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KW45Z41082AFTBR KW45Z41082AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45B41Z53AFPBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFTBR KW45Z41083AFTBR NXP USA Inc. KW45.pdf Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MVR5510AMMALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MVR5510AMBALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MVR5510AMDALESR2 NXP USA Inc. Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MC33PF8200CLESR2 MC33PF8200CLESR2 NXP USA Inc. Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MRFX1K80NR5 MRFX1K80NR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
MRFX1K80NR5 MRFX1K80NR5 NXP USA Inc. MRFX1K80N.pdf Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
PSMN1R7-25YLC,115 PSMN1R7-25YLC,115 NXP USA Inc. Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
Produkt ist nicht verfügbar
RPI-CAM-MIPI RPI-CAM-MIPI NXP USA Inc. rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA. Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+202.28 EUR
A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
Produkt ist nicht verfügbar
A2I22D050NR1 A2I22D050NR1 NXP USA Inc. Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
Produkt ist nicht verfügbar
BGU8M1UK/SZ NXP USA Inc. Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Produkt ist nicht verfügbar
S32K314EHT1MMMST NXP USA Inc. Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K314NHT1MMMST NXP USA Inc. Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1VMMST NXP USA Inc. S32K3xxDS.pdf Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1VPBST NXP USA Inc. S32K3xxDS.pdf Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MMMST NXP USA Inc. S32K3xxDS.pdf Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MPBSR NXP USA Inc. S32K3xxDS.pdf Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MPBST NXP USA Inc. S32K3xxDS.pdf Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344EHT1MMMST NXP USA Inc. S32K3xxDS.pdf Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344EHT1MPBST NXP USA Inc. Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K3X4EVBQ172NE NXP USA Inc. Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVBQ172ND NXP USA Inc. Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVBQ172NS NXP USA Inc. Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVB-Q257 NXP USA Inc. Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
RD-K344BMU NXP USA Inc. Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
S32K314EHT1VPBST NXP USA Inc. Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
MPC603RRX266LC MPC603RRX266LC NXP USA Inc. MPC603E7TEC.pdf Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
BLF8G27LS-100V,112 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
6+92.22 EUR
Mindestbestellmenge: 6
BLF8G27LS-100V,118 NXP USA Inc. PHGLS25948-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
6+91.83 EUR
Mindestbestellmenge: 6
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+7.61 EUR
Mindestbestellmenge: 2000
S9S12G128AVLFR S9S12G128AVLFR NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.94 EUR
10+ 10.95 EUR
100+ 9.07 EUR
1000+ 7.91 EUR
Mindestbestellmenge: 2
S9S12GN48F0WLFR S9S12GN48F0WLFR NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96ACLFR S9S12G96ACLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96F0MLFR S9S12G96F0MLFR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G64AMLHR S9S12G64AMLHR NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AVCH2T45GS115 NXP USA Inc. 74AVCH2T45.pdf Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
Produkt ist nicht verfügbar
TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.99 EUR
5000+ 1.92 EUR
Mindestbestellmenge: 2500
TEA19032BAAT/1J TEA19032BAAT/1J NXP USA Inc. TEA19032BT.pdf Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
auf Bestellung 9994 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.35 EUR
10+ 3.91 EUR
25+ 3.69 EUR
100+ 3.14 EUR
250+ 2.95 EUR
500+ 2.58 EUR
1000+ 2.14 EUR
Mindestbestellmenge: 5
PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
PDTC114EE,115 PDTC114EE,115 NXP USA Inc. PDTC114E_SER.pdf description Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
MIMX8US3DVK08SC NXP USA Inc. Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Produkt ist nicht verfügbar
MIMX8US3DVP08SC NXP USA Inc. Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
LPC1224FBD64/121,1 LPC1224FBD64/121,1 NXP USA Inc. LPC122X.pdf Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.88 EUR
10+ 10.12 EUR
160+ 8.38 EUR
Mindestbestellmenge: 2
MRF6VP21KHR5 MRF6VP21KHR5 NXP USA Inc. MRF6VP21KHR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
MRF6VP21KHR5 MRF6VP21KHR5 NXP USA Inc. MRF6VP21KHR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
1+1449.89 EUR
MRFE6VP5600-225 NXP USA Inc. MRFE6VP5600H.pdf Description: MRFE6VP5600 REF BOARD - 225
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+1483.1 EUR
KTY84/150,153 KTY84/150,153 NXP USA Inc. KTY84_SER.pdf Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
NJJ29C2A9HN5/349Y NXP USA Inc. Description: NJJ29C2A9HN5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S912ZVL12AMLFR NXP USA Inc. Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
S912ZVL12AMLF NXP USA Inc. Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
MC68HC908QY4VDTE MC68HC908QY4VDTE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PK-HC08QY4 NXP USA Inc. PK-HC08QY4_UM.pdf Description: MC68HC908QY4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HC08
Utilized IC / Part: MC68HC908QY4
Produkt ist nicht verfügbar
PSMN2R2-30YLC/GFX NXP USA Inc. Description: PSMN2R2-30YLC/GFX
Packaging: Bulk
Produkt ist nicht verfügbar
BTS6403CJ NXP USA Inc. BTS6403C.pdf Description: RF AMPLIFIER BTS6403C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
BTS6403UJ NXP USA Inc. BTS6403U.pdf Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
OMA1006TL-SKT NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: OMA1006TL-SKT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
KW45Z41082AFTBR KW45.pdf
KW45Z41082AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFPBR KW45.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45B41Z53AFPBR KW45.pdf
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 512kB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 40-HVQFN (6x6)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
KW45Z41083AFTBR KW45.pdf
KW45Z41083AFTBR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.36GHz ~ 2.4835GHz
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 0.9V ~ 2.4V, 1.175V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.3
Current - Receiving: 4.1mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 4.6mA ~ 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2C, PWM, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MVR5510AMMALESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MVR5510AMBALESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MVR5510AMDALESR2
Hersteller: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MC33PF8200CLESR2
MC33PF8200CLESR2
Hersteller: NXP USA Inc.
Description: PF8200
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MRFX1K80NR5 MRFX1K80N.pdf
MRFX1K80NR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Tape & Reel (TR)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
MRFX1K80NR5 MRFX1K80N.pdf
MRFX1K80NR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 65V OM1230-4
Packaging: Cut Tape (CT)
Package / Case: OM-1230-4L
Mounting Type: Surface Mount
Frequency: 1.8MHz ~ 470MHz
Power - Output: 1800W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: OM-1230-4L
Voltage - Test: 65 V
Produkt ist nicht verfügbar
PSMN1R7-25YLC,115
PSMN1R7-25YLC,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Tape & Reel (TR)
Package / Case: SC-100, SOT-669
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 25A, 10V
Power Dissipation (Max): 164W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK56, Power-SO8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3735 pF @ 12 V
Produkt ist nicht verfügbar
RPI-CAM-MIPI rpi-cam-mipi_overview.html?_gl=1*ongqnl*_ga*MTEwNjQyMjAzOS4xNzAxMjAxMTg0*_ga_WM5LE0KMSH*MTcwNDkwNDE3OS4xMS4xLjE3MDQ5MDg1ODcuMC4wLjA.
RPI-CAM-MIPI
Hersteller: NXP USA Inc.
Description: ACCESSORY BOARD:MIPI CAMERA CARD
Packaging: Box
For Use With/Related Products: AP1302, AR0144
Accessory Type: Adapter Board
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+202.28 EUR
A2I22D050NR1
A2I22D050NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
Produkt ist nicht verfügbar
A2I22D050NR1
A2I22D050NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 1.8-2.2GHZ TO270WB
Packaging: Cut Tape (CT)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: W-CDMA
Voltage - Supply: 24V ~ 32V
Gain: 34dB
Current - Supply: 520mA
P1dB: 16.5dBm
Test Frequency: 1.8GHz
Supplier Device Package: TO-270WB-15
Produkt ist nicht verfügbar
BGU8M1UK/SZ
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.805-2.2GHZ 6WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 6-XFBGA
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.2GHz
RF Type: Cellular
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB
Current - Supply: 5mA
Noise Figure: 0.7dB
P1dB: -5dBm
Test Frequency: 1.843GHz
Supplier Device Package: 6-WLCSP (0.65x0.44)
Produkt ist nicht verfügbar
S32K314EHT1MMMST
Hersteller: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K314NHT1MMMST
Hersteller: NXP USA Inc.
Description: S32K344 PHANTOM, 257MAPBGA, PROD
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1VMMST S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1VPBST S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MMMST S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MPBSR S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344NHT1MPBST S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: S32K344 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344EHT1MMMST S32K3xxDS.pdf
Hersteller: NXP USA Inc.
Description: LOCKSTEP CORE M7, 160MHZ, 4M FLA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 218
Produkt ist nicht verfügbar
S32K344EHT1MPBST
Hersteller: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K3X4EVBQ172NE
Hersteller: NXP USA Inc.
Description: S32K3X4EVBQ172NE
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVBQ172ND
Hersteller: NXP USA Inc.
Description: S32K3X4EVBQ172ND
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVBQ172NS
Hersteller: NXP USA Inc.
Description: S32K3X4EVBQ172NS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
S32K3X4EVB-Q257
Hersteller: NXP USA Inc.
Description: S32K3X4EVB-Q257 FULL-FEATURED EV
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: S32K344
Produkt ist nicht verfügbar
RD-K344BMU
Hersteller: NXP USA Inc.
Description: RD-K344BMU
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Produkt ist nicht verfügbar
S32K314EHT1VPBST
Hersteller: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I²C, I³C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I²S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Produkt ist nicht verfügbar
MPC603RRX266LC MPC603E7TEC.pdf
MPC603RRX266LC
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Packaging: Tray
Package / Case: 255-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-FCCBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
BLF8G27LS-100V,112 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: NOW AMPLEON, BLF8G27LS-100V, POW
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+92.22 EUR
Mindestbestellmenge: 6
BLF8G27LS-100V,118 PHGLS25948-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V CDFM6
Packaging: Bulk
Package / Case: SOT-1244B
Mounting Type: Chassis Mount
Frequency: 2.5GHz ~ 2.7GHz
Power - Output: 25W
Gain: 17dB
Technology: LDMOS
Supplier Device Package: CDFM6
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 900 mA
auf Bestellung 74 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+91.83 EUR
Mindestbestellmenge: 6
S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+7.61 EUR
Mindestbestellmenge: 2000
S9S12G128AVLFR MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AVLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.94 EUR
10+ 10.95 EUR
100+ 9.07 EUR
1000+ 7.91 EUR
Mindestbestellmenge: 2
S9S12GN48F0WLFR
S9S12GN48F0WLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96ACLFR
S9S12G96ACLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G96F0MLFR
S9S12G96F0MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G64AMLHR
S9S12G64AMLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AVCH2T45GS115 74AVCH2T45.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH2T45GS - BUS
Packaging: Bulk
Produkt ist nicht verfügbar
TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+1.99 EUR
5000+ 1.92 EUR
Mindestbestellmenge: 2500
TEA19032BAAT/1J TEA19032BT.pdf
TEA19032BAAT/1J
Hersteller: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHARGE SO10
Packaging: Cut Tape (CT)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Function: Controller
Interface: USB
Operating Temperature: -25°C ~ 125°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 10-SO
DigiKey Programmable: Not Verified
auf Bestellung 9994 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+4.35 EUR
10+ 3.91 EUR
25+ 3.69 EUR
100+ 3.14 EUR
250+ 2.95 EUR
500+ 2.58 EUR
1000+ 2.14 EUR
Mindestbestellmenge: 5
PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
PDTC114EE,115 description PDTC114E_SER.pdf
PDTC114EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Cut Tape (CT)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
MIMX8US3DVK08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Produkt ist nicht verfügbar
MIMX8US3DVP08SC
Hersteller: NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Produkt ist nicht verfügbar
LPC1224FBD64/121,1 LPC122X.pdf
LPC1224FBD64/121,1
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.88 EUR
10+ 10.12 EUR
160+ 8.38 EUR
Mindestbestellmenge: 2
MRF6VP21KHR5 MRF6VP21KHR6.pdf
MRF6VP21KHR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
MRF6VP21KHR5 MRF6VP21KHR6.pdf
MRF6VP21KHR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 1000W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 150 mA
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1449.89 EUR
MRFE6VP5600-225 MRFE6VP5600H.pdf
Hersteller: NXP USA Inc.
Description: MRFE6VP5600 REF BOARD - 225
Packaging: Bulk
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1483.1 EUR
KTY84/150,153 KTY84_SER.pdf
KTY84/150,153
Hersteller: NXP USA Inc.
Description: SENSOR PTC 603OHM DO34
Packaging: Tape & Box (TB)
Package / Case: DO-204AG, DO-34, Axial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 300°C
Supplier Device Package: DO-34
Resistance @ 25°C: 603 Ohms
Produkt ist nicht verfügbar
NJJ29C2A9HN5/349Y
Hersteller: NXP USA Inc.
Description: NJJ29C2A9HN5
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S912ZVL12AMLFR
Hersteller: NXP USA Inc.
Description: S12Z CPU, 6128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
S912ZVL12AMLF
Hersteller: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 10x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
Produkt ist nicht verfügbar
MC68HC908QY4VDTE MC68HC908QY4.pdf
MC68HC908QY4VDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PK-HC08QY4 PK-HC08QY4_UM.pdf
Hersteller: NXP USA Inc.
Description: MC68HC908QY4 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HC08
Utilized IC / Part: MC68HC908QY4
Produkt ist nicht verfügbar
PSMN2R2-30YLC/GFX
Hersteller: NXP USA Inc.
Description: PSMN2R2-30YLC/GFX
Packaging: Bulk
Produkt ist nicht verfügbar
BTS6403CJ BTS6403C.pdf
Hersteller: NXP USA Inc.
Description: RF AMPLIFIER BTS6403C
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
BTS6403UJ BTS6403U.pdf
Hersteller: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 16-HVQFN (3x3)
Produkt ist nicht verfügbar
OMA1006TL-SKT A1006_Demo-Dev_Kit.pdf
Hersteller: NXP USA Inc.
Description: OMA1006TL-SKT
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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