Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 469 nach 591
| Foto | Bezeichnung | Hersteller | Beschreibung |
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SSTU32865ET/G,518 | NXP USA Inc. |
 Description: IC REG BUFFER 28BIT 160-TFBGAPackaging: Bulk Package / Case: 160-TFBGA Mounting Type: Surface Mount Number of Bits: 28 Logic Type: 1:2 Registered Buffer with Parity Operating Temperature: 0°C ~ 70°C Supply Voltage: 1.7V ~ 1.9V Supplier Device Package: 160-TFBGA (13x9) Part Status: Obsolete |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTH244ADB,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SSOP |
auf Bestellung 2921 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVTH244AD,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SO |
auf Bestellung 17890 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLF2425M7LS140,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V SOT502B Packaging: Tube Package / Case: SOT-502B Frequency: 2.45GHz Power - Output: 140W Gain: 18.5dB Technology: LDMOS Supplier Device Package: SOT502B Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.3 A |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| NXH3670ADK | NXP USA Inc. |
Description: NXH3670ADK Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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.jpg "S9S08SL16F1MTJ") |
S9S08SL16F1MTJ | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOP |
Produkt ist nicht verfügbar |
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MC15XS3400DHFK557 | NXP USA Inc. |
Description: BUFFER/INVERTER BASED PERIPHERAL |
Produkt ist nicht verfügbar |
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NX3L4053HR,115 | NXP USA Inc. |
Description: IC ANALOG SWITCH SPDT HXQFN16U Packaging: Bulk Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 800mOhm -3db Bandwidth: 60MHz Supplier Device Package: 16-HXQFN (3x3) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Crosstalk: -90dB @ 100kHz Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 120mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Discontinued at Digi-Key Number of Circuits: 3 |
auf Bestellung 31106 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK9609-55A,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 75A D2PAK |
auf Bestellung 1600 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK9614-60E118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9614-60E - POWER |
Produkt ist nicht verfügbar |
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S912XEQ512BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| ASL5115EVBMST | NXP USA Inc. |
Description: ASL5115EVBMST Packaging: Bulk Features: Dimmable Voltage - Input: 4.5V ~ 5.5V Current - Output / Channel: 1.5A Utilized IC / Part: ASL5115 Supplied Contents: Board(s) Outputs and Type: 12, Non-Isolated Part Status: Active |
Produkt ist nicht verfügbar |
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| MK21FX512AVMD12 | NXP USA Inc. |
Description: KINETIS K21: 120MHZ CORTEX-M4F M |
Produkt ist nicht verfügbar |
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S9S12G240F0VLH | NXP USA Inc. |
Description: IC MCU 16BIT 240KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 240KB (240K x 8) RAM Size: 11K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKL33Z32VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 20x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Active Number of I/O: 70 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SEN-GEN6-SKT | NXP USA Inc. | Description: SOCKET EVALUATION BOARD FOR FXLS |
Produkt ist nicht verfügbar |
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N74F157AN,602 | NXP USA Inc. |
Description: IC MULTIPLEXER 4 X 2:1 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Supplier Device Package: 16-DIP Part Status: Obsolete |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MM912J637AM2EPR2564 | NXP USA Inc. |
Description: MM912 - MAGNIV S12 RELAY DRIVER, |
Produkt ist nicht verfügbar |
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SPC5673KAVMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5673KAVMM1R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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74LVT241PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
auf Bestellung 12500 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT240PW/AU118 | NXP USA Inc. |
Description: BUS DRIVER, LVT SERIES, 4-BIT |
auf Bestellung 4800 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K142WAT0WLHT | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 29x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
auf Bestellung 765 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6806TD/14H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.4V 200MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.4V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MRF8VP13350NR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V OM780G-4 Packaging: Tape & Reel (TR) Package / Case: OM-780G-4L Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 700MHz ~ 1.3GHz Power - Output: 350W Gain: 19.2dB Technology: LDMOS Supplier Device Package: OM-780G-4L Part Status: Active Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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PBSS4260PAN | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PAN - SMALL |
Produkt ist nicht verfügbar |
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| PBSS4260PANPS115 | NXP USA Inc. |
Description: NOW NEXPERIA PBSS4260PANPS SMALL |
Produkt ist nicht verfügbar |
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| MF3D2200DU15/02V | NXP USA Inc. | Description: MIFARE SMART CARD DESFIRE EV2 XL |
Produkt ist nicht verfügbar |
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74HCT4520DB,112 | NXP USA Inc. |
Description: BINARY COUNTER |
Produkt ist nicht verfügbar |
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74AHCT74PW112 | NXP USA Inc. |
Description: NOW NEXPERIA 74AHCT74PW - D FLIP Packaging: Bulk Part Status: Active |
auf Bestellung 5885 Stücke: Lieferzeit 10-14 Tag (e) |
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| A2I09VD050GNR1 | NXP USA Inc. |
Description: AIRFAST RF LDMOS WIDEBAND INTEGR |
Produkt ist nicht verfügbar |
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MIMX8MN3CVPIZAA | NXP USA Inc. |
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA Packaging: Tray Package / Case: 306-TFBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 306-TFBGA (11x11) Ethernet: GbE USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Additional Interfaces: I2C, PCIe, SDHC, SPI, UART |
auf Bestellung 168 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2470FET208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208TFBGA |
Produkt ist nicht verfügbar |
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| K32L2B21VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 32-QFN (5x5) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| K32L2B11VFM0A | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32QFN Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 32K x 8 Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.2V Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 32-QFN (5x5) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9547PW118 | NXP USA Inc. |
Description: IC MUX 8CH I2C BUS 24TSSOP Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| PCA9955BTW-ARD | NXP USA Inc. |
Description: PCA9955 EVK LED ARD Packaging: Bulk Function: LED Driver Type: Opto Contents: Board(s) Utilized IC / Part: PCA9955B Platform: Arduino Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD3V3L5U115 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk |
Produkt ist nicht verfügbar |
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S912ZVML32F3VKH | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 64LQFP |
Produkt ist nicht verfügbar |
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| LPC1820FBD144K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 83 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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MFRC53001T/0FE | NXP USA Inc. |
Description: IC MIFARE HS READER 32SO |
Produkt ist nicht verfügbar |
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041AMZ | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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SE98PW,118 | NXP USA Inc. |
Description: IC TEMP SENSOR I2C 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I²C/SMBus Mounting Type: Surface Mount Function: Temp Monitoring System (Sensor) Accuracy: ±4°C(Max) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.7V ~ 3.6V Sensor Type: Internal Sensing Temperature: -40°C ~ 125°C Topology: ADC (Sigma Delta), Register Bank Output Alarm: Yes Output Fan: Yes Supplier Device Package: 8-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FRDM665CANFDEVB | NXP USA Inc. |
Description: MC33665A CAN FD EVB Packaging: Box Function: CANbus Type: Interface Utilized IC / Part: MC33665A Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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RD33775ACNCEVB | NXP USA Inc. |
Description: CAN FD CENTRALIZED EVB Packaging: Box Function: CANbus Type: Interface Supplied Contents: Board(s) Contents: Board(s) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF7755HV/N205ZK | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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| SAF7755HV/N205ZY | NXP USA Inc. | Description: DSP AUDIO MULTI-TUNER |
Produkt ist nicht verfügbar |
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MC9S08GT32ACFDE | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
Produkt ist nicht verfügbar |
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74ALVCH162827DGG518 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVCH162827DGG118 | NXP USA Inc. |
Description: BUS DRIVER, ALVC/VCX/A SERIES Packaging: Bulk Part Status: Active Package / Case: 56-TFSOP (0.240", 6.10mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3.6V Number of Bits per Element: 10 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 56-TSSOP |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVT162827DGG | NXP USA Inc. |
Description: NOW NEXPERIA 74ALVT162827DGG - B |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |
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| MCHC912B32VFUE8-NXP | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP Packaging: Bulk Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 768 x 8 Core Processor: CPU12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 63 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AP48CFBER528 | NXP USA Inc. | Description: MICROCONTROLLER, 8-BIT, HC08/S08 |
auf Bestellung 2250 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC8544EVTANGA | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSORS, |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| FRDMGD31RPEVM | NXP USA Inc. |
Description: HALF BRIDGE EVAL GD3160 Packaging: Bulk Function: Gate Driver Type: Power Management Utilized IC / Part: GD3160, KL25Z Supplied Contents: Board(s), Cable(s) Primary Attributes: 1-Channel (Single) Embedded: Yes, MCU Part Status: Active Secondary Attributes: SPI/USB Interface(s) |
Produkt ist nicht verfügbar |
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PNX9535E/V1518 | NXP USA Inc. |
Description: SOFTWARE ENABLED VIDEO AND MULTI |
auf Bestellung 400 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74LV393D118 | NXP USA Inc. |
Description: NOW NEXPERIA 74LV393D - BINARY C Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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LPC1115FBD48/303 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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LPC1115FBD48/303151 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 |
Produkt ist nicht verfügbar |
| SSTU32865ET/G,518 |
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Hersteller: NXP USA Inc.
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
Description: IC REG BUFFER 28BIT 160-TFBGA
Packaging: Bulk
Package / Case: 160-TFBGA
Mounting Type: Surface Mount
Number of Bits: 28
Logic Type: 1:2 Registered Buffer with Parity
Operating Temperature: 0°C ~ 70°C
Supply Voltage: 1.7V ~ 1.9V
Supplier Device Package: 160-TFBGA (13x9)
Part Status: Obsolete
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 96+ | 5.09 EUR |
| 74LVTH244ADB,118 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
Description: IC BUFFER NON-INVERT 3.6V 20SSOP
auf Bestellung 2921 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1104+ | 0.47 EUR |
| 74LVTH244AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Description: IC BUFFER NON-INVERT 3.6V 20SO
auf Bestellung 17890 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1303+ | 0.4 EUR |
| BLF2425M7LS140,112 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Frequency: 2.45GHz
Power - Output: 140W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
Description: RF MOSFET LDMOS 28V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Frequency: 2.45GHz
Power - Output: 140W
Gain: 18.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.3 A
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 206.89 EUR |
| NXH3670ADK |
|
Produkt ist nicht verfügbar
| S9S08SL16F1MTJ |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Produkt ist nicht verfügbar
| MC15XS3400DHFK557 |
|
Hersteller: NXP USA Inc.
Description: BUFFER/INVERTER BASED PERIPHERAL
Description: BUFFER/INVERTER BASED PERIPHERAL
Produkt ist nicht verfügbar
| NX3L4053HR,115 |
|
Hersteller: NXP USA Inc.
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
Description: IC ANALOG SWITCH SPDT HXQFN16U
Packaging: Bulk
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 800mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 120mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Discontinued at Digi-Key
Number of Circuits: 3
auf Bestellung 31106 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 540+ | 0.92 EUR |
| BUK9609-55A,118 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Description: MOSFET N-CH 55V 75A D2PAK
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 444+ | 1.09 EUR |
| BUK9614-60E118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9614-60E - POWER
Description: NOW NEXPERIA BUK9614-60E - POWER
Produkt ist nicht verfügbar
| S912XEQ512BMALR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| ASL5115EVBMST |
Hersteller: NXP USA Inc.
Description: ASL5115EVBMST
Packaging: Bulk
Features: Dimmable
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
Description: ASL5115EVBMST
Packaging: Bulk
Features: Dimmable
Voltage - Input: 4.5V ~ 5.5V
Current - Output / Channel: 1.5A
Utilized IC / Part: ASL5115
Supplied Contents: Board(s)
Outputs and Type: 12, Non-Isolated
Part Status: Active
Produkt ist nicht verfügbar
| MK21FX512AVMD12 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K21: 120MHZ CORTEX-M4F M
Description: KINETIS K21: 120MHZ CORTEX-M4F M
Produkt ist nicht verfügbar
| S9S12G240F0VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 240KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL33Z32VLK4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Active
Number of I/O: 70
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SEN-GEN6-SKT |
Hersteller: NXP USA Inc.
Description: SOCKET EVALUATION BOARD FOR FXLS
Description: SOCKET EVALUATION BOARD FOR FXLS
Produkt ist nicht verfügbar
| N74F157AN,602 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 4 X 2:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
Description: IC MULTIPLEXER 4 X 2:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Part Status: Obsolete
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2219+ | 0.23 EUR |
| MM912J637AM2EPR2564 |
|
Hersteller: NXP USA Inc.
Description: MM912 - MAGNIV S12 RELAY DRIVER,
Description: MM912 - MAGNIV S12 RELAY DRIVER,
Produkt ist nicht verfügbar
| SPC5673KAVMM1 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5673KAVMM1R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVT241PW/AU118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
auf Bestellung 12500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1312+ | 0.4 EUR |
| 74LVT240PW/AU118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, LVT SERIES, 4-BIT
Description: BUS DRIVER, LVT SERIES, 4-BIT
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1312+ | 0.4 EUR |
| FS32K142WAT0WLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 29x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
auf Bestellung 765 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 14.06 EUR |
| 10+ | 11.23 EUR |
| 80+ | 10.24 EUR |
| LD6806TD/14H,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.16 EUR |
| MRF8VP13350NR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 350W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V OM780G-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780G-4L
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 700MHz ~ 1.3GHz
Power - Output: 350W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: OM-780G-4L
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
| PBSS4260PAN |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PAN - SMALL
Description: NOW NEXPERIA PBSS4260PAN - SMALL
Produkt ist nicht verfügbar
| PBSS4260PANPS115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBSS4260PANPS SMALL
Description: NOW NEXPERIA PBSS4260PANPS SMALL
Produkt ist nicht verfügbar
| MF3D2200DU15/02V |
Hersteller: NXP USA Inc.
Description: MIFARE SMART CARD DESFIRE EV2 XL
Description: MIFARE SMART CARD DESFIRE EV2 XL
Produkt ist nicht verfügbar
| 74AHCT74PW112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74AHCT74PW - D FLIP
Packaging: Bulk
Part Status: Active
auf Bestellung 5885 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2377+ | 0.21 EUR |
| A2I09VD050GNR1 |
|
Hersteller: NXP USA Inc.
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Description: AIRFAST RF LDMOS WIDEBAND INTEGR
Produkt ist nicht verfügbar
| MIMX8MN3CVPIZAA |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
Description: IC MPU I.MX8MN 1.4GHZ 306TFBGA
Packaging: Tray
Package / Case: 306-TFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 306-TFBGA (11x11)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
auf Bestellung 168 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 42.82 EUR |
| 10+ | 31.75 EUR |
| 25+ | 28.91 EUR |
| 168+ | 24.83 EUR |
| LPC2470FET208,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
Produkt ist nicht verfügbar
| K32L2B21VFM0A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| K32L2B11VFM0A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 32K x 8
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.2V
Connectivity: FlexIO, I²C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PCA9955BTW-ARD |
|
Hersteller: NXP USA Inc.
Description: PCA9955 EVK LED ARD
Packaging: Bulk
Function: LED Driver
Type: Opto
Contents: Board(s)
Utilized IC / Part: PCA9955B
Platform: Arduino
Part Status: Active
Description: PCA9955 EVK LED ARD
Packaging: Bulk
Function: LED Driver
Type: Opto
Contents: Board(s)
Utilized IC / Part: PCA9955B
Platform: Arduino
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 179.73 EUR |
| S912ZVML32F3VKH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
| LPC1820FBD144K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 20.01 EUR |
| 10+ | 14.12 EUR |
| 25+ | 12.61 EUR |
| 80+ | 11.14 EUR |
| 230+ | 10.16 EUR |
| MFRC53001T/0FE |
|
Hersteller: NXP USA Inc.
Description: IC MIFARE HS READER 32SO
Description: IC MIFARE HS READER 32SO
Produkt ist nicht verfügbar
| K32W041AMZ |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1000+ | 7.6 EUR |
| K32W041AMZ |
|
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.89 EUR |
| SE98PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Description: IC TEMP SENSOR I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I²C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
| FRDM665CANFDEVB |
|
Hersteller: NXP USA Inc.
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
Description: MC33665A CAN FD EVB
Packaging: Box
Function: CANbus
Type: Interface
Utilized IC / Part: MC33665A
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 488.17 EUR |
| RD33775ACNCEVB |
|
Hersteller: NXP USA Inc.
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Supplied Contents: Board(s)
Contents: Board(s)
Description: CAN FD CENTRALIZED EVB
Packaging: Box
Function: CANbus
Type: Interface
Supplied Contents: Board(s)
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 725.6 EUR |
| SAF7755HV/N205ZK |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| SAF7755HV/N205ZY |
Hersteller: NXP USA Inc.
Description: DSP AUDIO MULTI-TUNER
Description: DSP AUDIO MULTI-TUNER
Produkt ist nicht verfügbar
| MC9S08GT32ACFDE |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Produkt ist nicht verfügbar
| 74ALVCH162827DGG518 |
|
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 355+ | 1.5 EUR |
| 74ALVCH162827DGG118 |
|
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
Description: BUS DRIVER, ALVC/VCX/A SERIES
Packaging: Bulk
Part Status: Active
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3.6V
Number of Bits per Element: 10
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 56-TSSOP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 364+ | 1.31 EUR |
| 74ALVT162827DGG |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVT162827DGG - B
Description: NOW NEXPERIA 74ALVT162827DGG - B
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 79+ | 6.71 EUR |
| MCHC912B32VFUE8-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 768 x 8
Core Processor: CPU12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908AP48CFBER528 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Description: MICROCONTROLLER, 8-BIT, HC08/S08
auf Bestellung 2250 Stücke:
Lieferzeit 10-14 Tag (e)| MPC8544EVTANGA |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC RISC MICROPROCESSORS,
Description: POWERQUICC RISC MICROPROCESSORS,
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 203.3 EUR |
| FRDMGD31RPEVM |
|
Hersteller: NXP USA Inc.
Description: HALF BRIDGE EVAL GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI/USB Interface(s)
Description: HALF BRIDGE EVAL GD3160
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: GD3160, KL25Z
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 1-Channel (Single)
Embedded: Yes, MCU
Part Status: Active
Secondary Attributes: SPI/USB Interface(s)
Produkt ist nicht verfügbar
| PNX9535E/V1518 |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE ENABLED VIDEO AND MULTI
Description: SOFTWARE ENABLED VIDEO AND MULTI
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 17+ | 31.03 EUR |
| 74LV393D118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV393D - BINARY C
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LV393D - BINARY C
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| LPC1115FBD48/303 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
| LPC1115FBD48/303151 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
Produkt ist nicht verfügbar