Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35279) > Seite 400 nach 588
Foto | Bezeichnung | Hersteller | Beschreibung |
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UJA1132HW/FD/5V/4Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
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UJA1132HW/FD/5V/4Y | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 48-TQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 28V Current - Supply: 2.8mA Supplier Device Package: 48-HTQFP (10x10) Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 1478 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1132HW/FD/3V/4Y | NXP USA Inc. |
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UJA1132HW/FD/3V/4Y | NXP USA Inc. |
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UJA1132HW/3V3Y | NXP USA Inc. |
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UJA1132HW/3V3Y | NXP USA Inc. |
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UJA1132HW/5V0Y | NXP USA Inc. |
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UJA1132HW/5V0Y | NXP USA Inc. |
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UJA1131HW/FD/3V/4Y | NXP USA Inc. |
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UJA1131HW/5V0/S90Y | NXP USA Inc. |
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UJA1132HW/5V0/S9AY | NXP USA Inc. |
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UJA1136HW/5V0/S90Y | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC33FS8410G3ES | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C33/DG/B3215 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 3800 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMD20,115 | NXP USA Inc. |
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auf Bestellung 16411 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33972ATEKR2518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVC2G07GV-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 3788 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G07GM/S500115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 88217 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G07GM/S505125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC2G07GF/S500132 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 6298500 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G07GF/S505125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 89840 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9534D,512 | NXP USA Inc. |
![]() Features: POR Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Open Drain Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-SO Part Status: Obsolete |
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PCA9534D,518 | NXP USA Inc. |
![]() Features: POR Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Open Drain Mounting Type: Surface Mount Interface: I²C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-SO Part Status: Obsolete |
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PCF7938XA/CAAB3800122 | NXP USA Inc. | Description: STICKS |
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OM5579/PN7150RPI | NXP USA Inc. |
Description: EVAL BOARD FOR PN7150 Packaging: Bulk Function: Near Field Communication (NFC) Type: RF Contents: Board(s) Utilized IC / Part: PN7150 Platform: Arduino, BeagleBone Black, Raspberry Pi Part Status: Active |
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LPC2106FHN48/01551 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 1875 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2106FHN48/01 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Part Status: Active Number of I/O: 32 |
Produkt ist nicht verfügbar |
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LPC2103FBD48EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 70MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 32 DigiKey Programmable: Not Verified |
auf Bestellung 446 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9226-75A/C1,118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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BUK9219-55A118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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SSL21153T/1,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 50.5kHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 1.5A (Switch) Internal Switch(s): Yes Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 7-SOIC Voltage - Supply (Max): 35V |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1342FBD48.151 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1342FHN33,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 10650 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1342FBD48151 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1342FHN33,551 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 5166 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08AC60MFGE557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08AC60MFUE557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08AW60CFUE557 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PMEG2005AESF315 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 954000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG2005AESF/S711315 | NXP USA Inc. |
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auf Bestellung 135000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG2005AESFC315 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 135000 Stücke: Lieferzeit 10-14 Tag (e) |
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BYV34G-600127 | NXP USA Inc. |
Description: DIODE ARRAY GP 600V 20A I2PAK Packaging: Bulk Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 60 ns Technology: Standard Diode Configuration: 1 Pair Common Cathode Current - Average Rectified (Io) (per Diode): 20A Supplier Device Package: I2PAK Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A Current - Reverse Leakage @ Vr: 50 µA @ 600 V |
auf Bestellung 2841 Stücke: Lieferzeit 10-14 Tag (e) |
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MKW37Z512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW38Z512VFT4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MKW37A512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKW39A512VFT4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
auf Bestellung 260 Stücke: Lieferzeit 10-14 Tag (e) |
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MKW38A512VFT4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48HVQFN Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK22FN512VFX12R | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 88-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 88-QFN (10x10) Part Status: Active Number of I/O: 60 DigiKey Programmable: Not Verified |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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MK22FN512VDC12R | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 121-XFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-XFBGA (8x8) Number of I/O: 81 DigiKey Programmable: Not Verified |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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BF1206,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 400MHz Configuration: N-Channel Dual Gate Gain: 30dB Technology: MOSFET Noise Figure: 1.3dB Supplier Device Package: 6-TSSOP Part Status: Obsolete Voltage - Rated: 6 V Voltage - Test: 5 V Current - Test: 18 mA |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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BA792,115 | NXP USA Inc. |
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auf Bestellung 504000 Stücke: Lieferzeit 10-14 Tag (e) |
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TLVH431QDBZR,215 | NXP USA Inc. |
![]() Tolerance: ±1.5% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 1.24V Current - Cathode: 80 µA Current - Output: 70 mA Voltage - Output (Max): 18 V |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TLVH431QDBVR,125 | NXP USA Inc. |
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auf Bestellung 42000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMMA1200KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS 250G ROHS |
Produkt ist nicht verfügbar |
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PMMA1250KEGR2 | NXP USA Inc. | Description: IC ACCEL Z-AXIS |
Produkt ist nicht verfügbar |
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PMMA1254KEGR2 | NXP USA Inc. | Description: IC ACCEL 5G Z-AXIS |
Produkt ist nicht verfügbar |
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PMMA1260KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSUS 1.5 |
Produkt ist nicht verfügbar |
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PMMA1270KEGR2 | NXP USA Inc. | Description: IC ACCEL COLOSSUS 2.5G |
Produkt ist nicht verfügbar |
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PMMA2201KEGR2 | NXP USA Inc. | Description: IC ACCEL X-AXIS 50MV/G ROHS |
Produkt ist nicht verfügbar |
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PMMA2202KEGR2 | NXP USA Inc. | Description: IC ACCEL SMT LN X SOIC 16 |
Produkt ist nicht verfügbar |
UJA1132HW/FD/5V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
UJA1132HW/FD/5V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 28V
Current - Supply: 2.8mA
Supplier Device Package: 48-HTQFP (10x10)
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1478 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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2+ | 12.83 EUR |
10+ | 11.6 EUR |
25+ | 11.06 EUR |
100+ | 9.6 EUR |
250+ | 9.17 EUR |
500+ | 8.36 EUR |
UJA1132HW/FD/3V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
UJA1132HW/FD/3V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
UJA1131HW/FD/3V/4Y |
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Hersteller: NXP USA Inc.
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Description: BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Produkt ist nicht verfügbar
UJA1131HW/5V0/S90Y |
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Hersteller: NXP USA Inc.
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Produkt ist nicht verfügbar
UJA1132HW/5V0/S9AY |
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Hersteller: NXP USA Inc.
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Produkt ist nicht verfügbar
UJA1136HW/5V0/S90Y |
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Hersteller: NXP USA Inc.
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Description: IC SBCS CAN HIGH SPEED 48HTQFP
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC33FS8410G3ES |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8410
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: SYSTEM BASIS CHIP FS8410
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.84 EUR |
10+ | 9.79 EUR |
25+ | 9.33 EUR |
80+ | 8.1 EUR |
260+ | 8.01 EUR |
BZX84-C33/DG/B3215 |
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Hersteller: NXP USA Inc.
Description: BZX84-C33 - VOLTAGE REGULATOR DI
Packaging: Bulk
Part Status: Active
Description: BZX84-C33 - VOLTAGE REGULATOR DI
Packaging: Bulk
Part Status: Active
auf Bestellung 3800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3800+ | 0.13 EUR |
PEMD20,115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PEMD20 - SMALL SIGN
Description: NOW NEXPERIA PEMD20 - SMALL SIGN
auf Bestellung 16411 Stücke:
Lieferzeit 10-14 Tag (e)MC33972ATEKR2518 |
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Hersteller: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC2G07GV-Q100125 |
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auf Bestellung 3788 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3788+ | 0.13 EUR |
74LVC2G07GM/S500115 |
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auf Bestellung 88217 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3455+ | 0.15 EUR |
74LVC2G07GM/S505125 |
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Produkt ist nicht verfügbar
74LVC2G07GF/S500132 |
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auf Bestellung 6298500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2221+ | 0.23 EUR |
74LVC2G07GF/S505125 |
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auf Bestellung 89840 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1210+ | 0.42 EUR |
PCA9534D,512 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9534D,518 |
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Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: I²C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
OM5579/PN7150RPI |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PN7150
Packaging: Bulk
Function: Near Field Communication (NFC)
Type: RF
Contents: Board(s)
Utilized IC / Part: PN7150
Platform: Arduino, BeagleBone Black, Raspberry Pi
Part Status: Active
Description: EVAL BOARD FOR PN7150
Packaging: Bulk
Function: Near Field Communication (NFC)
Type: RF
Contents: Board(s)
Utilized IC / Part: PN7150
Platform: Arduino, BeagleBone Black, Raspberry Pi
Part Status: Active
Produkt ist nicht verfügbar
LPC2106FHN48/01551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 1875 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
17+ | 31.59 EUR |
LPC2106FHN48/01 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Active
Number of I/O: 32
Produkt ist nicht verfügbar
LPC2103FBD48EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 32
DigiKey Programmable: Not Verified
auf Bestellung 446 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.77 EUR |
10+ | 13.18 EUR |
80+ | 10.91 EUR |
BUK9226-75A/C1,118 |
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Hersteller: NXP USA Inc.
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL
Produkt ist nicht verfügbar
BUK9219-55A118 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9219-55A - POWER
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA BUK9219-55A - POWER
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
SSL21153T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
392+ | 1.25 EUR |
LPC1342FBD48.151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1342FHN33,518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 10650 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
72+ | 6.83 EUR |
LPC1342FBD48151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1342FHN33,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Bulk
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 5166 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
85+ | 5.79 EUR |
MC9S08AC60MFGE557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08AC60MFUE557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08AW60CFUE557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PMEG2005AESF315 |
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auf Bestellung 954000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7969+ | 0.07 EUR |
PMEG2005AESF/S711315 |
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Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, SCHOTTKY
Description: RECTIFIER DIODE, SCHOTTKY
auf Bestellung 135000 Stücke:
Lieferzeit 10-14 Tag (e)PMEG2005AESFC315 |
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auf Bestellung 135000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7212+ | 0.07 EUR |
BYV34G-600127 |
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 600V 20A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: I2PAK
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
Description: DIODE ARRAY GP 600V 20A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: I2PAK
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 2841 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
315+ | 1.52 EUR |
MKW37Z512VFT4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKW38Z512VFT4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 16.77 EUR |
10+ | 13.17 EUR |
80+ | 10.9 EUR |
MKW37A512VFT4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKW39A512VFT4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 17.88 EUR |
10+ | 14.05 EUR |
80+ | 11.63 EUR |
MKW38A512VFT4 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN512VFX12R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 88QFN
Packaging: Cut Tape (CT)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 88-QFN (10x10)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.16 EUR |
10+ | 16.62 EUR |
100+ | 13.76 EUR |
MK22FN512VDC12R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Cut Tape (CT)
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.03 EUR |
10+ | 16 EUR |
100+ | 13.51 EUR |
500+ | 13.43 EUR |
1000+ | 12.68 EUR |
BF1206,115 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
Description: RF MOSFET 5V 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
919+ | 0.55 EUR |
BA792,115 |
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Hersteller: NXP USA Inc.
Description: DIODE BAND-SWITCHING SOD110
Description: DIODE BAND-SWITCHING SOD110
auf Bestellung 504000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3606+ | 0.14 EUR |
TLVH431QDBZR,215 |
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Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1.5% TO236AB
Tolerance: ±1.5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
Description: IC VREF SHUNT ADJ 1.5% TO236AB
Tolerance: ±1.5%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3806+ | 0.13 EUR |
TLVH431QDBVR,125 |
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Hersteller: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
Description: IC VREF SHUNT ADJ 1.5% 5TSOP
auf Bestellung 42000 Stücke:
Lieferzeit 10-14 Tag (e)PMMA1200KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL Z-AXIS 250G ROHS
Description: IC ACCEL Z-AXIS 250G ROHS
Produkt ist nicht verfügbar
PMMA1270KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL COLOSSUS 2.5G
Description: IC ACCEL COLOSSUS 2.5G
Produkt ist nicht verfügbar
PMMA2201KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL X-AXIS 50MV/G ROHS
Description: IC ACCEL X-AXIS 50MV/G ROHS
Produkt ist nicht verfügbar
PMMA2202KEGR2 |
Hersteller: NXP USA Inc.
Description: IC ACCEL SMT LN X SOIC 16
Description: IC ACCEL SMT LN X SOIC 16
Produkt ist nicht verfügbar