Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35282) > Seite 511 nach 589
Foto | Bezeichnung | Hersteller | Beschreibung |
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SLRC61003HNY | NXP USA Inc. |
Description: CL READER IC'S Packaging: Cut Tape (CT) |
auf Bestellung 34735 Stücke: Lieferzeit 10-14 Tag (e) |
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P60D144PU12/9A201V | NXP USA Inc. |
Description: IC SMART CARD CTLR UNCASED Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC33FS6512CAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33FS6512LAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC35FS6512NAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC35FS6512CAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC33FS6512CAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC33FS6512LAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC35FS6512CAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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MC35FS6512NAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
Produkt ist nicht verfügbar |
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TJA1124AHG/1Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1124AHG/1Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC16240ADGG/C4118 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 6093 Stücke: Lieferzeit 10-14 Tag (e) |
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MPF5020CMMACESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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MC34VR500VCESR2 | NXP USA Inc. |
Description: REGULATOR, BUCK, QUAD WITH UP TO Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.8V ~ 4.5V Applications: Processor Current - Supply: 297µA Supplier Device Package: 56-QFN-EP (8x8) |
Produkt ist nicht verfügbar |
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MX93AUD-HAT | NXP USA Inc. |
![]() Packaging: Box |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL36Z256VMC4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D - 16bit; D/A - 12bit Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 84 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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T2080NSN8MQB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) |
Produkt ist nicht verfügbar |
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P3041NSE7NNC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) |
Produkt ist nicht verfügbar |
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SCC2692AC1A44,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Configurable GPIO, Internal Oscillator, Timer/Counter Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes |
Produkt ist nicht verfügbar |
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SCC2692AC1A44,512 | NXP USA Inc. |
![]() Packaging: Tube Features: Configurable GPIO, Internal Oscillator, Timer/Counter Package / Case: 44-LCC (J-Lead) Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 5V Data Rate (Max): 1Mbps Supplier Device Package: 44-PLCC With Auto Flow Control: Yes With False Start Bit Detection: Yes |
Produkt ist nicht verfügbar |
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MPC8349EVVAJDB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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BFT25,215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 30mW Current - Collector (Ic) (Max): 6.5mA Voltage - Collector Emitter Breakdown (Max): 5V DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V Frequency - Transition: 2.3GHz Noise Figure (dB Typ @ f): 5.5dB @ 500MHz Supplier Device Package: SOT-23 (TO-236AB) |
auf Bestellung 4782 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33MR3003AXVKR2 | NXP USA Inc. |
Description: IC Packaging: Bulk Package / Case: 214-UFBGA, WLCSP Mounting Type: Surface Mount Frequency: 76GHz ~ 81GHz Operating Temperature: 125°C Antenna Type: Antenna Not Included Modulation: BPSK RF Family/Standard: General ISM > 1GHz |
Produkt ist nicht verfügbar |
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74AHCT08PW/C1118 | NXP USA Inc. |
![]() Packaging: Bulk |
Produkt ist nicht verfügbar |
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MPX2010D | NXP USA Inc. |
![]() Packaging: Tray Features: Temperature Compensated Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Differential Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 10.88PSI (75kPa) |
auf Bestellung 925 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68040FE25V | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68EC040FE40A | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 184-BCQFP Mounting Type: Surface Mount Speed: 40MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68040 Voltage - I/O: 5.0V Supplier Device Package: 184-CQFP (31.3x31.3) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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PESD5V0C1UZF315 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 171000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08SL8F1MTLR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S08SL8F1MTL | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28TSSOP Packaging: Tube Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPC8272VRMIBA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MPC8271CVRMIBA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MPC8272CVRMIBA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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MPC8272VRPIEA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
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TEA1936XDB1530UL | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Charger Type: Power Management Utilized IC / Part: TEA1936x Supplied Contents: Board(s) |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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SAF4000EL/101Z224Y | NXP USA Inc. |
Description: SAF4000EL Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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SAF4000EL/101Q224Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2240 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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Z0109NA0,412 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads Mounting Type: Through Hole Triac Type: Logic - Sensitive Gate Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 10 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 12.5A, 13.8A Voltage - Gate Trigger (Vgt) (Max): 1.3 V Supplier Device Package: TO-92-3 Current - On State (It (RMS)) (Max): 1 A Voltage - Off State: 800 V |
auf Bestellung 3737 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEQ512J3VALR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5603BK0MLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 12x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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HEF4515BP,652 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X4:16 24DIP Packaging: Tube Package / Case: 24-DIP (0.600", 15.24mm) Mounting Type: Through Hole Circuit: 1 x 4:16 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 15.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 3mA Voltage Supply Source: Dual Supply Supplier Device Package: 24-DIP |
Produkt ist nicht verfügbar |
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74AUP1T58GF | NXP USA Inc. |
![]() Packaging: Bulk Features: Configurable Gate Logic Functions Package / Case: 6-XFDFN Output Type: Single-Ended Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Supplier Device Package: 6-XSON (1x1) Channel Type: Unidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.8 V ~ 2.7 V Voltage - VCCB: 2.3 V ~ 3.6 V Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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MCIMX6G2DVM05AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
auf Bestellung 616 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA88182HT/1J | NXP USA Inc. |
Description: PFC CONTROLLER Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74HCT04PW-Q100,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
auf Bestellung 6150 Stücke: Lieferzeit 10-14 Tag (e) |
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MF4SAM3X84/9BA6AUJ | NXP USA Inc. |
Description: MF4SAM3X84 Packaging: Tape & Reel (TR) Package / Case: Module Mounting Type: Surface Mount Interface: I2C Type: RFID Reader Operating Temperature: -25°C ~ 85°C Voltage - Supply: 6V Standards: Mifare, ISO 14443, ISO 7816 Supplier Device Package: PCM1.1 |
Produkt ist nicht verfügbar |
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LFVBBJ76ZA | NXP USA Inc. |
Description: QORIVVA MPC5676R 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5676R Accessory Type: Logic Analyzer |
Produkt ist nicht verfügbar |
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LFLAIBW1A | NXP USA Inc. |
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
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LFLAIBS1A | NXP USA Inc. |
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
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LFVDBVLAIB | NXP USA Inc. |
Description: VERTICAL LOGIC ANALYZER BOARD FO Packaging: Bulk For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx Accessory Type: Logic Analyzer |
Produkt ist nicht verfügbar |
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LFLAIBHT | NXP USA Inc. |
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
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LFLAIBLT | NXP USA Inc. |
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER Packaging: Bulk Module/Board Type: Adapter Board |
Produkt ist nicht verfügbar |
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PCA9515AD | NXP USA Inc. |
![]() ![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 3.6V Applications: I2C Current - Supply: 500µA Data Rate (Max): 400kHz Supplier Device Package: 8-SOIC Capacitance - Input: 7 pF |
auf Bestellung 1509 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K342EHT0MPAST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 438 Stücke: Lieferzeit 10-14 Tag (e) |
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S32K310NHT0VPASR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 |
Produkt ist nicht verfügbar |
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S32K310NHT0VPAST | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100QFP Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I²S, WDT Supplier Device Package: 100-MaxQFP (10x10) Number of I/O: 84 |
Produkt ist nicht verfügbar |
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S32K312NHT0VPASR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S32K312NHT0VPAST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S32K312NHT0VPBST | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, Serial Audio, WDT Supplier Device Package: 172-QFP (16x16) Number of I/O: 143 Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
SLRC61003HNY |
auf Bestellung 34735 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.51 EUR |
P60D144PU12/9A201V |
Hersteller: NXP USA Inc.
Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33FS6512CAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6512LAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC35FS6512NAER2 |
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Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC35FS6512CAER2 |
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Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33FS6512CAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6512LAE |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC35FS6512CAE |
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Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC35FS6512NAE |
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Hersteller: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
TJA1124AHG/1Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 2.59 EUR |
TJA1124AHG/1Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.16 EUR |
10+ | 4.63 EUR |
25+ | 4.38 EUR |
100+ | 3.79 EUR |
250+ | 3.6 EUR |
500+ | 3.23 EUR |
1000+ | 2.72 EUR |
74LVC16240ADGG/C4118 |
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auf Bestellung 6093 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
452+ | 1.16 EUR |
MPF5020CMMACESR2 |
Produkt ist nicht verfügbar
MC34VR500VCESR2 |
Hersteller: NXP USA Inc.
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Produkt ist nicht verfügbar
MKL36Z256VMC4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
T2080NSN8MQB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
P3041NSE7NNC |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
SCC2692AC1A44,518 |
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Hersteller: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tape & Reel (TR)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tape & Reel (TR)
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
SCC2692AC1A44,512 |
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Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 44-PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Description: UART IC 2, DUART CHANNEL 44-PLCC
Packaging: Tube
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
Produkt ist nicht verfügbar
MPC8349EVVAJDB |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 266.31 EUR |
24+ | 220.62 EUR |
BFT25,215 |
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Hersteller: NXP USA Inc.
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
auf Bestellung 4782 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1777+ | 0.28 EUR |
MC33MR3003AXVKR2 |
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
Description: IC
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
Produkt ist nicht verfügbar
74AHCT08PW/C1118 |
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Produkt ist nicht verfügbar
MPX2010D |
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Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
auf Bestellung 925 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.94 EUR |
10+ | 28.46 EUR |
25+ | 26.96 EUR |
125+ | 23.22 EUR |
500+ | 21.72 EUR |
MC68040FE25V |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC68EC040FE40A |
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Hersteller: NXP USA Inc.
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
PESD5V0C1UZF315 |
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auf Bestellung 171000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8876+ | 0.053 EUR |
S9S08SL8F1MTLR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08SL8F1MTL |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8272VRMIBA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8271CVRMIBA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8272CVRMIBA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MPC8272VRPIEA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
TEA1936XDB1530UL |
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Hersteller: NXP USA Inc.
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
Description: TEA1936X DEMOBOARD 1530
Packaging: Bulk
Function: Battery Charger
Type: Power Management
Utilized IC / Part: TEA1936x
Supplied Contents: Board(s)
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 568.52 EUR |
SAF4000EL/101Z224Y |
Produkt ist nicht verfügbar
SAF4000EL/101Q224Y |
Produkt ist nicht verfügbar
Z0109NA0,412 |
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Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12.5A, 13.8A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12.5A, 13.8A
Voltage - Gate Trigger (Vgt) (Max): 1.3 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 1 A
Voltage - Off State: 800 V
auf Bestellung 3737 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2502+ | 0.19 EUR |
S912XEQ512J3VALR |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5603BK0MLH6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
HEF4515BP,652 |
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Description: IC DECODER/DEMUX 1X4:16 24DIP
Packaging: Tube
Package / Case: 24-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Circuit: 1 x 4:16
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 15.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 3mA
Voltage Supply Source: Dual Supply
Supplier Device Package: 24-DIP
Produkt ist nicht verfügbar
74AUP1T58GF |
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Hersteller: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Configurable Gate Logic Functions
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Packaging: Bulk
Features: Configurable Gate Logic Functions
Package / Case: 6-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 6-XSON (1x1)
Channel Type: Unidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.8 V ~ 2.7 V
Voltage - VCCB: 2.3 V ~ 3.6 V
Number of Circuits: 1
Produkt ist nicht verfügbar
MCIMX6G2DVM05AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
auf Bestellung 616 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 32.68 EUR |
10+ | 26.12 EUR |
152+ | 22.06 EUR |
456+ | 21.93 EUR |
TEA88182HT/1J |
Hersteller: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: PFC CONTROLLER
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT04PW-Q100,118 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 6150 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2691+ | 0.18 EUR |
MF4SAM3X84/9BA6AUJ |
Hersteller: NXP USA Inc.
Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
Description: MF4SAM3X84
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Surface Mount
Interface: I2C
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 6V
Standards: Mifare, ISO 14443, ISO 7816
Supplier Device Package: PCM1.1
Produkt ist nicht verfügbar
LFVBBJ76ZA |
Hersteller: NXP USA Inc.
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
Description: QORIVVA MPC5676R 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
LFLAIBW1A |
Hersteller: NXP USA Inc.
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 422 PIN 1.0MM PITCH LOGIC ANALYZ
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
LFLAIBS1A |
Hersteller: NXP USA Inc.
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 256 PIN 1.0 MM LOGIC ANALYZER BO
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
LFVDBVLAIB |
Hersteller: NXP USA Inc.
Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
Description: VERTICAL LOGIC ANALYZER BOARD FO
Packaging: Bulk
For Use With/Related Products: MPC55xx, MPC56xx, MPC57xx
Accessory Type: Logic Analyzer
Produkt ist nicht verfügbar
LFLAIBHT |
Hersteller: NXP USA Inc.
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 100 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
LFLAIBLT |
Hersteller: NXP USA Inc.
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 144 PIN 0.5MM QFP LOGIC ANALYZER
Packaging: Bulk
Module/Board Type: Adapter Board
Produkt ist nicht verfügbar
PCA9515AD | ![]() |
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Hersteller: NXP USA Inc.
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
Description: PCA9515A DUAL BIDIRECTIONAL I2C
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: I2C
Current - Supply: 500µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SOIC
Capacitance - Input: 7 pF
auf Bestellung 1509 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
239+ | 2.07 EUR |
S32K342EHT0MPAST |
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Hersteller: NXP USA Inc.
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K342, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28 EUR |
10+ | 25.91 EUR |
25+ | 25.56 EUR |
40+ | 25.24 EUR |
80+ | 22.12 EUR |
230+ | 21.17 EUR |
S32K310NHT0VPASR |
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Hersteller: NXP USA Inc.
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Description: S32K310, 512KB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
S32K310NHT0VPAST |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Description: IC MCU 32BIT 512KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I²S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Number of I/O: 84
Produkt ist nicht verfügbar
S32K312NHT0VPASR |
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Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K312NHT0VPAST |
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Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S32K312NHT0VPBST |
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Hersteller: NXP USA Inc.
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Description: S32K312, 2MB FLASH, ARM M7
Packaging: Tray
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Number of I/O: 143
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar