Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35030) > Seite 435 nach 584
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LD6806TD/28P,125 | NXP USA Inc. |
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auf Bestellung 3869 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6815TD/30P,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 3V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 48983 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1043AXE8QQB,557 | NXP USA Inc. |
Description: QORIQ LAYERSCAPE, ARM CORTEX A53 Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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LS1023AXN8KQB557 | NXP USA Inc. |
Description: LS1023A - QORIQ LAYERSCAPE, ARM Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Supplier Device Package: 780-FCPBGA (23x23) Speed: 1GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: ARM TZ, Boot Security SATA: SATA 6Gbps (1) Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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LS1043AXE7QQB557 | NXP USA Inc. |
Description: LS1043A - QORIQ LAYERSCAPE, ARM Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Supplier Device Package: 621-FCBGA (21x21) Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1) USB: USB 3.0 + PHY (3) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: ARM TZ, Boot Security SATA: SATA 6Gbps (1) Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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LS1023ASN7MNLB557 | NXP USA Inc. |
Description: LS1023A - QORIQ LAYERSCAPE, ARM Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Supplier Device Package: 621-FCBGA (21x21) Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: ARM TZ, Boot Security SATA: SATA 6Gbps (1) Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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LS1043ASN8QQB557 | NXP USA Inc. |
Description: LS1043A - QORIQ LAYERSCAPE, ARM Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1020ASN7HNB557 | NXP USA Inc. |
Description: LS1020A - QORIQ LAYERSCAPE, ARM Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LS1026ASE8Q1A | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 780-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A72 Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Part Status: Active |
Produkt ist nicht verfügbar |
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TJA1124CHG/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Receiver Hysteresis: 200 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1124CHG/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBaud Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Receiver Hysteresis: 200 mV Duplex: Full Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 5830 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI8QFN/CE,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 8.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 7dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH32CTG,574 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 13 |
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MC9S08SH32CTLR,518 | NXP USA Inc. |
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XC7SH32GW,125 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PX1011B-EL1/Q900551 | NXP USA Inc. |
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auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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MWCT1015SFVMHN | NXP USA Inc. | Description: WCT1015 100BGA |
Produkt ist nicht verfügbar |
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74HC40103PW | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-TSSOP Part Status: Active Voltage - Supply: 2 V ~ 6 V Count Rate: 32 MHz Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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PTVS22VZ1USKYL | NXP USA Inc. |
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auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DN16F2CLF | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 25 |
auf Bestellung 2888 Stücke: Lieferzeit 10-14 Tag (e) |
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NVT4858HKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-XFQFN Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-XQFN (1.8x2.6) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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NVT4858HKZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 104Mbps Supplier Device Package: 16-XQFN (1.8x2.6) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 6 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Part Status: Active Number of Circuits: 1 |
auf Bestellung 234 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G53GS,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 8-XSON (1.35x1) Voltage - Supply, Single (V+): 1.65V ~ 5.5V Charge Injection: 7.5pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns Channel Capacitance (CS(off), CD(off)): 6pF Current - Leakage (IS(off)) (Max): 5µA Part Status: Active Number of Circuits: 1 |
auf Bestellung 89685 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9544AD | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PCA9544AWP112 | NXP USA Inc. | Description: IC I2C MUX 4CH 20-TSSOP |
Produkt ist nicht verfügbar |
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PCA9544AD,118 | NXP USA Inc. |
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auf Bestellung 414 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9547D,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V Applications: Translating Multiplexer Supplier Device Package: 24-SO Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9547D,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V Applications: Translating Multiplexer Supplier Device Package: 24-SO Part Status: Active |
auf Bestellung 4704 Stücke: Lieferzeit 10-14 Tag (e) |
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TJR1443AT/0Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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TJR1443AT/0Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 175°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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S9KEAZN16AMLCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9KEAZN16AMLCR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1G126GN,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON (0.9x1) Part Status: Active |
auf Bestellung 150000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AHC1G126GM115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 8mA, 8mA Supplier Device Package: 6-XSON, SOT886 (1.45x1) Part Status: Active |
Produkt ist nicht verfügbar |
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74AUP1G125GW-Q100125 | NXP USA Inc. |
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auf Bestellung 101497 Stücke: Lieferzeit 10-14 Tag (e) |
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74ALVC245PW118 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TDF8548J/N1,112 | NXP USA Inc. |
![]() Features: Depop, Short-Circuit and Thermal Protection Packaging: Tray Package / Case: 27-SIP, Formed Leads Output Type: 4-Channel (Quad) Mounting Type: Through Hole Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm Supplier Device Package: DBS27P Part Status: Obsolete |
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SPC5745BK1AVMH2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5745BK1AVMH2R | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA Packaging: Tape & Reel (TR) Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 100-MAPBGA (11x11) Part Status: Active Number of I/O: 65 DigiKey Programmable: Not Verified |
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PCA9554BBSHP | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: POR Package / Case: 16-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.65V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 16-HVQFN (3x3) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5604SF2CLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 16x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 105 |
Produkt ist nicht verfügbar |
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GPS1503MC | NXP USA Inc. | Description: MMIC LNA GPS SMD |
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BGU8103UK/SZ | NXP USA Inc. |
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GPS1503MCZ | NXP USA Inc. | Description: MMIC LNA GPS SMD |
Produkt ist nicht verfügbar |
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BGU6005/N2X | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 17dB ~ 17.5dB Current - Supply: 5.2mA Noise Figure: 0.85dB Test Frequency: 1.559GHz ~ 1.61GHz Supplier Device Package: 6-XSON, SOT886 (1.45x1) Part Status: Active |
auf Bestellung 12653 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU8019X115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 1.559GHz ~ 1.61GHz RF Type: Galileo, GLONASS, GPS Voltage - Supply: 1.5V ~ 3.1V Gain: 18.5dB Current - Supply: 4.6mA Noise Figure: 0.55dB P1dB: -7dBm Test Frequency: 1.575GHz Supplier Device Package: 6-XSON (1.1x0.7) Part Status: Active |
auf Bestellung 3181 Stücke: Lieferzeit 10-14 Tag (e) |
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MVR5510AMBAHES | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-B Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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MVR5510AMBAHESR2 | NXP USA Inc. |
Description: IC PMIC VR5510 ASIL-B Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Automotive Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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LPC1125JBD48/303EL | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 1787 Stücke: Lieferzeit 10-14 Tag (e) |
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KITPF8201FRDMEVM | NXP USA Inc. |
![]() Packaging: Bulk Type: Power Management Utilized IC / Part: PF8201 Supplied Contents: Board(s) |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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TDF19971BHN/C1,551 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDF19971BHN/C1,518 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TDF19971BHN/C1,557 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC34PF8100A0EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) Part Status: Active |
Produkt ist nicht verfügbar |
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AFM907NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Power - Output: 8.4W Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Part Status: Active Voltage - Rated: 30 V Voltage - Test: 10.8 V Current - Test: 100 mA |
Produkt ist nicht verfügbar |
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AFM907NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Power - Output: 8.4W Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Part Status: Active Voltage - Rated: 30 V Voltage - Test: 10.8 V Current - Test: 100 mA |
auf Bestellung 449 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QD2CSCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SC16C652BIB48,157 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 32 Byte Data Rate (Max): 5Mbps Supplier Device Package: 48-LQFP (7x7) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Obsolete |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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SC16C652BIB48,151 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 32 Byte Data Rate (Max): 5Mbps Supplier Device Package: 48-LQFP (7x7) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Obsolete |
auf Bestellung 1450 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT573AD,118 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 3.3ns Supplier Device Package: 20-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
LD6806TD/28P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.8V 200MA 5TSOP
Description: IC REG LINEAR 2.8V 200MA 5TSOP
auf Bestellung 3869 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3869+ | 0.16 EUR |
LD6815TD/30P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LINEAR 3V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 48983 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3328+ | 0.15 EUR |
LS1043AXE8QQB,557 |
Hersteller: NXP USA Inc.
Description: QORIQ LAYERSCAPE, ARM CORTEX A53
Packaging: Tray
Part Status: Active
Description: QORIQ LAYERSCAPE, ARM CORTEX A53
Packaging: Tray
Part Status: Active
Produkt ist nicht verfügbar
LS1023AXN8KQB557 |
Hersteller: NXP USA Inc.
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 780-FCPBGA (23x23)
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 780-FCPBGA (23x23)
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Produkt ist nicht verfügbar
LS1043AXE7QQB557 |
Hersteller: NXP USA Inc.
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 621-FCBGA (21x21)
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 621-FCBGA (21x21)
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Produkt ist nicht verfügbar
LS1023ASN7MNLB557 |
Hersteller: NXP USA Inc.
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 621-FCBGA (21x21)
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Description: LS1023A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Supplier Device Package: 621-FCBGA (21x21)
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Ethernet: 1Gbps (5), 1/2.5Gbps (1), 1/2.5/10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Produkt ist nicht verfügbar
LS1043ASN8QQB557 |
Hersteller: NXP USA Inc.
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LS1043A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS1020ASN7HNB557 |
Hersteller: NXP USA Inc.
Description: LS1020A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: LS1020A - QORIQ LAYERSCAPE, ARM
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LS1026ASE8Q1A |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Description: IC MPU QORIQ 1.6GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Part Status: Active
Produkt ist nicht verfügbar
TJA1124CHG/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 2.64 EUR |
TJA1124CHG/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Receiver Hysteresis: 200 mV
Duplex: Full
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5830 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.26 EUR |
10+ | 4.72 EUR |
25+ | 4.46 EUR |
100+ | 3.87 EUR |
250+ | 3.67 EUR |
500+ | 3.29 EUR |
1000+ | 2.78 EUR |
PEMI8QFN/CE,132 |
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Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Description: FILTER RC(PI) 20 OHM/8.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 8.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1567+ | 0.31 EUR |
MC9S08SH32CTG,574 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
Description: IC MCU 8BIT 32KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 13
Produkt ist nicht verfügbar
MC9S08SH32CTLR,518 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Produkt ist nicht verfügbar
XC7SH32GW,125 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA XC7SH32GW - OR GATE
Description: NOW NEXPERIA XC7SH32GW - OR GATE
Produkt ist nicht verfügbar
PX1011B-EL1/Q900551 |
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Hersteller: NXP USA Inc.
Description: PCI EXPRESS STAND-ALONE X1 PHY
Description: PCI EXPRESS STAND-ALONE X1 PHY
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)74HC40103PW |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC40103PW - BINAR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Description: NOW NEXPERIA 74HC40103PW - BINAR
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Part Status: Active
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Produkt ist nicht verfügbar
PTVS22VZ1USKYL |
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Hersteller: NXP USA Inc.
Description: DIODES NOT PHOTOSENSITIVE/LED
Description: DIODES NOT PHOTOSENSITIVE/LED
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)S9S08DN16F2CLF |
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Hersteller: NXP USA Inc.
Description: 8-BIT MCU, S08 CORE, 16KB FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
Description: 8-BIT MCU, S08 CORE, 16KB FLASH,
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 25
auf Bestellung 2888 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
53+ | 9.34 EUR |
NVT4858HKZ |
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Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 16XQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NVT4858HKZ |
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Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 104Mbps
Supplier Device Package: 16-XQFN (1.8x2.6)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 6
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Part Status: Active
Number of Circuits: 1
auf Bestellung 234 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
9+ | 1.97 EUR |
10+ | 1.76 EUR |
25+ | 1.67 EUR |
100+ | 1.37 EUR |
74LVC1G53GS,115 |
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Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Part Status: Active
Number of Circuits: 1
auf Bestellung 89685 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2455+ | 0.19 EUR |
PCA9544AWP112 |
Hersteller: NXP USA Inc.
Description: IC I2C MUX 4CH 20-TSSOP
Description: IC I2C MUX 4CH 20-TSSOP
Produkt ist nicht verfügbar
PCA9544AD,118 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SO
Description: IC INTERFACE SPECIALIZED 20SO
auf Bestellung 414 Stücke:
Lieferzeit 10-14 Tag (e)PCA9547D,118 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 2 EUR |
2000+ | 1.86 EUR |
PCA9547D,118 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
Description: IC INTERFACE SPECIALIZED 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Multiplexer
Supplier Device Package: 24-SO
Part Status: Active
auf Bestellung 4704 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 4.07 EUR |
10+ | 3.66 EUR |
25+ | 3.45 EUR |
100+ | 2.94 EUR |
250+ | 2.76 EUR |
500+ | 2.42 EUR |
TJR1443AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJR1443AT/0Z |
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Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Produkt ist nicht verfügbar
S9KEAZN16AMLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9KEAZN16AMLCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
163+ | 3.24 EUR |
74AUP1G126GN,132 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 150000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2137+ | 0.25 EUR |
74AHC1G126GM115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AHC1G126GM - BUS
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Description: NOW NEXPERIA 74AHC1G126GM - BUS
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Produkt ist nicht verfügbar
74AUP1G125GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5TSSOP
Description: IC BUFFER NON-INVERT 3.6V 5TSSOP
auf Bestellung 101497 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4243+ | 0.11 EUR |
74ALVC245PW118 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA 74ALVC245PW BUS TRA
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TDF8548J/N1,112 |
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Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Description: IC AMP CLASS AB QUAD 28W DBS27P
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tray
Package / Case: 27-SIP, Formed Leads
Output Type: 4-Channel (Quad)
Mounting Type: Through Hole
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 28W x 4 @ 4Ohm
Supplier Device Package: DBS27P
Part Status: Obsolete
Produkt ist nicht verfügbar
SPC5745BK1AVMH2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5745BK1AVMH2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 100MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9554BBSHP |
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Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5604SF2CLQ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 105
Produkt ist nicht verfügbar
BGU6005/N2X |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 17dB ~ 17.5dB
Current - Supply: 5.2mA
Noise Figure: 0.85dB
Test Frequency: 1.559GHz ~ 1.61GHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Part Status: Active
auf Bestellung 12653 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
48+ | 0.37 EUR |
54+ | 0.33 EUR |
59+ | 0.3 EUR |
100+ | 0.26 EUR |
250+ | 0.23 EUR |
500+ | 0.2 EUR |
1000+ | 0.16 EUR |
BGU8019X115 |
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Hersteller: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.559GHz ~ 1.61GHz
RF Type: Galileo, GLONASS, GPS
Voltage - Supply: 1.5V ~ 3.1V
Gain: 18.5dB
Current - Supply: 4.6mA
Noise Figure: 0.55dB
P1dB: -7dBm
Test Frequency: 1.575GHz
Supplier Device Package: 6-XSON (1.1x0.7)
Part Status: Active
auf Bestellung 3181 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2144+ | 0.25 EUR |
MVR5510AMBAHES |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC PMIC VR5510 ASIL-B
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
MVR5510AMBAHESR2 |
Hersteller: NXP USA Inc.
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC PMIC VR5510 ASIL-B
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Automotive
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
LPC1125JBD48/303EL |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 1787 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.28 EUR |
10+ | 7.25 EUR |
80+ | 5.94 EUR |
500+ | 5.81 EUR |
1000+ | 4.9 EUR |
KITPF8201FRDMEVM |
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Hersteller: NXP USA Inc.
Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
Description: FRDM EXPANSION BOARD PF8201
Packaging: Bulk
Type: Power Management
Utilized IC / Part: PF8201
Supplied Contents: Board(s)
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 701.41 EUR |
TDF19971BHN/C1,551 |
Produkt ist nicht verfügbar
TDF19971BHN/C1,518 |
Produkt ist nicht verfügbar
TDF19971BHN/C1,557 |
Produkt ist nicht verfügbar
MC34PF8100A0EP |
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Hersteller: NXP USA Inc.
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Description: IC POWER MANAGEMENT
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Part Status: Active
Produkt ist nicht verfügbar
AFM907NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
AFM907NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 10.8V 16DFN
Packaging: Cut Tape (CT)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Power - Output: 8.4W
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Part Status: Active
Voltage - Rated: 30 V
Voltage - Test: 10.8 V
Current - Test: 100 mA
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.23 EUR |
10+ | 4.69 EUR |
25+ | 4.43 EUR |
100+ | 3.84 EUR |
250+ | 3.64 EUR |
MC9S08QD2CSCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SC16C652BIB48,157 |
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Hersteller: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Description: UART IC 2, DUART CHANNEL 32 BYTE
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
134+ | 6.58 EUR |
SC16C652BIB48,151 |
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Hersteller: NXP USA Inc.
Description: UART INTERFACE IC 2CH. UART 32B
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
Description: UART INTERFACE IC 2CH. UART 32B
Packaging: Bulk
Package / Case: 48-LQFP
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 32 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 48-LQFP (7x7)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Obsolete
auf Bestellung 1450 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
140+ | 6.58 EUR |
74ABT573AD,118 |
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Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 3.3ns
Supplier Device Package: 20-SO
Part Status: Obsolete
Produkt ist nicht verfügbar