Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35283) > Seite 512 nach 589

Wählen Sie Seite:    << Vorherige Seite ]  1 58 116 174 232 290 348 406 464 507 508 509 510 511 512 513 514 515 516 517 522 580 589  Nächste Seite >> ]
Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
ohne MwSt
74HCT174PW,118 NXP USA Inc. PHGLS28028-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 6BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 69 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 6
auf Bestellung 4879 Stücke:
Lieferzeit 10-14 Tag (e)
1578+0.33 EUR
Mindestbestellmenge: 1578
74HCT174D,652 74HCT174D,652 NXP USA Inc. 74HC_HCT174.pdf Description: IC FF D-TYPE SNGL 6BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 69 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 6
auf Bestellung 25637 Stücke:
Lieferzeit 10-14 Tag (e)
1311+0.37 EUR
Mindestbestellmenge: 1311
PSMN3R9-60PSQ PSMN3R9-60PSQ NXP USA Inc. PSMN3R9-60PS.pdf Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Produkt ist nicht verfügbar
74HC2G34GW,125 74HC2G34GW,125 NXP USA Inc. NEXP-S-A0002882032-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7 Description: NOW NEXPERIA 74HC2G34GW - BUFFER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
BTA212-800B,127 BTA212-800B,127 NXP USA Inc. PHGLS23360-1.pdf?t.download=true&u=5oefqw Description: TRIAC 800V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 60 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 800 V
auf Bestellung 2797 Stücke:
Lieferzeit 10-14 Tag (e)
497+0.97 EUR
Mindestbestellmenge: 497
PX1011BI-EL1/G,551 PX1011BI-EL1/G,551 NXP USA Inc. PX1011B.pdf Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
auf Bestellung 4735 Stücke:
Lieferzeit 10-14 Tag (e)
50+17.6 EUR
Mindestbestellmenge: 50
MKE02Z64VLD4R MKE02Z64VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
1500+4.4 EUR
Mindestbestellmenge: 1500
MKE02Z64VLD4R MKE02Z64VLD4R NXP USA Inc. MKE02P64M40SF0.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.34 EUR
10+ 6.51 EUR
100+ 5.34 EUR
500+ 5.22 EUR
Mindestbestellmenge: 3
MKE17Z256VLH7 MKE17Z256VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z256VLL7 MKE17Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.39 EUR
10+ 10.52 EUR
80+ 8.71 EUR
Mindestbestellmenge: 2
MKE02Z16VLC4R NXP USA Inc. Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
MKE15Z64VFP4R NXP USA Inc. Description: ARM MICROCONTROLLERS - MCU KINET
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
Produkt ist nicht verfügbar
MKE02Z64VFM4R NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+3.36 EUR
Mindestbestellmenge: 5000
MKE02Z32VLH4R NXP USA Inc. Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
MKV11Z128VFM7R NXP USA Inc. KV11P64M75.pdf Description: KINETIS KV11: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
MKL27Z64VFM4R NXP USA Inc. Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE04Z64VLH4R NXP USA Inc. Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
MKE12Z128VLF7 MKE12Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+8.99 EUR
10+ 7.01 EUR
80+ 5.75 EUR
440+ 5.63 EUR
1250+ 4.74 EUR
Mindestbestellmenge: 2
MKE13Z128VLF7 MKE13Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.49 EUR
10+ 7.41 EUR
80+ 6.07 EUR
440+ 5.94 EUR
1250+ 5.01 EUR
Mindestbestellmenge: 2
MKV10Z128VLF7R NXP USA Inc. KV11P64M75.pdf Description: KINETIS KV10: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
Produkt ist nicht verfügbar
MKE17Z128VLF7 MKE17Z128VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.01 EUR
10+ 7.82 EUR
80+ 6.41 EUR
440+ 6.27 EUR
1250+ 5.29 EUR
Mindestbestellmenge: 2
MKL17Z256VFM4R NXP USA Inc. KL17P64M48SF6.pdf Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 28
Produkt ist nicht verfügbar
MKE13Z256VLF7 MKE13Z256VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.3 EUR
10+ 8.83 EUR
80+ 7.23 EUR
440+ 7.08 EUR
1250+ 5.97 EUR
Mindestbestellmenge: 2
MKE17Z256VLF7 MKE17Z256VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.93 EUR
10+ 9.32 EUR
80+ 7.63 EUR
440+ 7.47 EUR
1250+ 6.3 EUR
Mindestbestellmenge: 2
MKE15Z256VLH7R NXP USA Inc. Description: KINETIS KE15Z: 72MHZ CORTEX-M0+
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
MKE12Z128VLH7 MKE12Z128VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z128VLH7 MKE13Z128VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.09 EUR
10+ 8.66 EUR
80+ 7.1 EUR
800+ 6.95 EUR
Mindestbestellmenge: 2
MKE12Z128VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z128VLH7 MKE17Z128VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.88 EUR
10+ 9.28 EUR
80+ 7.6 EUR
800+ 7.44 EUR
Mindestbestellmenge: 2
MKE12Z256VLH7 MKE12Z256VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z128VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z128VLL7 MKE13Z128VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.27 EUR
10+ 9.58 EUR
80+ 7.85 EUR
450+ 7.68 EUR
Mindestbestellmenge: 2
MKE13Z256VLH7 MKE13Z256VLH7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.79 EUR
10+ 9.27 EUR
80+ 7.67 EUR
Mindestbestellmenge: 2
MKE12Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z256VLL7 MKE13Z256VLL7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.78 EUR
10+ 10.04 EUR
80+ 8.31 EUR
Mindestbestellmenge: 2
MKW37A512VFT4R MKW37A512VFT4R NXP USA Inc. MKW39A512.pdf Description: IC MCU 32BIT 512KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MKW39A512VFT4R NXP USA Inc. Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MKW38A512VFT4R NXP USA Inc. Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
SVF532R2K1CMK4R SVF532R2K1CMK4R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Cut Tape (CT)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Produkt ist nicht verfügbar
PCF8562TT/2,518 NXP USA Inc. PCF8562.pdf Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5613 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.42 EUR
10+ 3.97 EUR
25+ 3.74 EUR
100+ 3.19 EUR
250+ 2.99 EUR
500+ 2.62 EUR
1000+ 2.17 EUR
Mindestbestellmenge: 4
RDDRONE-IOT NXP USA Inc. hdib Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
UCANS32K146-01 NXP USA Inc. Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Produkt ist nicht verfügbar
RDDRONE-FMUK66L NXP USA Inc. getting-started Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
SPC5668GF1AVMG SPC5668GF1AVMG NXP USA Inc. MPC5668x.pdf Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
T1014NXN7MQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
MC9328MX21DVK MC9328MX21DVK NXP USA Inc. MC9328MX21.pdf Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Produkt ist nicht verfügbar
ASK-RYLT1043-25K NXP USA Inc. Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
S32K324EHT1MPBST NXP USA Inc. S32K3xx.pdf Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
6000+1.06 EUR
Mindestbestellmenge: 6000
PCF85053ATKJ PCF85053ATKJ NXP USA Inc. PCF85053A.pdf Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 10785 Stücke:
Lieferzeit 10-14 Tag (e)
8+2.41 EUR
10+ 2.17 EUR
25+ 2.04 EUR
100+ 1.74 EUR
250+ 1.64 EUR
500+ 1.43 EUR
1000+ 1.19 EUR
2500+ 1.1 EUR
Mindestbestellmenge: 8
LPC11E68JBD48K LPC11E68JBD48K NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 958 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.36 EUR
10+ 9.71 EUR
80+ 8.04 EUR
Mindestbestellmenge: 2
NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
Produkt ist nicht verfügbar
NMH1000T1 NXP USA Inc. NMH1000.pdf Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
auf Bestellung 2006 Stücke:
Lieferzeit 10-14 Tag (e)
6+2.97 EUR
10+ 2.3 EUR
25+ 1.92 EUR
50+ 1.88 EUR
100+ 1.71 EUR
500+ 1.49 EUR
1000+ 1.32 EUR
Mindestbestellmenge: 6
MR-CANHUBK344 MR-CANHUBK344 NXP USA Inc. MR-CANHUBK344.pdf Description: EVAL BOARD 100BASET1 SIX CAN-FD
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+313.4 EUR
HEF4075BT,653 HEF4075BT,653 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
HEF4075BT,653 HEF4075BT,653 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
HEF4075BT,652 HEF4075BT,652 NXP USA Inc. HEF4075B.pdf Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
MCF53016CMJ240J MCF53016CMJ240J NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
52+17.25 EUR
Mindestbestellmenge: 52
MCF53011CQT240 MCF53011CQT240 NXP USA Inc. MCF53010-17.pdf Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 2232 Stücke:
Lieferzeit 10-14 Tag (e)
43+20.54 EUR
Mindestbestellmenge: 43
KITPF5300SKTEVM NXP USA Inc. Description: EVAL PF5300
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
1+333.31 EUR
74HCT174PW,118 PHGLS28028-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 6BIT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 69 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 6
auf Bestellung 4879 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1578+0.33 EUR
Mindestbestellmenge: 1578
74HCT174D,652 74HC_HCT174.pdf
74HCT174D,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 6BIT 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 69 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 6
auf Bestellung 25637 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1311+0.37 EUR
Mindestbestellmenge: 1311
PSMN3R9-60PSQ PSMN3R9-60PS.pdf
PSMN3R9-60PSQ
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 103 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5600 pF @ 25 V
Produkt ist nicht verfügbar
74HC2G34GW,125 NEXP-S-A0002882032-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7
74HC2G34GW,125
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC2G34GW - BUFFER
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 5.2mA, 5.2mA
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
BTA212-800B,127 PHGLS23360-1.pdf?t.download=true&u=5oefqw
BTA212-800B,127
Hersteller: NXP USA Inc.
Description: TRIAC 800V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 60 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 800 V
auf Bestellung 2797 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
497+0.97 EUR
Mindestbestellmenge: 497
PX1011BI-EL1/G,551 PX1011B.pdf
PX1011BI-EL1/G,551
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, PBGA81
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
auf Bestellung 4735 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
50+17.6 EUR
Mindestbestellmenge: 50
MKE02Z64VLD4R MKE02P64M40SF0.pdf
MKE02Z64VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1500+4.4 EUR
Mindestbestellmenge: 1500
MKE02Z64VLD4R MKE02P64M40SF0.pdf
MKE02Z64VLD4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.34 EUR
10+ 6.51 EUR
100+ 5.34 EUR
500+ 5.22 EUR
Mindestbestellmenge: 3
MKE17Z256VLH7 KE1xZP100M72SF1.pdf
MKE17Z256VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z256VLL7 KE1xZP100M72SF1.pdf
MKE17Z256VLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.39 EUR
10+ 10.52 EUR
80+ 8.71 EUR
Mindestbestellmenge: 2
MKE02Z16VLC4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
MKE15Z64VFP4R
Hersteller: NXP USA Inc.
Description: ARM MICROCONTROLLERS - MCU KINET
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
Produkt ist nicht verfügbar
MKE02Z64VFM4R MKE02P64M40SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+3.36 EUR
Mindestbestellmenge: 5000
MKE02Z32VLH4R
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
Produkt ist nicht verfügbar
MKV11Z128VFM7R KV11P64M75.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV11: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 26
Produkt ist nicht verfügbar
MKL27Z64VFM4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, FlexIO, SPI, UART/USART, USB
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE04Z64VLH4R
Hersteller: NXP USA Inc.
Description: KINETIS KE04: 48MHZ CORTEX-M0+ 5
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
MKE12Z128VLF7 KE1xZP100M72SF1.pdf
MKE12Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+8.99 EUR
10+ 7.01 EUR
80+ 5.75 EUR
440+ 5.63 EUR
1250+ 4.74 EUR
Mindestbestellmenge: 2
MKE13Z128VLF7 KE1xZP100M72SF1.pdf
MKE13Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.49 EUR
10+ 7.41 EUR
80+ 6.07 EUR
440+ 5.94 EUR
1250+ 5.01 EUR
Mindestbestellmenge: 2
MKV10Z128VLF7R KV11P64M75.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KV10: 75MHZ CORTEX-M0+ R
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
Produkt ist nicht verfügbar
MKE17Z128VLF7 KE1xZP100M72SF1.pdf
MKE17Z128VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.01 EUR
10+ 7.82 EUR
80+ 6.41 EUR
440+ 6.27 EUR
1250+ 5.29 EUR
Mindestbestellmenge: 2
MKL17Z256VFM4R KL17P64M48SF6.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KL17: 48MHZ CORTEX-M0+ U
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 28
Produkt ist nicht verfügbar
MKE13Z256VLF7 KE1xZP100M72SF1.pdf
MKE13Z256VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.3 EUR
10+ 8.83 EUR
80+ 7.23 EUR
440+ 7.08 EUR
1250+ 5.97 EUR
Mindestbestellmenge: 2
MKE17Z256VLF7 KE1xZP100M72SF1.pdf
MKE17Z256VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.93 EUR
10+ 9.32 EUR
80+ 7.63 EUR
440+ 7.47 EUR
1250+ 6.3 EUR
Mindestbestellmenge: 2
MKE15Z256VLH7R
Hersteller: NXP USA Inc.
Description: KINETIS KE15Z: 72MHZ CORTEX-M0+
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Produkt ist nicht verfügbar
MKE12Z128VLH7 KE1xZP100M72SF1.pdf
MKE12Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z128VLH7 KE1xZP100M72SF1.pdf
MKE13Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.09 EUR
10+ 8.66 EUR
80+ 7.1 EUR
800+ 6.95 EUR
Mindestbestellmenge: 2
MKE12Z128VLL7 KE1xZP100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z128VLH7 KE1xZP100M72SF1.pdf
MKE17Z128VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.88 EUR
10+ 9.28 EUR
80+ 7.6 EUR
800+ 7.44 EUR
Mindestbestellmenge: 2
MKE12Z256VLH7 KE1xZP100M72SF1.pdf
MKE12Z256VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE17Z128VLL7 KE1xZP100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z128VLL7 KE1xZP100M72SF1.pdf
MKE13Z128VLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.27 EUR
10+ 9.58 EUR
80+ 7.85 EUR
450+ 7.68 EUR
Mindestbestellmenge: 2
MKE13Z256VLH7 KE1xZP100M72SF1.pdf
MKE13Z256VLH7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.79 EUR
10+ 9.27 EUR
80+ 7.67 EUR
Mindestbestellmenge: 2
MKE12Z256VLL7 KE1xZP100M72SF1.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE13Z256VLL7 KE1xZP100M72SF1.pdf
MKE13Z256VLL7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.78 EUR
10+ 10.04 EUR
80+ 8.31 EUR
Mindestbestellmenge: 2
MKW37A512VFT4R MKW39A512.pdf
MKW37A512VFT4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 48VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MKW39A512VFT4R
Hersteller: NXP USA Inc.
Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MKW38A512VFT4R
Hersteller: NXP USA Inc.
Description: 32-BIT BLUETOOTH 5.0 LONG-RANGE
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
SVF532R2K1CMK4R VYBRIDRSERIESEC.pdf
SVF532R2K1CMK4R
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Cut Tape (CT)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Produkt ist nicht verfügbar
PCF8562TT/2,518 PCF8562.pdf
Hersteller: NXP USA Inc.
Description: UNIVERSAL LCD DRIVER FOR LOW MUL
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 32 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 6 Characters, 8 Characters, 128 Elements
Supplier Device Package: 48-TSSOP
Current - Supply: 3.5 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5613 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.42 EUR
10+ 3.97 EUR
25+ 3.74 EUR
100+ 3.19 EUR
250+ 2.99 EUR
500+ 2.62 EUR
1000+ 2.17 EUR
Mindestbestellmenge: 4
RDDRONE-IOT hdib
Hersteller: NXP USA Inc.
Description: RAPID-IOT TO DRONE INTERFACE BOA
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
UCANS32K146-01
Hersteller: NXP USA Inc.
Description: UCANS32K146 BOARD FOR DRONES, RO
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: S32K146
Produkt ist nicht verfügbar
RDDRONE-FMUK66L getting-started
Hersteller: NXP USA Inc.
Description: PX4 ROBOTIC DRONE FMU (RDDRONE-F
Packaging: Bulk
Configuration: Quadcopter Components
Produkt ist nicht verfügbar
SPC5668GF1AVMG MPC5668x.pdf
SPC5668GF1AVMG
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 116MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 592K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z650
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
T1014NXN7MQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.2GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
MC9328MX21DVK MC9328MX21.pdf
MC9328MX21DVK
Hersteller: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Produkt ist nicht verfügbar
ASK-RYLT1043-25K
Hersteller: NXP USA Inc.
Description: ROYALTY PREPAYMENT 25K UNITS - L
Packaging: Bulk
Type: License
Produkt ist nicht verfügbar
S32K324EHT1MPBST S32K3xx.pdf
Hersteller: NXP USA Inc.
Description: S32K344, 4MB FLASH, ARM M7 LOCKS
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 218
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Hersteller: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Tape & Reel (TR)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6000+1.06 EUR
Mindestbestellmenge: 6000
PCF85053ATKJ PCF85053A.pdf
PCF85053ATKJ
Hersteller: NXP USA Inc.
Description: IC CPU RTC I2C SOT2413-1
Packaging: Cut Tape (CT)
Features: Alarm, Daylight Savings, Leap Year, SRAM
Package / Case: 12-VFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 128B
Interface: I2C
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 3.6V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD
Supplier Device Package: 12-HVSON (3x3)
Voltage - Supply, Battery: 1.55V ~ 3.6V
Current - Timekeeping (Max): 1mA @ 3.3V
auf Bestellung 10785 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.41 EUR
10+ 2.17 EUR
25+ 2.04 EUR
100+ 1.74 EUR
250+ 1.64 EUR
500+ 1.43 EUR
1000+ 1.19 EUR
2500+ 1.1 EUR
Mindestbestellmenge: 8
LPC11E68JBD48K LPC11E6X.pdf
LPC11E68JBD48K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 958 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.36 EUR
10+ 9.71 EUR
80+ 8.04 EUR
Mindestbestellmenge: 2
NMH1000T1 NMH1000.pdf
Hersteller: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Tape & Reel (TR)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
Produkt ist nicht verfügbar
NMH1000T1 NMH1000.pdf
Hersteller: NXP USA Inc.
Description: IC MAG SWITCH SENSOR
Packaging: Cut Tape (CT)
Features: Sleep Mode
Package / Case: 6-VFDFN
Output Type: I2C
Polarization: North Pole
Mounting Type: Surface Mount
Function: Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Technology: Hall Effect
Current - Supply (Max): 650µA
Supplier Device Package: 6-VSON (1.4x1.4)
auf Bestellung 2006 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+2.97 EUR
10+ 2.3 EUR
25+ 1.92 EUR
50+ 1.88 EUR
100+ 1.71 EUR
500+ 1.49 EUR
1000+ 1.32 EUR
Mindestbestellmenge: 6
MR-CANHUBK344 MR-CANHUBK344.pdf
MR-CANHUBK344
Hersteller: NXP USA Inc.
Description: EVAL BOARD 100BASET1 SIX CAN-FD
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: S32K344
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU, 32-Bit
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+313.4 EUR
HEF4075BT,653 HEF4075B.pdf
HEF4075BT,653
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
HEF4075BT,653 HEF4075B.pdf
HEF4075BT,653
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
HEF4075BT,652 HEF4075B.pdf
HEF4075BT,652
Hersteller: NXP USA Inc.
Description: IC GATE OR 3CH 3-INP 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3mA, 3mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 3.5V ~ 11V
Input Logic Level - Low: 1.5V ~ 4V
Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 4 µA
Produkt ist nicht verfügbar
MCF53016CMJ240J MCF53010-17.pdf
MCF53016CMJ240J
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 869 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
52+17.25 EUR
Mindestbestellmenge: 52
MCF53011CQT240 MCF53010-17.pdf
MCF53011CQT240
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208TQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 240MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V3
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 61
DigiKey Programmable: Not Verified
auf Bestellung 2232 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
43+20.54 EUR
Mindestbestellmenge: 43
KITPF5300SKTEVM
Hersteller: NXP USA Inc.
Description: EVAL PF5300
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+333.31 EUR
Wählen Sie Seite:    << Vorherige Seite ]  1 58 116 174 232 290 348 406 464 507 508 509 510 511 512 513 514 515 516 517 522 580 589  Nächste Seite >> ]