 10-14 Tag (e)| PHM10030DLS115 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Description: SMALL SIGNAL N-CHANNEL MOSFET
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)| PH2230DLS115 |
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 376+ | 1.41 EUR |
| TJA1044GT/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
| TJA1044GT/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 1928 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 2.02 EUR |
| 10+ | 1.82 EUR |
| 25+ | 1.73 EUR |
| 100+ | 1.42 EUR |
| 250+ | 1.33 EUR |
| 500+ | 1.17 EUR |
| 1000+ | 0.93 EUR |
| MPC563CVR40 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Produkt ist nicht verfügbar
| LD6816CX4/22P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.2V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 72000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| LD6806CX4/22P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| LPC4078FET208551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Bulk
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 208TFBGA
Packaging: Bulk
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Active
Number of I/O: 165
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC4078FBD100551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC4078FBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC4078FBD100K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.08 EUR |
| 10+ | 19.24 EUR |
| 90+ | 16.25 EUR |