Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 515 nach 591
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| MK10DX256VLL7557 | NXP USA Inc. |
 Description: KINETIS K10: MICROCONTROLLER CORPackaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9601DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 1CH 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Delay Time: 100ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 15V Applications: I2C Current - Supply: 5.5mA Data Rate (Max): 1MHz Supplier Device Package: 8-TSSOP Capacitance - Input: 10 pF |
auf Bestellung 3014 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8272VRTIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MC33814AER2 | NXP USA Inc. |
Description: IC CTRL SMALL ENG 2CYL 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 36V Applications: Small Engine Current - Supply: 10mA Supplier Device Package: 48-LQFP-EP (7x7) |
Produkt ist nicht verfügbar |
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MC33814AER2 | NXP USA Inc. |
Description: IC CTRL SMALL ENG 2CYL 48LQFP Packaging: Cut Tape (CT) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 36V Applications: Small Engine Current - Supply: 10mA Supplier Device Package: 48-LQFP-EP (7x7) |
auf Bestellung 1993 Stücke: Lieferzeit 10-14 Tag (e) |
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| SC900950AER2 | NXP USA Inc. |
Description: SOLENOID DRIVER, 8 DRV, MOTOR PU Packaging: Tape & Reel (TR) |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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| SC900950AER2 | NXP USA Inc. |
Description: SOLENOID DRIVER, 8 DRV, MOTOR PU Packaging: Cut Tape (CT) |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC865M201JHI33/0E | NXP USA Inc. |
Description: IC MCU CORTEX M0+ HVQFN32 Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 |
auf Bestellung 446 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC865M201JHI33/0K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32VFQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, I³C, SMBus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 29 |
Produkt ist nicht verfügbar |
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| HEF4043BT-Q100118 | NXP USA Inc. |
Description: R-S LATCH, HIGH LEVEL TRIGGERED Packaging: Bulk |
Produkt ist nicht verfügbar |
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| HEF4043BP | NXP USA Inc. |
Description: R-S LATCH, HIGH LEVEL TRIGGERED Packaging: Bulk |
Produkt ist nicht verfügbar |
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HEF4043BP,652 | NXP USA Inc. |
Description: IC R/S LATCH 3-STATE QUAD 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Tri-State Mounting Type: Through Hole Circuit: 1:1 Logic Type: S-R Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 15V Independent Circuits: 4 Current - Output High, Low: 3mA, 3mA Delay Time - Propagation: 15ns Supplier Device Package: 16-DIP |
auf Bestellung 728 Stücke: Lieferzeit 10-14 Tag (e) |
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HEF4043BP,652 | NXP USA Inc. |
Description: IC R/S LATCH 3-STATE QUAD 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Tri-State Mounting Type: Through Hole Circuit: 1:1 Logic Type: S-R Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 15V Independent Circuits: 4 Current - Output High, Low: 3mA, 3mA Delay Time - Propagation: 15ns Supplier Device Package: 16-DIP |
Produkt ist nicht verfügbar |
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PTN3222CUK-EVB | NXP USA Inc. |
Description: EUSB2 USB2 REDRIVER EVAL Packaging: Box Function: Re-Driver Type: Interface Utilized IC / Part: PTN3222 Supplied Contents: Board(s) Embedded: No |
Produkt ist nicht verfügbar |
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PTN3222GMJ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 QFN12 Packaging: Tape & Reel (TR) Package / Case: 12-XFQFN Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-XQFN (1.75x2.2) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
Produkt ist nicht verfügbar |
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PTN3222GMJ | NXP USA Inc. |
Description: IC EUSB2 TO USB2 QFN12 Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-XQFN (1.75x2.2) Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: 10 pF |
auf Bestellung 14534 Stücke: Lieferzeit 10-14 Tag (e) |
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| PTN3222EUKZ | NXP USA Inc. |
Description: USB INTERFACE IC PTN3222EUK Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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AFT20P140-4WNR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V OM780-4 Packaging: Bulk Package / Case: OM-780-4L Mounting Type: Surface Mount Frequency: 1.88GHz ~ 1.91GHz Configuration: Dual Power - Output: 24W Gain: 17.8dB Technology: LDMOS Supplier Device Package: OM-780-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
auf Bestellung 10473 Stücke: Lieferzeit 10-14 Tag (e) |
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| AFRX5G372T4 | NXP USA Inc. |
Description: AIRFAST RX MODULE, 3300-5000 MHZ Packaging: Tape & Reel (TR) Package / Case: 20-LFLGA Exposed Pad Frequency: 3.3GHz ~ 5GHz RF Type: 5G, LTE Supplier Device Package: 21-HLLGA (6.2x6.2) |
Produkt ist nicht verfügbar |
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| S908QY4AE0CDTE | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S908QY4AE0MDTER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| WLAN7205CY | NXP USA Inc. |
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ Packaging: Tape & Reel (TR) Features: SPDT Package / Case: 16-WFLGA Exposed Pad Frequency: 5.15GHz ~ 7.125GHz RF Type: WLAN Supplier Device Package: 16-HWFLGA (2x2) |
Produkt ist nicht verfügbar |
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MPC8378EVRANGA | NXP USA Inc. |
Description: IC MPU MPC83XX 800MHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
Produkt ist nicht verfügbar |
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MC9S08MM64CLH | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x16b; D/A 1x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MX8-DSI-OLED1A | NXP USA Inc. |
Description: OLED DISPLAY MIPI-DSI 1080P Packaging: Box Function: OLED Type: Display Contents: Board(s) Utilized IC / Part: i.MX 8M Mini |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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BZB784-C10,115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C10 - ZENER Packaging: Bulk Tolerance: ±5% Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Configuration: 1 Pair Common Anode Voltage - Zener (Nom) (Vz): 10 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-323 Power - Max: 180 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 200 nA @ 7 V |
Produkt ist nicht verfügbar |
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| BZB784-C4V3115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C4V3 - ZENER Packaging: Bulk |
Produkt ist nicht verfügbar |
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BZB784-C9V1,115 | NXP USA Inc. |
Description: DIODE ZENER DUAL 9.1V SOT323 Packaging: Bulk |
auf Bestellung 11940 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZB784-C4V3,115 | NXP USA Inc. |
Description: DIODE ZENER DUAL 4.3V SOT323 Packaging: Bulk |
auf Bestellung 113500 Stücke: Lieferzeit 10-14 Tag (e) |
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| BZB784-C2V4,115 | NXP USA Inc. |
Description: DIODE ZENER DUAL 2.4V SOT323 Packaging: Bulk |
auf Bestellung 23500 Stücke: Lieferzeit 10-14 Tag (e) |
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MBC13917EPR2 | NXP USA Inc. |
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD Packaging: Tape & Reel (TR) Package / Case: 6-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.1V ~ 3.3V Gain: 14.9dB Current - Supply: 20mA Noise Figure: 1.8dB P1dB: -1.1dB Test Frequency: 1.9GHz Supplier Device Package: 6-MLPD-EP (1.5x2) |
Produkt ist nicht verfügbar |
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MBC13917EPR2 | NXP USA Inc. |
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD Packaging: Cut Tape (CT) Package / Case: 6-UFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 100MHz ~ 2.5GHz RF Type: General Purpose Voltage - Supply: 2.1V ~ 3.3V Gain: 14.9dB Current - Supply: 20mA Noise Figure: 1.8dB P1dB: -1.1dB Test Frequency: 1.9GHz Supplier Device Package: 6-MLPD-EP (1.5x2) |
Produkt ist nicht verfügbar |
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| S9S12VR48AACLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AACLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| S9S12VR48AACLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAVLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAMLCR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAMLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAMLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAVLC | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 2x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 16 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAVLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAMLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| S9S12VR48AAVLF | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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| PCA9450B-EVK | NXP USA Inc. |
Description: PCA9450B-EVK Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: PCA9450 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes |
Produkt ist nicht verfügbar |
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| PCA9450C-EVK | NXP USA Inc. |
Description: PCA9450C-EVK Packaging: Bulk Function: Power Supply Type: Power Management Utilized IC / Part: PCA9450 Supplied Contents: Board(s), Cable(s), Accessories Embedded: Yes |
Produkt ist nicht verfügbar |
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| PCA9450AA-EVK | NXP USA Inc. |
Description: PCA9450AA-EVK Packaging: Bulk |
Produkt ist nicht verfügbar |
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| AFLP5G25641T6 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 2300- Packaging: Tape & Reel (TR) Package / Case: 17-LFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: General Purpose Voltage - Supply: 3.3V, 5V Gain: 32dB Current - Supply: 2.2mA P1dB: 29dBm Test Frequency: 2.5GHz Supplier Device Package: 17-HLFLGA (4x3) |
Produkt ist nicht verfügbar |
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| A3M40PD012T7 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 2300- Packaging: Tape & Reel (TR) Package / Case: 12-WFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: Cellular Voltage - Supply: 3.3V Gain: 34dB Current - Supply: 90mA P1dB: 25dBm Test Frequency: 3.5GHz Supplier Device Package: 12-PLGA (2.2x2.2) |
Produkt ist nicht verfügbar |
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| AFLP5G35645T6 | NXP USA Inc. |
Description: AIRFAST PRE-DRIVER MODULE, 3400- Packaging: Tape & Reel (TR) Package / Case: 17-LFLGA Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: General Purpose Voltage - Supply: 3.3V, 5V Gain: 31.5dB Current - Supply: 2.2mA P1dB: 29dBm Test Frequency: 3.5GHz Supplier Device Package: 17-HLFLGA (4x3) |
Produkt ist nicht verfügbar |
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| AFSC5G23E37T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.4GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 35dB Test Frequency: 2.3GHz, 2.4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| AFSC5G26E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 31V Gain: 32dB Current - Supply: 48mA Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| AFSC5G26F38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 36.7dB Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| AFSC5G35E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.7GHz RF Type: General Purpose Voltage - Supply: 24V ~ 31V Gain: 30.5dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| AFSC5G40E38T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 4GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dB Test Frequency: 4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
||||||||||||||||||||
| AFSC5G23E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| AFSC5G26E39T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28dB Current - Supply: 65mA Test Frequency: 2.69GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| A3M35TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 28.8dBm Test Frequency: 3.4GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| A3M39TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.7GHz ~ 3.98GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.6dB Test Frequency: 3.98GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
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| A3M37TL039T2 | NXP USA Inc. |
Description: AIRFAST POWER AMPLIFIER MODULE, Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.6GHz ~ 3.8GHz RF Type: 5G, LTE Voltage - Supply: 24V ~ 30V Gain: 27.1dB Test Frequency: 3.6GHz Supplier Device Package: 26-HLQFN (10x6) |
Produkt ist nicht verfügbar |
| MK10DX256VLL7557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: KINETIS K10: MICROCONTROLLER COR
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA9601DPZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Delay Time: 100ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.5mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
auf Bestellung 3014 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.81 EUR |
| 10+ | 7.02 EUR |
| 25+ | 6.64 EUR |
| 100+ | 5.75 EUR |
| 250+ | 5.46 EUR |
| 500+ | 4.9 EUR |
| 1000+ | 4.13 EUR |
| MPC8272VRTIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
| MC33814AER2 |
|
Hersteller: NXP USA Inc.
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Produkt ist nicht verfügbar
| MC33814AER2 |
|
Hersteller: NXP USA Inc.
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: IC CTRL SMALL ENG 2CYL 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 36V
Applications: Small Engine
Current - Supply: 10mA
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 1993 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.52 EUR |
| 10+ | 16.72 EUR |
| 25+ | 15.94 EUR |
| 100+ | 13.84 EUR |
| 250+ | 13.22 EUR |
| 500+ | 12.05 EUR |
| 1000+ | 10.5 EUR |
| SC900950AER2 |
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1500+ | 11 EUR |
| SC900950AER2 |
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.35 EUR |
| 10+ | 14.12 EUR |
| 25+ | 13.83 EUR |
| 50+ | 13.78 EUR |
| 100+ | 12.36 EUR |
| 250+ | 11.99 EUR |
| 500+ | 11.4 EUR |
| LPC865M201JHI33/0E |
|
Hersteller: NXP USA Inc.
Description: IC MCU CORTEX M0+ HVQFN32
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
Description: IC MCU CORTEX M0+ HVQFN32
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
auf Bestellung 446 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.33 EUR |
| 10+ | 3.48 EUR |
| 25+ | 2.99 EUR |
| 80+ | 2.53 EUR |
| 230+ | 2.21 EUR |
| LPC865M201JHI33/0K |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, I³C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
Description: IC MCU 32BIT 64KB FLASH 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, I³C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 29
Produkt ist nicht verfügbar
| HEF4043BT-Q100118 |
|
Produkt ist nicht verfügbar
| HEF4043BP |
|
Produkt ist nicht verfügbar
| HEF4043BP,652 |
|
Hersteller: NXP USA Inc.
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
auf Bestellung 728 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 728+ | 0.67 EUR |
| HEF4043BP,652 |
|
Hersteller: NXP USA Inc.
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
Description: IC R/S LATCH 3-STATE QUAD 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:1
Logic Type: S-R Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 4
Current - Output High, Low: 3mA, 3mA
Delay Time - Propagation: 15ns
Supplier Device Package: 16-DIP
Produkt ist nicht verfügbar
| PTN3222CUK-EVB |
|
Hersteller: NXP USA Inc.
Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
Description: EUSB2 USB2 REDRIVER EVAL
Packaging: Box
Function: Re-Driver
Type: Interface
Utilized IC / Part: PTN3222
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
| PTN3222GMJ |
|
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 QFN12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
| PTN3222GMJ |
|
Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 QFN12
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-XQFN (1.75x2.2)
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: 10 pF
auf Bestellung 14534 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.2 EUR |
| 10+ | 2.87 EUR |
| 25+ | 2.71 EUR |
| 100+ | 2.31 EUR |
| 250+ | 2.17 EUR |
| 500+ | 1.9 EUR |
| 1000+ | 1.57 EUR |
| 2500+ | 1.46 EUR |
| 5000+ | 1.41 EUR |
| PTN3222EUKZ |
Produkt ist nicht verfügbar
| AFT20P140-4WNR3 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 28V OM780-4
Packaging: Bulk
Package / Case: OM-780-4L
Mounting Type: Surface Mount
Frequency: 1.88GHz ~ 1.91GHz
Configuration: Dual
Power - Output: 24W
Gain: 17.8dB
Technology: LDMOS
Supplier Device Package: OM-780-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
auf Bestellung 10473 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 134.02 EUR |
| AFRX5G372T4 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
Description: AIRFAST RX MODULE, 3300-5000 MHZ
Packaging: Tape & Reel (TR)
Package / Case: 20-LFLGA Exposed Pad
Frequency: 3.3GHz ~ 5GHz
RF Type: 5G, LTE
Supplier Device Package: 21-HLLGA (6.2x6.2)
Produkt ist nicht verfügbar
| S908QY4AE0CDTE |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, 8MHZ, CM
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S908QY4AE0MDTER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| WLAN7205CY |
Hersteller: NXP USA Inc.
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Features: SPDT
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
| MPC8378EVRANGA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Produkt ist nicht verfügbar
| MC9S08MM64CLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x16b; D/A 1x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI, USB
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MX8-DSI-OLED1A |
|
Hersteller: NXP USA Inc.
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
Description: OLED DISPLAY MIPI-DSI 1080P
Packaging: Box
Function: OLED
Type: Display
Contents: Board(s)
Utilized IC / Part: i.MX 8M Mini
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 925.3 EUR |
| BZB784-C10,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Description: NOW NEXPERIA BZB784-C10 - ZENER
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Configuration: 1 Pair Common Anode
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-323
Power - Max: 180 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 200 nA @ 7 V
Produkt ist nicht verfügbar
| BZB784-C4V3115 |
|
Produkt ist nicht verfügbar
| BZB784-C9V1,115 |
|
auf Bestellung 11940 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11940+ | 0.053 EUR |
| BZB784-C4V3,115 |
|
auf Bestellung 113500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10452+ | 0.053 EUR |
| BZB784-C2V4,115 |
|
auf Bestellung 23500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10452+ | 0.053 EUR |
| MBC13917EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Tape & Reel (TR)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
| MBC13917EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Description: IC AMP GPS 100MHZ-2.5GHZ 6MLPD
Packaging: Cut Tape (CT)
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.5GHz
RF Type: General Purpose
Voltage - Supply: 2.1V ~ 3.3V
Gain: 14.9dB
Current - Supply: 20mA
Noise Figure: 1.8dB
P1dB: -1.1dB
Test Frequency: 1.9GHz
Supplier Device Package: 6-MLPD-EP (1.5x2)
Produkt ist nicht verfügbar
| S9S12VR48AACLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AACLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AACLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S9S12VR48AACLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S9S12VR48AAVLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AAMLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AAMLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AAMLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S9S12VR48AAVLC |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 2x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 16
Produkt ist nicht verfügbar
| S9S12VR48AAVLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S9S12VR48AAMLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S9S12VR48AAVLF |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| PCA9450B-EVK |
Hersteller: NXP USA Inc.
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Description: PCA9450B-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
| PCA9450C-EVK |
Hersteller: NXP USA Inc.
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Description: PCA9450C-EVK
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PCA9450
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes
Produkt ist nicht verfügbar
| PCA9450AA-EVK |
Produkt ist nicht verfügbar
| AFLP5G25641T6 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 32dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 2.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
| A3M40PD012T7 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Description: AIRFAST PRE-DRIVER MODULE, 2300-
Packaging: Tape & Reel (TR)
Package / Case: 12-WFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: Cellular
Voltage - Supply: 3.3V
Gain: 34dB
Current - Supply: 90mA
P1dB: 25dBm
Test Frequency: 3.5GHz
Supplier Device Package: 12-PLGA (2.2x2.2)
Produkt ist nicht verfügbar
| AFLP5G35645T6 |
Hersteller: NXP USA Inc.
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Description: AIRFAST PRE-DRIVER MODULE, 3400-
Packaging: Tape & Reel (TR)
Package / Case: 17-LFLGA Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: General Purpose
Voltage - Supply: 3.3V, 5V
Gain: 31.5dB
Current - Supply: 2.2mA
P1dB: 29dBm
Test Frequency: 3.5GHz
Supplier Device Package: 17-HLFLGA (4x3)
Produkt ist nicht verfügbar
| AFSC5G23E37T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 35dB
Test Frequency: 2.3GHz, 2.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G26E38T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 31V
Gain: 32dB
Current - Supply: 48mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G26F38T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 36.7dB
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G35E38T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.7GHz
RF Type: General Purpose
Voltage - Supply: 24V ~ 31V
Gain: 30.5dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G40E38T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 4GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dB
Test Frequency: 4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G23E39T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| AFSC5G26E39T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28dB
Current - Supply: 65mA
Test Frequency: 2.69GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| A3M35TL039T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 28.8dBm
Test Frequency: 3.4GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| A3M39TL039T2 |
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.7GHz ~ 3.98GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.6dB
Test Frequency: 3.98GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar
| A3M37TL039T2 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.6GHz ~ 3.8GHz
RF Type: 5G, LTE
Voltage - Supply: 24V ~ 30V
Gain: 27.1dB
Test Frequency: 3.6GHz
Supplier Device Package: 26-HLQFN (10x6)
Produkt ist nicht verfügbar