Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 436 nach 584
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74ABT573AD,118 | NXP USA Inc. |
 Description: IC D-TYPE TRANSP SGL 8:8 20SOPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 3.3ns Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 1665 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT573AD,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 3.3ns Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 3252 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F153D,623 | NXP USA Inc. |
Description: IC MULTIPLEXER 2 X 4:1 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 2 x 4:1 Type: Multiplexer Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 1mA, 20mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO Part Status: Obsolete |
auf Bestellung 2672 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3311DP,118 | NXP USA Inc. |
Description: IC TRANSLATOR UNIDIR 8TSSOP Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: Differential Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 800Mbps Supplier Device Package: 8-TSSOP Channel Type: Unidirectional Output Signal: LVDS Translator Type: Mixed Signal Channels per Circuit: 1 Input Signal: PECL Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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DSP56311VL150R2 | NXP USA Inc. |
Description: IC DSP 24BIT 150MHZ 196-MAPBGA |
Produkt ist nicht verfügbar |
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74LVC377D,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SO Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 3.6V Current - Quiescent (Iq): 10 µA Current - Output High, Low: 24mA, 24mA Trigger Type: Positive Edge Clock Frequency: 330 MHz Input Capacitance: 5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF Part Status: Active Number of Bits per Element: 8 |
auf Bestellung 5500 Stücke: Lieferzeit 10-14 Tag (e) |
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| PTN3944EVM-KIT | NXP USA Inc. |
Description: PTN3944 EVALUATION BOARD Packaging: Box Function: Equalizer Type: Interface Utilized IC / Part: PTN3944 Supplied Contents: Board(s) Embedded: No Part Status: Active |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM13501UL | NXP USA Inc. |
Description: PCA8538 LCD DEMO BOARD Packaging: Bulk Function: LCD Controller Type: Display Utilized IC / Part: PCA8538 Supplied Contents: Board(s) Embedded: Yes, MCU, 32-Bit Part Status: Obsolete |
Produkt ist nicht verfügbar |
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NCX2222GUX | NXP USA Inc. |
Description: IC COMPARATOR 2 GEN PUR 8DFN Packaging: Cut Tape (CT) Package / Case: 8-XFDFN Exposed Pad Output Type: Open-Drain Mounting Type: Surface Mount Number of Elements: 2 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: DFN1714-8 Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 5µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): 68mA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 9mV Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MF1PH2101DA6/02J | NXP USA Inc. | Description: MIFAREA PLUS EV1 |
Produkt ist nicht verfügbar |
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| MF1PH2101DUD/01V | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ WAFER |
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| MF1PH2101DA4/01J | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ PLLMC |
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| MF1PH2101DUF/02V | NXP USA Inc. | Description: MIFAREA PLUS EV1 |
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| MF1PH2101DA6/01J | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ PLLMC |
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| MF1PH2101DA4/02J | NXP USA Inc. | Description: MIFAREA PLUS EV1 |
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| MF1PH2101DUF/01V | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ WAFER |
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| MF1PH2101DUD/02V | NXP USA Inc. |
Description: MIFARE PLUS EV1 |
Produkt ist nicht verfügbar |
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S9S08DN32F2CLH | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 64LQFP |
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S9S08DN32F2CLHR | NXP USA Inc. | Description: IC MCU 8BIT 32KB FLASH 64LQFP |
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TJF1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
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TJF1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active |
auf Bestellung 2618 Stücke: Lieferzeit 10-14 Tag (e) |
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TJR1443ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14HVSON Packaging: Tape & Reel (TR) Package / Case: 14-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-HVSON (3x4.5) Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJR1441BT/0Z | NXP USA Inc. |
Description: IC CAN BASIC TXRX SO8 Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active |
Produkt ist nicht verfügbar |
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TJR1442BT/0Z | NXP USA Inc. |
Description: IC CAN STANDBY TXRX SO8 |
Produkt ist nicht verfügbar |
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TJR1442AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJR1441AT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJR1441DT/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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BZX84-C9V1/LF1R | NXP USA Inc. |
Description: DIODE ZENER 9.1V 250MW TO236AB Tolerance: ±5% Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 15 Ohms Supplier Device Package: SOT-23 (TO-236AB) Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 500 nA @ 6 V |
Produkt ist nicht verfügbar |
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S912XEG128W1MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Cut Tape (CT) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Part Status: Active Number of I/O: 59 DigiKey Programmable: Not Verified |
auf Bestellung 750 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6U5EVM10ACR | NXP USA Inc. |
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA Packaging: Cut Tape (CT) Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Part Status: Active Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
auf Bestellung 500 Stücke: Lieferzeit 10-14 Tag (e) |
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| PBLS4005Y115 | NXP USA Inc. |
Description: NOW NEXPERIA PBLS4005Y - SMALL S Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 300mW Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 40V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V Frequency - Transition: 300MHz Resistor - Base (R1): 47kOhms Resistor - Emitter Base (R2): 47kOhms Supplier Device Package: 6-TSSOP |
Produkt ist nicht verfügbar |
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PEMI6QFN/CM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/16PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 12dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1049TK/1Z | NXP USA Inc. |
Description: IC TXRX HS-CAN HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
Produkt ist nicht verfügbar |
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TJA1049TK/3/1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 8-HVSON (3x3) |
Produkt ist nicht verfügbar |
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74AUP1G07GX/S500125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SON |
auf Bestellung 794428 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1G07GF/S500132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-XSON (1x1) Part Status: Active |
auf Bestellung 568668 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G07GM/S505125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: -, 32mA Supplier Device Package: 6-XSON (1.45x1) Part Status: Active |
auf Bestellung 6759 Stücke: Lieferzeit 10-14 Tag (e) |
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K32W041Y | NXP USA Inc. |
Description: K32W041 BLE/ZIGBEE SOC Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0, Thread, Zigbee® Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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SP5748CSK0AMMJ6R | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA |
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SPC5748CSK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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FS32K146HRT0VLHT | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP |
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FS32K146HRT0VLHR | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 24x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
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| P60D080MX1C/9C980J | NXP USA Inc. | Description: P60D080MX1C/9C980J |
Produkt ist nicht verfügbar |
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K32WA-001-T10 | NXP USA Inc. |
Description: K32W041A UPGRADE BOARD Packaging: Bulk For Use With/Related Products: K32W041A Frequency: 2.4GHz Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5 Supplied Contents: Board(s) |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S12G48F0CLFR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SSL1750T/N1,518 | NXP USA Inc. |
Description: IC LED DRIVER OFFL SWITCHER 16SO Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 125kHz Type: AC DC Offline Switcher Operating Temperature: -20°C ~ 150°C (TJ) Applications: Lighting Internal Switch(s): No Topology: Flyback Supplier Device Package: 16-SO Voltage - Supply (Min): 70V Voltage - Supply (Max): 276V Part Status: Obsolete |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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DSP56321VF200 | NXP USA Inc. |
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT Packaging: Bulk Package / Case: 196-BGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 100°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Clock Rate: 200MHz Supplier Device Package: 196-MAPBGA (15x15) Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF5485CZP200 | NXP USA Inc. |
Description: RISC MICROPROCESSOR, 32-BIT, COL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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BZX84-A33,215 | NXP USA Inc. |
Description: DIODE ZENER 33V 250MW TO236AB Tolerance: ±1% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 33 V Impedance (Max) (Zzt): 80 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 700 mV Qualification: AEC-Q101 |
auf Bestellung 5820 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTA114YU | NXP USA Inc. |
Description: PDTA114Y SERIES - PNP RESISTOR-E Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| 74LVC1G07GW/C4125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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PEMI6QFN/LM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/16PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 65Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 65 ESD Protection: Yes Number of Channels: 6 |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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| P5010NXN7TNB557 | NXP USA Inc. |
Description: QORIQ RISC MICROPROCESSOR 64 BI Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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B4860NXN7QUMD | NXP USA Inc. |
Description: B4860 - QORIQ QONVERGE SOC, 6X1. Packaging: Bulk Part Status: Active |
auf Bestellung 112 Stücke: Lieferzeit 10-14 Tag (e) |
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| LS1043AXN7KQB | NXP USA Inc. |
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM Packaging: Bulk Part Status: Active |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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TJR1442ATK/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 50 mV Duplex: Half |
Produkt ist nicht verfügbar |
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PEMI4QFN/WK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 200 OHM/13.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 200Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 24dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 200 ESD Protection: Yes Part Status: Obsolete Number of Channels: 4 |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33PF8200DEES | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QXP Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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S912XES384J3VAA | NXP USA Inc. | Description: IC MCU 16BIT 384KB FLASH 80QFP |
Produkt ist nicht verfügbar |
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MCHSC705C8ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 40DIP Packaging: Bulk Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| 74ABT573AD,118 |
|
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 1665 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1665+ | 0.34 EUR |
| 74ABT573AD,112 |
|
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 3252 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1402+ | 0.34 EUR |
| N74F153D,623 |
|
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: IC MULTIPLEXER 2 X 4:1 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Multiplexer
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 1mA, 20mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Part Status: Obsolete
auf Bestellung 2672 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1665+ | 0.29 EUR |
| PTN3311DP,118 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 800Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Unidirectional
Output Signal: LVDS
Translator Type: Mixed Signal
Channels per Circuit: 1
Input Signal: PECL
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| DSP56311VL150R2 |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Description: IC DSP 24BIT 150MHZ 196-MAPBGA
Produkt ist nicht verfügbar
| 74LVC377D,118 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 330 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Current - Quiescent (Iq): 10 µA
Current - Output High, Low: 24mA, 24mA
Trigger Type: Positive Edge
Clock Frequency: 330 MHz
Input Capacitance: 5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 7.6ns @ 3.3V, 50pF
Part Status: Active
Number of Bits per Element: 8
auf Bestellung 5500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 928+ | 0.53 EUR |
| PTN3944EVM-KIT |
|
Hersteller: NXP USA Inc.
Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
Description: PTN3944 EVALUATION BOARD
Packaging: Box
Function: Equalizer
Type: Interface
Utilized IC / Part: PTN3944
Supplied Contents: Board(s)
Embedded: No
Part Status: Active
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 974.9 EUR |
| OM13501UL |
|
Hersteller: NXP USA Inc.
Description: PCA8538 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8538
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Description: PCA8538 LCD DEMO BOARD
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCA8538
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Obsolete
Produkt ist nicht verfügbar
| NCX2222GUX |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
| MF1PH2101DUD/01V |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
| MF1PH2101DA4/01J |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
| MF1PH2101DA6/01J |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ PLLMC
Description: IC RFID TRANSP 13.56MHZ PLLMC
Produkt ist nicht verfügbar
| MF1PH2101DUF/01V |
|
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Description: IC RFID TRANSP 13.56MHZ WAFER
Produkt ist nicht verfügbar
| S9S08DN32F2CLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
| S9S08DN32F2CLHR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Produkt ist nicht verfügbar
| TJF1441AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
| TJF1441AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
auf Bestellung 2618 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 2.76 EUR |
| 10+ | 2.48 EUR |
| 25+ | 2.34 EUR |
| 100+ | 1.99 EUR |
| 250+ | 1.87 EUR |
| 500+ | 1.64 EUR |
| 1000+ | 1.36 EUR |
| TJR1443ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJR1441BT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC CAN BASIC TXRX SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Description: IC CAN BASIC TXRX SO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Produkt ist nicht verfügbar
| TJR1442BT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC CAN STANDBY TXRX SO8
Description: IC CAN STANDBY TXRX SO8
Produkt ist nicht verfügbar
| TJR1442AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJR1441AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TJR1441DT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| BZX84-C9V1/LF1R |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Description: DIODE ZENER 9.1V 250MW TO236AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 500 nA @ 6 V
Produkt ist nicht verfügbar
| S912XEG128W1MAAR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Cut Tape (CT)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 32.4 EUR |
| 10+ | 25.89 EUR |
| 100+ | 21.87 EUR |
| MCIMX6U5EVM10ACR |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1.0GHZ 624MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Part Status: Active
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 89.71 EUR |
| 10+ | 72.77 EUR |
| 100+ | 63.18 EUR |
| PBLS4005Y115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PBLS4005Y - SMALL S
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Description: NOW NEXPERIA PBLS4005Y - SMALL S
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: 6-TSSOP
Produkt ist nicht verfügbar
| PEMI6QFN/CM,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1902+ | 0.26 EUR |
| TJA1049TK/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC TXRX HS-CAN HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
| TJA1049TK/3/1Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 8-HVSON (3x3)
Produkt ist nicht verfügbar
| 74AUP1G07GX/S500125 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
auf Bestellung 794428 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4236+ | 0.12 EUR |
| 74AUP1G07GF/S500132 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (1x1)
Part Status: Active
auf Bestellung 568668 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3781+ | 0.13 EUR |
| 74LVC1G07GM/S505125 |
|
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 6-XSON (1.45x1)
Part Status: Active
auf Bestellung 6759 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5323+ | 0.096 EUR |
| K32W041Y |
|
Hersteller: NXP USA Inc.
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: K32W041 BLE/ZIGBEE SOC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0, Thread, Zigbee®
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4000+ | 6.79 EUR |
| SP5748CSK0AMMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Produkt ist nicht verfügbar
| SPC5748CSK0AMMJ6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| FS32K146HRT0VLHT |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Produkt ist nicht verfügbar
| FS32K146HRT0VLHR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| P60D080MX1C/9C980J |
Hersteller: NXP USA Inc.
Description: P60D080MX1C/9C980J
Description: P60D080MX1C/9C980J
Produkt ist nicht verfügbar
| K32WA-001-T10 |
Hersteller: NXP USA Inc.
Description: K32W041A UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5
Supplied Contents: Board(s)
Description: K32W041A UPGRADE BOARD
Packaging: Bulk
For Use With/Related Products: K32W041A
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5
Supplied Contents: Board(s)
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 62.37 EUR |
| S9S12G48F0CLFR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SSL1750T/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 125kHz
Type: AC DC Offline Switcher
Operating Temperature: -20°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 70V
Voltage - Supply (Max): 276V
Part Status: Obsolete
Description: IC LED DRIVER OFFL SWITCHER 16SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 125kHz
Type: AC DC Offline Switcher
Operating Temperature: -20°C ~ 150°C (TJ)
Applications: Lighting
Internal Switch(s): No
Topology: Flyback
Supplier Device Package: 16-SO
Voltage - Supply (Min): 70V
Voltage - Supply (Max): 276V
Part Status: Obsolete
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 151+ | 3.25 EUR |
| DSP56321VF200 |
|
Hersteller: NXP USA Inc.
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT
Packaging: Bulk
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
Description: DIGITAL SIGNAL PROCESSOR, 24-EXT
Packaging: Bulk
Package / Case: 196-BGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 200MHz
Supplier Device Package: 196-MAPBGA (15x15)
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 197.93 EUR |
| MCF5485CZP200 |
|
Hersteller: NXP USA Inc.
Description: RISC MICROPROCESSOR, 32-BIT, COL
Packaging: Bulk
Part Status: Active
Description: RISC MICROPROCESSOR, 32-BIT, COL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BZX84-A33,215 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER 33V 250MW TO236AB
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
Description: DIODE ZENER 33V 250MW TO236AB
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 33 V
Impedance (Max) (Zzt): 80 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
auf Bestellung 5820 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2681+ | 0.18 EUR |
| PDTA114YU |
|
Hersteller: NXP USA Inc.
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Description: PDTA114Y SERIES - PNP RESISTOR-E
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74LVC1G07GW/C4125 |
|
Produkt ist nicht verfügbar
| PEMI6QFN/LM,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 65 OHM/16PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 6
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1902+ | 0.26 EUR |
| P5010NXN7TNB557 |
|
Hersteller: NXP USA Inc.
Description: QORIQ RISC MICROPROCESSOR 64 BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: QORIQ RISC MICROPROCESSOR 64 BI
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 848.04 EUR |
| B4860NXN7QUMD |
|
Hersteller: NXP USA Inc.
Description: B4860 - QORIQ QONVERGE SOC, 6X1.
Packaging: Bulk
Part Status: Active
Description: B4860 - QORIQ QONVERGE SOC, 6X1.
Packaging: Bulk
Part Status: Active
auf Bestellung 112 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1154.31 EUR |
| LS1043AXN7KQB |
|
Hersteller: NXP USA Inc.
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM
Packaging: Bulk
Part Status: Active
Description: LS1043 - QORIQ, 4XCPU 64-BIT ARM
Packaging: Bulk
Part Status: Active
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 133.46 EUR |
| TJR1442ATK/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 50 mV
Duplex: Half
Produkt ist nicht verfügbar
| PEMI4QFN/WK,132 |
|
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
Description: FILTER RC(PI) 200 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 24dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 4
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.16 EUR |
| MC33PF8200DEES |
|
Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT I.MX8QXP
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
| S912XES384J3VAA |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Description: IC MCU 16BIT 384KB FLASH 80QFP
Produkt ist nicht verfügbar
| MCHSC705C8ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Bulk
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 40DIP
Packaging: Bulk
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar