Technische Details FS32R294JCK0MJDT NXP Semiconductors
Description: IC MCU 32BIT 269LFBGA, Packaging: Tray, Package / Case: 269-LFBGA, Mounting Type: Surface Mount, RAM Size: 5.5M x 8, Program Memory Type: ROMless, Core Processor: e200z4, e200z7, Core Size: 32-Bit Dual-Core, Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI, Peripherals: Temp Sensor, Supplier Device Package: 269-LFBGA (14x14).
Weitere Produktangebote FS32R294JCK0MJDT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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| FS32R294JCK0MJDT | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 269LFBGAPackaging: Tray Package / Case: 269-LFBGA Mounting Type: Surface Mount RAM Size: 5.5M x 8 Program Memory Type: ROMless Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Supplier Device Package: 269-LFBGA (14x14) |
Produkt ist nicht verfügbar |
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| FS32R294JCK0MJDT | Hersteller : NXP Semiconductors |
NXP Semiconductors S32R29 multicore Power Architecture, 266 MHz, ISO 26262, AEC-Q100, CSE3 Security |
Produkt ist nicht verfügbar |