Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 470 nach 591
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FS32K148HFT0VLLT | NXP USA Inc. |
 Description: IC MCU 32BIT 2MB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08AW32CFDER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCSPTR2A5775E | NXP USA Inc. |
Description: MPC5775E DEV KIT FOR PMSM MOTOR Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: eTPU Utilized IC / Part: FS6520, MC33937, MPC5775E |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08FL8CBM | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32SDIP Packaging: Tube Package / Case: 32-SDIP (0.400", 10.16mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-SDIP Part Status: Obsolete Number of I/O: 30 |
auf Bestellung 893 Stücke: Lieferzeit 10-14 Tag (e) |
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CGY888C,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Tube Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 280 mA |
auf Bestellung 5553 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5603BAMLL4 | NXP USA Inc. | Description: NXP 32-BIT MCU, POWER ARCH CORE, |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCA85263ATL-ARD | NXP USA Inc. | Description: PCF85263 EVAL BOARD ARDUINO |
Produkt ist nicht verfügbar |
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| MCIMX6QP4AVT1AB | NXP USA Inc. |
Description: I.MX 6QP ROM PERF ENHAN |
Produkt ist nicht verfügbar |
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SPC5603BK0MLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S12XA256VAA | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08PA8VLC-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFP Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 12x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08PT16VLC-NXP | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
auf Bestellung 1254 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT2G66GT,115 | NXP USA Inc. |
Description: NOW NEXPERIA 74HCT2G66GT - SPST, |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT2G66DC,125 | NXP USA Inc. |
Description: 74HCT2G66 - DUAL SINGLE-POLE SIN |
Produkt ist nicht verfügbar |
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NX3L2G66GD | NXP USA Inc. |
Description: MULTIPLEXERS/SWITCHES, 2 FUNC, C |
Produkt ist nicht verfügbar |
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| 74LVCV2G66GT115 | NXP USA Inc. |
Description: OVERVOLTAGE TOLERANT SWITCH Packaging: Bulk |
Produkt ist nicht verfügbar |
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SPC5742PK1AMLQ5 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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SPC5643LFAMMM1R | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
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SPC5643LFAMMM1 | NXP USA Inc. | Description: IC MCU 32BIT 1MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
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LPC4310FET100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Bulk Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 4x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 |
Produkt ist nicht verfügbar |
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MC9S08FL8CLCR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 30 |
Produkt ist nicht verfügbar |
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| RDGD3160I3PH5EVB | NXP USA Inc. |
Description: 3-PHASE REF DESIGN GD3160 Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: FS6500, GD3160, MPC5777C Supplied Contents: Board(s) Embedded: Yes, MCU |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| KITFS6507LAEEVM | NXP USA Inc. |
Description: FS6507 EVAL BOARD Packaging: Box Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS6507 Supplied Contents: Board(s) Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7SET125GM,132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 6XSON |
Produkt ist nicht verfügbar |
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| 74LVC2G125GF115 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC2G125GF BUS DR Packaging: Bulk |
Produkt ist nicht verfügbar |
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S912XET256BVAL | NXP USA Inc. | Description: IC MCU 16BIT 256KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
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LD6816CX4/12P,315 | NXP USA Inc. |
Description: IC REG LINEAR 1.2V 150MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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NX5DV330D,118 | NXP USA Inc. |
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-SO Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
auf Bestellung 9354 Stücke: Lieferzeit 10-14 Tag (e) |
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NX5DV330PW,112 | NXP USA Inc. |
Description: IC VIDEO MUX/DEMUX 1X2 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-TSSOP Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
auf Bestellung 17253 Stücke: Lieferzeit 10-14 Tag (e) |
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NX5DV330D,112 | NXP USA Inc. |
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: Video On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 16-SO Voltage - Supply, Single (V+): 4V ~ 5.5V Multiplexer/Demultiplexer Circuit: 2:1 Number of Channels: 4 |
auf Bestellung 5024 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5747CBK0AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5605BK0CLQ4 | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 768KB (768K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 15x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 121 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCF2131TFY | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 16HLSON Packaging: Tape & Reel (TR) Features: Alarm, Leap Year, SRAM, Watchdog Timer Package / Case: 16-LFDFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 8b Interface: I2C, SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HLSON (4.5x3.5) Voltage - Supply, Battery: 1.2V ~ 5.5V Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCF2131TFY | NXP USA Inc. |
Description: IC RTC CLK/CALENDAR I2C 16HLSON Packaging: Cut Tape (CT) Features: Alarm, Leap Year, SRAM, Watchdog Timer Package / Case: 16-LFDFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Memory Size: 8b Interface: I2C, SPI Type: Clock/Calendar Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.2V ~ 5.5V Time Format: HH:MM:SS:hh (12/24 hr) Date Format: YY-MM-DD-dd Supplier Device Package: 16-HLSON (4.5x3.5) Voltage - Supply, Battery: 1.2V ~ 5.5V Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3817 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6815TD/12H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.2V 150MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.2V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 73448 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12Q12J2VFAE1R | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Not For New Designs Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 8932 Stücke: Lieferzeit 10-14 Tag (e) |
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| NX30P0121UKAZ | NXP USA Inc. |
Description: COMPANION BACK TO BACK OVP SWITC |
Produkt ist nicht verfügbar |
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TJR1441BTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJR1441DTK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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PESD2NFC-SF315 | NXP USA Inc. | Description: NOW NEXPERIA PESD2NFC - NFC ANTE |
auf Bestellung 99000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMEG1201AESF315 | NXP USA Inc. |
Description: RECTIFIER DIODE, SOD962 Packaging: Bulk |
auf Bestellung 53718 Stücke: Lieferzeit 10-14 Tag (e) |
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PMEG3005AESF315 | NXP USA Inc. |
Description: NOW NEXPERIA PMEG3005AE RECTIFIE |
Produkt ist nicht verfügbar |
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PESD3V3U1BCSF315 | NXP USA Inc. |
Description: PESD3V3U1BCSF - ULTRA LOW CLAMPI |
Produkt ist nicht verfügbar |
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PEMI4QFN/HE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/8.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 9dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 28000 Stücke: Lieferzeit 10-14 Tag (e) |
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S912ZVC19F0VLF | NXP USA Inc. |
Description: IC MCU 16BIT 192KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 192KB (192K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MC7457RX867NC157 | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32 BIT, POW |
Produkt ist nicht verfügbar |
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| PDZ3.9BGW,115 | NXP USA Inc. |
Description: NOW NEXPERIA PDZ3.9BGW - ZENER D |
Produkt ist nicht verfügbar |
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LD6806TD/16P,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.6V 200MA 5TSOP |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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| TJA1153ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 14HVSON Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Part Status: Active |
Produkt ist nicht verfügbar |
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| TJA1153ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 14HVSON Packaging: Cut Tape (CT) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Part Status: Active |
auf Bestellung 5485 Stücke: Lieferzeit 10-14 Tag (e) |
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| PHP9NQ20T127 | NXP USA Inc. |
Description: NOW NEXPERIA PHP9NQ20T - 8.7A, 2 |
Produkt ist nicht verfügbar |
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| MCIMX6QP6AVT1AAR | NXP USA Inc. |
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) Part Status: Active Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART |
Produkt ist nicht verfügbar |
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NCR402T215 | NXP USA Inc. |
Description: NCR4 LED DRIVER, SOT23 Packaging: Bulk Part Status: Active |
auf Bestellung 34920 Stücke: Lieferzeit 10-14 Tag (e) |
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NCR402U125 | NXP USA Inc. |
Description: LED DRIVER |
Produkt ist nicht verfügbar |
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| BSC9131NJN1HHHB557 | NXP USA Inc. |
Description: IC MPU QORIQ 800MHZ 520FCBGA Packaging: Bulk Package / Case: 520-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 520-FCBGA (21x21) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Part Status: Active |
Produkt ist nicht verfügbar |
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| FXLS8974CFR3 | NXP USA Inc. |
Description: IC 3-AXIS ACCELEROMETER 10-DFN Packaging: Tape & Reel (TR) Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active |
Produkt ist nicht verfügbar |
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| FXLS8974CFR3 | NXP USA Inc. |
Description: IC 3-AXIS ACCELEROMETER 10-DFN Packaging: Cut Tape (CT) Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor Package / Case: 10-VFDFN Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g, 16g Operating Temperature: -40°C ~ 105°C Voltage - Supply: 1.71V ~ 3.6V Bandwidth: 1.6kHz Supplier Device Package: 10-DFN (2x2) Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g) Part Status: Active |
auf Bestellung 2837 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV138D/S400118 | NXP USA Inc. |
Description: DECODER/DRIVER |
auf Bestellung 4373 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV138DB,112-NXP | NXP USA Inc. | Description: DECODER/DRIVER, LV/LV-A/LVX/H SE |
Produkt ist nicht verfügbar |
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MPC860PCZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
|
| FS32K148HFT0VLLT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08AW32CFDER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCSPTR2A5775E |
|
Hersteller: NXP USA Inc.
Description: MPC5775E DEV KIT FOR PMSM MOTOR
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: eTPU
Utilized IC / Part: FS6520, MC33937, MPC5775E
Description: MPC5775E DEV KIT FOR PMSM MOTOR
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: eTPU
Utilized IC / Part: FS6520, MC33937, MPC5775E
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 2971.2 EUR |
| MC9S08FL8CBM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 30
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-SDIP
Part Status: Obsolete
Number of I/O: 30
auf Bestellung 893 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 283+ | 2.91 EUR |
| CGY888C,112 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
auf Bestellung 5553 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 14+ | 36.86 EUR |
| SPC5603BAMLL4 |
Hersteller: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Description: NXP 32-BIT MCU, POWER ARCH CORE,
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 35+ | 15.16 EUR |
| PCA85263ATL-ARD |
Hersteller: NXP USA Inc.
Description: PCF85263 EVAL BOARD ARDUINO
Description: PCF85263 EVAL BOARD ARDUINO
Produkt ist nicht verfügbar
| MCIMX6QP4AVT1AB |
|
Hersteller: NXP USA Inc.
Description: I.MX 6QP ROM PERF ENHAN
Description: I.MX 6QP ROM PERF ENHAN
Produkt ist nicht verfügbar
| SPC5603BK0MLQ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S12XA256VAA |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 51.5 EUR |
| MC9S08PA8VLC-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08PT16VLC-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
auf Bestellung 1254 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 152+ | 3.52 EUR |
| 74HCT2G66GT,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HCT2G66GT - SPST,
Description: NOW NEXPERIA 74HCT2G66GT - SPST,
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1502+ | 0.34 EUR |
| 74HCT2G66DC,125 |
|
Hersteller: NXP USA Inc.
Description: 74HCT2G66 - DUAL SINGLE-POLE SIN
Description: 74HCT2G66 - DUAL SINGLE-POLE SIN
Produkt ist nicht verfügbar
| NX3L2G66GD |
|
Hersteller: NXP USA Inc.
Description: MULTIPLEXERS/SWITCHES, 2 FUNC, C
Description: MULTIPLEXERS/SWITCHES, 2 FUNC, C
Produkt ist nicht verfügbar
| 74LVCV2G66GT115 |
|
Produkt ist nicht verfügbar
| SPC5742PK1AMLQ5 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
| SPC5643LFAMMM1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
| SPC5643LFAMMM1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
| LPC4310FET100 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Bulk
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
Produkt ist nicht verfügbar
| MC9S08FL8CLCR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 30
Produkt ist nicht verfügbar
| RDGD3160I3PH5EVB |
Hersteller: NXP USA Inc.
Description: 3-PHASE REF DESIGN GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5777C
Supplied Contents: Board(s)
Embedded: Yes, MCU
Description: 3-PHASE REF DESIGN GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: FS6500, GD3160, MPC5777C
Supplied Contents: Board(s)
Embedded: Yes, MCU
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1840.77 EUR |
| KITFS6507LAEEVM |
Hersteller: NXP USA Inc.
Description: FS6507 EVAL BOARD
Packaging: Box
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6507
Supplied Contents: Board(s)
Part Status: Active
Description: FS6507 EVAL BOARD
Packaging: Box
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS6507
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 536.61 EUR |
| XC7SET125GM,132 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Produkt ist nicht verfügbar
| 74LVC2G125GF115 |
|
Produkt ist nicht verfügbar
| S912XET256BVAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Produkt ist nicht verfügbar
| LD6816CX4/12P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.2V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| NX5DV330D,118 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 9354 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 952+ | 0.52 EUR |
| NX5DV330PW,112 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-TSSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 17253 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 952+ | 0.51 EUR |
| NX5DV330D,112 |
|
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
Description: IC VIDEO MUX/DEMUX 1X2 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 5024 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 720+ | 0.66 EUR |
| SPC5747CBK0AVKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5605BK0CLQ4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 15x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 121
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCF2131TFY |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, SRAM, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 8b
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, SRAM, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 8b
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCF2131TFY |
|
Hersteller: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, SRAM, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 8b
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RTC CLK/CALENDAR I2C 16HLSON
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, SRAM, Watchdog Timer
Package / Case: 16-LFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 8b
Interface: I2C, SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 5.5V
Time Format: HH:MM:SS:hh (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 16-HLSON (4.5x3.5)
Voltage - Supply, Battery: 1.2V ~ 5.5V
Current - Timekeeping (Max): 770nA ~ 2.135µA @ 1.2V ~ 5.5V
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3817 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 5.93 EUR |
| 10+ | 5.32 EUR |
| 25+ | 5.03 EUR |
| 100+ | 4.36 EUR |
| 250+ | 4.14 EUR |
| 500+ | 3.71 EUR |
| 1000+ | 3.13 EUR |
| LD6815TD/12H,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.2V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LINEAR 1.2V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 73448 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.14 EUR |
| S9S12Q12J2VFAE1R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 8932 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 16+ | 30.87 EUR |
| NX30P0121UKAZ |
|
Hersteller: NXP USA Inc.
Description: COMPANION BACK TO BACK OVP SWITC
Description: COMPANION BACK TO BACK OVP SWITC
Produkt ist nicht verfügbar
| TJR1441BTK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJR1441DTK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| PESD2NFC-SF315 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PESD2NFC - NFC ANTE
Description: NOW NEXPERIA PESD2NFC - NFC ANTE
auf Bestellung 99000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3606+ | 0.14 EUR |
| PMEG1201AESF315 |
auf Bestellung 53718 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6662+ | 0.088 EUR |
| PMEG3005AESF315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMEG3005AE RECTIFIE
Description: NOW NEXPERIA PMEG3005AE RECTIFIE
Produkt ist nicht verfügbar
| PESD3V3U1BCSF315 |
|
Hersteller: NXP USA Inc.
Description: PESD3V3U1BCSF - ULTRA LOW CLAMPI
Description: PESD3V3U1BCSF - ULTRA LOW CLAMPI
Produkt ist nicht verfügbar
| PEMI4QFN/HE,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 45 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 9dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |
| S912ZVC19F0VLF |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 192KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC7457RX867NC157 |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32 BIT, POW
Description: RISC MICROPROCESSOR, 32 BIT, POW
Produkt ist nicht verfügbar
| PDZ3.9BGW,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDZ3.9BGW - ZENER D
Description: NOW NEXPERIA PDZ3.9BGW - ZENER D
Produkt ist nicht verfügbar
| LD6806TD/16P,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.6V 200MA 5TSOP
Description: IC REG LINEAR 1.6V 200MA 5TSOP
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.17 EUR |
| TJA1153ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Part Status: Active
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Part Status: Active
Produkt ist nicht verfügbar
| TJA1153ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Part Status: Active
Description: IC TRANSCEIVER 1/1 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Part Status: Active
auf Bestellung 5485 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.37 EUR |
| 10+ | 6.62 EUR |
| 25+ | 6.26 EUR |
| 100+ | 5.43 EUR |
| 250+ | 5.15 EUR |
| 500+ | 4.62 EUR |
| 1000+ | 3.9 EUR |
| 2500+ | 3.7 EUR |
| PHP9NQ20T127 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PHP9NQ20T - 8.7A, 2
Description: NOW NEXPERIA PHP9NQ20T - 8.7A, 2
Produkt ist nicht verfügbar
| MCIMX6QP6AVT1AAR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6QP 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Part Status: Active
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
| NCR402T215 |
|
auf Bestellung 34920 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5635+ | 0.088 EUR |
| BSC9131NJN1HHHB557 |
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Part Status: Active
Description: IC MPU QORIQ 800MHZ 520FCBGA
Packaging: Bulk
Package / Case: 520-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 520-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Part Status: Active
Produkt ist nicht verfügbar
| FXLS8974CFR3 |
|
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Produkt ist nicht verfügbar
| FXLS8974CFR3 |
|
Hersteller: NXP USA Inc.
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
Description: IC 3-AXIS ACCELEROMETER 10-DFN
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Sleep Mode, Temperature Sensor
Package / Case: 10-VFDFN
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 10-DFN (2x2)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
Part Status: Active
auf Bestellung 2837 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.19 EUR |
| 5+ | 4.37 EUR |
| 10+ | 4.06 EUR |
| 25+ | 3.69 EUR |
| 50+ | 3.42 EUR |
| 100+ | 3.18 EUR |
| 500+ | 2.68 EUR |
| 1000+ | 2.49 EUR |
| 74LV138D/S400118 |
|
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER
Description: DECODER/DRIVER
auf Bestellung 4373 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2061+ | 0.27 EUR |
| 74LV138DB,112-NXP |
Hersteller: NXP USA Inc.
Description: DECODER/DRIVER, LV/LV-A/LVX/H SE
Description: DECODER/DRIVER, LV/LV-A/LVX/H SE
Produkt ist nicht verfügbar
| MPC860PCZQ66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 380.54 EUR |