Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 480 nach 584
Foto | Bezeichnung | Hersteller | Beschreibung |
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MCF51MM256VLL557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MCF5475ZP266557 | NXP USA Inc. |
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MCF52258CAG66,557 | NXP USA Inc. |
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MCF51JF128VHS | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 44-VFLGA Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 44-MAPLGA (5x5) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 927 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K144HAT0VLLR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FS32K142HFT0MLHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
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CBT3861BQ,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 24-DHVQFN (5.5x3.5) |
auf Bestellung 2650 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTD3861BQ,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Circuit: 10 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 24-DHVQFN (5.5x3.5) |
auf Bestellung 4400 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G07GM,132 | NXP USA Inc. |
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auf Bestellung 108999 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4041CX25/LF/P13 | NXP USA Inc. |
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auf Bestellung 2025 Stücke: Lieferzeit 10-14 Tag (e) |
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IP4338CX24/LF/P13 | NXP USA Inc. |
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auf Bestellung 4399 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC3G07DC,125 | NXP USA Inc. |
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auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC3G07DP,125 | NXP USA Inc. |
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auf Bestellung 21000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC245ABX,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-XFQFN Exposed Pad Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 20-DHXQFN (4.5x2.5) Part Status: Active |
auf Bestellung 69907 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33903D5EK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912ZVL64F0MLF | NXP USA Inc. |
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MC9S12H128VFVE | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LPC54102J512BD64QL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 50 DigiKey Programmable: Not Verified |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6X2AVN08AC | NXP USA Inc. |
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MC9S08JM8CLC | NXP USA Inc. |
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SPC5607BK0CLU4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 149 DigiKey Programmable: Not Verified |
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SPC5607BK0CLU4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 29x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 149 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCIMX6D5EZK08AD | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Part Status: Active |
auf Bestellung 1648 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1082TT,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Interface: FlexRay Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 14-TSSOP Part Status: Obsolete Grade: Automotive |
Produkt ist nicht verfügbar |
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BGS8L2X | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz Voltage - Supply: 1.5V ~ 3.1V Gain: 13dB Current - Supply: 5.2mA Noise Figure: 0.85dB Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
Produkt ist nicht verfügbar |
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BGS8L2X | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz Voltage - Supply: 1.5V ~ 3.1V Gain: 13dB Current - Supply: 5.2mA Noise Figure: 0.85dB Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
auf Bestellung 2449 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH32VTL | NXP USA Inc. |
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auf Bestellung 16058 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH32VTL | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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NVT4557HKX | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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NVT4557HKX | NXP USA Inc. |
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auf Bestellung 2860 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS86AUTFRDMEM | NXP USA Inc. |
Description: EVAL BOARD FS86 12V Packaging: Tray Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS86 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Embedded: Yes, MCU, 32-Bit |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS86SKTFRDMEM | NXP USA Inc. |
Description: EVAL BOARD FS86 12V/24V Packaging: Tray Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS86 Supplied Contents: Board(s), Cable(s), Power Supply, Accessories Embedded: Yes, MCU, 32-Bit |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVC244D112 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC33879TEK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33879BPEK | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC33879BPEKR2 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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FRDMDUALK3664EVB | NXP USA Inc. |
![]() Packaging: Box Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2211BT/N1,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Frequency: 40.05kHz ~ 42.68kHz Type: CFL/TL Driver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 10.7V ~ 13.8V Supplier Device Package: 14-SO Dimming: No Current - Output Source/Sink: 1.35A |
auf Bestellung 2769 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU7044,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 40MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 3.1V ~ 3.5V Gain: 14dB Current - Supply: 34mA Noise Figure: 2.8dB P1dB: 13dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Active |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF85263ATL/A115 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC100ES6111FAR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: ECL, PECL Type: Fanout Buffer (Distribution), Multiplexer Input: ECL, HSTL, PECL Operating Temperature: -40°C ~ 110°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 2.7 GHz |
Produkt ist nicht verfügbar |
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MC100ES6111FAR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: ECL, PECL Type: Fanout Buffer (Distribution), Multiplexer Input: ECL, HSTL, PECL Operating Temperature: -40°C ~ 110°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 2.7 GHz |
Produkt ist nicht verfügbar |
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BUK762R4-60E,118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912ZVML31F1WKF557 | NXP USA Inc. |
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74ABT540DB,118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LPC12D27FBD100/301 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PEMI4QFN/LP,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 19dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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LX2122RE82029B | NXP USA Inc. |
Description: IC MPU QORIQ LX 2GHZ 1150FBGA Packaging: Tray Package / Case: 1150-FBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: 5°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A72 Supplier Device Package: 1150-FBGA (23x23) USB: USB 3.0 (1) Number of Cores/Bus Width: 12 Core, 64-Bit RAM Controllers: DDR4, SDRAM Graphics Acceleration: No SATA: SATA 6Gbps (4) Additional Interfaces: CANbus, I2C, PCIe, SPI, UART |
Produkt ist nicht verfügbar |
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MK20DX64VFT5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 11x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Part Status: Active Number of I/O: 29 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SGTL5000XNBA3R2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Type: Stereo Audio Data Interface: I2C, I2S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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SGTL5000XNBA3 | NXP USA Inc. |
Description: IC AUDIO CODEC STEREO 32HVQFN Packaging: Tray Type: Stereo Audio Data Interface: I²C, I²S, PCM, SPI Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply, Analog: 1.62V ~ 3.6V Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V Dynamic Range, ADCs / DACs (db) Typ: 87 / 100 Number of ADCs / DACs: 1 / 1 S/N Ratio, ADCs / DACs (db) Typ: 90 / 100 Sigma Delta: No Part Status: Active |
Produkt ist nicht verfügbar |
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MCIMX6U5DVM10ACR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 879 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI6QFN/CG,132 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
Produkt ist nicht verfügbar |
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PEMI6QFN/CG,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 11pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XD64F2MAA557 | NXP USA Inc. |
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auf Bestellung 1260 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12XS128J1MAA557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XEG128J2MAA557 | NXP USA Inc. |
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S912XD128F2MAA557 | NXP USA Inc. | Description: MICROCONTROLLER, 16-BIT, FLASH, |
Produkt ist nicht verfügbar |
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AFT23H201-24SR6 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: ACP-1230S-4L2L Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.4GHz Power - Output: 210W Gain: 15.6dB Technology: LDMOS Supplier Device Package: ACP-1230S-4L2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 500 mA |
Produkt ist nicht verfügbar |
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BGO807C/SC0112 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 10848 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51MM256VLL557 |
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Hersteller: NXP USA Inc.
Description: COLD FIRE MICROCONTROLLER 32-BI
Description: COLD FIRE MICROCONTROLLER 32-BI
Produkt ist nicht verfügbar
MCF5475ZP266557 |
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Hersteller: NXP USA Inc.
Description: MCF547X V4ECORE MMU, FPU
Description: MCF547X V4ECORE MMU, FPU
Produkt ist nicht verfügbar
MCF52258CAG66,557 |
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Hersteller: NXP USA Inc.
Description: MCF522XX 32 BIT MCU, COLDFIRE V2
Description: MCF522XX 32 BIT MCU, COLDFIRE V2
Produkt ist nicht verfügbar
MCF51JF128VHS |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Bulk
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 927 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
58+ | 9.2 EUR |
FS32K144HAT0VLLR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K142HFT0MLHR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
CBT3861BQ,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Description: IC BUS SWITCH 10 X 1:1 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-DHVQFN (5.5x3.5)
auf Bestellung 2650 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1397+ | 0.34 EUR |
CBTD3861BQ,118 |
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Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 10 X 1:1 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Description: IC BUS SWITCH 10 X 1:1 24DHVQFN
Packaging: Bulk
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 10 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 24-DHVQFN (5.5x3.5)
auf Bestellung 4400 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1266+ | 0.39 EUR |
74AUP2G07GM,132 |
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Hersteller: NXP USA Inc.
Description: IC BUFF DL LOW PWR OP/DR 6XSON
Description: IC BUFF DL LOW PWR OP/DR 6XSON
auf Bestellung 108999 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3620+ | 0.14 EUR |
IP4041CX25/LF/P13 |
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Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 2025 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1443+ | 0.36 EUR |
IP4338CX24/LF/P13 |
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Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 4399 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1803+ | 0.29 EUR |
74HC3G07DC,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8VSSOP
Description: IC BUFFER NON-INVERT 6V 8VSSOP
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1581+ | 0.32 EUR |
74HC3G07DP,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8TSSOP
Description: IC BUFFER NON-INVERT 6V 8TSSOP
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2299+ | 0.22 EUR |
74LVC245ABX,115 |
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Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Part Status: Active
Description: IC TXRX NON-INVERT 3.6V 20DHXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Part Status: Active
auf Bestellung 69907 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1567+ | 0.31 EUR |
MCZ33903D5EK |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Produkt ist nicht verfügbar
S912ZVL64F0MLF |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
MC9S12H128VFVE |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Description: IC MCU 16BIT 128KB FLASH 144LQFP
Produkt ist nicht verfügbar
LPC54102J512BD64QL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 50
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 20.61 EUR |
10+ | 16.19 EUR |
160+ | 13.41 EUR |
MCIMX6X2AVN08AC |
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Hersteller: NXP USA Inc.
Description: I.MX 6SX ROM PERF ENHAN
Description: I.MX 6SX ROM PERF ENHAN
Produkt ist nicht verfügbar
MC9S08JM8CLC |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Produkt ist nicht verfügbar
SPC5607BK0CLU4 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5607BK0CLU4R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 29x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 149
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCIMX6D5EZK08AD |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Bulk
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Part Status: Active
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 130.8 EUR |
TJA1082TT,112 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
Grade: Automotive
Produkt ist nicht verfügbar
BGS8L2X |
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Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Produkt ist nicht verfügbar
BGS8L2X |
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Hersteller: NXP USA Inc.
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC RF AMP 728MHZ-960MHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
Voltage - Supply: 1.5V ~ 3.1V
Gain: 13dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 2449 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
18+ | 1 EUR |
20+ | 0.89 EUR |
25+ | 0.8 EUR |
100+ | 0.7 EUR |
250+ | 0.62 EUR |
500+ | 0.55 EUR |
1000+ | 0.43 EUR |
MC9S08SH32VTL |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
auf Bestellung 16058 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
89+ | 5.77 EUR |
MC9S08SH32VTL |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Produkt ist nicht verfügbar
NVT4557HKX |
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Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Description: SIM CARD INTERFACE LEVEL TRANSLA
Produkt ist nicht verfügbar
NVT4557HKX |
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Hersteller: NXP USA Inc.
Description: SIM CARD INTERFACE LEVEL TRANSLA
Description: SIM CARD INTERFACE LEVEL TRANSLA
auf Bestellung 2860 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.2 EUR |
9+ | 2.13 EUR |
11+ | 1.73 EUR |
25+ | 1.49 EUR |
50+ | 1.29 EUR |
100+ | 1.17 EUR |
500+ | 0.99 EUR |
1000+ | 0.88 EUR |
KITFS86AUTFRDMEM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FS86 12V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 885.63 EUR |
KITFS86SKTFRDMEM |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FS86 12V/24V
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS86
Supplied Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1062.88 EUR |
74ALVC244D112 |
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Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MC33879TEK |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
MC33879BPEK |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
MC33879BPEKR2 |
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Hersteller: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Description: IC SW SERIAL OCTAL 32SOIC
Produkt ist nicht verfügbar
FRDMDUALK3664EVB |
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auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 500.88 EUR |
UBA2211BT/N1,518 |
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Hersteller: NXP USA Inc.
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.35A
Description: IC CFL/TL DRIVER 42.68KHZ 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 40.05kHz ~ 42.68kHz
Type: CFL/TL Driver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 10.7V ~ 13.8V
Supplier Device Package: 14-SO
Dimming: No
Current - Output Source/Sink: 1.35A
auf Bestellung 2769 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.95 EUR |
11+ | 1.65 EUR |
25+ | 1.54 EUR |
100+ | 1.38 EUR |
250+ | 1.29 EUR |
500+ | 1.22 EUR |
1000+ | 1.16 EUR |
BGU7044,115 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
Description: IC RF AMP GPS 40MHZ-1GHZ 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 3.1V ~ 3.5V
Gain: 14dB
Current - Supply: 34mA
Noise Figure: 2.8dB
P1dB: 13dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1138+ | 0.43 EUR |
PCF85263ATL/A115 |
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Hersteller: NXP USA Inc.
Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: TINY REAL-TIME CLOCK/CALENDAR WI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC100ES6111FAR2 |
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Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
MC100ES6111FAR2 |
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Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
BUK762R4-60E,118 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 120A D2PAK
Description: MOSFET N-CH 60V 120A D2PAK
Produkt ist nicht verfügbar
S912ZVML31F1WKF557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Description: MICROCONTROLLER, 16-BIT, HCS12 C
Produkt ist nicht verfügbar
74ABT540DB,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20SSOP
Description: IC BUFFER INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
LPC12D27FBD100/301 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PEMI4QFN/LP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 19dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.18 EUR |
LX2122RE82029B |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
Produkt ist nicht verfügbar
MK20DX64VFT5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SGTL5000XNBA3R2 |
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Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tape & Reel (TR)
Type: Stereo Audio
Data Interface: I2C, I2S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5000+ | 4.48 EUR |
SGTL5000XNBA3 |
Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I²C, I²S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Description: IC AUDIO CODEC STEREO 32HVQFN
Packaging: Tray
Type: Stereo Audio
Data Interface: I²C, I²S, PCM, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply, Analog: 1.62V ~ 3.6V
Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
Number of ADCs / DACs: 1 / 1
S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
Sigma Delta: No
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6U5DVM10ACR |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 879 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 81.54 EUR |
10+ | 66.15 EUR |
100+ | 57.43 EUR |
PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Cut Tape (CT)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Produkt ist nicht verfügbar
PEMI6QFN/CG,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/11PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 11pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.28 EUR |
S912XD64F2MAA557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
Description: 16-BIT MCU, S12X CORE, 64KB FLAS
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
24+ | 21.34 EUR |
S9S12XS128J1MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT, HCS12 C
Description: MICROCONTROLLER 16-BIT, HCS12 C
Produkt ist nicht verfügbar
S912XEG128J2MAA557 |
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Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 16-BIT FLASH,
Description: MICROCONTROLLER 16-BIT FLASH,
Produkt ist nicht verfügbar
S912XD128F2MAA557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Description: MICROCONTROLLER, 16-BIT, FLASH,
Produkt ist nicht verfügbar
AFT23H201-24SR6 |
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Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Description: AIRFAST RF POWER LDMOS TRANSISTO
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2L
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 210W
Gain: 15.6dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
BGO807C/SC0112 |
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auf Bestellung 10848 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 119.31 EUR |