Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35029) > Seite 507 nach 584
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MIMXRT1176AVM8AR | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 800MHz RAM Size: 2M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4, Cortex®-M7 Data Converters: A/D 20x12b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active Number of I/O: 13 |
Produkt ist nicht verfügbar |
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LPC1769FBD100/P1K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x12b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 70 |
auf Bestellung 441 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF5249LAG120 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 96K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 4x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SCF5249LAG120 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 96K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 4x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCAL9539APW,118 | NXP USA Inc. |
![]() Features: POR Packaging: Tape & Reel (TR) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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PCAL9539APW,118 | NXP USA Inc. |
![]() Features: POR Packaging: Cut Tape (CT) Package / Case: 24-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-TSSOP Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3928 Stücke: Lieferzeit 10-14 Tag (e) |
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T1042NSE7PQPB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 1Gbps (5) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART Part Status: Active |
Produkt ist nicht verfügbar |
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SAF7741HV/N118518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 2250 Stücke: Lieferzeit 10-14 Tag (e) |
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SAF3561EL/V1101,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Packaging: Tape & Reel (TR) Package / Case: 170-LFBGA Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 170-LFBGA (12x12) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561EL/V1103,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Packaging: Tape & Reel (TR) Package / Case: 170-LFBGA Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 170-LFBGA (12x12) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561EL/V1102,51 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Packaging: Tape & Reel (TR) Package / Case: 170-LFBGA Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 170-LFBGA (12x12) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561EL/V1100K | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Packaging: Tray Package / Case: 170-LFBGA Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 170-LFBGA (12x12) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561EL/V1101,55 | NXP USA Inc. |
Description: IC DAB RADIO 170LFBGA Packaging: Tray Package / Case: 170-LFBGA Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 170-LFBGA (12x12) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561HV/V1103,55 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3560HV/V1100,51 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3560HV/V1102,55 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561HV/V1101,51 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3561HV/V1103,51 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SAF3560HV/V1106K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74AHCT2G32GD,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 8-XSON (2x3) Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 1 µA |
auf Bestellung 5387 Stücke: Lieferzeit 10-14 Tag (e) |
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PRF13750HR9 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI1230 Packaging: Strip Package / Case: SOT-979A Current Rating (Amps): 10µA Frequency: 700MHz ~ 1.3GHz Configuration: Dual Power - Output: 650W Gain: 20.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Part Status: Obsolete Voltage - Rated: 105 V |
Produkt ist nicht verfügbar |
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K32W1480VFTBT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz Memory Size: 1MB Flash, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Power - Output: 10dBm Protocol: Bluetooth v5.2, Thread, Zigbee® Current - Receiving: 8.7mA Data Rate (Max): 2Mbps Current - Transmitting: 22.4mA Supplier Device Package: 48-HVQFN (7x7) Modulation: FSK, GFSK, GMSK, MSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, I2S, SPI, UART Part Status: Active |
auf Bestellung 1298 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G06GN,132 | NXP USA Inc. |
![]() Features: Open Drain Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: -, 32mA Number of Inputs: 1 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.07V ~ 3.85V Input Logic Level - Low: 0.58V ~ 1.65V Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 200 µA |
auf Bestellung 96924 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHCT1G04GV | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHCT1G04GW-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHCT1G04GM115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MMW9014KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Packaging: Tape & Reel (TR) Package / Case: 182-UFBGA Mounting Type: Surface Mount Function: Transmitter Frequency: 24.25GHz RF Type: General Purpose Supplier Device Package: 182-HUBGA (6.1x6.5) Part Status: Active |
Produkt ist nicht verfügbar |
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MMW9012KZ | NXP USA Inc. |
Description: 4-CHANNEL DUAL-POLARIZED ANALOG Packaging: Tape & Reel (TR) Package / Case: 182-UFBGA Mounting Type: Surface Mount Function: Transmitter Frequency: 26.5GHz ~ 29.5GHz RF Type: General Purpose Supplier Device Package: 182-HUBGA (6.1x6.5) Part Status: Active |
Produkt ist nicht verfügbar |
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74LVC2G74GF,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 1 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 200 MHz Input Capacitance: 4 pF Supplier Device Package: 8-XSON (1.35x1) Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 200219 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9634D | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9634D118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12DB128MPVE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Obsolete Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12DB128CFUE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V Connectivity: CANbus, I²C, SCI, SPI Peripherals: PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Obsolete Number of I/O: 59 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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N74F541D,623 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 946 Stücke: Lieferzeit 10-14 Tag (e) |
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PMMA2241KEG | NXP USA Inc. |
Description: IC ACCEL X-LATERAL 10G Packaging: Tube Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LM75BDP/DG,118 | NXP USA Inc. |
![]() Features: Output Switch, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LM75BDP/DG,118 | NXP USA Inc. |
![]() Features: Output Switch, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Voltage - Supply: 2.8V ~ 5.5V Sensor Type: Digital, Local Resolution: 11 b Supplier Device Package: 8-TSSOP Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -55°C ~ 125°C Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74LVC1G80GM,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Quiescent (Iq): 200 µA Current - Output High, Low: 32mA, 32mA Trigger Type: Positive Edge Clock Frequency: 400 MHz Input Capacitance: 5 pF Supplier Device Package: 6-XSON (1.45x1) Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 14440 Stücke: Lieferzeit 10-14 Tag (e) |
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MC56F83766VLK | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 20x12b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPXV2202DP | NXP USA Inc. |
![]() ![]() Features: Temperature Compensated Packaging: Tray Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC9S08GT8AMFCE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL05Z32VLF4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
auf Bestellung 25 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8AMFKR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8AMFKR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 9980 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI2STD/WG,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-665 Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 11pF (Total) Height: 0.024" (0.60mm) Filter Order: 2nd Applications: Data Lines for Mobile Devices Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
Produkt ist nicht verfügbar |
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PTN3222CUKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3222CUKZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-XFBGA, WLCSP Delay Time: 3.0ns (Max) Number of Channels: 1 Mounting Type: Surface Mount Output: Differential Type: Buffer, ReDriver Input: Differential Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V Applications: USB Current - Supply: 55mA Data Rate (Max): 480Mbps Supplier Device Package: 12-WLCSP (1.55x1.18) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active Capacitance - Input: 10 pF |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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Z0107NA,116 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 10 mA Current - Gate Trigger (Igt) (Max): 5 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A Voltage - Gate Trigger (Vgt) (Max): 1.3 V Supplier Device Package: TO-92-3 Part Status: Active Current - On State (It (RMS)) (Max): 1 A Voltage - Off State: 800 V |
auf Bestellung 99890 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT652AD,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO Part Status: Obsolete |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC32245AEC,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 96-LFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 96-LFBGA (13.5x5.5) Part Status: Active |
auf Bestellung 5700 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC32245AEC,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 96-LFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 96-LFBGA (13.5x5.5) Part Status: Active |
auf Bestellung 80605 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXHZ6116A6U | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Tube Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.399 V ~ 4.645 V Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPXHZ6116A6T1 | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.399 V ~ 4.645 V Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
Produkt ist nicht verfügbar |
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STMP3770XXBJEA3N | NXP USA Inc. |
Description: STMP3770XXBJEA3N Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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STMP3770XXLAEA3N | NXP USA Inc. |
Description: STMP3770XXLAEA3N Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74LVC1G3157GM,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 6-XSON (1.45x1) Voltage - Supply, Single (V+): 1.65V ~ 5.5V Charge Injection: 7.5pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Switch Time (Ton, Toff) (Max): 4ns, 3.5ns Channel Capacitance (CS(off), CD(off)): 6pF Current - Leakage (IS(off)) (Max): 5µA Part Status: Active Number of Circuits: 1 |
auf Bestellung 60636 Stücke: Lieferzeit 10-14 Tag (e) |
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LX2160XN72232B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART Part Status: Active |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8560VTAQFC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART |
Produkt ist nicht verfügbar |
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MPC8248VRTMFA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-FPBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Part Status: Active |
auf Bestellung 266 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08GT8ACFBE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-QFP (10x10) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
MIMXRT1176AVM8AR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 800MHz
RAM Size: 2M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
LPC1769FBD100/P1K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 70
auf Bestellung 441 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 20.35 EUR |
10+ | 19.58 EUR |
MCF5249LAG120 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SCF5249LAG120 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 96K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 4x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCAL9539APW,118 |
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Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 2.18 EUR |
PCAL9539APW,118 |
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Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-TSSOP
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3928 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 4.77 EUR |
10+ | 4.29 EUR |
25+ | 4.05 EUR |
100+ | 3.45 EUR |
250+ | 3.24 EUR |
500+ | 2.83 EUR |
1000+ | 2.35 EUR |
T1042NSE7PQPB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
Description: IC MPU QORIQ T1 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1Gbps (5)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
SAF7741HV/N118518 |
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Hersteller: NXP USA Inc.
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
Description: CAR RADIO DIGITAL SIGNAL PROCESS
Packaging: Bulk
Part Status: Active
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
55+ | 9.68 EUR |
SAF3561EL/V1101,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561EL/V1103,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561EL/V1102,51 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Description: IC DAB RADIO 170LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561EL/V1100K |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561EL/V1101,55 |
Hersteller: NXP USA Inc.
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Description: IC DAB RADIO 170LFBGA
Packaging: Tray
Package / Case: 170-LFBGA
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 170-LFBGA (12x12)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561HV/V1103,55 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3560HV/V1100,51 |
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Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3560HV/V1102,55 |
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Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561HV/V1101,51 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3561HV/V1103,51 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF3560HV/V1106K |
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Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
74AHCT2G32GD,125 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Description: IC GATE OR 2CH 2-INP 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
auf Bestellung 5387 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2049+ | 0.24 EUR |
PRF13750HR9 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS NI1230
Packaging: Strip
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 105 V
Description: RF MOSFET LDMOS NI1230
Packaging: Strip
Package / Case: SOT-979A
Current Rating (Amps): 10µA
Frequency: 700MHz ~ 1.3GHz
Configuration: Dual
Power - Output: 650W
Gain: 20.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Part Status: Obsolete
Voltage - Rated: 105 V
Produkt ist nicht verfügbar
K32W1480VFTBT |
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Hersteller: NXP USA Inc.
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.2, Thread, Zigbee®
Current - Receiving: 8.7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
Part Status: Active
Description: K4W1 HVQFN48
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz
Memory Size: 1MB Flash, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Power - Output: 10dBm
Protocol: Bluetooth v5.2, Thread, Zigbee®
Current - Receiving: 8.7mA
Data Rate (Max): 2Mbps
Current - Transmitting: 22.4mA
Supplier Device Package: 48-HVQFN (7x7)
Modulation: FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
Part Status: Active
auf Bestellung 1298 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.04 EUR |
10+ | 11.99 EUR |
25+ | 11.74 EUR |
40+ | 11.7 EUR |
80+ | 10.5 EUR |
260+ | 10.18 EUR |
520+ | 9.68 EUR |
1040+ | 9.34 EUR |
74LVC1G06GN,132 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
Description: IC INVERTER 1CH 1-INP 6XSON
Features: Open Drain
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: -, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
auf Bestellung 96924 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2882+ | 0.16 EUR |
74AHCT1G04GV |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHCT1G04GV - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74AHCT1G04GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Description: INVERTER, AHCT/VHCT/VT SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74AHCT1G04GM115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHCT1G04GM - INVE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MMW9014KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 24.25GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
MMW9012KZ |
Hersteller: NXP USA Inc.
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Description: 4-CHANNEL DUAL-POLARIZED ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 182-UFBGA
Mounting Type: Surface Mount
Function: Transmitter
Frequency: 26.5GHz ~ 29.5GHz
RF Type: General Purpose
Supplier Device Package: 182-HUBGA (6.1x6.5)
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G74GF,115 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 200 MHz
Input Capacitance: 4 pF
Supplier Device Package: 8-XSON (1.35x1)
Max Propagation Delay @ V, Max CL: 4.1ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 200219 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1880+ | 0.26 EUR |
PCA9634D |
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Hersteller: NXP USA Inc.
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LED DRIVER 8-SEGMENT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9634D118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC LED DRIVER LIN DIM 25MA 20SO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DB128MPVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12DB128CFUE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N74F541D,623 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 5.5V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 946 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
946+ | 0.54 EUR |
PMMA2241KEG |
Produkt ist nicht verfügbar
LM75BDP/DG,118 |
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Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
LM75BDP/DG,118 |
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Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Description: SENSOR DIGITAL -55C-125C 8TSSOP
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-TSSOP
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Obsolete
Produkt ist nicht verfügbar
74LVC1G80GM,115 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (1.45x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 14440 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4653+ | 0.097 EUR |
MC56F83766VLK |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 20x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPXV2202DP | ![]() |
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Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 29.01PSID 0.13" .04V 8SOP
Features: Temperature Compensated
Packaging: Tray
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MC9S08GT8AMFCE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
67+ | 7.38 EUR |
MKL05Z32VLF4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 25 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.63 EUR |
10+ | 8.29 EUR |
S9KEAZN8AMFKR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5000+ | 2.31 EUR |
S9KEAZN8AMFKR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 9980 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.23 EUR |
10+ | 4.09 EUR |
100+ | 3.29 EUR |
500+ | 3.11 EUR |
1000+ | 2.57 EUR |
2500+ | 2.4 EUR |
PEMI2STD/WG,115 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 200 OHM/11PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 11pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
PTN3222CUKZ |
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Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Tape & Reel (TR)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8000+ | 1.43 EUR |
PTN3222CUKZ |
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Hersteller: NXP USA Inc.
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
Description: IC EUSB2 TO USB2 WLCSP12
Packaging: Cut Tape (CT)
Package / Case: 12-XFBGA, WLCSP
Delay Time: 3.0ns (Max)
Number of Channels: 1
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.85V ~ 3.63V
Applications: USB
Current - Supply: 55mA
Data Rate (Max): 480Mbps
Supplier Device Package: 12-WLCSP (1.55x1.18)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Capacitance - Input: 10 pF
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.26 EUR |
Z0107NA,116 |
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Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Part Status: Active
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.5A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Part Status: Active
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
auf Bestellung 99890 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2699+ | 0.18 EUR |
74ABT652AD,118 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
452+ | 1.09 EUR |
74LVC32245AEC,551 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 5700 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
89+ | 5.95 EUR |
74LVC32245AEC,518 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 80605 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
89+ | 5.95 EUR |
MPXHZ6116A6U |
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Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Produkt ist nicht verfügbar
MPXHZ6116A6T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 4.645V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.399 V ~ 4.645 V
Operating Pressure: 2.9PSI ~ 16.68PSI (20kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Produkt ist nicht verfügbar
STMP3770XXBJEA3N |
Produkt ist nicht verfügbar
STMP3770XXLAEA3N |
Produkt ist nicht verfügbar
74LVC1G3157GM,132 |
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Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 6-XSON (1.45x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 4ns, 3.5ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 10OHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 6-XSON (1.45x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 4ns, 3.5ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
auf Bestellung 60636 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2659+ | 0.18 EUR |
LX2160XN72232B |
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Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1002.94 EUR |
MPC8560VTAQFC |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Description: IC MPU MPC85XX 1.0GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCI, RapidIO, SPI, TDM, UART
Produkt ist nicht verfügbar
MPC8248VRTMFA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
Description: IC MPU MPC82XX 400MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Active
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 163.26 EUR |
MC9S08GT8ACFBE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-QFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar