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MC13202FC MC13202FC NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA24S08AD PCA24S08AD NXP USA Inc. PHGLS20439-1.pdf?t.download=true&u=5oefqw Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4264 Stücke:
Lieferzeit 10-14 Tag (e)
740+0.67 EUR
Mindestbestellmenge: 740
PCA24S08AD112 NXP USA Inc. Description: EEPROM 1MX8
Produkt ist nicht verfügbar
PCA24S08AD,112 PCA24S08AD,112 NXP USA Inc. PCA24S08A.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1839 Stücke:
Lieferzeit 10-14 Tag (e)
FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
FXLS8964AFR3 FXLS8964AFR3 NXP USA Inc. FXLS8964AF.pdf Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.49 EUR
10+ 4.12 EUR
25+ 3.67 EUR
50+ 3.48 EUR
100+ 3.39 EUR
500+ 2.84 EUR
1000+ 2.66 EUR
Mindestbestellmenge: 4
NX7002BK215 NX7002BK215 NXP USA Inc. NX7002BK.pdf Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
auf Bestellung 813665 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.032 EUR
Mindestbestellmenge: 15000
MC56F80746MLF MC56F80746MLF NXP USA Inc. MC56F80XXX.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.66 EUR
10+ 11.52 EUR
80+ 9.54 EUR
1000+ 8.32 EUR
Mindestbestellmenge: 2
MC56F80646VLF MC56F80646VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80626VLF MC56F80626VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80736VLF MC56F80736VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80746VLF MC56F80746VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80726VLF MC56F80726VLF NXP USA Inc. MC56F80XXX.pdf Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F8027VLHR MC56F8027VLHR NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.12 EUR
10+ 20.07 EUR
100+ 16.95 EUR
500+ 16.85 EUR
BLF7G24L-100,112 BLF7G24L-100,112 NXP USA Inc. PHGLS23273-1.pdf?t.download=true&u=5oefqw Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
6+96.04 EUR
Mindestbestellmenge: 6
MC9S08AC48CFDE MC9S08AC48CFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
48+11 EUR
Mindestbestellmenge: 48
MC9S08AC48CFDE MC9S08AC48CFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC860ENCVR66D4 MPC860ENCVR66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
2+308.44 EUR
Mindestbestellmenge: 2
NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NVT4858UKZ NVT4858UKZ NXP USA Inc. Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.75 EUR
10+ 2.46 EUR
25+ 2.34 EUR
100+ 1.92 EUR
250+ 1.79 EUR
500+ 1.59 EUR
1000+ 1.25 EUR
Mindestbestellmenge: 7
MC68HC908QY4CDTE MC68HC908QY4CDTE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.59 EUR
10+ 10.67 EUR
96+ 8.83 EUR
1056+ 7.71 EUR
Mindestbestellmenge: 2
74CBTLVD3245DS,118 74CBTLVD3245DS,118 NXP USA Inc. 74CBTLVD3245_Rev_Mar2017.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
auf Bestellung 1482 Stücke:
Lieferzeit 10-14 Tag (e)
1110+0.44 EUR
Mindestbestellmenge: 1110
MC33FS8530A1ESR2 NXP USA Inc. Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SPC5606BK0VLQ6 SPC5606BK0VLQ6 NXP USA Inc. MPC5606B.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ALVCH16373DL,118 74ALVCH16373DL,118 NXP USA Inc. PHGLS25099-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
430+1.15 EUR
Mindestbestellmenge: 430
BUJD203A,127 BUJD203A,127 NXP USA Inc. PHGLS21815-1.pdf?t.download=true&u=5oefqw Description: NOW WEEN - BUJD203A - POWER BIPO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
auf Bestellung 1499 Stücke:
Lieferzeit 10-14 Tag (e)
908+0.54 EUR
Mindestbestellmenge: 908
BUJD103AD,118 BUJD103AD,118 NXP USA Inc. PHGLS22085-1.pdf?t.download=true&u=5oefqw Description: NOW WEEN - BUJD103AD - POWER BIP
Produkt ist nicht verfügbar
MPC860ENVR50D4 MPC860ENVR50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
auf Bestellung 2640 Stücke:
Lieferzeit 10-14 Tag (e)
3+208.1 EUR
Mindestbestellmenge: 3
MCF52212CAE50 MCF52212CAE50 NXP USA Inc. MCF52211.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.91 EUR
10+ 20.7 EUR
80+ 17.48 EUR
PSMN7R8-120PSQ PSMN7R8-120PSQ NXP USA Inc. PHGLS25951-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 120V 70A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 7.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 120 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9473 pF @ 60 V
auf Bestellung 242 Stücke:
Lieferzeit 10-14 Tag (e)
177+2.99 EUR
Mindestbestellmenge: 177
BZX79-B36,133 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 36V 400MW ALF2
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
16000+0.033 EUR
Mindestbestellmenge: 16000
PH1225AL,115 PH1225AL,115 NXP USA Inc. _nxp_nxp_computing_application_guide-1319618.pdf?t.download=true&u=ovmfp3 Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Bulk
Package / Case: SOT-1023, 4-LFPAK
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 15A, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56; Power-SO8
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 105 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6380 pF @ 12 V
auf Bestellung 24733 Stücke:
Lieferzeit 10-14 Tag (e)
1268+0.39 EUR
Mindestbestellmenge: 1268
K32W041AY K32W041AY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+4.45 EUR
Mindestbestellmenge: 4000
K32W041AMK K32W041AMK NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.89 EUR
10+ 9.73 EUR
25+ 8.75 EUR
80+ 7.98 EUR
230+ 7.2 EUR
440+ 6.46 EUR
2450+ 5.18 EUR
Mindestbestellmenge: 2
K32W041AMY K32W041AMY NXP USA Inc. K32W041AM.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+5.18 EUR
Mindestbestellmenge: 4000
SPC5634MF2MMG80 SPC5634MF2MMG80 NXP USA Inc. MPC5634M.pdf Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
IMXEBOOKDC4 NXP USA Inc. Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
MCZ33905CS5EKR2,518 MCZ33905CS5EKR2,518 NXP USA Inc. MC33903-MC33904-MC33905.pdf Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Produkt ist nicht verfügbar
MCZ33905CD5EK MCZ33905CD5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
MCZ33905CS5EK MCZ33905CS5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
MCZ33905CS5EKR2 MCZ33905CS5EKR2 NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
MC908GR16MFAE MC908GR16MFAE NXP USA Inc. MC68HC908GR16.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Produkt ist nicht verfügbar
74LVCH32373AEC/G557 74LVCH32373AEC/G557 NXP USA Inc. PHGL-S-A0001341479-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
auf Bestellung 8191 Stücke:
Lieferzeit 10-14 Tag (e)
64+7.56 EUR
Mindestbestellmenge: 64
74LVCH32373AEC/G551 NXP USA Inc. PHGL-S-A0001341479-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
KIT10XS6225EKEVB NXP USA Inc. Description: EVALUATION KIT - MC10XS6225 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6225
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT10XS6200EKEVB NXP USA Inc. Description: EVALUATION KIT - MC10XS6200 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6200
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT25XS6300EKEVB NXP USA Inc. KT12XS6UG.pdf Description: EVALUATION KIT - MC25XS6300 12
Produkt ist nicht verfügbar
LFVBBM34QA NXP USA Inc. Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
Produkt ist nicht verfügbar
BYV415K-600PQ127 BYV415K-600PQ127 NXP USA Inc. BYV415K-600P.pdf Description: DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
252+1.92 EUR
Mindestbestellmenge: 252
PDZ27B/ZL115 PDZ27B/ZL115 NXP USA Inc. PHGLS19616-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER
Produkt ist nicht verfügbar
S912B32E4CFUE8R S912B32E4CFUE8R NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP1G386GF,132 74AUP1G386GF,132 NXP USA Inc. 74AUP1G386.pdf Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
1972+0.24 EUR
Mindestbestellmenge: 1972
74LVC08APW/S400118 74LVC08APW/S400118 NXP USA Inc. 74LVC08A.pdf Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
74LVC08APW-Q100118 74LVC08APW-Q100118 NXP USA Inc. 74LVC08A_Q100.pdf Description: 74LVC08APW-Q100 - AND GATE
Produkt ist nicht verfügbar
S9S08DZ48F2MLFR S9S08DZ48F2MLFR NXP USA Inc. Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NTM88J125T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
NTM88J125T1 NXP USA Inc. Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
JN5148/Z01,515 JN5148/Z01,515 NXP USA Inc. JN5148-001.pdf Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NCF2961VHN3/0200EY NXP USA Inc. Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MKL36Z256VMP4 MKL36Z256VMP4 NXP USA Inc. FSCL-S-A0000571967-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7 Description: KINETIS KL36: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
MC13202FC MC13202.pdf
MC13202FC
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA24S08AD PHGLS20439-1.pdf?t.download=true&u=5oefqw
PCA24S08AD
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 4264 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
740+0.67 EUR
Mindestbestellmenge: 740
PCA24S08AD112
Hersteller: NXP USA Inc.
Description: EEPROM 1MX8
Produkt ist nicht verfügbar
PCA24S08AD,112 PCA24S08A.pdf
PCA24S08AD,112
Hersteller: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SO
Memory Interface: I2C
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1839 Stücke:
Lieferzeit 10-14 Tag (e)
FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
FXLS8964AFR3 FXLS8964AF.pdf
FXLS8964AFR3
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 2-16G 10DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.49 EUR
10+ 4.12 EUR
25+ 3.67 EUR
50+ 3.48 EUR
100+ 3.39 EUR
500+ 2.84 EUR
1000+ 2.66 EUR
Mindestbestellmenge: 4
NX7002BK215 NX7002BK.pdf
NX7002BK215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Part Status: Active
auf Bestellung 813665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15000+0.032 EUR
Mindestbestellmenge: 15000
MC56F80746MLF MC56F80XXX.pdf
MC56F80746MLF
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: 56800EF
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVI, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.66 EUR
10+ 11.52 EUR
80+ 9.54 EUR
1000+ 8.32 EUR
Mindestbestellmenge: 2
MC56F80646VLF MC56F80XXX.pdf
MC56F80646VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80626VLF MC56F80XXX.pdf
MC56F80626VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80736VLF MC56F80XXX.pdf
MC56F80736VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80746VLF MC56F80XXX.pdf
MC56F80746VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F80726VLF MC56F80XXX.pdf
MC56F80726VLF
Hersteller: NXP USA Inc.
Description: IC DIGITAL SIGNAL CTRL LQFP48
Produkt ist nicht verfügbar
MC56F8027VLHR MC56F8037.pdf
MC56F8027VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.12 EUR
10+ 20.07 EUR
100+ 16.95 EUR
500+ 16.85 EUR
BLF7G24L-100,112 PHGLS23273-1.pdf?t.download=true&u=5oefqw
BLF7G24L-100,112
Hersteller: NXP USA Inc.
Description: RF TRANSISTOR
auf Bestellung 45 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6+96.04 EUR
Mindestbestellmenge: 6
MC9S08AC48CFDE MC9S08AC60.pdf
MC9S08AC48CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
48+11 EUR
Mindestbestellmenge: 48
MC9S08AC48CFDE MC9S08AC60.pdf
MC9S08AC48CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC860ENCVR66D4 MPC860EC.pdf
MPC860ENCVR66D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+308.44 EUR
Mindestbestellmenge: 2
NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NVT4858UKZ
NVT4858UKZ
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 16WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-WLCSP (1.84x1.87)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7+2.75 EUR
10+ 2.46 EUR
25+ 2.34 EUR
100+ 1.92 EUR
250+ 1.79 EUR
500+ 1.59 EUR
1000+ 1.25 EUR
Mindestbestellmenge: 7
MC68HC908QY4CDTE MC68HC908QY4.pdf
MC68HC908QY4CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2440 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.59 EUR
10+ 10.67 EUR
96+ 8.83 EUR
1056+ 7.71 EUR
Mindestbestellmenge: 2
74CBTLVD3245DS,118 74CBTLVD3245_Rev_Mar2017.pdf
74CBTLVD3245DS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Part Status: Obsolete
auf Bestellung 1482 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1110+0.44 EUR
Mindestbestellmenge: 1110
MC33FS8530A1ESR2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP FS8500
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SPC5606BK0VLQ6 MPC5606B.pdf
SPC5606BK0VLQ6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ALVCH16373DL,118 PHGLS25099-1.pdf?t.download=true&u=5oefqw
74ALVCH16373DL,118
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 2
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 2.7V, 3V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-SSOP
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
430+1.15 EUR
Mindestbestellmenge: 430
BUJD203A,127 PHGLS21815-1.pdf?t.download=true&u=5oefqw
BUJD203A,127
Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJD203A - POWER BIPO
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 600mA, 3A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 11 @ 2A, 5V
Supplier Device Package: TO-220AB
Current - Collector (Ic) (Max): 4 A
Voltage - Collector Emitter Breakdown (Max): 425 V
Power - Max: 80 W
auf Bestellung 1499 Stücke:
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Anzahl Preis ohne MwSt
908+0.54 EUR
Mindestbestellmenge: 908
BUJD103AD,118 PHGLS22085-1.pdf?t.download=true&u=5oefqw
BUJD103AD,118
Hersteller: NXP USA Inc.
Description: NOW WEEN - BUJD103AD - POWER BIP
Produkt ist nicht verfügbar
MPC860ENVR50D4 MPC860EC.pdf
MPC860ENVR50D4
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
auf Bestellung 2640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+208.1 EUR
Mindestbestellmenge: 3
MCF52212CAE50 MCF52211.pdf
MCF52212CAE50
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Last Time Buy
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 690 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.91 EUR
10+ 20.7 EUR
80+ 17.48 EUR
PSMN7R8-120PSQ PHGLS25951-1.pdf?t.download=true&u=5oefqw
PSMN7R8-120PSQ
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 120V 70A I2PAK
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 7.9mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 120 V
Gate Charge (Qg) (Max) @ Vgs: 167 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9473 pF @ 60 V
auf Bestellung 242 Stücke:
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Anzahl Preis ohne MwSt
177+2.99 EUR
Mindestbestellmenge: 177
BZX79-B36,133 PHGLS19463-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 400MW ALF2
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
16000+0.033 EUR
Mindestbestellmenge: 16000
PH1225AL,115 _nxp_nxp_computing_application_guide-1319618.pdf?t.download=true&u=ovmfp3
PH1225AL,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Packaging: Bulk
Package / Case: SOT-1023, 4-LFPAK
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.2mOhm @ 15A, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Supplier Device Package: LFPAK56; Power-SO8
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 105 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6380 pF @ 12 V
auf Bestellung 24733 Stücke:
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Anzahl Preis ohne MwSt
1268+0.39 EUR
Mindestbestellmenge: 1268
K32W041AY K32W041AM.pdf
K32W041AY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+4.45 EUR
Mindestbestellmenge: 4000
K32W041AMK K32W041AM.pdf
K32W041AMK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.89 EUR
10+ 9.73 EUR
25+ 8.75 EUR
80+ 7.98 EUR
230+ 7.2 EUR
440+ 6.46 EUR
2450+ 5.18 EUR
Mindestbestellmenge: 2
K32W041AMY K32W041AM.pdf
K32W041AMY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+5.18 EUR
Mindestbestellmenge: 4000
SPC5634MF2MMG80 MPC5634M.pdf
SPC5634MF2MMG80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 94K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z3
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Part Status: Active
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
IMXEBOOKDC4
Hersteller: NXP USA Inc.
Description: KIT EVAL
Packaging: Bulk
For Use With/Related Products: i.MX 6SoloLite
Accessory Type: Electronic Paper Display (EPD)
Part Status: Active
Produkt ist nicht verfügbar
MCZ33905CS5EKR2,518 MC33903-MC33904-MC33905.pdf
MCZ33905CS5EKR2,518
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 5.0V
Produkt ist nicht verfügbar
MCZ33905CD5EK MC33903%2C4%2C5.pdf
MCZ33905CD5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
MCZ33905CS5EK MC33903%2C4%2C5.pdf
MCZ33905CS5EK
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
MCZ33905CS5EKR2 MC33903%2C4%2C5.pdf
MCZ33905CS5EKR2
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
MC908GR16MFAE MC68HC908GR16.pdf
MC908GR16MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Produkt ist nicht verfügbar
74LVCH32373AEC/G557 PHGL-S-A0001341479-1.pdf?t.download=true&u=5oefqw
74LVCH32373AEC/G557
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 4
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 3ns
Supplier Device Package: 96-LFBGA (13.5x5.5)
auf Bestellung 8191 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
64+7.56 EUR
Mindestbestellmenge: 64
74LVCH32373AEC/G551 PHGL-S-A0001341479-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
Produkt ist nicht verfügbar
KIT10XS6225EKEVB
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6225 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6225
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT10XS6200EKEVB
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC10XS6200 12
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: MC10XS6200
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
KIT25XS6300EKEVB KT12XS6UG.pdf
Hersteller: NXP USA Inc.
Description: EVALUATION KIT - MC25XS6300 12
Produkt ist nicht verfügbar
LFVBBM34QA
Hersteller: NXP USA Inc.
Description: MPC5534 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Board Type: Evaluation Platform
Utilized IC / Part: MPC5534
Part Status: Obsolete
Produkt ist nicht verfügbar
BYV415K-600PQ127 BYV415K-600P.pdf
BYV415K-600PQ127
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 438 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
252+1.92 EUR
Mindestbestellmenge: 252
PDZ27B/ZL115 PHGLS19616-1.pdf?t.download=true&u=5oefqw
PDZ27B/ZL115
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Produkt ist nicht verfügbar
S912B32E4CFUE8R
S912B32E4CFUE8R
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP1G386GF,132 74AUP1G386.pdf
74AUP1G386GF,132
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 3-INP 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT891 (1x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.1ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1972+0.24 EUR
Mindestbestellmenge: 1972
74LVC08APW/S400118 74LVC08A.pdf
74LVC08APW/S400118
Hersteller: NXP USA Inc.
Description: AND GATE, LVC/LCX/Z SERIES
Produkt ist nicht verfügbar
74LVC08APW-Q100118 74LVC08A_Q100.pdf
74LVC08APW-Q100118
Hersteller: NXP USA Inc.
Description: 74LVC08APW-Q100 - AND GATE
Produkt ist nicht verfügbar
S9S08DZ48F2MLFR
S9S08DZ48F2MLFR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NTM88J125T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
NTM88J125T1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
Part Status: Obsolete
Produkt ist nicht verfügbar
JN5148/Z01,515 JN5148-001.pdf
JN5148/Z01,515
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 56VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB ROM, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.75dBm
Protocol: Zigbee®
Current - Receiving: 17.5mA
Data Rate (Max): 667kbps
Current - Transmitting: 15mA
Supplier Device Package: 56-HVQFN (8x8)
GPIO: 21
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NCF2961VHN3/0200EY
Hersteller: NXP USA Inc.
Description: COMBI KEY TX 014
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MKL36Z256VMP4 FSCL-S-A0000571967-1.pdf?hkey=EC6BD57738AE6E33B588C5F9AD3CEFA7
MKL36Z256VMP4
Hersteller: NXP USA Inc.
Description: KINETIS KL36: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
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