Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35282) > Seite 509 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
SAF775DHV/N208WY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF7754HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF7751HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/DY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHN/N208WAMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/CY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHN/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/DK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/AY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/CK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF7754HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/AK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
Produkt ist nicht verfügbar |
||||||||||||||||
SAF775DHV/N208W/BY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
|
MHW8188AN | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: 7-CATV Module Number of Circuits: 1 Current - Supply: 425 mA |
Produkt ist nicht verfügbar |
|||||||||||||||
BSC9131NSE1KHKB | NXP USA Inc. |
Description: QORIQ QONVERGE MULTICORE BASEBAN Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294KCK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294KAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294KCK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294KAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294JCK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount RAM Size: 5.5M x 8 Program Memory Type: ROMless Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294JAK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294JAK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294JCK0MJDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294HBK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294HBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294LBK0MJDT | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294LBK0MJDR | NXP USA Inc. |
Description: S32R29 MULTICORE POWER ARCHITECT Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294LAK0MJDT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 500MHz, 430MHz Program Memory Size: 3MB (3M x 8) RAM Size: 2.5M x 8 Oscillator Type: Internal Program Memory Type: SRAM Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit 5-Core Connectivity: CAN, Ethernet, FlexRay Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
FS32R294LAK0MJDR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 269-LFBGA Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
||||||||||||||||
![]() |
74VHCT541D,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 20-SO |
auf Bestellung 5880 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
OM5578/PN7150ARD | NXP USA Inc. |
Description: DEV KIT PN7150 PLUG/PLAY NFC CTL Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||||||
![]() |
MC9S08AC128CFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
![]() |
MC9RS08KA8CPJ | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-DIP Number of I/O: 18 DigiKey Programmable: Not Verified |
auf Bestellung 518 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
![]() |
S912XDG128F2CAL | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b, 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
|
MFS8623BMBA0ES | NXP USA Inc. |
Description: IC FS86 SYSTEM BASIS CHIP ASIL Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 36V Applications: Camera Supplier Device Package: 48-QFN (7x7) |
Produkt ist nicht verfügbar |
|||||||||||||||
![]() |
MCF5280CVF66 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 142 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||||||||||||||
S32G378ASAK1VUCT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
||||||||||||||||
S32G378ASAK1VUCR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 400MHz, 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 525-FCPBGA (19x19) Ethernet: 2.5Gbps (3) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
||||||||||||||||
|
MC68en360ai33l | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
auf Bestellung 156 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
![]() |
BUK9535-100A,127 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 41A (Tc) Rds On (Max) @ Id, Vgs: 34mOhm @ 25A, 10V Power Dissipation (Max): 149W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±10V Drain to Source Voltage (Vdss): 100 V Input Capacitance (Ciss) (Max) @ Vds: 3573 pF @ 25 V |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
MFS2613AMDA4AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 242 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MFS2613AMDA3AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
auf Bestellung 243 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MFS2633AMDA0AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Applications: System Basis Chip Current - Supply: 29µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 282 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||||||
MF3D2300DA4/00J | NXP USA Inc. |
Description: MF3D2300DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
||||||||||||||||
MF3D2300DA4/00J | NXP USA Inc. |
Description: MF3D2300DA4 Packaging: Cut Tape (CT) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
||||||||||||||||
MF3D8300DA4/00J | NXP USA Inc. |
Description: MF3D8300DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
||||||||||||||||
![]() |
MFRC63103HNY | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) For Use With/Related Products: MFRC631 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
|||||||||||||||
![]() |
MFRC63103HNY | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) For Use With/Related Products: MFRC631 Frequency: 13.56MHz Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
auf Bestellung 5967 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
MFS2633AMVA0AD | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP WITH LO Packaging: Tray |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0UL2101DUD,005 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 70°C Standards: ISO 14443, MIFARE Supplier Device Package: Die |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0ICU2001DUD,005 | NXP USA Inc. |
Description: MIFARE ULTRALIGHT SGL FCC Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: 25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0ICU2101DUD,005 | NXP USA Inc. |
Description: MIFARE ULTRALIGHT SGL FCC Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0ICU2001DUF,005 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, MIFARE Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AESH2001DUFZ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AES2001DUFZ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AESH2001DUDZ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AES2001DUDZ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AES2000DA8J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
||||||||||||||||
MF0AESH2000DA8J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
Produkt ist nicht verfügbar |
||||||||||||||||
RDW8987E-R0 | NXP USA Inc. |
Description: RDW8987E-R0 Packaging: Bulk |
Produkt ist nicht verfügbar |
SAF775DHV/N208WY |
Produkt ist nicht verfügbar
SAF7754HN/N208WMP |
Produkt ist nicht verfügbar
SAF7751HN/N208WK |
Produkt ist nicht verfügbar
SAF775DHV/N208W/DY |
Produkt ist nicht verfügbar
SAF775DHN/N208WAMP |
Produkt ist nicht verfügbar
SAF775DHV/N208W/CY |
Produkt ist nicht verfügbar
SAF775DHN/N208W/KK |
Produkt ist nicht verfügbar
SAF775DHV/N208W/DK |
Produkt ist nicht verfügbar
SAF775DHV/N208W/AY |
Produkt ist nicht verfügbar
SAF775DHV/N208W/CK |
Produkt ist nicht verfügbar
SAF7754HN/N208WK |
Produkt ist nicht verfügbar
SAF775DHV/N208W/AK |
Produkt ist nicht verfügbar
SAF775DHV/N208W/BY |
Produkt ist nicht verfügbar
MHW8188AN |
![]() |
Hersteller: NXP USA Inc.
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Description: IC AMP CATV 7-CATV MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: 7-CATV Module
Number of Circuits: 1
Current - Supply: 425 mA
Produkt ist nicht verfügbar
BSC9131NSE1KHKB |
Produkt ist nicht verfügbar
FS32R294KCK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KCK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294KAK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDT |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
RAM Size: 5.5M x 8
Program Memory Type: ROMless
Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JAK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294JCK0MJDR |
![]() |
Produkt ist nicht verfügbar
FS32R294HBK0MJDT |
![]() |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294HBK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDT |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LBK0MJDR |
Hersteller: NXP USA Inc.
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: S32R29 MULTICORE POWER ARCHITECT
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDT |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU 32BIT 3MB 269LFBGA
Packaging: Tray
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 500MHz, 430MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 2.5M x 8
Oscillator Type: Internal
Program Memory Type: SRAM
Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit 5-Core
Connectivity: CAN, Ethernet, FlexRay
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
FS32R294LAK0MJDR |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Description: IC MCU
Packaging: Tape & Reel (TR)
Package / Case: 269-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 269-LFBGA (14x14)
Produkt ist nicht verfügbar
74VHCT541D,118 |
![]() |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74VHCT541D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
Description: NOW NEXPERIA 74VHCT541D - BUS DR
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-SO
auf Bestellung 5880 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1302+ | 0.37 EUR |
OM5578/PN7150ARD |
Produkt ist nicht verfügbar
MC9S08AC128CFUE |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9RS08KA8CPJ |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-DIP
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 518 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
518+ | 1.71 EUR |
S912XDG128F2CAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b, 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MFS8623BMBA0ES |
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Produkt ist nicht verfügbar
MCF5280CVF66 |
![]() |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 142
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S32G378ASAK1VUCT |
![]() |
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
S32G378ASAK1VUCR |
![]() |
Hersteller: NXP USA Inc.
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Description: MICROPROCESSORS - MPU 4X CORTEX-
Packaging: Tape & Reel (TR)
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 2.5Gbps (3)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: CANbus, DMA, FlexRay, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
MC68en360ai33l |
![]() |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 254.46 EUR |
BUK9535-100A,127 |
![]() |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 41A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 25A, 10V
Power Dissipation (Max): 149W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3573 pF @ 25 V
Description: MOSFET N-CH 100V 41A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 41A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 25A, 10V
Power Dissipation (Max): 149W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3573 pF @ 25 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
666+ | 0.72 EUR |
MFS2613AMDA4AD |
![]() |
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 242 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.43 EUR |
10+ | 12.37 EUR |
25+ | 12.11 EUR |
40+ | 12.07 EUR |
80+ | 10.83 EUR |
MFS2613AMDA3AD |
![]() |
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.39 EUR |
10+ | 12.32 EUR |
25+ | 12.07 EUR |
40+ | 12.03 EUR |
80+ | 10.79 EUR |
MFS2633AMDA0AD |
![]() |
Hersteller: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Applications: System Basis Chip
Current - Supply: 29µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 282 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.9 EUR |
10+ | 12.8 EUR |
25+ | 12.53 EUR |
40+ | 12.49 EUR |
80+ | 11.2 EUR |
250+ | 10.87 EUR |
MF3D2300DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D2300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D2300DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3D2300DA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D2300DA4
Packaging: Cut Tape (CT)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D8300DA4/00J |
Hersteller: NXP USA Inc.
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MFRC63103HNY |
![]() |
Hersteller: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MFRC63103HNY |
![]() |
Hersteller: NXP USA Inc.
Description: CL READER IC'S
Packaging: Cut Tape (CT)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: CL READER IC'S
Packaging: Cut Tape (CT)
For Use With/Related Products: MFRC631
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
auf Bestellung 5967 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 12.58 EUR |
10+ | 11.37 EUR |
25+ | 10.84 EUR |
100+ | 9.41 EUR |
250+ | 8.99 EUR |
500+ | 8.2 EUR |
1000+ | 7.14 EUR |
MFS2633AMVA0AD |
Produkt ist nicht verfügbar
MF0UL2101DUD,005 |
![]() |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
Produkt ist nicht verfügbar
MF0ICU2001DUD,005 |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: 25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0ICU2101DUD,005 |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT SGL FCC
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0ICU2001DUF,005 |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT C - CONTACTLES
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, MIFARE
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0AESH2001DUFZ |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0AES2001DUFZ |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0AESH2001DUDZ |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0AES2001DUDZ |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
MF0AES2000DA8J |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF0AESH2000DA8J |
![]() |
Hersteller: NXP USA Inc.
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MIFARE ULTRALIGHT AES - CONTACTL
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
RDW8987E-R0 |
Produkt ist nicht verfügbar