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RD772BJBTPLEVB NXP USA Inc. Description: RD772BJBTPLEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Produkt ist nicht verfügbar
RD772BJBTPL8EVB NXP USA Inc. Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
QN9090-001-T10 QN9090-001-T10 NXP USA Inc. QN9090-FS.pdf Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
P3T1755DPZ P3T1755DPZ NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode, One-Shot
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
P3T1755DPZ P3T1755DPZ NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode, One-Shot
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 1701 Stücke:
Lieferzeit 10-14 Tag (e)
24+0.75 EUR
26+ 0.69 EUR
100+ 0.61 EUR
250+ 0.6 EUR
500+ 0.59 EUR
1000+ 0.58 EUR
Mindestbestellmenge: 24
SL3S1206FUD2/HAPZ NXP USA Inc. UCODE9FSA4.pdf Description: SL3S1206FUD2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SL3S1206FUD2/HAPZ NXP USA Inc. UCODE9FSA4.pdf Description: SL3S1206FUD2
Packaging: Cut Tape (CT)
auf Bestellung 388461 Stücke:
Lieferzeit 10-14 Tag (e)
112+0.16 EUR
278+ 0.063 EUR
298+ 0.059 EUR
336+ 0.052 EUR
500+ 0.051 EUR
1000+ 0.05 EUR
5000+ 0.045 EUR
Mindestbestellmenge: 112
P3T1750DPZ NXP USA Inc. Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
P3T1750DPZ NXP USA Inc. Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
MCF51JF128VHS MCF51JF128VHS NXP USA Inc. FSCL-S-A0000577550-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
58+9.2 EUR
Mindestbestellmenge: 58
MC33742PEP MC33742PEP NXP USA Inc. www.nxp.com Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
60+8.2 EUR
Mindestbestellmenge: 60
MC33742PEG MC33742PEG NXP USA Inc. Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
NCF2961VHN2/0200EJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961XHN2/0200EJ NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961XHN3/0200EY NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961EHN3/0200EY NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
LPC55S26JBD64Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S26JEV98Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+7.26 EUR
Mindestbestellmenge: 2000
LPC55S26JBD64E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.19 EUR
10+ 8.38 EUR
25+ 8.22 EUR
40+ 8.16 EUR
160+ 7.32 EUR
Mindestbestellmenge: 2
LPC55S26JBD100Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+7.39 EUR
Mindestbestellmenge: 1000
LPC55S28JBD64Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S28JEV98Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S26JEV98E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.52 EUR
10+ 9.6 EUR
25+ 9.42 EUR
40+ 9.35 EUR
80+ 8.39 EUR
260+ 8.36 EUR
Mindestbestellmenge: 2
LPC55S26JBD100E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.37 EUR
10+ 9.46 EUR
25+ 9.28 EUR
40+ 9.21 EUR
90+ 8.27 EUR
Mindestbestellmenge: 2
LPC55S28JBD64E NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S28JBD100Y NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S28JEV98E NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S28JBD100E NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
MC44BS374T1EFR2 MC44BS374T1EFR2 NXP USA Inc. MC44BS374T1.pdf Description: IC NTSC/PAL MODULATOR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BC817-16W,135 BC817-16W,135 NXP USA Inc. PIRSS13150-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC817-16W - SMALL S
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 40000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
RHRG5060 RHRG5060 NXP USA Inc. ONSM-S-A0003589247-1.pdf?t.download=true&u=5oefqw Description: RECTIFIER DIODE, AVALANCHE, 1 PH
Packaging: Bulk
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Avalanche
Current - Average Rectified (Io): 50A
Supplier Device Package: TO-247-2
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 600 V
auf Bestellung 318 Stücke:
Lieferzeit 10-14 Tag (e)
141+3.51 EUR
Mindestbestellmenge: 141
A3T18H400W23SR6 NXP USA Inc. A3T18H400W23S.pdf Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 170W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
74AHC2G32GD,125 74AHC2G32GD,125 NXP USA Inc. 74AHC_AHCT2G32.pdf Description: IC GATE OR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 11541 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
74HC138DB112 74HC138DB112 NXP USA Inc. 74HC_HCT138.pdf Description: NOW NEXPERIA 74HC138DB - DECODER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
MC9S08AC128MLKE MC9S08AC128MLKE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NVT4558-4858-EVB NXP USA Inc. UM11855.pdf Description: NVT4558HK EVAL BOARD
Packaging: Box
Function: Transceiver
Type: Interface
Utilized IC / Part: NVT4558, NVT4858
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+380.14 EUR
PCA85133U/2DA/Q1Z NXP USA Inc. PCA85133.pdf Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: Die
Grade: Automotive
Current - Supply: 50 mA
Qualification: AEC-Q100
auf Bestellung 11440 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.12 EUR
10+ 3.69 EUR
25+ 3.48 EUR
80+ 2.97 EUR
230+ 2.79 EUR
440+ 2.44 EUR
945+ 2.02 EUR
2400+ 1.88 EUR
4900+ 1.81 EUR
Mindestbestellmenge: 5
PBSS4021SP PBSS4021SP NXP USA Inc. PHGLS21532-1.pdf?t.download=true&u=5oefqw Description: POWER BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
74AHCT1G17GW125 74AHCT1G17GW125 NXP USA Inc. 74AHC_AHCT1G17.pdf Description: BUFFER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
LD6836TD/14H,125 LD6836TD/14H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 1.4V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 29980 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.18 EUR
Mindestbestellmenge: 2664
PCA9600DP/S911Z PCA9600DP/S911Z NXP USA Inc. PCA9600.pdf Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
74HCT112DB,112 74HCT112DB,112 NXP USA Inc. 74HC_HCT112.pdf Description: IC FF JK TYPE DUAL 1BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 3276 Stücke:
Lieferzeit 10-14 Tag (e)
1211+0.41 EUR
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74HCT112D,653 74HCT112D,653 NXP USA Inc. 74HC_HCT112.pdf Description: IC FF JK TYPE DUAL 1BIT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 2480 Stücke:
Lieferzeit 10-14 Tag (e)
1598+0.31 EUR
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MPX5700D MPX5700D NXP USA Inc. MPX5700.pdf Description: SENSOR 101.53PSID 4.7V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.2 V ~ 4.7 V
Operating Pressure: 101.53PSI (700kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 406.11PSI (2800kPa)
auf Bestellung 2036 Stücke:
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125+ 29.92 EUR
500+ 27.93 EUR
MRFE6VP6600NR3 MRFE6VP6600NR3 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 50V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 24.7dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MRFE6VP6600NR3 MRFE6VP6600NR3 NXP USA Inc. RF_%20Gde.pdf Description: RF MOSFET LDMOS 50V OM780-4
Packaging: Cut Tape (CT)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 24.7dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
1+147.03 EUR
74LVC1G08GN,132 74LVC1G08GN,132 NXP USA Inc. PHGLS25110-1.pdf?t.download=true&u=5oefqw Description: IC GATE AND 1CH 2-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 226720 Stücke:
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BAS21PG115 BAS21PG115 NXP USA Inc. BAS21PG.pdf Description: BAS21PG - RECTIFIER DIODE
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 225mA
Supplier Device Package: SOT-353
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Produkt ist nicht verfügbar
BY459-1500,127 BY459-1500,127 NXP USA Inc. BY459-1500%28S%29.pdf Description: DIODE GEN PURP 1.5KV 12A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Produkt ist nicht verfügbar
MC33664ATL1EGR2 MC33664ATL1EGR2 NXP USA Inc. MC33664_SDS.pdf Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
MC33664ATL1EGR2 MC33664ATL1EGR2 NXP USA Inc. MC33664_SDS.pdf Description: TRANSFORMER PHYSICAL LAYER
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
auf Bestellung 1928 Stücke:
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2+13.66 EUR
10+ 12.35 EUR
25+ 11.77 EUR
100+ 10.22 EUR
250+ 9.76 EUR
500+ 8.9 EUR
1000+ 7.75 EUR
Mindestbestellmenge: 2
1PS181,115 1PS181,115 NXP USA Inc. 1PS181_DS_Rev_Feb2017.pdf Description: DIODE ARRAY GP 80V 215MA SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SMT3; MPAK
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
PDTA123JMB,315 PDTA123JMB,315 NXP USA Inc. PHGLS24660-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 190000 Stücke:
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Mindestbestellmenge: 11225
MCIMX7S5EVK08SC MCIMX7S5EVK08SC NXP USA Inc. PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 508 Stücke:
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16+31.89 EUR
Mindestbestellmenge: 16
74AUP1G74GF,115 74AUP1G74GF,115 NXP USA Inc. PHGLS29134-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Number of Bits per Element: 1
auf Bestellung 162372 Stücke:
Lieferzeit 10-14 Tag (e)
2004+0.25 EUR
Mindestbestellmenge: 2004
74LVCH16245AEV557 74LVCH16245AEV557 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G557 74LVCH16245AEV/G557 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G551 74LVCH16245AEV/G551 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G518 74LVCH16245AEV/G518 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV518 74LVCH16245AEV518 NXP USA Inc. 74LVC_LVCH16245A.pdf Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
RD772BJBTPLEVB
Hersteller: NXP USA Inc.
Description: RD772BJBTPLEVB
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Produkt ist nicht verfügbar
RD772BJBTPL8EVB
Hersteller: NXP USA Inc.
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
QN9090-001-T10 QN9090-FS.pdf
QN9090-001-T10
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
P3T1755DPZ P3T1755.pdf
P3T1755DPZ
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode, One-Shot
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
P3T1755DPZ P3T1755.pdf
P3T1755DPZ
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Features: Shutdown Mode, One-Shot
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 1701 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
24+0.75 EUR
26+ 0.69 EUR
100+ 0.61 EUR
250+ 0.6 EUR
500+ 0.59 EUR
1000+ 0.58 EUR
Mindestbestellmenge: 24
SL3S1206FUD2/HAPZ UCODE9FSA4.pdf
Hersteller: NXP USA Inc.
Description: SL3S1206FUD2
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SL3S1206FUD2/HAPZ UCODE9FSA4.pdf
Hersteller: NXP USA Inc.
Description: SL3S1206FUD2
Packaging: Cut Tape (CT)
auf Bestellung 388461 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
112+0.16 EUR
278+ 0.063 EUR
298+ 0.059 EUR
336+ 0.052 EUR
500+ 0.051 EUR
1000+ 0.05 EUR
5000+ 0.045 EUR
Mindestbestellmenge: 112
P3T1750DPZ
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
P3T1750DPZ
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
MCF51JF128VHS FSCL-S-A0000577550-1.pdf?t.download=true&u=5oefqw
MCF51JF128VHS
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
58+9.2 EUR
Mindestbestellmenge: 58
MC33742PEP www.nxp.com
MC33742PEP
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 48-QFN-EP (7x7)
auf Bestellung 210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
60+8.2 EUR
Mindestbestellmenge: 60
MC33742PEG
MC33742PEG
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Produkt ist nicht verfügbar
NCF2961VHN2/0200EJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961XHN2/0200EJ
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961XHN3/0200EY
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
NCF2961EHN3/0200EY
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
LPC55S26JBD64Y LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S26JEV98Y LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+7.26 EUR
Mindestbestellmenge: 2000
LPC55S26JBD64E LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.19 EUR
10+ 8.38 EUR
25+ 8.22 EUR
40+ 8.16 EUR
160+ 7.32 EUR
Mindestbestellmenge: 2
LPC55S26JBD100Y LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+7.39 EUR
Mindestbestellmenge: 1000
LPC55S28JBD64Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S28JEV98Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S26JEV98E LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.52 EUR
10+ 9.6 EUR
25+ 9.42 EUR
40+ 9.35 EUR
80+ 8.39 EUR
260+ 8.36 EUR
Mindestbestellmenge: 2
LPC55S26JBD100E LPC55S2x_LPC552x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.37 EUR
10+ 9.46 EUR
25+ 9.28 EUR
40+ 9.21 EUR
90+ 8.27 EUR
Mindestbestellmenge: 2
LPC55S28JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Produkt ist nicht verfügbar
LPC55S28JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S28JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
Produkt ist nicht verfügbar
LPC55S28JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Produkt ist nicht verfügbar
MC44BS374T1EFR2 MC44BS374T1.pdf
MC44BS374T1EFR2
Hersteller: NXP USA Inc.
Description: IC NTSC/PAL MODULATOR 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BC817-16W,135 PIRSS13150-1.pdf?t.download=true&u=5oefqw
BC817-16W,135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC817-16W - SMALL S
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 40000 Stücke:
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Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
RHRG5060 ONSM-S-A0003589247-1.pdf?t.download=true&u=5oefqw
RHRG5060
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE, AVALANCHE, 1 PH
Packaging: Bulk
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Avalanche
Current - Average Rectified (Io): 50A
Supplier Device Package: TO-247-2
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 50 A
Current - Reverse Leakage @ Vr: 250 µA @ 600 V
auf Bestellung 318 Stücke:
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Anzahl Preis ohne MwSt
141+3.51 EUR
Mindestbestellmenge: 141
A3T18H400W23SR6 A3T18H400W23S.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 1.88GHz
Configuration: Dual
Power - Output: 170W
Gain: 16.8dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 300 mA
Produkt ist nicht verfügbar
74AHC2G32GD,125 74AHC_AHCT2G32.pdf
74AHC2G32GD,125
Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8-XSON
Packaging: Bulk
auf Bestellung 11541 Stücke:
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2049+0.24 EUR
Mindestbestellmenge: 2049
74HC138DB112 74HC_HCT138.pdf
74HC138DB112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC138DB - DECODER
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Produkt ist nicht verfügbar
MC9S08AC128MLKE MC9S08AC128.pdf
MC9S08AC128MLKE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NVT4558-4858-EVB UM11855.pdf
Hersteller: NXP USA Inc.
Description: NVT4558HK EVAL BOARD
Packaging: Box
Function: Transceiver
Type: Interface
Utilized IC / Part: NVT4558, NVT4858
Supplied Contents: Board(s)
Embedded: No
auf Bestellung 1 Stücke:
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Anzahl Preis ohne MwSt
1+380.14 EUR
PCA85133U/2DA/Q1Z PCA85133.pdf
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT DIE
Packaging: Tray
Package / Case: Die
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Supplier Device Package: Die
Grade: Automotive
Current - Supply: 50 mA
Qualification: AEC-Q100
auf Bestellung 11440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.12 EUR
10+ 3.69 EUR
25+ 3.48 EUR
80+ 2.97 EUR
230+ 2.79 EUR
440+ 2.44 EUR
945+ 2.02 EUR
2400+ 1.88 EUR
4900+ 1.81 EUR
Mindestbestellmenge: 5
PBSS4021SP PHGLS21532-1.pdf?t.download=true&u=5oefqw
PBSS4021SP
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR
Packaging: Bulk
Produkt ist nicht verfügbar
74AHCT1G17GW125 74AHC_AHCT1G17.pdf
74AHCT1G17GW125
Hersteller: NXP USA Inc.
Description: BUFFER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
LD6836TD/14H,125 LD6836.pdf
LD6836TD/14H,125
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 29980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2664+0.18 EUR
Mindestbestellmenge: 2664
PCA9600DP/S911Z PCA9600.pdf
PCA9600DP/S911Z
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
74HCT112DB,112 74HC_HCT112.pdf
74HCT112DB,112
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 3276 Stücke:
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Anzahl Preis ohne MwSt
1211+0.41 EUR
Mindestbestellmenge: 1211
74HCT112D,653 74HC_HCT112.pdf
74HCT112D,653
Hersteller: NXP USA Inc.
Description: IC FF JK TYPE DUAL 1BIT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 2480 Stücke:
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Anzahl Preis ohne MwSt
1598+0.31 EUR
Mindestbestellmenge: 1598
MPX5700D MPX5700.pdf
MPX5700D
Hersteller: NXP USA Inc.
Description: SENSOR 101.53PSID 4.7V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.2 V ~ 4.7 V
Operating Pressure: 101.53PSI (700kPa)
Pressure Type: Differential
Accuracy: ±2.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 406.11PSI (2800kPa)
auf Bestellung 2036 Stücke:
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1+41.89 EUR
10+ 34.91 EUR
25+ 30.92 EUR
125+ 29.92 EUR
500+ 27.93 EUR
MRFE6VP6600NR3 RF_%20Gde.pdf
MRFE6VP6600NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM780-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 24.7dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MRFE6VP6600NR3 RF_%20Gde.pdf
MRFE6VP6600NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM780-4
Packaging: Cut Tape (CT)
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 24.7dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+147.03 EUR
74LVC1G08GN,132 PHGLS25110-1.pdf?t.download=true&u=5oefqw
74LVC1G08GN,132
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 226720 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2882+0.16 EUR
Mindestbestellmenge: 2882
BAS21PG115 BAS21PG.pdf
BAS21PG115
Hersteller: NXP USA Inc.
Description: BAS21PG - RECTIFIER DIODE
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 225mA
Supplier Device Package: SOT-353
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 250 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Produkt ist nicht verfügbar
BY459-1500,127 BY459-1500%28S%29.pdf
BY459-1500,127
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 1.5KV 12A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Produkt ist nicht verfügbar
MC33664ATL1EGR2 MC33664_SDS.pdf
MC33664ATL1EGR2
Hersteller: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
Produkt ist nicht verfügbar
MC33664ATL1EGR2 MC33664_SDS.pdf
MC33664ATL1EGR2
Hersteller: NXP USA Inc.
Description: TRANSFORMER PHYSICAL LAYER
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Applications: Isolated Communications Interface
Current - Supply: 40mA
Supplier Device Package: 16-SOIC
auf Bestellung 1928 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.66 EUR
10+ 12.35 EUR
25+ 11.77 EUR
100+ 10.22 EUR
250+ 9.76 EUR
500+ 8.9 EUR
1000+ 7.75 EUR
Mindestbestellmenge: 2
1PS181,115 1PS181_DS_Rev_Feb2017.pdf
1PS181,115
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 80V 215MA SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Supplier Device Package: SMT3; MPAK
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 100 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
PDTA123JMB,315 PHGLS24660-1.pdf?t.download=true&u=5oefqw
PDTA123JMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 190000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11225+0.049 EUR
Mindestbestellmenge: 11225
MCIMX7S5EVK08SC PHGL-S-A0003204178-1.pdf?t.download=true&u=5oefqw
MCIMX7S5EVK08SC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX7S 800MHZ 488TFBGA
Packaging: Bulk
Package / Case: 488-TFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 488-TFBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, MIPI
Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Additional Interfaces: AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
auf Bestellung 508 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
16+31.89 EUR
Mindestbestellmenge: 16
74AUP1G74GF,115 PHGLS29134-1.pdf?t.download=true&u=5oefqw
74AUP1G74GF,115
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 315 MHz
Input Capacitance: 0.6 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Number of Bits per Element: 1
auf Bestellung 162372 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2004+0.25 EUR
Mindestbestellmenge: 2004
74LVCH16245AEV557 74LVC_LVCH16245A.pdf
74LVCH16245AEV557
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G557 74LVC_LVCH16245A.pdf
74LVCH16245AEV/G557
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G551 74LVC_LVCH16245A.pdf
74LVCH16245AEV/G551
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV/G518 74LVC_LVCH16245A.pdf
74LVCH16245AEV/G518
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
74LVCH16245AEV518 74LVC_LVCH16245A.pdf
74LVCH16245AEV518
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
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