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MC17XS6500BEK MC17XS6500BEK NXP USA Inc. MX07XS6,MC17XS6.pdf Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
74HCT00PW/S400118 74HCT00PW/S400118 NXP USA Inc. PHGL-S-A0001295616-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
74HC259PW112 NXP USA Inc. 74HC_HCT259.pdf Description: NOW NEXPERIA 74HC259PW - D LATCH
Produkt ist nicht verfügbar
PEMI4QFN/HK,132 PEMI4QFN/HK,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.16 EUR
Mindestbestellmenge: 2959
MAC7131MVF40 MAC7131MVF40 NXP USA Inc. MAC7100EC.pdf Description: IC MCU 32B 544KB FLASH 208MAPBGA
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
4+136.01 EUR
Mindestbestellmenge: 4
ASC8851AETE ASC8851AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I²S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EM773FHN33,551 EM773FHN33,551 NXP USA Inc. EM773.pdf Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 5538 Stücke:
Lieferzeit 10-14 Tag (e)
116+4.58 EUR
Mindestbestellmenge: 116
MMA3202KEG MMA3202KEG NXP USA Inc. MMA3202KEG.pdf Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Produkt ist nicht verfügbar
NTSX2102GU8125 NXP USA Inc. PHGLS27057-1.pdf?t.download=true&u=5oefqw Description: DUAL SUPPLY TRANSLATING TRANSCEI
Produkt ist nicht verfügbar
74HC132PW/S400118 74HC132PW/S400118 NXP USA Inc. PHGL-S-A0001367154-1.pdf?t.download=true&u=5oefqw Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
BAP70-04W,115 BAP70-04W,115 NXP USA Inc. BAP70-04W.pdf Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
auf Bestellung 999477 Stücke:
Lieferzeit 10-14 Tag (e)
1866+0.26 EUR
Mindestbestellmenge: 1866
BAP70AM,115 BAP70AM,115 NXP USA Inc. BAP70AM.pdf Description: RF DIODE PIN 50V 300MW 6TSSOP
Produkt ist nicht verfügbar
BAP51LX,315 BAP51LX,315 NXP USA Inc. BAP51LX.pdf Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Cut Tape (CT)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
Produkt ist nicht verfügbar
MRF8P20165WHSR5 MRF8P20165WHSR5 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
MRF8P20165WHSR5 MRF8P20165WHSR5 NXP USA Inc. MRF8P20165WH.pdf Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
BAT54CM315 BAT54CM315 NXP USA Inc. BAT54CM.pdf Description: NOW NEXPERIA BAT54C - RECTIFIER
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-883
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Produkt ist nicht verfügbar
PEMI2STD/CP,115 PEMI2STD/CP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/18.5PF SMD
Produkt ist nicht verfügbar
MRF6VP2600HR5 MRF6VP2600HR5 NXP USA Inc. MRF6VP2600HR6.pdf Description: FET RF 2CH 110V 225MHZ NI-1230
Packaging: Bulk
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
auf Bestellung 446 Stücke:
Lieferzeit 10-14 Tag (e)
1+607.24 EUR
74AHC377D,118 74AHC377D,118 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
auf Bestellung 5523 Stücke:
Lieferzeit 10-14 Tag (e)
74AHC377D,112 74AHC377D,112 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
auf Bestellung 1803 Stücke:
Lieferzeit 10-14 Tag (e)
74HC3GU04DC,125 74HC3GU04DC,125 NXP USA Inc. 74HC3GU04.pdf Description: IC INVERTER 3CH 3-INP 8VSSOP
auf Bestellung 2780 Stücke:
Lieferzeit 10-14 Tag (e)
LX2162RC82029B NXP USA Inc. Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Part Status: Active
Produkt ist nicht verfügbar
S9S08SG8E2CTJR S9S08SG8E2CTJR NXP USA Inc. MC9S08SG8.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 2765 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.93 EUR
10+ 5.41 EUR
100+ 4.43 EUR
500+ 4.34 EUR
1000+ 3.66 EUR
Mindestbestellmenge: 3
JN516X-EK005-120VZ NXP USA Inc. JN516X.pdf Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK005-230VZ NXP USA Inc. JN516X.pdf Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK006-120VZ NXP USA Inc. JN516X.pdf Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK006-230VZ NXP USA Inc. JN516X.pdf Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-UG001Z NXP USA Inc. Description: UPGRADE KIT JN516X
Produkt ist nicht verfügbar
PMN34LN,135 PMN34LN,135 NXP USA Inc. PMN34LN.pdf Description: MOSFET N-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2.5A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 20 V
auf Bestellung 10173 Stücke:
Lieferzeit 10-14 Tag (e)
2219+0.23 EUR
Mindestbestellmenge: 2219
PMN55LN,135 PMN55LN,135 NXP USA Inc. PMN55LN.pdf Description: MOSFET N-CH 20V 4.1A 6TSOP
Produkt ist nicht verfügbar
FXPS7400DS4T1 NXP USA Inc. FXPS7400D4.pdf Description: 20-400 KPA BAP DIG SPI
Produkt ist nicht verfügbar
LPC1785FBD208,551 LPC1785FBD208,551 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 8761 Stücke:
Lieferzeit 10-14 Tag (e)
22+22.96 EUR
Mindestbestellmenge: 22
LPC1785FBD208557 LPC1785FBD208557 NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LPC2470FBD208,551 LPC2470FBD208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 15810 Stücke:
Lieferzeit 10-14 Tag (e)
22+22.96 EUR
Mindestbestellmenge: 22
LPC2939FBD208551 LPC2939FBD208551 NXP USA Inc. LPC2939.pdf Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54607J256BD208551 LPC54607J256BD208551 NXP USA Inc. PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LX2160SN71826B LX2160SN71826B NXP USA Inc. Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Produkt ist nicht verfügbar
BZX84-C18/LF1R BZX84-C18/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZX84-C18/LF1VL BZX84-C18/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Produkt ist nicht verfügbar
74ALVCH16244DL,118 74ALVCH16244DL,118 NXP USA Inc. PHGLS11539-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-SSOP
auf Bestellung 4819 Stücke:
Lieferzeit 10-14 Tag (e)
494+1.01 EUR
Mindestbestellmenge: 494
74ALVCH16244DL,112 74ALVCH16244DL,112 NXP USA Inc. PHGLS11539-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, ALVC/VCX/A SERIES, 4
auf Bestellung 1581 Stücke:
Lieferzeit 10-14 Tag (e)
74ALVCH16374DL,118 74ALVCH16374DL,118 NXP USA Inc. PHGLS25100-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE DUAL 8BIT 48SSOP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
466+1.09 EUR
Mindestbestellmenge: 466
74ALVC574D,112 74ALVC574D,112 NXP USA Inc. PHGLS14966-1.pdf?t.download=true&u=5oefqw Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 2790 Stücke:
Lieferzeit 10-14 Tag (e)
1135+0.46 EUR
Mindestbestellmenge: 1135
NX3L1T53GT,115 NX3L1T53GT,115 NXP USA Inc. NX3L1T53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
13+1.36 EUR
15+ 1.21 EUR
25+ 1.15 EUR
100+ 0.94 EUR
250+ 0.88 EUR
500+ 0.78 EUR
Mindestbestellmenge: 13
NX3V1G66GM,132 NX3V1G66GM,132 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NX3V1G384GM,132 NX3V1G384GM,132 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NX3V1G384GM,132 NX3V1G384GM,132 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 6211 Stücke:
Lieferzeit 10-14 Tag (e)
2219+0.23 EUR
Mindestbestellmenge: 2219
NX3V1G384GM,115 NX3V1G384GM,115 NXP USA Inc. NX3V1G384.pdf Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 14539 Stücke:
Lieferzeit 10-14 Tag (e)
2219+0.23 EUR
Mindestbestellmenge: 2219
NX3V1G66GM,115 NX3V1G66GM,115 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
74AUP1T45GS,132 74AUP1T45GS,132 NXP USA Inc. PHGLS25189-1.pdf?t.download=true&u=5oefqw Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
auf Bestellung 102450 Stücke:
Lieferzeit 10-14 Tag (e)
2671+0.19 EUR
Mindestbestellmenge: 2671
74HC574PW-Q100118 74HC574PW-Q100118 NXP USA Inc. 74HC_HCT574_Q100.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
FS32K148HAT0MLQT FS32K148HAT0MLQT NXP USA Inc. S32K-DS.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
BZX84-C4V3/LF1VL BZX84-C4V3/LF1VL NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.3V 250MW TO236AB
Produkt ist nicht verfügbar
BZX84-C4V3/LF1R BZX84-C4V3/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 4.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
XC68C812A4PVE5-NXP XC68C812A4PVE5-NXP NXP USA Inc. FSCLS02683-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16 BIT, EEPROM,
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
9+59.63 EUR
Mindestbestellmenge: 9
LS1027ASN7HNA NXP USA Inc. Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1017ASE7NQA NXP USA Inc. Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7HNA LS1018AXN7HNA NXP USA Inc. Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7KQA NXP USA Inc. Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7NQA NXP USA Inc. Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
MC17XS6500BEK MX07XS6,MC17XS6.pdf
MC17XS6500BEK
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:1 32HSOP
Produkt ist nicht verfügbar
74HCT00PW/S400118 PHGL-S-A0001295616-1.pdf?t.download=true&u=5oefqw
74HCT00PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12ns @ 4.5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
74HC259PW112 74HC_HCT259.pdf
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC259PW - D LATCH
Produkt ist nicht verfügbar
PEMI4QFN/HK,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/HK,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2959+0.16 EUR
Mindestbestellmenge: 2959
MAC7131MVF40 MAC7100EC.pdf
MAC7131MVF40
Hersteller: NXP USA Inc.
Description: IC MCU 32B 544KB FLASH 208MAPBGA
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+136.01 EUR
Mindestbestellmenge: 4
ASC8851AETE 75017379.pdf
ASC8851AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I²S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
EM773FHN33,551 EM773.pdf
EM773FHN33,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 5538 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
116+4.58 EUR
Mindestbestellmenge: 116
MMA3202KEG MMA3202KEG.pdf
MMA3202KEG
Hersteller: NXP USA Inc.
Description: ACCEL 112.5G/56.3G ANALOG 20SOIC
Produkt ist nicht verfügbar
NTSX2102GU8125 PHGLS27057-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: DUAL SUPPLY TRANSLATING TRANSCEI
Produkt ist nicht verfügbar
74HC132PW/S400118 PHGL-S-A0001367154-1.pdf?t.download=true&u=5oefqw
74HC132PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14TSSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 21ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
BAP70-04W,115 BAP70-04W.pdf
BAP70-04W,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 260MW SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Diode Type: PIN - 1 Pair Series Connection
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SC-70
Part Status: Obsolete
Current - Max: 100 mA
Power Dissipation (Max): 260 mW
auf Bestellung 999477 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1866+0.26 EUR
Mindestbestellmenge: 1866
BAP70AM,115 BAP70AM.pdf
BAP70AM,115
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 50V 300MW 6TSSOP
Produkt ist nicht verfügbar
BAP51LX,315 BAP51LX.pdf
BAP51LX,315
Hersteller: NXP USA Inc.
Description: RF DIODE PIN 60V 140MW SOD2
Packaging: Cut Tape (CT)
Package / Case: 2-XDFN
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: DFN1006D-2
Current - Max: 100 mA
Power Dissipation (Max): 140 mW
Produkt ist nicht verfügbar
MRF8P20165WHSR5 MRF8P20165WH.pdf
MRF8P20165WHSR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
MRF8P20165WHSR5 MRF8P20165WH.pdf
MRF8P20165WHSR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 65V 2.01GHZ NI780S4
Produkt ist nicht verfügbar
BAT54CM315 BAT54CM.pdf
BAT54CM315
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BAT54C - RECTIFIER
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: SOT-883
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 100 mA
Current - Reverse Leakage @ Vr: 2 µA @ 25 V
Produkt ist nicht verfügbar
PEMI2STD/CP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CP,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/18.5PF SMD
Produkt ist nicht verfügbar
MRF6VP2600HR5 MRF6VP2600HR6.pdf
MRF6VP2600HR5
Hersteller: NXP USA Inc.
Description: FET RF 2CH 110V 225MHZ NI-1230
Packaging: Bulk
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
auf Bestellung 446 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+607.24 EUR
74AHC377D,118 74AHC_AHCT377.pdf
74AHC377D,118
Hersteller: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
auf Bestellung 5523 Stücke:
Lieferzeit 10-14 Tag (e)
74AHC377D,112 74AHC_AHCT377.pdf
74AHC377D,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
auf Bestellung 1803 Stücke:
Lieferzeit 10-14 Tag (e)
74HC3GU04DC,125 74HC3GU04.pdf
74HC3GU04DC,125
Hersteller: NXP USA Inc.
Description: IC INVERTER 3CH 3-INP 8VSSOP
auf Bestellung 2780 Stücke:
Lieferzeit 10-14 Tag (e)
LX2162RC82029B
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Part Status: Active
Produkt ist nicht verfügbar
S9S08SG8E2CTJR MC9S08SG8.pdf
S9S08SG8E2CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 2765 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.93 EUR
10+ 5.41 EUR
100+ 4.43 EUR
500+ 4.34 EUR
1000+ 3.66 EUR
Mindestbestellmenge: 3
JN516X-EK005-120VZ JN516X.pdf
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK005-230VZ JN516X.pdf
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK006-120VZ JN516X.pdf
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-EK006-230VZ JN516X.pdf
Hersteller: NXP USA Inc.
Description: DEMO BOARD WIRELESS MCU
Produkt ist nicht verfügbar
JN516X-UG001Z
Hersteller: NXP USA Inc.
Description: UPGRADE KIT JN516X
Produkt ist nicht verfügbar
PMN34LN,135 PMN34LN.pdf
PMN34LN,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 5.7A 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.7A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 2.5A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 13.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 20 V
auf Bestellung 10173 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2219+0.23 EUR
Mindestbestellmenge: 2219
PMN55LN,135 PMN55LN.pdf
PMN55LN,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 4.1A 6TSOP
Produkt ist nicht verfügbar
FXPS7400DS4T1 FXPS7400D4.pdf
Hersteller: NXP USA Inc.
Description: 20-400 KPA BAP DIG SPI
Produkt ist nicht verfügbar
LPC1785FBD208,551 LPC178X_7X.pdf
LPC1785FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 165
DigiKey Programmable: Not Verified
auf Bestellung 8761 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
22+22.96 EUR
Mindestbestellmenge: 22
LPC1785FBD208557 LPC178X_7X.pdf
LPC1785FBD208557
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LPC2470FBD208,551 LPC2470.pdf
LPC2470FBD208,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 15810 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
22+22.96 EUR
Mindestbestellmenge: 22
LPC2939FBD208551 LPC2939.pdf
LPC2939FBD208551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC54607J256BD208551 PHGL-S-A0006515862-1.pdf?t.download=true&u=5oefqw
LPC54607J256BD208551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LX2160SN71826B
LX2160SN71826B
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ 1.8GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Produkt ist nicht verfügbar
BZX84-C18/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C18/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
BZX84-C18/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C18/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 18V 250MW TO236AB
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
Produkt ist nicht verfügbar
74ALVCH16244DL,118 PHGLS11539-1.pdf?t.download=true&u=5oefqw
74ALVCH16244DL,118
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 48SSOP
Packaging: Bulk
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 48-SSOP
auf Bestellung 4819 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
494+1.01 EUR
Mindestbestellmenge: 494
74ALVCH16244DL,112 PHGLS11539-1.pdf?t.download=true&u=5oefqw
74ALVCH16244DL,112
Hersteller: NXP USA Inc.
Description: BUS DRIVER, ALVC/VCX/A SERIES, 4
auf Bestellung 1581 Stücke:
Lieferzeit 10-14 Tag (e)
74ALVCH16374DL,118 PHGLS25100-1.pdf?t.download=true&u=5oefqw
74ALVCH16374DL,118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 8BIT 48SSOP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
466+1.09 EUR
Mindestbestellmenge: 466
74ALVC574D,112 PHGLS14966-1.pdf?t.download=true&u=5oefqw
74ALVC574D,112
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 300 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 3.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 2790 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1135+0.46 EUR
Mindestbestellmenge: 1135
NX3L1T53GT,115 NX3L1T53.pdf
NX3L1T53GT,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 579 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+1.36 EUR
15+ 1.21 EUR
25+ 1.15 EUR
100+ 0.94 EUR
250+ 0.88 EUR
500+ 0.78 EUR
Mindestbestellmenge: 13
NX3V1G66GM,132 NX3V1G66.pdf
NX3V1G66GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NX3V1G384GM,132 NX3V1G384.pdf
NX3V1G384GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NX3V1G384GM,132 NX3V1G384.pdf
NX3V1G384GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 6211 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2219+0.23 EUR
Mindestbestellmenge: 2219
NX3V1G384GM,115 NX3V1G384.pdf
NX3V1G384GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NCX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NC
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 26ns, 10ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
auf Bestellung 14539 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2219+0.23 EUR
Mindestbestellmenge: 2219
NX3V1G66GM,115 NX3V1G66.pdf
NX3V1G66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
74AUP1T45GS,132 PHGLS25189-1.pdf?t.download=true&u=5oefqw
74AUP1T45GS,132
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.1V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Part Status: Active
auf Bestellung 102450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2671+0.19 EUR
Mindestbestellmenge: 2671
74HC574PW-Q100118 74HC_HCT574_Q100.pdf
74HC574PW-Q100118
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Part Status: Active
Number of Bits per Element: 8
Produkt ist nicht verfügbar
FS32K148HAT0MLQT S32K-DS.pdf
FS32K148HAT0MLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
BZX84-C4V3/LF1VL PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V3/LF1VL
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
Produkt ist nicht verfügbar
BZX84-C4V3/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C4V3/LF1R
Hersteller: NXP USA Inc.
Description: DIODE ZENER 4.3V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 4.3 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
XC68C812A4PVE5-NXP FSCLS02683-1.pdf?t.download=true&u=5oefqw
XC68C812A4PVE5-NXP
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 16 BIT, EEPROM,
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+59.63 EUR
Mindestbestellmenge: 9
LS1027ASN7HNA
Hersteller: NXP USA Inc.
Description: LS1027A-800 ST NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1017ASE7NQA
Hersteller: NXP USA Inc.
Description: LS1017A-1300 ST SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7HNA
LS1018AXN7HNA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 800MHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7KQA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ LAYER 1GHZ 448FBGA
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
LS1018AXN7NQA
Hersteller: NXP USA Inc.
Description: LS1018A-1300 XT NO SEC
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.3GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
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