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LPC55S28JBD100E NXP Semiconductors
auf Bestellung 90 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
12+ | 13.4 EUR |
15+ | 10.12 EUR |
50+ | 9.17 EUR |
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Technische Details LPC55S28JBD100E NXP Semiconductors
Description: IC MCU 32BIT 512KB FLSH 100LQFP, Packaging: Tray, Package / Case: 100-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 512KB (512K x 8), RAM Size: 256K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT, Supplier Device Package: 100-HLQFP (14x14), Number of I/O: 64.
Weitere Produktangebote LPC55S28JBD100E
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LPC55S28JBD100E | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC55S28JBD100E | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC55S28JBD100E | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 128kBSRAM,512kBFLASH; HLQFP100 Type of integrated circuit: ARM microcontroller Memory: 128kB SRAM; 512kB FLASH Case: HLQFP100 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 64 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Anzahl je Verpackung: 180 Stücke |
Produkt ist nicht verfügbar |
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LPC55S28JBD100E | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
Produkt ist nicht verfügbar |
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LPC55S28JBD100E | Hersteller : NXP Semiconductors |
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Produkt ist nicht verfügbar |
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LPC55S28JBD100E | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 128kBSRAM,512kBFLASH; HLQFP100 Type of integrated circuit: ARM microcontroller Memory: 128kB SRAM; 512kB FLASH Case: HLQFP100 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 64 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog |
Produkt ist nicht verfügbar |