![LPC55S28JBD64E LPC55S28JBD64E](https://static6.arrow.com/aropdfconversion/arrowimages/c6aae6924c33e915091a1347eb44621364248c04/sot855-5.jpg)
LPC55S28JBD64E NXP Semiconductors
auf Bestellung 160 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
13+ | 12.69 EUR |
16+ | 9.45 EUR |
50+ | 8.23 EUR |
100+ | 7.51 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details LPC55S28JBD64E NXP Semiconductors
Description: IC MCU 32BIT 512KB FLASH 64TQFP, Packaging: Tray, Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 512KB (512K x 8), RAM Size: 256K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 36.
Weitere Produktangebote LPC55S28JBD64E nach Preis ab 7.37 EUR bis 13.66 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
LPC55S28JBD64E | Hersteller : NXP Semiconductors |
![]() |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
![]() |
LPC55S28JBD64E | Hersteller : NXP Semiconductors |
![]() |
Produkt ist nicht verfügbar |
|||||||||||||||||
![]() |
LPC55S28JBD64E | Hersteller : NXP Semiconductors |
![]() |
Produkt ist nicht verfügbar |
|||||||||||||||||
LPC55S28JBD64E | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 128kBSRAM,512kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 128kB SRAM; 512kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 36 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
||||||||||||||||||
LPC55S28JBD64E | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64TQFP Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I²C, SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
Produkt ist nicht verfügbar |
||||||||||||||||||
LPC55S28JBD64E | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 128kBSRAM,512kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 128kB SRAM; 512kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 36 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog |
Produkt ist nicht verfügbar |