Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35037) > Seite 474 nach 584
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MVR5510AMMA0ES | NXP USA Inc. |
Description: IC PMIC VR5510 QM Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
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MVR5510AMBA6ESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-B Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
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MVR5510AVMAHEP | NXP USA Inc. |
Description: IC PMIC VR5510 QM Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
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MVR5510AMBA0ES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-B Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
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MC33VR5500V2ESR2 | NXP USA Inc. | Description: VR5500 |
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MC33VR5500V3ESR2 | NXP USA Inc. | Description: VR5500 |
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MC33VR5500V0ESR2 | NXP USA Inc. |
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MC33VR5500V1ESR2 | NXP USA Inc. |
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MC33VR5500V2ES | NXP USA Inc. | Description: VR5500 |
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S912ZVHL32F1VLL | NXP USA Inc. |
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S912ZVHY32F1CLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
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LPC3220FET296/01K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b SAR Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Number of I/O: 51 DigiKey Programmable: Not Verified |
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74LVCH32374AEC,518 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 96-LFBGA Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 4 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 300 MHz Input Capacitance: 5 pF Supplier Device Package: 96-LFBGA (13.5x5.5) Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF Part Status: Obsolete Number of Bits per Element: 8 |
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FRDM-34931-EVB | NXP USA Inc. | Description: FREEDOM EXPANSION BOARD - MC3493 |
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LX2160SN72232B | NXP USA Inc. |
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.2GHz Operating Temperature: 0°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART |
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FS32K144HFT0CLLT | NXP USA Inc. |
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SPC5746CK1AMMJ6R | NXP USA Inc. |
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MPC555LFCZP40 | NXP USA Inc. |
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BUK7107-55ATE,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Ta) Rds On (Max) @ Id, Vgs: 7mOhm @ 50A, 10V Power Dissipation (Max): 272W (Ta) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Part Status: Active Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 116 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 4500 pF @ 25 V |
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BUK7108-40AIE,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 8mOhm @ 50A, 10V FET Feature: Current Sensing Power Dissipation (Max): 221W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: SOT-426 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 84 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3140 pF @ 25 V Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1115 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5745CFK1AMKU6 | NXP USA Inc. |
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TL431MSDT215 | NXP USA Inc. |
![]() Tolerance: ±2% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Output Type: Adjustable Mounting Type: Surface Mount Reference Type: Shunt Operating Temperature: -40°C ~ 125°C (TA) Supplier Device Package: SOT-23 (TO-236AB) Voltage - Output (Min/Fixed): 2.495V Part Status: Active Current - Cathode: 1 mA Current - Output: 100 mA Voltage - Output (Max): 36 V |
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A5G23H065NT4 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.4GHz Power - Output: 8.8W Gain: 15.5dB Supplier Device Package: 6-PDFN (7x6.5) Part Status: Active Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 30 mA |
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74HCT640DB,118 | NXP USA Inc. |
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MC33FS6500NAER2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Part Status: Active |
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PEMI4QFN/RP,132 | NXP USA Inc. |
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PEMI4QFN/RP,132 | NXP USA Inc. |
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PEMI8QFN/RP,132 | NXP USA Inc. |
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PEMI8QFN/RP,132 | NXP USA Inc. |
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BB156,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio Condition: C1/C7.5 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 10 V Capacitance Ratio: 3.9 |
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BB156,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz Capacitance Ratio Condition: C1/C7.5 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 10 V Capacitance Ratio: 3.9 |
auf Bestellung 434255 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9E1R9-40E,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V I2PAK Packaging: Tube Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tj) Supplier Device Package: I2PAK Part Status: Obsolete Drain to Source Voltage (Vdss): 40 V |
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BT138-600G,127 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 60 mA Current - Gate Trigger (Igt) (Max): 50 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A Voltage - Gate Trigger (Vgt) (Max): 1.5 V Supplier Device Package: TO-220AB Part Status: Active Current - On State (It (RMS)) (Max): 12 A Voltage - Off State: 600 V |
auf Bestellung 3740 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1051AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 120 mV Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMK50XP518 | NXP USA Inc. | Description: P-CHANNEL POWER MOSFET |
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BUK653R5-55C | NXP USA Inc. | Description: N-CHANNEL POWER MOSFET |
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BUK653R5-55C,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 120A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V Power Dissipation (Max): 263W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 191 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 11516 pF @ 25 V |
auf Bestellung 4931 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK653R7-30C,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 100A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V Power Dissipation (Max): 158W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 4707 pF @ 25 V |
auf Bestellung 6267 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK653R2-55C,127 | NXP USA Inc. |
Description: MOSFET N-CH 55V 120A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 10V Power Dissipation (Max): 306W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 258 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 15300 pF @ 25 V |
auf Bestellung 3726 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK654R0-75C,127 | NXP USA Inc. |
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BGA7350,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 50MHz ~ 250MHz RF Type: General Purpose Voltage - Supply: 4.75V ~ 5.25V Gain: 19.5dB Current - Supply: 245mA Noise Figure: 6dB P1dB: 17dBm Test Frequency: 50MHz Supplier Device Package: 32-HVQFN (5x5) |
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MC9S08AC32CFJE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
auf Bestellung 1745 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVT162823DGG | NXP USA Inc. |
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auf Bestellung 252 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX585-C13,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±5% Package / Case: SC-79, SOD-523 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 13 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: SOD-523 Part Status: Active Power - Max: 300 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 100 µA @ 8 V |
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MC9S08QG8MDNE | NXP USA Inc. |
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MC68306FC16B | NXP USA Inc. |
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BZX84J-C22,115 | NXP USA Inc. |
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auf Bestellung 19039 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT3G04GD,125 | NXP USA Inc. |
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auf Bestellung 6018 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTB114ET215 | NXP USA Inc. |
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LD6806TD/25P,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 2.5V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 36758 Stücke: Lieferzeit 10-14 Tag (e) |
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2PD602AS,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V Frequency - Transition: 180MHz Supplier Device Package: SMT3; MPAK Part Status: Obsolete Current - Collector (Ic) (Max): 500 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW |
auf Bestellung 3774000 Stücke: Lieferzeit 10-14 Tag (e) |
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LFMAJ46CS1NT | NXP USA Inc. |
Description: MPC5646C NEXUS DEBUG BOARD Packaging: Bulk For Use With/Related Products: MPC5646C Accessory Type: Adapter Part Status: Active |
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MC68EN360CVR25L | NXP USA Inc. |
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auf Bestellung 32 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN36241GHXZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 12-XFQFN Delay Time: 500ps Number of Channels: 2 Mounting Type: Surface Mount Type: Buffer, ReDriver Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.9V Applications: USB 3.0 Current - Supply: 105mA Data Rate (Max): 5Gbps Supplier Device Package: 12-X2QFN (1.25x2.10) Signal Conditioning: Input Equalization, Output De-Emphasis Part Status: Active |
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PEMI4QFN/WT,132 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
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PEMI4QFN/WT,132 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
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LPC2102FHN48,551 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 70MHz Program Memory Size: 16KB (16K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 48-HVQFN (7x7) Number of I/O: 32 DigiKey Programmable: Not Verified |
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PCA9846PW-ARD | NXP USA Inc. |
![]() Packaging: Box Function: Multiplexer (MUX) Type: Interface Contents: Board(s) Utilized IC / Part: PCA9846 Platform: Arduino Part Status: Active |
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MRFG35010ANT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 3.55GHz Power - Output: 9W Gain: 10dB Technology: pHEMT FET Supplier Device Package: PLD-1.5 Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 130 mA |
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MRFG35010AR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-360HF Mounting Type: Chassis Mount Frequency: 3.55GHz Power - Output: 1W Gain: 10dB Technology: pHEMT FET Supplier Device Package: NI-360HF Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 140 mA |
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MVR5510AMMA0ES |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MVR5510AMBA6ESR2 |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Produkt ist nicht verfügbar
MVR5510AVMAHEP |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC PMIC VR5510 QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
MVR5510AMBA0ES |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MC33VR5500V1ESR2 |
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Produkt ist nicht verfügbar
S912ZVHL32F1VLL |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Produkt ist nicht verfügbar
S912ZVHY32F1CLQ |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC3220FET296/01K |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b SAR
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVCH32374AEC,518 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 4
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 5 pF
Supplier Device Package: 96-LFBGA (13.5x5.5)
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 50pF
Part Status: Obsolete
Number of Bits per Element: 8
Produkt ist nicht verfügbar
FRDM-34931-EVB |
Hersteller: NXP USA Inc.
Description: FREEDOM EXPANSION BOARD - MC3493
Description: FREEDOM EXPANSION BOARD - MC3493
Produkt ist nicht verfügbar
LX2160SN72232B |
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Description: IC MPU QORLQ 2.2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Produkt ist nicht verfügbar
FS32K144HFT0CLLT |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
SPC5746CK1AMMJ6R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Produkt ist nicht verfügbar
MPC555LFCZP40 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Produkt ist nicht verfügbar
BUK7107-55ATE,118 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 7mOhm @ 50A, 10V
Power Dissipation (Max): 272W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 116 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4500 pF @ 25 V
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 7mOhm @ 50A, 10V
Power Dissipation (Max): 272W (Ta)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 116 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4500 pF @ 25 V
Produkt ist nicht verfügbar
BUK7108-40AIE,118 |
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Hersteller: NXP USA Inc.
Description: PFET, 75A I(D), 40V, 0.008OHM, 1
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 50A, 10V
FET Feature: Current Sensing
Power Dissipation (Max): 221W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 84 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3140 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Description: PFET, 75A I(D), 40V, 0.008OHM, 1
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 50A, 10V
FET Feature: Current Sensing
Power Dissipation (Max): 221W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 84 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3140 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1115 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
370+ | 1.35 EUR |
SPC5745CFK1AMKU6 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Produkt ist nicht verfügbar
TL431MSDT215 |
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Hersteller: NXP USA Inc.
Description: VOLTAGE REFERENCE
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Active
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Description: VOLTAGE REFERENCE
Tolerance: ±2%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: -40°C ~ 125°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 2.495V
Part Status: Active
Current - Cathode: 1 mA
Current - Output: 100 mA
Voltage - Output (Max): 36 V
Produkt ist nicht verfügbar
A5G23H065NT4 |
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Hersteller: NXP USA Inc.
Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 8.8W
Gain: 15.5dB
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 30 mA
Description: AIRFAST RF POWER GAN TRANSISTOR,
Packaging: Tape & Reel (TR)
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.4GHz
Power - Output: 8.8W
Gain: 15.5dB
Supplier Device Package: 6-PDFN (7x6.5)
Part Status: Active
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
74HCT640DB,118 |
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Hersteller: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20SSOP
Description: IC TXRX INVERT 5.5V 20SSOP
Produkt ist nicht verfügbar
MC33FS6500NAER2 |
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Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Part Status: Active
Produkt ist nicht verfügbar
PEMI4QFN/RP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Produkt ist nicht verfügbar
PEMI4QFN/RP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Produkt ist nicht verfügbar
PEMI8QFN/RP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Produkt ist nicht verfügbar
PEMI8QFN/RP,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Description: FILTER RC(PI) 100 OHM/18.5PF SMD
Produkt ist nicht verfügbar
BB156,115 |
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Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Produkt ist nicht verfügbar
BB156,115 |
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Hersteller: NXP USA Inc.
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
Description: DIODE VAR CAP 10V 20MA SOD323
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 5.4pF @ 7.5V, 1MHz
Capacitance Ratio Condition: C1/C7.5
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.9
auf Bestellung 434255 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1067+ | 0.45 EUR |
BUK9E1R9-40E,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Description: MOSFET N-CH 40V I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tj)
Supplier Device Package: I2PAK
Part Status: Obsolete
Drain to Source Voltage (Vdss): 40 V
Produkt ist nicht verfügbar
BT138-600G,127 |
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Hersteller: NXP USA Inc.
Description: TRIAC 600V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 60 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 600 V
Description: TRIAC 600V 12A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 60 mA
Current - Gate Trigger (Igt) (Max): 50 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 95A, 105A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Active
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 600 V
auf Bestellung 3740 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
724+ | 0.67 EUR |
TJA1051AT/0Z |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.15 EUR |
5000+ | 1.11 EUR |
12500+ | 1.07 EUR |
BUK653R5-55C |
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Description: N-CHANNEL POWER MOSFET
Produkt ist nicht verfügbar
BUK653R5-55C,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 191 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11516 pF @ 25 V
Description: MOSFET N-CH 55V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 263W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 191 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11516 pF @ 25 V
auf Bestellung 4931 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
290+ | 1.69 EUR |
BUK653R7-30C,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 158W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4707 pF @ 25 V
Description: MOSFET N-CH 30V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.9mOhm @ 25A, 10V
Power Dissipation (Max): 158W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4707 pF @ 25 V
auf Bestellung 6267 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
503+ | 0.99 EUR |
BUK653R2-55C,127 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 258 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15300 pF @ 25 V
Description: MOSFET N-CH 55V 120A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 10V
Power Dissipation (Max): 306W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 258 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 15300 pF @ 25 V
auf Bestellung 3726 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
224+ | 2.16 EUR |
BUK654R0-75C,127 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 120A TO220AB
Description: MOSFET N-CH 75V 120A TO220AB
Produkt ist nicht verfügbar
BGA7350,115 |
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Hersteller: NXP USA Inc.
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
Description: IC AMP GPS 50MHZ-250MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 50MHz ~ 250MHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 19.5dB
Current - Supply: 245mA
Noise Figure: 6dB
P1dB: 17dBm
Test Frequency: 50MHz
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
MC9S08AC32CFJE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1745 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.9 EUR |
10+ | 10.93 EUR |
80+ | 9.05 EUR |
1250+ | 7.89 EUR |
74ALVT162823DGG |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVT162823DGG - B
Description: NOW NEXPERIA 74ALVT162823DGG - B
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
73+ | 6.68 EUR |
BZX585-C13,115 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 13V 300MW SOD523
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 µA @ 8 V
Description: DIODE ZENER 13V 300MW SOD523
Packaging: Bulk
Tolerance: ±5%
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: SOD-523
Part Status: Active
Power - Max: 300 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 100 µA @ 8 V
Produkt ist nicht verfügbar
MC9S08QG8MDNE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Description: IC MCU 8BIT 8KB FLASH 8SOIC
Produkt ist nicht verfügbar
MC68306FC16B |
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Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 132QFP
Description: IC MPU M683XX 16MHZ 132QFP
Produkt ist nicht verfügbar
BZX84J-C22,115 |
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Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 550MW SOD323F
Description: DIODE ZENER 22V 550MW SOD323F
auf Bestellung 19039 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11823+ | 0.054 EUR |
74HCT3G04GD,125 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8XSON
Description: IC INVERTER 3CH 3-INP 8XSON
auf Bestellung 6018 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2219+ | 0.23 EUR |
PDTB114ET215 |
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Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Produkt ist nicht verfügbar
LD6806TD/25P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.5V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 36758 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.16 EUR |
2PD602AS,115 |
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Hersteller: NXP USA Inc.
Description: TRANS NPN 50V 0.5A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V
Frequency - Transition: 180MHz
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Description: TRANS NPN 50V 0.5A SMT3
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 170 @ 150mA, 10V
Frequency - Transition: 180MHz
Supplier Device Package: SMT3; MPAK
Part Status: Obsolete
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
auf Bestellung 3774000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
13172+ | 0.033 EUR |
LFMAJ46CS1NT |
Hersteller: NXP USA Inc.
Description: MPC5646C NEXUS DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5646C
Accessory Type: Adapter
Part Status: Active
Description: MPC5646C NEXUS DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5646C
Accessory Type: Adapter
Part Status: Active
Produkt ist nicht verfügbar
MC68EN360CVR25L |
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Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
auf Bestellung 32 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 215.25 EUR |
PTN36241GHXZ |
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Hersteller: NXP USA Inc.
Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Description: IC REDRIVER USB 3.0 12X2QFN
Packaging: Cut Tape (CT)
Package / Case: 12-XFQFN
Delay Time: 500ps
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB 3.0
Current - Supply: 105mA
Data Rate (Max): 5Gbps
Supplier Device Package: 12-X2QFN (1.25x2.10)
Signal Conditioning: Input Equalization, Output De-Emphasis
Part Status: Active
Produkt ist nicht verfügbar
PEMI4QFN/WT,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
PEMI4QFN/WT,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Produkt ist nicht verfügbar
LPC2102FHN48,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 16KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 16KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9846PW-ARD |
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Hersteller: NXP USA Inc.
Description: ARD SHIELD 4-CH FM I2C BUS EVAL
Packaging: Box
Function: Multiplexer (MUX)
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9846
Platform: Arduino
Part Status: Active
Description: ARD SHIELD 4-CH FM I2C BUS EVAL
Packaging: Box
Function: Multiplexer (MUX)
Type: Interface
Contents: Board(s)
Utilized IC / Part: PCA9846
Platform: Arduino
Part Status: Active
Produkt ist nicht verfügbar
MRFG35010ANT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 9W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 9W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
MRFG35010AR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 140 mA
Description: FET RF 15V 3.55GHZ NI360HF
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 140 mA
Produkt ist nicht verfügbar