Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35283) > Seite 426 nach 589
| Foto | Bezeichnung | Hersteller | Beschreibung |
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PIMXRT1064DVL6B | NXP USA Inc. | Description: IC MCU 32BIT EXT MEM 196MAPBGA |
Produkt ist nicht verfügbar |
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PIMXRT1064CVJ5B | NXP USA Inc. | Description: IC MCU 32BIT EXT MEM 196MAPBGA |
Produkt ist nicht verfügbar |
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PIMXRT1064CVL5B | NXP USA Inc. | Description: IC MCU 32BIT EXT MEM 196MAPBGA |
Produkt ist nicht verfügbar |
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LPC1112FHN33/102K | NXP USA Inc. |
 Description: IC MCU 32BIT 16KB FLASH 32HVQFNPackaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1112FHN33/202K | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1113FBD48/302EL | NXP USA Inc. |
Description: IC MCU 32BIT 24KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 24KB (24K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 139 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1115FBD48/303EL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 2965 Stücke: Lieferzeit 10-14 Tag (e) |
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| A3T18H360W23SR6 | NXP USA Inc. |
Description: 1.8GHZ 360W ACP1230S-4L2 |
Produkt ist nicht verfügbar |
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NX3L1G3157GW-Q100H | NXP USA Inc. |
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP Packaging: Tape & Reel (TR) Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 750mOhm -3db Bandwidth: 60MHz Supplier Device Package: 6-TSSOP Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 15pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Channel-to-Channel Matching (ΔRon): 20mOhm Switch Time (Ton, Toff) (Max): 25ns, 10ns Channel Capacitance (CS(off), CD(off)): 35pF Current - Leakage (IS(off)) (Max): 10nA Part Status: Obsolete Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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| NX3L1G3157GW125 | NXP USA Inc. |
Description: SPDT 1 FUNC 1 CHANNEL Packaging: Bulk |
Produkt ist nicht verfügbar |
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| NX3L1G3157GW | NXP USA Inc. |
Description: SPDT 1 FUNC 1 CHANNEL Packaging: Bulk |
Produkt ist nicht verfügbar |
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NX3L1G3157GW,125 | NXP USA Inc. |
Description: SPDT, 1 FUNC, 1 CHANNEL, CMOS, P |
Produkt ist nicht verfügbar |
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HVP-KV11Z75M | NXP USA Inc. |
Description: KV1X HIGH-VOLTAGE DEV PLATFORM |
Produkt ist nicht verfügbar |
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LD6806TD/13H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.3V 200MA 5TSOP |
auf Bestellung 21000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836TD/13H,125 | NXP USA Inc. |
Description: IC REG LINEAR 1.3V 300MA 5TSOP Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.2V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 33000 Stücke: Lieferzeit 10-14 Tag (e) |
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| MC9S12NE64CPVE557 | NXP USA Inc. | Description: MCU 16-BIT FLASH, 25MHZ |
Produkt ist nicht verfügbar |
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MC33772BTA2AE | NXP USA Inc. |
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP Packaging: Tray Package / Case: 48-LQFP Exposed Pad Number of Cells: 3 ~ 6 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 48-HLQFP (7x7) Fault Protection: Over/Under Voltage Part Status: Active |
Produkt ist nicht verfügbar |
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PZU6.2B2L/NO315 | NXP USA Inc. |
Description: DIODE ZENER |
auf Bestellung 2200000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU6.2B1,115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU6.2B1 - ZENER DI |
auf Bestellung 79840 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU6.2B3115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU6.2B3 ZENER DIOD |
auf Bestellung 52450 Stücke: Lieferzeit 10-14 Tag (e) |
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| PZU6.2B3A115 | NXP USA Inc. | Description: DIODE ZENER SINGLE |
Produkt ist nicht verfügbar |
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PZU6.2B1A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU6.2B1A - ZENER D |
Produkt ist nicht verfügbar |
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74LVCH245APW-Q100118 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIES |
auf Bestellung 29650 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH245APW/AU118 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIES |
auf Bestellung 3450 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVT245PW/AU118 | NXP USA Inc. |
Description: BUS TRANSCVR, LVT SERIES, 8-BIT |
auf Bestellung 47070 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVCH16245ADGG-Q100118 | NXP USA Inc. |
Description: BUS TRANSCVR, LVC/LCX/Z SERIES Packaging: Bulk |
Produkt ist nicht verfügbar |
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LD6805K/23P,115 | NXP USA Inc. |
Description: IC REG LIN 2.3V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.3V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 70000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6805K/23H,115 | NXP USA Inc. |
Description: IC REG LIN 2.3V 150MA DFN1010C-4 Packaging: Bulk Package / Case: 4-UDFN Exposed Pad Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: DFN1010C-4 Voltage - Output (Min/Fixed): 2.3V Control Features: Enable Part Status: Obsolete PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9561D,112 | NXP USA Inc. |
Description: IC I2C EEPROM DIP SWITCH 20-SOIC |
auf Bestellung 1425 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1102AHN/S/0Z | NXP USA Inc. |
Description: IC TXRX FULL/HALF 1/1 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1102AHN/S/0Z | NXP USA Inc. |
Description: IC TXRX FULL/HALF 1/1 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Receiver Hysteresis: 500 mV Duplex: Full, Half Part Status: Active |
auf Bestellung 7824 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1102AHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 2/2 56HVQFN Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.8V, 3.3V Number of Drivers/Receivers: 2/2 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Duplex: Full Part Status: Active |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1102AHN/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 2/2 56HVQFN Packaging: Cut Tape (CT) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.8V, 3.3V Number of Drivers/Receivers: 2/2 Data Rate: 100Mbps Protocol: Ethernet Supplier Device Package: 56-HVQFN (8x8) Duplex: Full Part Status: Active |
auf Bestellung 3720 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1124BHG/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN Packaging: Cut Tape (CT) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 5V ~ 28V Number of Drivers/Receivers: 4/4 Data Rate: 20kBd Protocol: LIN Supplier Device Package: 24-DHVQFN (5.5x3.5) Duplex: Full Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 4745 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5644CAVLU1 | NXP USA Inc. | Description: IC MCU 32BIT 1.5MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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SPC5644CAVLU8 | NXP USA Inc. | Description: IC MCU 32BIT 1.5MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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DSPB56371AF180 | NXP USA Inc. |
Description: IC DSP 24BIT 180MHZ 80-LQFP |
Produkt ist nicht verfügbar |
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74LV164DB112 | NXP USA Inc. |
Description: NOW NEXPERIA 74LV164DB - SERIAL |
Produkt ist nicht verfügbar |
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74AXP2G07GS125 | NXP USA Inc. |
Description: 74AXP2G07GS - BUFFER, AXP SERIES |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G07GN/S500125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 6-XSON (0.9x1) Part Status: Active |
auf Bestellung 70000 Stücke: Lieferzeit 10-14 Tag (e) |
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BGU7007 | NXP USA Inc. |
Description: SIGE:C LOW NOISE AMPLIFIER MMIC |
Produkt ist nicht verfügbar |
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PCA9615DPZ | NXP USA Inc. |
Description: IC REDRIVER I2C 2CH 10TSSOP Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Delay Time: 150ns Number of Channels: 2 Mounting Type: Surface Mount Output: 2-Wire Bus Type: Buffer, ReDriver Input: 2-Wire Bus Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V Applications: I2C Current - Supply: 16µA Data Rate (Max): 400MHz Supplier Device Package: 10-TSSOP Part Status: Active Capacitance - Input: 6 pF |
Produkt ist nicht verfügbar |
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MC33FS6513CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO |
Produkt ist nicht verfügbar |
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PESD3V3S2UQ/S911,115 | NXP USA Inc. |
Description: NOW NEXPERIA, TRANS VOLTAGE SUPP Packaging: Bulk |
Produkt ist nicht verfügbar |
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PCA9622DR/S911118 | NXP USA Inc. |
Description: LED DRIVER 16-SEGMENT |
auf Bestellung 255786 Stücke: Lieferzeit 10-14 Tag (e) |
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PDZ12B/S911115 | NXP USA Inc. |
Description: PDZ12B - VOLTAGE REGULATOR DIODE |
Produkt ist nicht verfügbar |
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PSMN1R9-25YLC,115 | NXP USA Inc. | Description: MOSFET N-CH 25V 100A LFPAK56 |
auf Bestellung 5149 Stücke: Lieferzeit 10-14 Tag (e) |
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| PSMN1R5-40ES,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 120A I2PAK Packaging: Tube |
auf Bestellung 7345 Stücke: Lieferzeit 10-14 Tag (e) |
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MKV46F256VLL16Q | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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MKV46F256VLL16P | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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| IP3337CX18/LF/P135 | NXP USA Inc. |
Description: DATA LINE FILTER Packaging: Bulk Part Status: Active |
auf Bestellung 4499 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7628-100A,118 | NXP USA Inc. |
Description: MOSFET N-CH 100V 47A D2PAK Packaging: Bulk Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 47A (Tc) Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V Power Dissipation (Max): 166W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: D2PAK Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V Qualification: AEC-Q101 |
auf Bestellung 5440 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC2G17GN,132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 6-XSON (0.9x1) Part Status: Active |
auf Bestellung 128756 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F38D,602 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14SO Features: Open Collector Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: -, 64mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF Part Status: Obsolete Number of Circuits: 4 |
auf Bestellung 19835 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F38D-Q100118 | NXP USA Inc. |
Description: NAND GATE, F/FAST SERIES, TTL |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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BY229-600,127 | NXP USA Inc. |
Description: DIODE GEN PURP 500V 8A TO220AC Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 135 ns Technology: Standard Current - Average Rectified (Io): 8A Supplier Device Package: TO-220AC Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 500 V Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A Current - Reverse Leakage @ Vr: 400 µA @ 500 V |
Produkt ist nicht verfügbar |
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BY229X-200,127 | NXP USA Inc. |
Description: DIODE GEN PURP 150V 8A TO220FP Packaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 135 ns Technology: Standard Current - Average Rectified (Io): 8A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 150 V Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A Current - Reverse Leakage @ Vr: 400 µA @ 150 V |
Produkt ist nicht verfügbar |
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BY229X-600,127 | NXP USA Inc. |
Description: DIODE GEN PURP 500V 8A TO220FP Packaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 135 ns Technology: Standard Current - Average Rectified (Io): 8A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 500 V Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A Current - Reverse Leakage @ Vr: 400 µA @ 500 V |
Produkt ist nicht verfügbar |
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BY229X-800,127 | NXP USA Inc. |
Description: DIODE GEN PURP 600V 8A TO220FP Packaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 135 ns Technology: Standard Current - Average Rectified (Io): 8A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A Current - Reverse Leakage @ Vr: 400 µA @ 600 V |
Produkt ist nicht verfügbar |
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| BUK9107-55ATE,118 | NXP USA Inc. |
Description: NOW NEXPERIA BUK9107-55ATE - Packaging: Bulk Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V FET Feature: Temperature Sensing Diode Power Dissipation (Max): 272W (Tc) Vgs(th) (Max) @ Id: 2V @ 1mA Supplier Device Package: SOT-426 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±15V Drain to Source Voltage (Vdss): 55 V Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V |
Produkt ist nicht verfügbar |
| PIMXRT1064DVL6B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
| PIMXRT1064CVJ5B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
| PIMXRT1064CVL5B |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Produkt ist nicht verfügbar
| LPC1112FHN33/102K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.56 EUR |
| 10+ | 4.34 EUR |
| 80+ | 3.56 EUR |
| 520+ | 3.48 EUR |
| 1040+ | 2.94 EUR |
| LPC1112FHN33/202K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 5.93 EUR |
| 10+ | 4.63 EUR |
| 80+ | 3.79 EUR |
| 520+ | 3.71 EUR |
| 1040+ | 3.13 EUR |
| LPC1113FBD48/302EL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 139 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.41 EUR |
| 10+ | 5.79 EUR |
| 80+ | 4.74 EUR |
| LPC1115FBD48/303EL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2965 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 9.77 EUR |
| 10+ | 7.62 EUR |
| 80+ | 6.24 EUR |
| 500+ | 6.11 EUR |
| 1000+ | 5.16 EUR |
| 2500+ | 4.9 EUR |
| A3T18H360W23SR6 |
|
Hersteller: NXP USA Inc.
Description: 1.8GHZ 360W ACP1230S-4L2
Description: 1.8GHZ 360W ACP1230S-4L2
Produkt ist nicht verfügbar
| NX3L1G3157GW-Q100H |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Description: IC SWITCH SPDTX1 750MOHM 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-TSSOP
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
| NX3L1G3157GW125 |
Produkt ist nicht verfügbar
| NX3L1G3157GW |
Produkt ist nicht verfügbar
| NX3L1G3157GW,125 |
|
Hersteller: NXP USA Inc.
Description: SPDT, 1 FUNC, 1 CHANNEL, CMOS, P
Description: SPDT, 1 FUNC, 1 CHANNEL, CMOS, P
Produkt ist nicht verfügbar
| HVP-KV11Z75M |
|
Hersteller: NXP USA Inc.
Description: KV1X HIGH-VOLTAGE DEV PLATFORM
Description: KV1X HIGH-VOLTAGE DEV PLATFORM
Produkt ist nicht verfügbar
| LD6806TD/13H,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 200MA 5TSOP
Description: IC REG LINEAR 1.3V 200MA 5TSOP
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.17 EUR |
| LD6836TD/13H,125 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.3V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.3V 300MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 33000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2664+ | 0.18 EUR |
| MC9S12NE64CPVE557 |
Hersteller: NXP USA Inc.
Description: MCU 16-BIT FLASH, 25MHZ
Description: MCU 16-BIT FLASH, 25MHZ
Produkt ist nicht verfügbar
| MC33772BTA2AE |
|
Hersteller: NXP USA Inc.
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Description: IC BATT CNTRL LI-ION 3-6C 48LQFP
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Number of Cells: 3 ~ 6
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 48-HLQFP (7x7)
Fault Protection: Over/Under Voltage
Part Status: Active
Produkt ist nicht verfügbar
| PZU6.2B2L/NO315 |
|
Hersteller: NXP USA Inc.
Description: DIODE ZENER
Description: DIODE ZENER
auf Bestellung 2200000 Stücke:
Lieferzeit 10-14 Tag (e)| PZU6.2B1,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU6.2B1 - ZENER DI
Description: NOW NEXPERIA PZU6.2B1 - ZENER DI
auf Bestellung 79840 Stücke:
Lieferzeit 10-14 Tag (e)| PZU6.2B3115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU6.2B3 ZENER DIOD
Description: NOW NEXPERIA PZU6.2B3 ZENER DIOD
auf Bestellung 52450 Stücke:
Lieferzeit 10-14 Tag (e)| PZU6.2B1A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU6.2B1A - ZENER D
Description: NOW NEXPERIA PZU6.2B1A - ZENER D
Produkt ist nicht verfügbar
| 74LVCH245APW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
auf Bestellung 29650 Stücke:
Lieferzeit 10-14 Tag (e)| 74LVCH245APW/AU118 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
Description: BUS TRANSCVR, LVC/LCX/Z SERIES
auf Bestellung 3450 Stücke:
Lieferzeit 10-14 Tag (e)| 74LVT245PW/AU118 |
|
Hersteller: NXP USA Inc.
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
Description: BUS TRANSCVR, LVT SERIES, 8-BIT
auf Bestellung 47070 Stücke:
Lieferzeit 10-14 Tag (e)| LD6805K/23P,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.16 EUR |
| LD6805K/23H,115 |
|
Hersteller: NXP USA Inc.
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LIN 2.3V 150MA DFN1010C-4
Packaging: Bulk
Package / Case: 4-UDFN Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: DFN1010C-4
Voltage - Output (Min/Fixed): 2.3V
Control Features: Enable
Part Status: Obsolete
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2959+ | 0.17 EUR |
| PCA9561D,112 |
|
Hersteller: NXP USA Inc.
Description: IC I2C EEPROM DIP SWITCH 20-SOIC
Description: IC I2C EEPROM DIP SWITCH 20-SOIC
auf Bestellung 1425 Stücke:
Lieferzeit 10-14 Tag (e)| TJA1102AHN/S/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 4.44 EUR |
| TJA1102AHN/S/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
Description: IC TXRX FULL/HALF 1/1 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.745V ~ 1.95V, 3.1V ~ 3.5V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Receiver Hysteresis: 500 mV
Duplex: Full, Half
Part Status: Active
auf Bestellung 7824 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.67 EUR |
| 10+ | 6 EUR |
| 25+ | 5.67 EUR |
| 100+ | 4.92 EUR |
| 250+ | 4.66 EUR |
| 500+ | 4.44 EUR |
| TJA1102AHN/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 5.34 EUR |
| TJA1102AHN/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
Description: IC TRANSCEIVER FULL 2/2 56HVQFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V, 3.3V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 56-HVQFN (8x8)
Duplex: Full
Part Status: Active
auf Bestellung 3720 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.63 EUR |
| 10+ | 9.55 EUR |
| 25+ | 9.03 EUR |
| 100+ | 7.82 EUR |
| 250+ | 7.42 EUR |
| 500+ | 6.66 EUR |
| 1000+ | 5.62 EUR |
| TJA1124BHG/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER FULL 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBd
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 4745 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.23 EUR |
| 10+ | 4.68 EUR |
| 25+ | 4.42 EUR |
| 100+ | 3.83 EUR |
| 250+ | 3.64 EUR |
| 500+ | 3.26 EUR |
| 1000+ | 2.75 EUR |
| SPC5644CAVLU1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
| SPC5644CAVLU8 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
| DSPB56371AF180 |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 180MHZ 80-LQFP
Description: IC DSP 24BIT 180MHZ 80-LQFP
Produkt ist nicht verfügbar
| 74LV164DB112 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV164DB - SERIAL
Description: NOW NEXPERIA 74LV164DB - SERIAL
Produkt ist nicht verfügbar
| 74AXP2G07GS125 |
|
Hersteller: NXP USA Inc.
Description: 74AXP2G07GS - BUFFER, AXP SERIES
Description: 74AXP2G07GS - BUFFER, AXP SERIES
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2862+ | 0.18 EUR |
| 74AUP2G07GN/S500125 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 70000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1106+ | 0.45 EUR |
| BGU7007 |
|
Hersteller: NXP USA Inc.
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Description: SIGE:C LOW NOISE AMPLIFIER MMIC
Produkt ist nicht verfügbar
| PCA9615DPZ |
|
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
Description: IC REDRIVER I2C 2CH 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Delay Time: 150ns
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 3V, 3V ~ 5.5V
Applications: I2C
Current - Supply: 16µA
Data Rate (Max): 400MHz
Supplier Device Package: 10-TSSOP
Part Status: Active
Capacitance - Input: 6 pF
Produkt ist nicht verfügbar
| MC33FS6513CAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Produkt ist nicht verfügbar
| PCA9622DR/S911118 |
|
Hersteller: NXP USA Inc.
Description: LED DRIVER 16-SEGMENT
Description: LED DRIVER 16-SEGMENT
auf Bestellung 255786 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 174+ | 2.78 EUR |
| PDZ12B/S911115 |
|
Hersteller: NXP USA Inc.
Description: PDZ12B - VOLTAGE REGULATOR DIODE
Description: PDZ12B - VOLTAGE REGULATOR DIODE
Produkt ist nicht verfügbar
| PSMN1R9-25YLC,115 |
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 100A LFPAK56
Description: MOSFET N-CH 25V 100A LFPAK56
auf Bestellung 5149 Stücke:
Lieferzeit 10-14 Tag (e)| PSMN1R5-40ES,127 |
|
auf Bestellung 7345 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 224+ | 2.2 EUR |
| MKV46F256VLL16Q |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
| MKV46F256VLL16P |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
| IP3337CX18/LF/P135 |
|
auf Bestellung 4499 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 875+ | 0.56 EUR |
| BUK7628-100A,118 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
Description: MOSFET N-CH 100V 47A D2PAK
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Rds On (Max) @ Id, Vgs: 28mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 5440 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 480+ | 1.02 EUR |
| 74LVC2G17GN,132 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
Part Status: Active
auf Bestellung 128756 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1708+ | 0.29 EUR |
| N74F38D,602 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
Description: IC GATE NAND 4CH 2-INP 14SO
Features: Open Collector
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 4
auf Bestellung 19835 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2420+ | 0.2 EUR |
| N74F38D-Q100118 |
|
Hersteller: NXP USA Inc.
Description: NAND GATE, F/FAST SERIES, TTL
Description: NAND GATE, F/FAST SERIES, TTL
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| BY229-600,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Description: DIODE GEN PURP 500V 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Produkt ist nicht verfügbar
| BY229X-200,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
Description: DIODE GEN PURP 150V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 150 V
Produkt ist nicht verfügbar
| BY229X-600,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Description: DIODE GEN PURP 500V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 500 V
Produkt ist nicht verfügbar
| BY229X-800,127 |
|
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
Description: DIODE GEN PURP 600V 8A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 400 µA @ 600 V
Produkt ist nicht verfügbar
| BUK9107-55ATE,118 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
Description: NOW NEXPERIA BUK9107-55ATE -
Packaging: Bulk
Package / Case: TO-263-5, D²Pak (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 6.2mOhm @ 50A, 10V
FET Feature: Temperature Sensing Diode
Power Dissipation (Max): 272W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SOT-426
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 108 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 5836 pF @ 25 V
Produkt ist nicht verfügbar