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MCF51JE256CMB MCF51JE256CMB NXP USA Inc. MCF51JE256.pdf Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
Produkt ist nicht verfügbar
FS32K144UIT0VLHR FS32K144UIT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08RN60W1MLH S9S08RN60W1MLH NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08RN60W1MLHR S9S08RN60W1MLHR NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8555VTALF MPC8555VTALF NXP USA Inc. MPC8555E.pdf Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MVF51NN151CMK50 MVF51NN151CMK50 NXP USA Inc. VYBRIDFSERIESEC.pdf Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)
1+47.24 EUR
10+ 37.88 EUR
90+ 37.46 EUR
P3S0200GMX NXP USA Inc. P3S0200.pdf Description: IC I3C BI-DIR SWITCH XQFN10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.59 EUR
10000+ 0.57 EUR
Mindestbestellmenge: 5000
P3S0200GMX NXP USA Inc. P3S0200.pdf Description: IC I3C BI-DIR SWITCH XQFN10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
auf Bestellung 12965 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.46 EUR
14+ 1.3 EUR
25+ 1.24 EUR
100+ 1.02 EUR
250+ 0.95 EUR
500+ 0.84 EUR
1000+ 0.66 EUR
2500+ 0.62 EUR
Mindestbestellmenge: 13
BLA1011S-200R,112 BLA1011S-200R,112 NXP USA Inc. PHGLS20075-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 36V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Power - Output: 200W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 75 V
Voltage - Test: 36 V
Current - Test: 150 mA
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)
1+630.5 EUR
74AVCH16245DGG112 74AVCH16245DGG112 NXP USA Inc. 74AVCH16245.pdf Description: NOW NEXPERIA 74AVCH16245DGG - BU
Packaging: Bulk
Part Status: Active
auf Bestellung 945 Stücke:
Lieferzeit 10-14 Tag (e)
329+1.5 EUR
Mindestbestellmenge: 329
N74F125N,602 N74F125N,602 NXP USA Inc. DS_568_74F125.pdf Description: IC BUFFER NON-INVERT 5.5V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8349CZUAJDB MPC8349CZUAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC43S30FET100K LPC43S30FET100K NXP USA Inc. LPC43S50_30_20.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 1270 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.38 EUR
10+ 11.49 EUR
80+ 10.48 EUR
Mindestbestellmenge: 2
74LV07APWJ 74LV07APWJ NXP USA Inc. 74LV07A.pdf Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 16mA
Supplier Device Package: 14-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
MIMXRT1040-EVK MIMXRT1040-EVK NXP USA Inc. Description: EVAL KIT I.MX RT1040
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1040
Part Status: Active
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
1+171.58 EUR
SLN-TLHMI-IOT SLN-TLHMI-IOT NXP USA Inc. MCU-SMHMI-SDUG.pdf Description: EVAL KIT I.MX RT117H
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: RT117H
Platform: EdgeReady
Part Status: Active
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
1+495.65 EUR
FS32K144HAT0VMHR FS32K144HAT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K144HFT0MMHT FS32K144HFT0MMHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
Produkt ist nicht verfügbar
MKW22D512VHA5 MKW22D512VHA5 NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1214 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.6 EUR
10+ 11.4 EUR
25+ 10.56 EUR
Mindestbestellmenge: 2
74AXP2G34GSH 74AXP2G34GSH NXP USA Inc. 74AXP2G34.pdf Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
auf Bestellung 4180 Stücke:
Lieferzeit 10-14 Tag (e)
2862+0.16 EUR
Mindestbestellmenge: 2862
74HC153PW,112 74HC153PW,112 NXP USA Inc. PHGL-S-A0001821427-1.pdf?t.download=true&u=5oefqw Description: IC MULTIPLEXER 2 X 4:1 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 13036 Stücke:
Lieferzeit 10-14 Tag (e)
1487+0.33 EUR
Mindestbestellmenge: 1487
LX2120XE72029B LX2120XE72029B NXP USA Inc. Description: SSL MATRIX CONTROLLER
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Produkt ist nicht verfügbar
NCX2200GMAZ NCX2200GMAZ NXP USA Inc. NCX2200.pdf Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
auf Bestellung 147367 Stücke:
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28+0.65 EUR
32+ 0.56 EUR
34+ 0.52 EUR
100+ 0.42 EUR
250+ 0.39 EUR
500+ 0.33 EUR
1000+ 0.25 EUR
2500+ 0.23 EUR
Mindestbestellmenge: 28
1PS300/ZL115 NXP USA Inc. PHGLS24307-1.pdf?t.download=true&u=5oefqw Description: SIGNAL DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 167960 Stücke:
Lieferzeit 10-14 Tag (e)
8876+0.053 EUR
Mindestbestellmenge: 8876
BGE787B,112 BGE787B,112 NXP USA Inc. BGE787B_Rev4.pdf Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Supplier Device Package: SOT115J
Part Status: Obsolete
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
10+50.03 EUR
Mindestbestellmenge: 10
MKW21D512VHA5 MKW21D512VHA5 NXP USA Inc. Description: IC RF TXRX+MCU 802.15.4 63VFLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
MKW21D512VHA5R MKW21D512VHA5R NXP USA Inc. MKW2xDxxx.pdf Description: IC RF TXRX+MCU 802.15.4 63VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6L8DVN10ABR MCIMX6L8DVN10ABR NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
LD6806CX4/28P,315 LD6806CX4/28P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 16185 Stücke:
Lieferzeit 10-14 Tag (e)
3606+0.13 EUR
Mindestbestellmenge: 3606
MC9S08DN60ACLH MC9S08DN60ACLH NXP USA Inc. FSCLS07395-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)
33+15.21 EUR
Mindestbestellmenge: 33
MC9S08DN60ACLF557 MC9S08DN60ACLF557 NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MC9S08DN60ACLC MC9S08DN60ACLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
MC68LK332GCAG16 MC68LK332GCAG16 NXP USA Inc. MC68332TS.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8323EVRADDCA MPC8323EVRADDCA NXP USA Inc. MPC8323EEC.pdf Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MPC8323ECVRADDCA MPC8323ECVRADDCA NXP USA Inc. FSCLS05368-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MPC8323CVRADDCA MPC8323CVRADDCA NXP USA Inc. FSCLS05368-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
SSL5031BTS/1X SSL5031BTS/1X NXP USA Inc. Description: IC LED DRIVER OFFL SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
74HCT597N,652 74HCT597N,652 NXP USA Inc. 74HC%28T%29597_Rev3_2017.pdf Description: IC 8BIT SHIFT REGISTER 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
74LVC32245AEC,557 74LVC32245AEC,557 NXP USA Inc. PHGLS23919-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 15535 Stücke:
Lieferzeit 10-14 Tag (e)
89+5.44 EUR
Mindestbestellmenge: 89
SPC5602BK0CLH4 SPC5602BK0CLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
Produkt ist nicht verfügbar
SPC5602BK0CLH4R SPC5602BK0CLH4R NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
Produkt ist nicht verfügbar
SPC5602BF2VLH4 SPC5602BF2VLH4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08DN32ACLH MC9S08DN32ACLH NXP USA Inc. MC9S08DN60AD.pdf Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12GC128CFUE MC9S12GC128CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
Produkt ist nicht verfügbar
74LV244DB653 NXP USA Inc. Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
SPC5745BK1VMH2 SPC5745BK1VMH2 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5745BK1VMH2R SPC5745BK1VMH2R NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC1G80GN,132 74LVC1G80GN,132 NXP USA Inc. PHGLS25117-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3193 Stücke:
Lieferzeit 10-14 Tag (e)
3193+0.16 EUR
Mindestbestellmenge: 3193
FS32K144UAT0VMHR FS32K144UAT0VMHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HFT0MMHT FS32K146HFT0MMHT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE12Z256VLF7 MKE12Z256VLF7 NXP USA Inc. KE1xZP100M72SF1.pdf Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
T1023RDB-PC T1023RDB-PC NXP USA Inc. T1023RDBFS.pdf Description: T1013/T1023 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Board Type: Evaluation Platform
Utilized IC / Part: T1013, T1023
Part Status: Obsolete
Produkt ist nicht verfügbar
MF1PH4101DUF/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DA6/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DA4/02J NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DUD/02V NXP USA Inc. Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC34981ABHFK MC34981ABHFK NXP USA Inc. MC34981ABHFK.pdf Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
UJA1161ATK/0Z UJA1161ATK/0Z NXP USA Inc. UJA1161A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5990 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.9 EUR
10+ 4.45 EUR
25+ 3.81 EUR
100+ 3.08 EUR
250+ 2.72 EUR
500+ 2.5 EUR
1000+ 2.32 EUR
2500+ 2.24 EUR
Mindestbestellmenge: 3
SVF331R3K2CKU2R NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
SVF331R3K2CKU2 NXP USA Inc. VYBRIDRSERIESEC.pdf Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
MCF51JE256CMB MCF51JE256.pdf
MCF51JE256CMB
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Part Status: Active
Number of I/O: 48
Produkt ist nicht verfügbar
FS32K144UIT0VLHR S32K1xx.pdf
FS32K144UIT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08RN60W1MLH S9S08RN60DS.pdf
S9S08RN60W1MLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S08RN60W1MLHR S9S08RN60DS.pdf
S9S08RN60W1MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8555VTALF MPC8555E.pdf
MPC8555VTALF
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MVF51NN151CMK50 VYBRIDFSERIESEC.pdf
MVF51NN151CMK50
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 500MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+47.24 EUR
10+ 37.88 EUR
90+ 37.46 EUR
P3S0200GMX P3S0200.pdf
Hersteller: NXP USA Inc.
Description: IC I3C BI-DIR SWITCH XQFN10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.59 EUR
10000+ 0.57 EUR
Mindestbestellmenge: 5000
P3S0200GMX P3S0200.pdf
Hersteller: NXP USA Inc.
Description: IC I3C BI-DIR SWITCH XQFN10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 2 x 1:2, 2 x 2:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Independent Circuits: 2
Voltage Supply Source: Single Supply
Supplier Device Package: 10-XQFN (1.55x2)
Part Status: Active
auf Bestellung 12965 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+1.46 EUR
14+ 1.3 EUR
25+ 1.24 EUR
100+ 1.02 EUR
250+ 0.95 EUR
500+ 0.84 EUR
1000+ 0.66 EUR
2500+ 0.62 EUR
Mindestbestellmenge: 13
BLA1011S-200R,112 PHGLS20075-1.pdf?t.download=true&u=5oefqw
BLA1011S-200R,112
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 36V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Power - Output: 200W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 75 V
Voltage - Test: 36 V
Current - Test: 150 mA
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1+630.5 EUR
74AVCH16245DGG112 74AVCH16245.pdf
74AVCH16245DGG112
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AVCH16245DGG - BU
Packaging: Bulk
Part Status: Active
auf Bestellung 945 Stücke:
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Anzahl Preis ohne MwSt
329+1.5 EUR
Mindestbestellmenge: 329
N74F125N,602 DS_568_74F125.pdf
N74F125N,602
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8349CZUAJDB MPC8349EAEC.pdf
MPC8349CZUAJDB
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
LPC43S30FET100K LPC43S50_30_20.pdf
LPC43S30FET100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b SAR; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
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2+14.38 EUR
10+ 11.49 EUR
80+ 10.48 EUR
Mindestbestellmenge: 2
74LV07APWJ 74LV07A.pdf
74LV07APWJ
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 6
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 16mA
Supplier Device Package: 14-TSSOP
Part Status: Active
Produkt ist nicht verfügbar
MIMXRT1040-EVK
MIMXRT1040-EVK
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT1040
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1040
Part Status: Active
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1+171.58 EUR
SLN-TLHMI-IOT MCU-SMHMI-SDUG.pdf
SLN-TLHMI-IOT
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT117H
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: RT117H
Platform: EdgeReady
Part Status: Active
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1+495.65 EUR
FS32K144HAT0VMHR S32K1xx.pdf
FS32K144HAT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K144HFT0MMHT S32K-DS.pdf
FS32K144HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
Produkt ist nicht verfügbar
MKW22D512VHA5 MKW2xDxxx.pdf
MKW22D512VHA5
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63MAPLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
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2+12.6 EUR
10+ 11.4 EUR
25+ 10.56 EUR
Mindestbestellmenge: 2
74AXP2G34GSH 74AXP2G34.pdf
74AXP2G34GSH
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 2.75V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 0.7V ~ 2.75V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
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2862+0.16 EUR
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74HC153PW,112 PHGL-S-A0001821427-1.pdf?t.download=true&u=5oefqw
74HC153PW,112
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
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1487+0.33 EUR
Mindestbestellmenge: 1487
LX2120XE72029B
LX2120XE72029B
Hersteller: NXP USA Inc.
Description: SSL MATRIX CONTROLLER
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Produkt ist nicht verfügbar
NCX2200GMAZ NCX2200.pdf
NCX2200GMAZ
Hersteller: NXP USA Inc.
Description: IC COMPAR 1 GEN PUR SLP0603P2X3F
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Complementary, Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns (Typ)
Current - Quiescent (Max): 6µA (Typ)
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
Current - Output (Typ): 68mA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Active
auf Bestellung 147367 Stücke:
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28+0.65 EUR
32+ 0.56 EUR
34+ 0.52 EUR
100+ 0.42 EUR
250+ 0.39 EUR
500+ 0.33 EUR
1000+ 0.25 EUR
2500+ 0.23 EUR
Mindestbestellmenge: 28
1PS300/ZL115 PHGLS24307-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: SIGNAL DIODE
Packaging: Bulk
Part Status: Active
auf Bestellung 167960 Stücke:
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8876+0.053 EUR
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BGE787B,112 BGE787B_Rev4.pdf
BGE787B,112
Hersteller: NXP USA Inc.
Description: IC VIDEO PUSH-PULL CTRLR SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Supplier Device Package: SOT115J
Part Status: Obsolete
auf Bestellung 198 Stücke:
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10+50.03 EUR
Mindestbestellmenge: 10
MKW21D512VHA5
MKW21D512VHA5
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63VFLGA
Packaging: Tray
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
MKW21D512VHA5R MKW2xDxxx.pdf
MKW21D512VHA5R
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 63VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 63-VFLGA
Sensitivity: -102dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 512kB Flash, 64kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 8dBm
Protocol: Zigbee®
Current - Receiving: 15mA
Data Rate (Max): 250kbps
Current - Transmitting: 19mA
Supplier Device Package: 63-MAPLGA (8x8)
GPIO: 2
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I²C, JTAG, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6L8DVN10ABR IMX6SLCEC.pdf
MCIMX6L8DVN10ABR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Produkt ist nicht verfügbar
LD6806CX4/28P,315 LD6806_Series.pdf
LD6806CX4/28P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.8V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 16185 Stücke:
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Anzahl Preis ohne MwSt
3606+0.13 EUR
Mindestbestellmenge: 3606
MC9S08DN60ACLH FSCLS07395-1.pdf?t.download=true&u=5oefqw
MC9S08DN60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 316 Stücke:
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Anzahl Preis ohne MwSt
33+15.21 EUR
Mindestbestellmenge: 33
MC9S08DN60ACLF557 MC9S08DN60AD.pdf
MC9S08DN60ACLF557
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MC9S08DN60ACLC MC9S08DN60.pdf
MC9S08DN60ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 25
Produkt ist nicht verfügbar
MC68LK332GCAG16 MC68332TS.pdf
MC68LK332GCAG16
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 15
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPC8323EVRADDCA MPC8323EEC.pdf
MPC8323EVRADDCA
Hersteller: NXP USA Inc.
Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MPC8323ECVRADDCA FSCLS05368-1.pdf?t.download=true&u=5oefqw
MPC8323ECVRADDCA
Hersteller: NXP USA Inc.
Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
MPC8323CVRADDCA FSCLS05368-1.pdf?t.download=true&u=5oefqw
MPC8323CVRADDCA
Hersteller: NXP USA Inc.
Description: POWERQUICC, 32 BIT POWER ARCHITE
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
SSL5031BTS/1X
SSL5031BTS/1X
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SC74
Packaging: Cut Tape (CT)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Number of Outputs: 1
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 160°C (TJ)
Applications: Lighting
Internal Switch(s): Yes
Topology: Step-Down (Buck)
Supplier Device Package: SC-74
Voltage - Supply (Min): 9.5V
Voltage - Supply (Max): 16V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
74HCT597N,652 74HC%28T%29597_Rev3_2017.pdf
74HCT597N,652
Hersteller: NXP USA Inc.
Description: IC 8BIT SHIFT REGISTER 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Parallel or Serial to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
74LVC32245AEC,557 PHGLS23919-1.pdf?t.download=true&u=5oefqw
74LVC32245AEC,557
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Active
auf Bestellung 15535 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
89+5.44 EUR
Mindestbestellmenge: 89
SPC5602BK0CLH4
SPC5602BK0CLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
Produkt ist nicht verfügbar
SPC5602BK0CLH4R
SPC5602BK0CLH4R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
Produkt ist nicht verfügbar
SPC5602BF2VLH4
SPC5602BF2VLH4
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 45
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08DN32ACLH MC9S08DN60AD.pdf
MC9S08DN32ACLH
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12GC128CFUE MC9S12C128V1.pdf
MC9S12GC128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
Produkt ist nicht verfügbar
74LV244DB653
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LV/LV-A/LVX/H SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
SPC5745BK1VMH2 MPC5746C.pdf
SPC5745BK1VMH2
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5745BK1VMH2R MPC5746C.pdf
SPC5745BK1VMH2R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC1G80GN,132 PHGLS25117-1.pdf?t.download=true&u=5oefqw
74LVC1G80GN,132
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Quiescent (Iq): 200 µA
Current - Output High, Low: 32mA, 32mA
Trigger Type: Positive Edge
Clock Frequency: 400 MHz
Input Capacitance: 5 pF
Supplier Device Package: 6-XSON (0.9x1)
Max Propagation Delay @ V, Max CL: 4.5ns @ 5V, 50pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 3193 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3193+0.16 EUR
Mindestbestellmenge: 3193
FS32K144UAT0VMHR S32K1xx.pdf
FS32K144UAT0VMHR
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HFT0MMHT S32K-DS.pdf
FS32K146HFT0MMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKE12Z256VLF7 KE1xZP100M72SF1.pdf
MKE12Z256VLF7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
T1023RDB-PC T1023RDBFS.pdf
T1023RDB-PC
Hersteller: NXP USA Inc.
Description: T1013/T1023 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e5500
Board Type: Evaluation Platform
Utilized IC / Part: T1013, T1023
Part Status: Obsolete
Produkt ist nicht verfügbar
MF1PH4101DUF/02V
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DA6/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DA4/02J
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Tape & Reel (TR)
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MF1PH4101DUD/02V
Hersteller: NXP USA Inc.
Description: MIFAREA PLUS EV1
Packaging: Bulk
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC34981ABHFK MC34981ABHFK.pdf
MC34981ABHFK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 16QFN
Features: Slew Rate Controlled
Packaging: Tray
Package / Case: 16-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: PWM
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 4mOhm (Max)
Voltage - Load: 6V ~ 27V
Current - Output (Max): 40A
Ratio - Input:Output: 1:1
Supplier Device Package: 16-PQFN (12x12)
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Produkt ist nicht verfügbar
UJA1161ATK/0Z UJA1161A.pdf
UJA1161ATK/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 28V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 30 mV
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5990 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.9 EUR
10+ 4.45 EUR
25+ 3.81 EUR
100+ 3.08 EUR
250+ 2.72 EUR
500+ 2.5 EUR
1000+ 2.32 EUR
2500+ 2.24 EUR
Mindestbestellmenge: 3
SVF331R3K2CKU2R VYBRIDRSERIESEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
SVF331R3K2CKU2 VYBRIDRSERIESEC.pdf
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Part Status: Active
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
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