Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 484 nach 584
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S912ZVHY32F1VLL | NXP USA Inc. |
 Description: IC MCU 16BIT 32KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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S9S12HY32J0CLH557 | NXP USA Inc. |
Description: 16-BIT MCU, S12 CORE, 32KB FLASH |
Produkt ist nicht verfügbar |
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S9S12HY32J0VLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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S912ZVHY32F1CLL | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 4x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 73 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12HY32J0CLHR | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12 Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912ZVHY32F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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| SL3S1205FUD2/HAA | NXP USA Inc. |
Description: UCODE Packaging: Tape & Reel (TR) Package / Case: Die Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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BGU7258X | NXP USA Inc. |
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 5GHz ~ 6GHz RF Type: ISM Voltage - Supply: 3V ~ 3.6V Gain: 14dB Current - Supply: 13mA Noise Figure: 1.6dB Test Frequency: 6GHz Supplier Device Package: 6-HXSON (1.6x1.6) |
auf Bestellung 18117 Stücke: Lieferzeit 10-14 Tag (e) |
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| BGU7051118 | NXP USA Inc. | Description: IC AMP LNA FOR WIRELESS 10HVSON |
Produkt ist nicht verfügbar |
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BGU7045115 | NXP USA Inc. |
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP |
Produkt ist nicht verfügbar |
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BGU7063,518 | NXP USA Inc. |
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.92GHz ~ 1.98GHz RF Type: Cellular Voltage - Supply: 4.75V ~ 5.25V Gain: 37.5dB Current - Supply: 230mA Noise Figure: 0.9dB P1dB: -12.5dBm Test Frequency: 1.95GHz Supplier Device Package: 16-HLQFN (8x8) |
Produkt ist nicht verfügbar |
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| MKW21D256VHA5 | NXP USA Inc. |
Description: KINETIS KW21D: 802.15.4 WIRELESS |
Produkt ist nicht verfügbar |
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| ASL9115FHNZ | NXP USA Inc. | Description: IC LED DRIVER 36HVQFN |
Produkt ist nicht verfügbar |
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| ASL5115FHNZ | NXP USA Inc. |
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 12 Frequency: 200MHz Type: DC DC Controller Operating Temperature: -40°C ~ 125°C (TA) Applications: Automotive Current - Output / Channel: 1.5A Internal Switch(s): Yes Topology: Switched Capacitor (Charge Pump) Supplier Device Package: 36-HVQFN (6x6) Dimming: PWM Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Part Status: Active |
Produkt ist nicht verfügbar |
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PESD5V0L1USF,315 | NXP USA Inc. |
Description: NOW NEXPERIA PESD5V0L1USF - TRAN Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 150°C (TA) Applications: General Purpose Capacitance @ Frequency: 12pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.2A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DSN0603-2 Unidirectional Channels: 1 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 10.5V Power - Peak Pulse: 11W Power Line Protection: No Part Status: Active |
auf Bestellung 11762273 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1812JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
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74LVC1G27GF,132 | NXP USA Inc. |
Description: IC GATE NOR 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
auf Bestellung 169560 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1Z04GF132 | NXP USA Inc. |
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D |
auf Bestellung 89970 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G38GF132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1G38GF - NAND |
auf Bestellung 75000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1G06GF,132-NXP | NXP USA Inc. | Description: IC INVERTER OD 1CH 1-INP 6XSON |
Produkt ist nicht verfügbar |
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74AUP1G58GF,132-NXP | NXP USA Inc. | Description: LOGIC CIRCUIT, CMOS, PDSO6 |
Produkt ist nicht verfügbar |
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NTS0101GF,132 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Tape & Reel (TR) Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT891 (1x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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NTS0101GF,132 | NXP USA Inc. |
Description: IC TRANSLTR BIDIRECTIONAL 6XSON Packaging: Cut Tape (CT) Features: Auto-Direction Sensing Package / Case: 6-XFDFN Output Type: Open Drain, Tri-State Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 6-XSON, SOT891 (1x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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74AUP1G11GF,132 | NXP USA Inc. |
Description: IC GATE AND 1CH 3-INP 6-XSON |
auf Bestellung 8383 Stücke: Lieferzeit 10-14 Tag (e) |
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SL2S2602FTBX | NXP USA Inc. |
Description: ICODE Packaging: Tape & Reel (TR) Package / Case: 3-XDFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: ISO 15693 Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.1V ~ 1.3V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: 3-XSON (1x1.45) |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL2S1502FTBX | NXP USA Inc. |
Description: ICODE ILT Packaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 1.7V Standards: ISO 15693, ISO 18000-3 Supplier Device Package: Wafer Part Status: Active |
Produkt ist nicht verfügbar |
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| SL2S2602FUD/BGZ | NXP USA Inc. | Description: IC RFID TRANSP 13.56MHZ WAFER |
Produkt ist nicht verfügbar |
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MCZ33905DD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP Part Status: Active |
Produkt ist nicht verfügbar |
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MCZ33905DS5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP Part Status: Active |
Produkt ist nicht verfügbar |
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MCZ33905DD3EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
Produkt ist nicht verfügbar |
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MCZ33905S5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
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MCZ33905BS5EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
Produkt ist nicht verfügbar |
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| MW7IC2220NBR1 | NXP USA Inc. |
Description: NARROW BAND HIGH POWER AMPLIFIER Packaging: Bulk |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K142HFT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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FS32K142HFT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 577 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTL05023BS,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TA) Applications: Thunderbolt -3db Bandwidth: 5GHz Supplier Device Package: 24-HVQFN (3x3) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Obsolete Number of Channels: 2 |
Produkt ist nicht verfügbar |
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CBTL05023BS,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TA) Applications: Thunderbolt -3db Bandwidth: 5GHz Supplier Device Package: 24-HVQFN (3x3) Voltage - Supply, Single (V+): 3V ~ 3.6V Multiplexer/Demultiplexer Circuit: 2:1 Part Status: Obsolete Number of Channels: 2 |
Produkt ist nicht verfügbar |
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PZU30BA115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
Produkt ist nicht verfügbar |
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PZU3.0BA115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
Produkt ist nicht verfügbar |
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PEMI2QFN/CR,115 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/21PF SMD Packaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 21pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 14dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 2 |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVC16T245EV/G518 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
auf Bestellung 1985 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVCH16T245DGV112 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES Packaging: Bulk Part Status: Active |
auf Bestellung 5956 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVC16T245DGV-Q100118 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
Produkt ist nicht verfügbar |
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74AVCH16T245DGG118 | NXP USA Inc. |
Description: BUS TRANSCEIVER, AVC SERIES |
Produkt ist nicht verfügbar |
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74AVCH16T245EV,518 | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 56VFBGA |
auf Bestellung 26441 Stücke: Lieferzeit 10-14 Tag (e) |
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S912XEG128J2CAL | NXP USA Inc. | Description: IC MCU 16BIT 128KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
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MPC885VR66-NXP | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Part Status: Active Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 264 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13502UL | NXP USA Inc. |
Description: PCF2117 LCD DEMO BOARD |
Produkt ist nicht verfügbar |
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BZX100A115 | NXP USA Inc. |
Description: DIODE ZENER SINGLE |
Produkt ist nicht verfügbar |
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MC9S08AC60MPUE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08AC60MFGE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Bulk Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP |
Produkt ist nicht verfügbar |
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MC68360ZQ33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA |
Produkt ist nicht verfügbar |
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ON5520215 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET |
Produkt ist nicht verfügbar |
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| ON5275/C1135 | NXP USA Inc. | Description: MOSFET RF, SOT223 |
Produkt ist nicht verfügbar |
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| ON5087115 | NXP USA Inc. | Description: RF SMALL SIGNAL TRANSISTOR BIPOL |
Produkt ist nicht verfügbar |
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BZX79-B47,113 | NXP USA Inc. |
Description: DIODE ZENER 47V 400MW ALF2 |
auf Bestellung 50000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TCZT66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
auf Bestellung 342 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC852TCZT66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
Produkt ist nicht verfügbar |
| S912ZVHY32F1VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Produkt ist nicht verfügbar
| S9S12HY32J0CLH557 |
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Hersteller: NXP USA Inc.
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
Description: 16-BIT MCU, S12 CORE, 32KB FLASH
Produkt ist nicht verfügbar
| S9S12HY32J0VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Produkt ist nicht verfügbar
| S912ZVHY32F1CLL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 4x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 73
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S9S12HY32J0CLHR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912ZVHY32F1VLQ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Produkt ist nicht verfügbar
| SL3S1205FUD2/HAA |
Hersteller: NXP USA Inc.
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Description: UCODE
Packaging: Tape & Reel (TR)
Package / Case: Die
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
| BGU7258X |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 14dB
Current - Supply: 13mA
Noise Figure: 1.6dB
Test Frequency: 6GHz
Supplier Device Package: 6-HXSON (1.6x1.6)
Description: IC RF AMP ISM 5GHZ-6GHZ 6HXSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: ISM
Voltage - Supply: 3V ~ 3.6V
Gain: 14dB
Current - Supply: 13mA
Noise Figure: 1.6dB
Test Frequency: 6GHz
Supplier Device Package: 6-HXSON (1.6x1.6)
auf Bestellung 18117 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 19+ | 0.93 EUR |
| 22+ | 0.82 EUR |
| 25+ | 0.74 EUR |
| 100+ | 0.65 EUR |
| 250+ | 0.57 EUR |
| 500+ | 0.5 EUR |
| 1000+ | 0.4 EUR |
| BGU7051118 |
Hersteller: NXP USA Inc.
Description: IC AMP LNA FOR WIRELESS 10HVSON
Description: IC AMP LNA FOR WIRELESS 10HVSON
Produkt ist nicht verfügbar
| BGU7045115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP
Description: IC AMP LNA 1GHZ W/BYPASS 6TSSOP
Produkt ist nicht verfügbar
| BGU7063,518 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.92GHz ~ 1.98GHz
RF Type: Cellular
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37.5dB
Current - Supply: 230mA
Noise Figure: 0.9dB
P1dB: -12.5dBm
Test Frequency: 1.95GHz
Supplier Device Package: 16-HLQFN (8x8)
Description: IC AMP CELL 1.92-1.98GHZ 16HLQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.92GHz ~ 1.98GHz
RF Type: Cellular
Voltage - Supply: 4.75V ~ 5.25V
Gain: 37.5dB
Current - Supply: 230mA
Noise Figure: 0.9dB
P1dB: -12.5dBm
Test Frequency: 1.95GHz
Supplier Device Package: 16-HLQFN (8x8)
Produkt ist nicht verfügbar
| MKW21D256VHA5 |
|
Hersteller: NXP USA Inc.
Description: KINETIS KW21D: 802.15.4 WIRELESS
Description: KINETIS KW21D: 802.15.4 WIRELESS
Produkt ist nicht verfügbar
| ASL5115FHNZ |
|
Hersteller: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Applications: Automotive
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Part Status: Active
Produkt ist nicht verfügbar
| PESD5V0L1USF,315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PESD5V0L1USF - TRAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 11W
Power Line Protection: No
Part Status: Active
Description: NOW NEXPERIA PESD5V0L1USF - TRAN
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 12pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.2A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 10.5V
Power - Peak Pulse: 11W
Power Line Protection: No
Part Status: Active
auf Bestellung 11762273 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5052+ | 0.11 EUR |
| LPC1812JBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
| 74LVC1G27GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC GATE NOR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 169560 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3909+ | 0.13 EUR |
| 74AUP1Z04GF132 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D
Description: NOW NEXPERIA 74AUP1Z04GF - BUS D
auf Bestellung 89970 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1797+ | 0.28 EUR |
| 74LVC1G38GF132 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1G38GF - NAND
Description: NOW NEXPERIA 74LVC1G38GF - NAND
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3390+ | 0.15 EUR |
| 74AUP1G06GF,132-NXP |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 1CH 1-INP 6XSON
Description: IC INVERTER OD 1CH 1-INP 6XSON
Produkt ist nicht verfügbar
| 74AUP1G58GF,132-NXP |
Hersteller: NXP USA Inc.
Description: LOGIC CIRCUIT, CMOS, PDSO6
Description: LOGIC CIRCUIT, CMOS, PDSO6
Produkt ist nicht verfügbar
| NTS0101GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| NTS0101GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT891 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| 74AUP1G11GF,132 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6-XSON
Description: IC GATE AND 1CH 3-INP 6-XSON
auf Bestellung 8383 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2533+ | 0.2 EUR |
| SL2S2602FTBX |
|
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
Description: ICODE
Packaging: Tape & Reel (TR)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5000+ | 0.31 EUR |
| SL2S1502FTBX |
|
Hersteller: NXP USA Inc.
Description: ICODE ILT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Wafer
Part Status: Active
Description: ICODE ILT
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 1.7V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
| SL2S2602FUD/BGZ |
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
| MCZ33905DD5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Part Status: Active
Produkt ist nicht verfügbar
| MCZ33905DS5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Part Status: Active
Produkt ist nicht verfügbar
| MCZ33905DD3EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Produkt ist nicht verfügbar
| MCZ33905S5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
| MCZ33905BS5EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
| MW7IC2220NBR1 |
|
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 65.67 EUR |
| FS32K142HFT0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
| FS32K142HFT0VLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 577 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 16.35 EUR |
| 10+ | 12.85 EUR |
| 80+ | 10.64 EUR |
| CBTL05023BS,118 |
|
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
| CBTL05023BS,118 |
|
Hersteller: NXP USA Inc.
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Description: IC MUX/DEMUX 2:1 PCI 24HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TA)
Applications: Thunderbolt
-3db Bandwidth: 5GHz
Supplier Device Package: 24-HVQFN (3x3)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Multiplexer/Demultiplexer Circuit: 2:1
Part Status: Obsolete
Number of Channels: 2
Produkt ist nicht verfügbar
| PEMI2QFN/CR,115 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 14dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
Description: FILTER RC(PI) 20 OHM/21PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 14dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3806+ | 0.13 EUR |
| 74AVC16T245EV/G518 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
auf Bestellung 1985 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 217+ | 2.29 EUR |
| 74AVCH16T245DGV112 |
|
auf Bestellung 5956 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 413+ | 1.21 EUR |
| 74AVC16T245DGV-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
Produkt ist nicht verfügbar
| 74AVCH16T245DGG118 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
Produkt ist nicht verfügbar
| 74AVCH16T245EV,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 56VFBGA
Description: IC TRANSLATOR BIDIR 56VFBGA
auf Bestellung 26441 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 265+ | 1.87 EUR |
| S912XEG128J2CAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Produkt ist nicht verfügbar
| MPC885VR66-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Part Status: Active
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 264 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 90.21 EUR |
| MC9S08AC60MPUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08AC60MFGE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68360AI25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Bulk
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 193.05 EUR |
| MC68360AI25VL |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Description: IC MPU M683XX 25MHZ 240FQFP
Produkt ist nicht verfügbar
| MC68360ZQ33L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Description: IC MPU M683XX 33MHZ 357BGA
Produkt ist nicht verfügbar
| ON5520215 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Description: SMALL SIGNAL N-CHANNEL MOSFET
Produkt ist nicht verfügbar
| ON5087115 |
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL TRANSISTOR BIPOL
Description: RF SMALL SIGNAL TRANSISTOR BIPOL
Produkt ist nicht verfügbar
| BZX79-B47,113 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 47V 400MW ALF2
Description: DIODE ZENER 47V 400MW ALF2
auf Bestellung 50000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.032 EUR |
| MPC852TCZT66A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
auf Bestellung 342 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 14+ | 36.09 EUR |
| MPC852TCZT66A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Produkt ist nicht verfügbar