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PEMI8QFN/HT,132 PEMI8QFN/HT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/23PF SMD
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
1697+0.32 EUR
Mindestbestellmenge: 1697
PR601HL/C1,557 PR601HL/C1,557 NXP USA Inc. PR601.pdf Description: IC RFID READER 13.56MHZ 100LQFP
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
35+18.82 EUR
Mindestbestellmenge: 35
KIT33908MBEVBE NXP USA Inc. MC33907_8.pdf Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
TEA19031AET/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
TEA19031ADT/1J NXP USA Inc. TEA19031AT.pdf Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
MPC5554AZP132 MPC5554AZP132 NXP USA Inc. MPC5554.pdf Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BUK7E2R3-40E,127-NXP NXP USA Inc. Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Produkt ist nicht verfügbar
PCA9519PW118 PCA9519PW118 NXP USA Inc. PCA9519.pdf Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
119+4.08 EUR
Mindestbestellmenge: 119
PCA9518APW NXP USA Inc. PHGLS18251-1.pdf?t.download=true&u=5oefqw Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
Produkt ist nicht verfügbar
PCA9516APW NXP USA Inc. PHGLS19265-1.pdf?t.download=true&u=5oefqw Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9516APW,112 PCA9516APW,112 NXP USA Inc. PCA9516A.pdf Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
74AHCT241BQ,115 74AHCT241BQ,115 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
74AHCT241BQ,115 74AHCT241BQ,115 NXP USA Inc. 74AHC_AHCT241_Rev_Feb2017.pdf Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
PSMN070-200B PSMN070-200B NXP USA Inc. PHGLS21832-1.pdf?t.download=true&u=5oefqw Description: 35A, 200V, 0.07OHM, N-CHANNEL
Produkt ist nicht verfügbar
MC9S12GC32CFUE MC9S12GC32CFUE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33FS6512NAE MC33FS6512NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6512NAER2 MC33FS6512NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MPC8572CLVJAULE NXP USA Inc. MPC8572E.pdf Description: IC MPU MPC85XX 1.333GHZ 1023BGA
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
1+849.66 EUR
LD6815TD/36P,125 LD6815TD/36P,125 NXP USA Inc. PHGLS29812-1.pdf?t.download=true&u=5oefqw Description: NEXPERIA LD6815TD/36P - FIXED PO
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
MPC8360VVALFHA NXP USA Inc. FSCLS05951-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
MK22DN512VDC5 MK22DN512VDC5 NXP USA Inc. Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN256VMP12 MK22FN256VMP12 NXP USA Inc. K22P121M120SF8.pdf Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5646CF0VMJ1R SPC5646CF0VMJ1R NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
NCX2200GM,132 NCX2200GM,132 NXP USA Inc. NCX2200.pdf Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 245973 Stücke:
Lieferzeit 10-14 Tag (e)
2070+0.23 EUR
Mindestbestellmenge: 2070
FXPS7250DI4ST1 FXPS7250DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7165DI4ST1 FXPS7165DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7400DI4T1 FXPS7400DI4T1 NXP USA Inc. FXPS7400D4.pdf Description: 20-400 KPA BAP DIG I2C
Produkt ist nicht verfügbar
FXPS7400DI4ST1 FXPS7400DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7165DI4T1 FXPS7165DI4T1 NXP USA Inc. FXPS7165D4.pdf Description: 60-165 KPA BAP DIG I2C
Produkt ist nicht verfügbar
FXPS7115DI4ST1 FXPS7115DI4ST1 NXP USA Inc. Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
MC9328MXLCVM15R2 MC9328MXLCVM15R2 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 256MAPBGA
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
10+58.89 EUR
Mindestbestellmenge: 10
MC9328MXLCVM15 MC9328MXLCVM15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 256MAPBGA
Produkt ist nicht verfügbar
MC68302RC20C MC68302RC20C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 20MHZ 132PGA
auf Bestellung 1708 Stücke:
Lieferzeit 10-14 Tag (e)
2+333.24 EUR
Mindestbestellmenge: 2
MC68302RC20C MC68302RC20C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 20MHZ 132PGA
Produkt ist nicht verfügbar
MC68302EH20C NXP USA Inc. MC68302.pdf Description: M68000 MICROPROCESSOR IC SERIES
auf Bestellung 1268 Stücke:
Lieferzeit 10-14 Tag (e)
5+166.63 EUR
Mindestbestellmenge: 5
PHPT60410PY115 PHPT60410PY115 NXP USA Inc. PHPT60410PY.pdf Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Produkt ist nicht verfügbar
PHPT60410NY115 PHPT60410NY115 NXP USA Inc. PHPT60410NY.pdf Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Produkt ist nicht verfügbar
SPC5746CFK1ACMH6 SPC5746CFK1ACMH6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
SPC5744CBK1ACMH6 SPC5744CBK1ACMH6 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
BBY31,215 BBY31,215 NXP USA Inc. DS_568_BBY31.pdf Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
Produkt ist nicht verfügbar
TJA1042AT/0Z TJA1042AT/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.27 EUR
Mindestbestellmenge: 2500
BSH207,135 BSH207,135 NXP USA Inc. PHGLS06940-1.pdf?t.download=true&u=5oefqw Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
auf Bestellung 50873 Stücke:
Lieferzeit 10-14 Tag (e)
1025+0.48 EUR
Mindestbestellmenge: 1025
NX20P5090UK041 NXP USA Inc. PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF Description: NX20P5090UK - BUFFER/INVERTER BA
Produkt ist nicht verfügbar
MCF5272VM66 MCF5272VM66 NXP USA Inc. MCF5272UM.pdf Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF5206EAB40 MCF5206EAB40 NXP USA Inc. MCF5206EFS.pdf Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
P1020NSE2DFB P1020NSE2DFB NXP USA Inc. P1020PB.pdf Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
MRF24301HR5178 NXP USA Inc. ROCELEC_1.pdf?t.download=true&u=ovmfp3 Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
MPC8544ECVTALFA MPC8544ECVTALFA NXP USA Inc. MPC8544E.pdf Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
mpc8250aczumhbc mpc8250aczumhbc NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8250ACVVMHBC MPC8250ACVVMHBC NXP USA Inc. MPC8250.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
74LV132N,112 74LV132N,112 NXP USA Inc. 74LV132.pdf Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
74LV367D,112 74LV367D,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
74LV367N,112 74LV367N,112 NXP USA Inc. 74LV367.pdf Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
SPC5603BF2CLL6 SPC5603BF2CLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
PDTA113ZE,115 PDTA113ZE,115 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
PDTA113EE,115 PDTA113EE,115 NXP USA Inc. PHGLS19170-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
MC33665ATF4AE MC33665ATF4AE NXP USA Inc. MC33665A_SDS.pdf Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.62 EUR
10+ 15.9 EUR
25+ 15.16 EUR
80+ 13.17 EUR
A3I20D040WNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
A3I20D040WGNR1 NXP USA Inc. Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
PEMI8QFN/HT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/HT,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/23PF SMD
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1697+0.32 EUR
Mindestbestellmenge: 1697
PR601HL/C1,557 PR601.pdf
PR601HL/C1,557
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 100LQFP
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
35+18.82 EUR
Mindestbestellmenge: 35
KIT33908MBEVBE MC33907_8.pdf
Hersteller: NXP USA Inc.
Description: KIT EVAL MC33908 MOTHER BOARD PO
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: MC33908
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
TEA19031AET/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
TEA19031ADT/1J TEA19031AT.pdf
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH 10SO
Packaging: Tape & Reel (TR)
Package / Case: 10-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -25°C ~ 125°C (TJ)
Frequency - Switching: 10MHz
Internal Switch(s): Yes
Output Isolation: Isolated
Voltage - Supply (Vcc/Vdd): 0V ~ 21V
Supplier Device Package: 10-SO
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Control Features: EN
Part Status: Obsolete
Power (Watts): 45 W
Produkt ist nicht verfügbar
MPC5554AZP132 MPC5554.pdf
MPC5554AZP132
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 256
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BUK7E2R3-40E,127-NXP
Hersteller: NXP USA Inc.
Description: PFET, 120A I(D), 40V, 0.0023OHM,
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 293W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 109.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8500 pF @ 25 V
Produkt ist nicht verfügbar
PCA9519PW118 PCA9519.pdf
PCA9519PW118
Hersteller: NXP USA Inc.
Description: 4-CHANNEL LEVEL TRANSLATING I2C-
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Delay Time: 105ns
Number of Channels: 4
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1V ~ 4V, 3V ~ 5.5V
Applications: I²C
Current - Supply: 11.6mA
Data Rate (Max): 400kHz
Supplier Device Package: 20-TSSOP
Capacitance - Input: 2 pF
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
119+4.08 EUR
Mindestbestellmenge: 119
PCA9518APW PHGLS18251-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: INTERFACE CIRCUIT, CMOS, PDSO20
Packaging: Bulk
Produkt ist nicht verfügbar
PCA9516APW PHGLS19265-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: LINE TRANSCEIVER, 10 FUNC, 10 DR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PCA9516APW,112 PCA9516A.pdf
PCA9516APW,112
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 5CH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Channels: 5
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: I²C
Current - Supply: 5mA
Data Rate (Max): 400kHz
Supplier Device Package: 16-TSSOP
Part Status: Obsolete
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
74AHCT241BQ,115 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241BQ,115
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
74AHCT241BQ,115 74AHC_AHCT241_Rev_Feb2017.pdf
74AHCT241BQ,115
Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 5.5V 20DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Part Status: Obsolete
Produkt ist nicht verfügbar
PSMN070-200B PHGLS21832-1.pdf?t.download=true&u=5oefqw
PSMN070-200B
Hersteller: NXP USA Inc.
Description: 35A, 200V, 0.07OHM, N-CHANNEL
Produkt ist nicht verfügbar
MC9S12GC32CFUE MC9S12C128V1.pdf
MC9S12GC32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC33FS6512NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MC33FS6512NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6512NAER2
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
MPC8572CLVJAULE MPC8572E.pdf
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 1023BGA
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+849.66 EUR
LD6815TD/36P,125 PHGLS29812-1.pdf?t.download=true&u=5oefqw
LD6815TD/36P,125
Hersteller: NXP USA Inc.
Description: NEXPERIA LD6815TD/36P - FIXED PO
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3.6V
Control Features: Enable
Part Status: Active
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
MPC8360VVALFHA FSCLS05951-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCH SOC
Produkt ist nicht verfügbar
MK22DN512VDC5
MK22DN512VDC5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 121XFBGA
Packaging: Tray
Package / Case: 121-XFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-XFBGA (8x8)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK22FN256VMP12 K22P121M120SF8.pdf
MK22FN256VMP12
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 64MAPBGA
Packaging: Tray
Package / Case: 64-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-MAPBGA (5x5)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5646CF0VMJ1R
SPC5646CF0VMJ1R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 256MAPBGA
Produkt ist nicht verfügbar
NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Produkt ist nicht verfügbar
NCX2200GM,132 NCX2200.pdf
NCX2200GM,132
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Propagation Delay (Max): 800ns
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA @ 5.5V
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 245973 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2070+0.23 EUR
Mindestbestellmenge: 2070
FXPS7250DI4ST1
FXPS7250DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7165DI4ST1
FXPS7165DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7400DI4T1 FXPS7400D4.pdf
FXPS7400DI4T1
Hersteller: NXP USA Inc.
Description: 20-400 KPA BAP DIG I2C
Produkt ist nicht verfügbar
FXPS7400DI4ST1
FXPS7400DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
FXPS7165DI4T1 FXPS7165D4.pdf
FXPS7165DI4T1
Hersteller: NXP USA Inc.
Description: 60-165 KPA BAP DIG I2C
Produkt ist nicht verfügbar
FXPS7115DI4ST1
FXPS7115DI4ST1
Hersteller: NXP USA Inc.
Description: IC PRESSURE SENSOR 16HQFN
Produkt ist nicht verfügbar
MC9328MXLCVM15R2 MC9328MXL.pdf
MC9328MXLCVM15R2
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256MAPBGA
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10+58.89 EUR
Mindestbestellmenge: 10
MC9328MXLCVM15 MC9328MXL.pdf
MC9328MXLCVM15
Hersteller: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 256MAPBGA
Produkt ist nicht verfügbar
MC68302RC20C MC68302TIMING.pdf
MC68302RC20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
auf Bestellung 1708 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+333.24 EUR
Mindestbestellmenge: 2
MC68302RC20C MC68302TIMING.pdf
MC68302RC20C
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PGA
Produkt ist nicht verfügbar
MC68302EH20C MC68302.pdf
Hersteller: NXP USA Inc.
Description: M68000 MICROPROCESSOR IC SERIES
auf Bestellung 1268 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+166.63 EUR
Mindestbestellmenge: 5
PHPT60410PY115 PHPT60410PY.pdf
PHPT60410PY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR, PNP
Packaging: Bulk
Produkt ist nicht verfügbar
PHPT60410NY115 PHPT60410NY.pdf
PHPT60410NY115
Hersteller: NXP USA Inc.
Description: POWER BIPOLAR TRANSISTOR NPN
Packaging: Bulk
Produkt ist nicht verfügbar
SPC5746CFK1ACMH6
SPC5746CFK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
SPC5744CBK1ACMH6
SPC5744CBK1ACMH6
Hersteller: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Produkt ist nicht verfügbar
BBY31,215 DS_568_BBY31.pdf
BBY31,215
Hersteller: NXP USA Inc.
Description: DIODE UHF VAR CAP 30V SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Voltage - Peak Reverse (Max): 30 V
Capacitance Ratio: 8.3
Produkt ist nicht verfügbar
TJA1042AT/0Z
TJA1042AT/0Z
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2500+1.27 EUR
Mindestbestellmenge: 2500
BSH207,135 PHGLS06940-1.pdf?t.download=true&u=5oefqw
BSH207,135
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 12V 1.52A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 1.52A (Ta)
Rds On (Max) @ Id, Vgs: 120mOhm @ 1A, 4.5V
Power Dissipation (Max): 417mW (Ta)
Vgs(th) (Max) @ Id: 600mV @ 1mA (Typ)
Supplier Device Package: 6-TSOP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 9.6 V
auf Bestellung 50873 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1025+0.48 EUR
Mindestbestellmenge: 1025
NX20P5090UK041 PHGL-S-A0002488754-1.pdf?hkey=303B1225A0F33E39BD2F1DF328DA94FF
Hersteller: NXP USA Inc.
Description: NX20P5090UK - BUFFER/INVERTER BA
Produkt ist nicht verfügbar
MCF5272VM66 MCF5272UM.pdf
MCF5272VM66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 16KB (4K x 32)
RAM Size: 1K x 32
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROM
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF5206EAB40 MCF5206EFS.pdf
MCF5206EAB40
Hersteller: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Part Status: Obsolete
Produkt ist nicht verfügbar
P1020NSE2DFB P1020PB.pdf
P1020NSE2DFB
Hersteller: NXP USA Inc.
Description: IC MPU Q OR IQ 800MHZ 689TEBGA
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Part Status: Obsolete
Produkt ist nicht verfügbar
MRF24301HR5178 ROCELEC_1.pdf?t.download=true&u=ovmfp3
Hersteller: NXP USA Inc.
Description: 300W 32V RF POWER TRANSISTOR
Produkt ist nicht verfügbar
MPC8544ECVTALFA MPC8544E.pdf
MPC8544ECVTALFA
Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 667MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Produkt ist nicht verfügbar
mpc8250aczumhbc MPC8250.pdf
mpc8250aczumhbc
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC8250ACVVMHBC MPC8250.pdf
MPC8250ACVVMHBC
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Produkt ist nicht verfügbar
74LV132N,112 74LV132.pdf
74LV132N,112
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2IN 14DIP
Produkt ist nicht verfügbar
74LV367D,112 74LV367.pdf
74LV367D,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-SO
Produkt ist nicht verfügbar
74LV367N,112 74LV367.pdf
74LV367N,112
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-DIP
Part Status: Obsolete
Produkt ist nicht verfügbar
SPC5603BF2CLL6 MPC5604BC.pdf
SPC5603BF2CLL6
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Produkt ist nicht verfügbar
PDTA113ZE,115 PDTA113Z_SER.pdf
PDTA113ZE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 35 @ 5mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Produkt ist nicht verfügbar
PDTA113EE,115 PHGLS19170-1.pdf?t.download=true&u=5oefqw
PDTA113EE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 1.5mA, 30mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 40mA, 5V
Supplier Device Package: SC-75
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 1 kOhms
Resistor - Emitter Base (R2): 1 kOhms
Produkt ist nicht verfügbar
MC33665ATF4AE MC33665A_SDS.pdf
MC33665ATF4AE
Hersteller: NXP USA Inc.
Description: IC BMS TPL TXRX CAN GATEWAY
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Function: Power Management
Interface: CAN, I2C
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+17.62 EUR
10+ 15.9 EUR
25+ 15.16 EUR
80+ 13.17 EUR
A3I20D040WNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
A3I20D040WGNR1
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
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