Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 431 nach 584
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AHCT132PW/S400118 | NXP USA Inc. |
Description: NAND GATE, AHCT/VHCT/VT SERIES Packaging: Bulk |
auf Bestellung 2751 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
PEMI6QFN/LT,132 | NXP USA Inc. | Description: DATA LINE FILTER |
auf Bestellung 76000 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||
PEMI6QFN/WT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/23PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 32dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
PEMI6QFN/HT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/23PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 20dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
PEMI6QFN/CT,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/23PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 23pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 16dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BC847C/AU,215 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Frequency - Transition: 100MHz Supplier Device Package: SOT23-3 (TO-236) Part Status: Active Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 250 mW |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BC847CQA147 | NXP USA Inc. |
Description: SMALL SIGNAL BIPOLAR TRANSISTOR Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||
74AUP3G17GNX | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 8-XSON (1.95x1) |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
74LVC3G17GN115 | NXP USA Inc. | Description: NOW NEXPERIA 74LVC3G17GN BUFFER, |
Produkt ist nicht verfügbar |
||||||||||||
PEMI4QFN/CE,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/8.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 7dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BC807-40QA147 | NXP USA Inc. | Description: NOW NEXPERIA BC807-40 - SMALL SI |
Produkt ist nicht verfügbar |
||||||||||||
MCIMX6DP6AVT8AB | NXP USA Inc. |
Description: IC MPU I.MX6DP 852MHZ 624FCBGA Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS SATA: SATA 3Gbps (1) |
Produkt ist nicht verfügbar |
||||||||||||
MCIMX6G0DVM05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||
MCIMX6G2AVM05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA Packaging: Bulk Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 289-MAPBGA (14x14) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS |
Produkt ist nicht verfügbar |
||||||||||||
MC9S08AC128CFUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08 Packaging: Bulk Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
MCF51AC128ACPUE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 32-BIT, FLASH, Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
MCF51AC128CCPUE557 | NXP USA Inc. |
Description: COLD FIRE MICROCONTROLLER 32-BI Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
BAS21/MI,215 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
auf Bestellung 467370 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BAS21/MI,235 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
auf Bestellung 160000 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BAS21/MI215 | NXP USA Inc. |
Description: BAS21 - HIGH-VOLTAGE SWITCHING D Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||
BAS21/ZL215 | NXP USA Inc. |
Description: BAS21 - RECTIFIER DIODE Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||
74LVCH32245AEC,557 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 96LFBGA Packaging: Tray Package / Case: 96-LFBGA Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.2V ~ 3.6V Number of Bits per Element: 8 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 96-LFBGA (13.5x5.5) Part Status: Obsolete |
auf Bestellung 20172 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
74HC139PW,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X2:4 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 2:4 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP Part Status: Active |
auf Bestellung 6700 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BZX84-C11/LF1R | NXP USA Inc. |
Description: DIODE ZENER 11V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
||||||||||||
BZX84-C11/LF1VL | NXP USA Inc. |
Description: DIODE ZENER 11V 250MW TO236AB Packaging: Tape & Reel (TR) Tolerance: ±5% Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 11 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 8 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
||||||||||||
BZB784-C6V2115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C5V6 - ZENER Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||
MC34PF3000A7EPR2 | NXP USA Inc. | Description: POWER MANAGEMENT IC I.MX7 PRE- |
Produkt ist nicht verfügbar |
||||||||||||
BAS40-04/ZLR | NXP USA Inc. |
Description: DIODE ARR SCHOTT 40V 120MA SOT23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 120mA (DC) Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA Current - Reverse Leakage @ Vr: 10 µA @ 40 V |
Produkt ist nicht verfügbar |
||||||||||||
BAS40-04/ZLVL | NXP USA Inc. |
Description: DIODE ARR SCHOTT 40V 120MA SOT23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 120mA (DC) Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA Current - Reverse Leakage @ Vr: 10 µA @ 40 V |
Produkt ist nicht verfügbar |
||||||||||||
BGA2748,115 | NXP USA Inc. |
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP Packaging: Cut Tape (CT) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Frequency: 100MHz ~ 2.2GHz RF Type: ISM Voltage - Supply: 3V ~ 4V Gain: 21.8dB Current - Supply: 15mA Noise Figure: 1.9dB P1dB: -9.2dBm Test Frequency: 1GHz Supplier Device Package: 6-TSSOP Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||
BZX84-C5V6/CH/LFVL | NXP USA Inc. |
Description: DIODE ZENER 5.6V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 5.6 V Impedance (Max) (Zzt): 40 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 1 µA @ 2 V |
Produkt ist nicht verfügbar |
||||||||||||
74LVC1T45GN132 | NXP USA Inc. |
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||
BAW56QA147 | NXP USA Inc. |
Description: DIODE Packaging: Bulk Part Status: Active Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Common Anode Current - Average Rectified (Io) (per Diode): 310mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V Grade: Automotive Qualification: AEC-Q101 |
Produkt ist nicht verfügbar |
||||||||||||
MC9S08QG4CFFER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16QFN Packaging: Cut Tape (CT) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-QFN-EP (5x5) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
MC68340FE16VE | NXP USA Inc. | Description: MICROCONTROLLER, 32-BIT, 16.78MH |
auf Bestellung 912 Stücke: Lieferzeit 10-14 Tag (e) |
||||||||||||
N74F253D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16SO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||
N74F253D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 3mA, 24mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
SW5746R-Z4ICST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC5746R Z4 INSTRU |
Produkt ist nicht verfügbar |
||||||||||||
SW574XG-Z4SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC574XG Z4 STRUCT |
Produkt ist nicht verfügbar |
||||||||||||
SW577XK-Z7SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE MPC577XK Z7 STRUCT |
Produkt ist nicht verfügbar |
||||||||||||
SWAC57D-A5SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D A5 STRUCTUR |
Produkt ist nicht verfügbar |
||||||||||||
SWAC57D-M4SCST1F | NXP USA Inc. | Description: AUTO SOFTWARE SAC57D M4 STRUCTUR |
Produkt ist nicht verfügbar |
||||||||||||
LPC11U14FBD48/201 | NXP USA Inc. | Description: RISC MICROCONTROLLER, 32-BIT, FL |
Produkt ist nicht verfügbar |
||||||||||||
LPC11U14FHI33/201551 | NXP USA Inc. | Description: IC MCU 32BIT 32KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
||||||||||||
LPC11U14FBD48/20EL | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 1100 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||||
BZB784-C3V0115 | NXP USA Inc. |
Description: NOW NEXPERIA BZB784-C3V0 ZENER D Packaging: Bulk |
Produkt ist nicht verfügbar |
||||||||||||
MC68331CAG25 | NXP USA Inc. | Description: IC MCU 32BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
||||||||||||
MC68HC16Z1CAG25 | NXP USA Inc. | Description: IC MCU 16BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
||||||||||||
NCX2220DP,125 | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Rail-to-Rail Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 8-TSSOP Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||||||
BC847BMB315 | NXP USA Inc. | Description: SMALL SIGNAL BIPOLAR TRANSISTOR, |
Produkt ist nicht verfügbar |
||||||||||||
IP4280CZ10,118 | NXP USA Inc. |
Description: TVS DIODE 5.5VWM 8VC 10TSSOP Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Type: Steering (Rail to Rail) Operating Temperature: -40°C ~ 85°C (TA) Applications: HDMI Voltage - Reverse Standoff (Typ): 5.5V Supplier Device Package: 10-TSSOP Unidirectional Channels: 4 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 8V (Typ) Power Line Protection: Yes |
Produkt ist nicht verfügbar |
||||||||||||
JN5188HN/001K | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5188HN/001Y | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5188THN/001K | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5188THN/001Y | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 40-HVQFN (6x6) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5189HN/001K | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5189HN/001Y | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5189THN/001K | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
JN5189THN/001Y | NXP USA Inc. |
Description: WIRELESS MICROCONTROLLER Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||||||||||||
PDTB123EQA147 | NXP USA Inc. |
Description: TRANS PREBIAS Packaging: Bulk |
auf Bestellung 79000 Stücke: Lieferzeit 10-14 Tag (e) |
|
74AHCT132PW/S400118 |
auf Bestellung 2751 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2049+ | 0.26 EUR |
PEMI6QFN/LT,132 |
Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 76000 Stücke:
Lieferzeit 10-14 Tag (e)PEMI6QFN/WT,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 200 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 32dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
PEMI6QFN/HT,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 45 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
PEMI6QFN/CT,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/23PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
BC847C/AU,215 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT23-3 (TO-236)
Part Status: Active
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 250 mW
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.032 EUR |
BC847CQA147 |
Produkt ist nicht verfügbar
74AUP3G17GNX |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1043+ | 0.47 EUR |
74LVC3G17GN115 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G17GN BUFFER,
Description: NOW NEXPERIA 74LVC3G17GN BUFFER,
Produkt ist nicht verfügbar
PEMI4QFN/CE,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 20 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.16 EUR |
BC807-40QA147 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC807-40 - SMALL SI
Description: NOW NEXPERIA BC807-40 - SMALL SI
Produkt ist nicht verfügbar
MCIMX6DP6AVT8AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Description: IC MPU I.MX6DP 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Produkt ist nicht verfügbar
MCIMX6G0DVM05AB |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Part Status: Active
Produkt ist nicht verfügbar
MCIMX6G2AVM05AA |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Bulk
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Produkt ist nicht verfügbar
MC9S08AC128CFUE557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF51AC128ACPUE557 |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 32-BIT, FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 32-BIT, FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCF51AC128CCPUE557 |
Hersteller: NXP USA Inc.
Description: COLD FIRE MICROCONTROLLER 32-BI
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: COLD FIRE MICROCONTROLLER 32-BI
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BAS21/MI,215 |
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
auf Bestellung 467370 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.032 EUR |
BAS21/MI,235 |
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
auf Bestellung 160000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.032 EUR |
BAS21/MI215 |
Hersteller: NXP USA Inc.
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Description: BAS21 - HIGH-VOLTAGE SWITCHING D
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
BAS21/ZL215 |
Produkt ist nicht verfügbar
74LVCH32245AEC,557 |
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Obsolete
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Packaging: Tray
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Part Status: Obsolete
auf Bestellung 20172 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
82+ | 6.04 EUR |
74HC139PW,112 |
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC DECODER/DEMUX 1X2:4 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 2:4
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 6700 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1805+ | 0.28 EUR |
BZX84-C11/LF1R |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZX84-C11/LF1VL |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE ZENER 11V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZB784-C6V2115 |
Produkt ist nicht verfügbar
MC34PF3000A7EPR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Description: POWER MANAGEMENT IC I.MX7 PRE-
Produkt ist nicht verfügbar
BAS40-04/ZLR |
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Produkt ist nicht verfügbar
BAS40-04/ZLVL |
Hersteller: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Produkt ist nicht verfügbar
BGA2748,115 |
Hersteller: NXP USA Inc.
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.2GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.8dB
Current - Supply: 15mA
Noise Figure: 1.9dB
P1dB: -9.2dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Description: IC AMP ISM 100MHZ-2.2GHZ 6TSSOP
Packaging: Cut Tape (CT)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Frequency: 100MHz ~ 2.2GHz
RF Type: ISM
Voltage - Supply: 3V ~ 4V
Gain: 21.8dB
Current - Supply: 15mA
Noise Figure: 1.9dB
P1dB: -9.2dBm
Test Frequency: 1GHz
Supplier Device Package: 6-TSSOP
Part Status: Obsolete
Produkt ist nicht verfügbar
BZX84-C5V6/CH/LFVL |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Description: DIODE ZENER 5.6V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 40 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 1 µA @ 2 V
Produkt ist nicht verfügbar
74LVC1T45GN132 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA 74LVC1T45GN BUS TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
BAW56QA147 |
Hersteller: NXP USA Inc.
Description: DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 310mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Description: DIODE
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Common Anode
Current - Average Rectified (Io) (per Diode): 310mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
MC9S08QG4CFFER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC68340FE16VE |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 32-BIT, 16.78MH
Description: MICROCONTROLLER, 32-BIT, 16.78MH
auf Bestellung 912 Stücke:
Lieferzeit 10-14 Tag (e)N74F253D,623 |
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
N74F253D,623 |
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 3mA, 24mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1480+ | 0.32 EUR |
SW5746R-Z4ICST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
Description: AUTO SOFTWARE MPC5746R Z4 INSTRU
Produkt ist nicht verfügbar
SW574XG-Z4SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
Description: AUTO SOFTWARE MPC574XG Z4 STRUCT
Produkt ist nicht verfügbar
SW577XK-Z7SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
Description: AUTO SOFTWARE MPC577XK Z7 STRUCT
Produkt ist nicht verfügbar
SWAC57D-A5SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
Description: AUTO SOFTWARE SAC57D A5 STRUCTUR
Produkt ist nicht verfügbar
SWAC57D-M4SCST1F |
Hersteller: NXP USA Inc.
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
Description: AUTO SOFTWARE SAC57D M4 STRUCTUR
Produkt ist nicht verfügbar
LPC11U14FBD48/201 |
Hersteller: NXP USA Inc.
Description: RISC MICROCONTROLLER, 32-BIT, FL
Description: RISC MICROCONTROLLER, 32-BIT, FL
Produkt ist nicht verfügbar
LPC11U14FHI33/201551 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Produkt ist nicht verfügbar
LPC11U14FBD48/20EL |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 1100 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 8.48 EUR |
10+ | 6.62 EUR |
80+ | 5.43 EUR |
500+ | 5.31 EUR |
1000+ | 4.48 EUR |
BZB784-C3V0115 |
Produkt ist nicht verfügbar
MC68331CAG25 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
MC68HC16Z1CAG25 |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Description: IC MCU 16BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
NCX2220DP,125 |
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Part Status: Obsolete
Produkt ist nicht verfügbar
BC847BMB315 |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Description: SMALL SIGNAL BIPOLAR TRANSISTOR,
Produkt ist nicht verfügbar
IP4280CZ10,118 |
Hersteller: NXP USA Inc.
Description: TVS DIODE 5.5VWM 8VC 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Power Line Protection: Yes
Description: TVS DIODE 5.5VWM 8VC 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8V (Typ)
Power Line Protection: Yes
Produkt ist nicht verfügbar
JN5188HN/001K |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5188HN/001Y |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5188THN/001K |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5188THN/001Y |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 40-HVQFN (6x6)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5189HN/001K |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5189HN/001Y |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5189THN/001K |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
JN5189THN/001Y |
Hersteller: NXP USA Inc.
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: WIRELESS MICROCONTROLLER
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PDTB123EQA147 |
auf Bestellung 79000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
8219+ | 0.067 EUR |