Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35281) > Seite 422 nach 589
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TJA1448AT/0Z | NXP USA Inc. |
 Description: IC TRANSCEIVER HALF 2/2 14SOPackaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 2/2 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 50 mV Duplex: Half Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 15274 Stücke: Lieferzeit 10-14 Tag (e) |
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| BF861B | NXP USA Inc. | Description: SMALL SIGNAL FIELD-EFFECT TRANSI |
Produkt ist nicht verfügbar |
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74HCT4351D/C4118 | NXP USA Inc. |
Description: 74HCT4351D - SINGLE-ENDED MUX Packaging: Bulk Part Status: Active Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 120Ohm -3db Bandwidth: 170MHz Supplier Device Package: 20-SO Voltage - Supply, Single (V+): 4.5V ~ 5.5V Voltage - Supply, Dual (V±): ±1V ~ 5V Switch Circuit: SP8T - Open/Closed Multiplexer/Demultiplexer Circuit: 8:1 Channel-to-Channel Matching (ΔRon): 6Ohm Switch Time (Ton, Toff) (Max): 35ns, 23ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 100nA Number of Circuits: 1 |
Produkt ist nicht verfügbar |
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| TDA10028HN/C1,557 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk |
Produkt ist nicht verfügbar |
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| TDA10028HN/C1,551 | NXP USA Inc. |
Description: IC VIDEO SILICON TUNER Packaging: Bulk |
Produkt ist nicht verfügbar |
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S912XET256BCAL | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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| KTY81/150 | NXP USA Inc. |
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY Packaging: Bulk Package / Case: TO-226-2, TO-92-2 (TO-226AC) Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C Supplier Device Package: PBCYT2 Part Status: Obsolete Resistance @ 25°C: 1 kOhms |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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| KTY81/122 | NXP USA Inc. |
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY Packaging: Bulk Package / Case: TO-226-2, TO-92-2 (TO-226AC) Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C Supplier Device Package: PBCYT2 Resistance @ 25°C: 1.01 kOhms |
auf Bestellung 32000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BLT81 | NXP USA Inc. |
Description: RF SMALL SIGNAL BIPOLAR TRANSIST Packaging: Bulk Part Status: Obsolete |
Produkt ist nicht verfügbar |
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74LVC10APW/S400118 | NXP USA Inc. |
Description: 74LVC10APW - NAND GATE |
auf Bestellung 182500 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5120A0ET/C2151 | NXP USA Inc. |
Description: FULL NFC FORUM-COMPLIANT FRONTEN Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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PN5120A0HN/C2,518 | NXP USA Inc. |
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 90°C Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
auf Bestellung 26071 Stücke: Lieferzeit 10-14 Tag (e) |
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PN512A0HN/C1,551 | NXP USA Inc. |
Description: FULL NFC FORUM-COMPLIANT FRONTEN Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I²C, SPI, UART Type: RFID Reader/Transponder Operating Temperature: -30°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 3.6V Standards: FeliCa, ISO 14443, MIFARE, NFC Supplier Device Package: 40-HVQFN (6x6) Part Status: Active |
Produkt ist nicht verfügbar |
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TEF6614T/V1,518 | NXP USA Inc. |
Description: RF RCVR AM/FM/RDS 32SO Packaging: Bulk Package / Case: 32-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Modulation or Protocol: AM, FM, RDS Data Interface: PCB, Surface Mount Voltage - Supply: 8.5V Applications: AM/FM Radio Receiver Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-SO Part Status: Obsolete |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU18B2L315 | NXP USA Inc. |
Description: NOW NEXPERIA PZU18B2L ZENER DIOD Tolerance: ±2% Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 18 V Impedance (Max) (Zzt): 20 Ohms Supplier Device Package: DFN1006-2 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 13 V Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| TEA88181T/1518 | NXP USA Inc. |
Description: RESONANT LLC POWER SUPPLY Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| TEA88181T/1Y | NXP USA Inc. |
Description: RESONANT LLC POWER SUPPLY Packaging: Tape & Reel (TR) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XHY256F0VLLR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 256KB (256K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 8K x 8 Core Processor: HCS12X Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ384BMAL | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S912XEQ384BMALR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 112LQFP |
Produkt ist nicht verfügbar |
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FS32R274VBK2MMM | NXP USA Inc. | Description: IC MCU 32BIT 2MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
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FS32R274KCK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active |
Produkt ist nicht verfügbar |
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FS32R274KBK2MMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz, 240MHz Program Memory Size: 2MB (2M x 8) RAM Size: 1.5M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4, e200z7 (2) Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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FS32R274KBK2MMMR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
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FS32R274KBK2VMM | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA |
Produkt ist nicht verfügbar |
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SPC5604CF2CLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC9S08PB16VTG | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOP Packaging: Tray Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 956 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU12DB2,115 | NXP USA Inc. |
Description: ZENER DIODE, 12V V(Z), 2.09%, 0. Packaging: Bulk Tolerance: ±2% Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Configuration: 2 Independent Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 12 V Impedance (Max) (Zzt): 10 Ohms Supplier Device Package: 5-TSSOP Part Status: Active Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 100 nA @ 9 V |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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PZU12B2A115 | NXP USA Inc. |
Description: NOW NEXPERIA PZU12B2A ZENER DIOD |
Produkt ist nicht verfügbar |
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| PZU12BA115 | NXP USA Inc. |
Description: SINGLE ZENER DIODE |
Produkt ist nicht verfügbar |
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BUK654R0-75C,127 | NXP USA Inc. |
Description: MOSFET N-CH 75V 120A TO220AB |
auf Bestellung 3883 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2220FET144/G,55 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144TFBGA Packaging: Bulk Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 75MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-TFBGA (12x12) Part Status: Not For New Designs Number of I/O: 76 DigiKey Programmable: Not Verified |
auf Bestellung 1754 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2880FET180551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 180TFBGA Packaging: Bulk Package / Case: 180-TFBGA Mounting Type: Surface Mount Speed: 60MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 5x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, Memory Card, UART/USART, USB Peripherals: DMA, I²S, LCD, WDT Supplier Device Package: 180-TFBGA (10x10) Part Status: Active Number of I/O: 85 DigiKey Programmable: Not Verified |
auf Bestellung 920 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2220FET144/G518 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144TFBGA Packaging: Bulk Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 75MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-TFBGA (12x12) Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMDPB70XPE | NXP USA Inc. |
Description: NOW NEXPERIA PMDPB70XPE - SMALL |
Produkt ist nicht verfügbar |
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MRFX035H-2MHZ | NXP USA Inc. |
Description: MRFX035H REF BRD 54MHZ 35W Packaging: Bulk For Use With/Related Products: MRFX035H Frequency: 1.8MHz ~ 54MHz Type: Transistor Supplied Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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LPC4370FET100K | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 204MHz RAM Size: 282K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0/M0 Data Converters: A/D 3x12b SAR; D/A 1x10b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 49 DigiKey Programmable: Not Verified |
auf Bestellung 998 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F74D,602 | NXP USA Inc. |
Description: IC FF D-TYPE DUAL 1BIT 14SO Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 16 mA Current - Output High, Low: 1mA, 20mA Trigger Type: Positive Edge Clock Frequency: 125 MHz Supplier Device Package: 14-SO Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF Part Status: Obsolete Number of Bits per Element: 1 |
auf Bestellung 42862 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV27D,118 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14SO |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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MMG15241HT1 | NXP USA Inc. |
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A Packaging: Cut Tape (CT) Package / Case: TO-243AA Mounting Type: Surface Mount Frequency: 500MHz ~ 2.8GHz RF Type: W-CDMA Voltage - Supply: 5V Gain: 15.9dB Current - Supply: 85mA Noise Figure: 1.6dB P1dB: 24dBm Test Frequency: 2.14GHz Supplier Device Package: SOT-89A Part Status: Active |
auf Bestellung 2267 Stücke: Lieferzeit 10-14 Tag (e) |
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MMG3006NT1 | NXP USA Inc. |
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN Packaging: Cut Tape (CT) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Frequency: 400MHz ~ 2.4GHz RF Type: Cellular, PCS, PHS, WLL Voltage - Supply: 5V Gain: 17.5dB Current - Supply: 850mA Noise Figure: 6.6dB P1dB: 33dBm Test Frequency: 900MHz Supplier Device Package: 16-QFN (4x4) Part Status: Active |
auf Bestellung 898 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN3363BSMP | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: HDMI Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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LPC1813JBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 512KB (512K x 8) RAM Size: 104K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 16K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
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SPC5602BK0CLQ4557 | NXP USA Inc. |
Description: POWERPC CORE ARCHITECTURE MPU |
auf Bestellung 24260 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5604PEF1MLQ6R528 | NXP USA Inc. |
Description: MICROCONTROLLER 32-BIT FLASH, E2 |
auf Bestellung 18400 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5602BK0VLQ6 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 123 DigiKey Programmable: Not Verified |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5605BK0VLL6557 | NXP USA Inc. |
Description: POWERPC CORE ARCHITECTURE MPU |
auf Bestellung 84 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5606BK0VLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1MB (1M x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 77 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MCIMX6X4AVM08ACR | NXP USA Inc. |
Description: I.MX6SX ROM PERF ENHAN |
Produkt ist nicht verfügbar |
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74LVC1G10GF/S500132 | NXP USA Inc. |
Description: IC GATE NAND Packaging: Bulk Part Status: Active |
auf Bestellung 54850 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G10GM,115 | NXP USA Inc. |
Description: IC GATE NAND 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 3 Supplier Device Package: 6-XSON (1.45x1) Input Logic Level - High: 1.7V ~ 2V Input Logic Level - Low: 0.7V ~ 0.8V Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
auf Bestellung 203808 Stücke: Lieferzeit 10-14 Tag (e) |
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MK60FN1M0VMD12R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA Packaging: Cut Tape (CT) Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 58x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 1050 Stücke: Lieferzeit 10-14 Tag (e) |
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| MK60DX256ZVLL10557 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MK60DN512ZVLQ10-NXP | NXP USA Inc. |
Description: KINETIS K60: 100MHZ CORTEX-M4 MC |
Produkt ist nicht verfügbar |
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BUK755R2-40B,127 | NXP USA Inc. |
Description: PFET, 75A I(D), 40V, 0.0052OHM, |
auf Bestellung 4994 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9560D,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 20SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 3V ~ 3.6V Applications: Network, Telecom Supplier Device Package: 20-SO Part Status: Obsolete |
auf Bestellung 1514 Stücke: Lieferzeit 10-14 Tag (e) |
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PSMN012-25YLC,115 | NXP USA Inc. |
Description: MOSFET N-CH 25V 33A LFPAK56 |
auf Bestellung 4847 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F534N,602 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20DIP |
Produkt ist nicht verfügbar |
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BUK654R8-40C,127 | NXP USA Inc. |
Description: MOSFET N-CH 40V 100A TO220AB Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 4.8mOhm @ 25A, 10V Power Dissipation (Max): 158W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Grade: Automotive Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5200 pF @ 25 V Qualification: AEC-Q101 |
auf Bestellung 1963 Stücke: Lieferzeit 10-14 Tag (e) |
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| SPC5775BDK3MME2R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA |
Produkt ist nicht verfügbar |
| TJA1448AT/0Z |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 2/2 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 2/2
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 15274 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.24 EUR |
| 10+ | 3.81 EUR |
| 25+ | 3.6 EUR |
| 100+ | 3.07 EUR |
| 250+ | 2.88 EUR |
| 500+ | 2.52 EUR |
| 1000+ | 2.09 EUR |
| BF861B |
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Description: SMALL SIGNAL FIELD-EFFECT TRANSI
Produkt ist nicht verfügbar
| 74HCT4351D/C4118 |
|
Hersteller: NXP USA Inc.
Description: 74HCT4351D - SINGLE-ENDED MUX
Packaging: Bulk
Part Status: Active
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 20-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Circuit: SP8T - Open/Closed
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 35ns, 23ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 1
Description: 74HCT4351D - SINGLE-ENDED MUX
Packaging: Bulk
Part Status: Active
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 20-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Switch Circuit: SP8T - Open/Closed
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 35ns, 23ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 1
Produkt ist nicht verfügbar
| TDA10028HN/C1,557 |
Produkt ist nicht verfügbar
| TDA10028HN/C1,551 |
Produkt ist nicht verfügbar
| S912XET256BCAL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 33.46 EUR |
| 10+ | 26.74 EUR |
| 80+ | 22.58 EUR |
| KTY81/150 |
Hersteller: NXP USA Inc.
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Obsolete
Resistance @ 25°C: 1 kOhms
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 0.22 EUR |
| KTY81/122 |
Hersteller: NXP USA Inc.
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1.01 kOhms
Description: TEMPERATURE SENSOR, 1 FUNC, PBCY
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Resistance @ 25°C: 1.01 kOhms
auf Bestellung 32000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2500+ | 0.42 EUR |
| BLT81 |
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL BIPOLAR TRANSIST
Packaging: Bulk
Part Status: Obsolete
Description: RF SMALL SIGNAL BIPOLAR TRANSIST
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
| 74LVC10APW/S400118 |
|
Hersteller: NXP USA Inc.
Description: 74LVC10APW - NAND GATE
Description: 74LVC10APW - NAND GATE
auf Bestellung 182500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.15 EUR |
| PN5120A0ET/C2151 |
|
Hersteller: NXP USA Inc.
Description: FULL NFC FORUM-COMPLIANT FRONTEN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FULL NFC FORUM-COMPLIANT FRONTEN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 62+ | 8.13 EUR |
| PN5120A0HN/C2,518 |
|
Hersteller: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
auf Bestellung 26071 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 61+ | 8.09 EUR |
| PN512A0HN/C1,551 |
|
Hersteller: NXP USA Inc.
Description: FULL NFC FORUM-COMPLIANT FRONTEN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Description: FULL NFC FORUM-COMPLIANT FRONTEN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I²C, SPI, UART
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
Produkt ist nicht verfügbar
| TEF6614T/V1,518 |
|
Hersteller: NXP USA Inc.
Description: RF RCVR AM/FM/RDS 32SO
Packaging: Bulk
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, RDS
Data Interface: PCB, Surface Mount
Voltage - Supply: 8.5V
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
Description: RF RCVR AM/FM/RDS 32SO
Packaging: Bulk
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, RDS
Data Interface: PCB, Surface Mount
Voltage - Supply: 8.5V
Applications: AM/FM Radio Receiver
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-SO
Part Status: Obsolete
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 36+ | 14.7 EUR |
| PZU18B2L315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU18B2L ZENER DIOD
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 13 V
Qualification: AEC-Q100
Description: NOW NEXPERIA PZU18B2L ZENER DIOD
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: DFN1006-2
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 13 V
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| TEA88181T/1518 |
Hersteller: NXP USA Inc.
Description: RESONANT LLC POWER SUPPLY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: RESONANT LLC POWER SUPPLY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TEA88181T/1Y |
Hersteller: NXP USA Inc.
Description: RESONANT LLC POWER SUPPLY
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Description: RESONANT LLC POWER SUPPLY
Packaging: Tape & Reel (TR)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XHY256F0VLLR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 8K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XEQ384BMAL |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| S912XEQ384BMALR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Produkt ist nicht verfügbar
| FS32R274VBK2MMM |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
| FS32R274KCK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
Produkt ist nicht verfügbar
| FS32R274KBK2MMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz, 240MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 1.5M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4, e200z7 (2)
Data Converters: A/D 16x12b SAR, 4x12 Sigma; D/A 1x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.19V ~ 5.5V
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Obsolete
Produkt ist nicht verfügbar
| FS32R274KBK2MMMR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
| FS32R274KBK2VMM |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Description: IC MCU 32BIT 2MB FLASH 257MAPBGA
Produkt ist nicht verfügbar
| SPC5604CF2CLL6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC9S08PB16VTG |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tray
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Tray
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 956 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.77 EUR |
| 10+ | 2.94 EUR |
| 96+ | 2.36 EUR |
| 480+ | 2.23 EUR |
| PZU12DB2,115 |
|
Hersteller: NXP USA Inc.
Description: ZENER DIODE, 12V V(Z), 2.09%, 0.
Packaging: Bulk
Tolerance: ±2%
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
Description: ZENER DIODE, 12V V(Z), 2.09%, 0.
Packaging: Bulk
Tolerance: ±2%
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Configuration: 2 Independent
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 12 V
Impedance (Max) (Zzt): 10 Ohms
Supplier Device Package: 5-TSSOP
Part Status: Active
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 9 V
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8876+ | 0.048 EUR |
| PZU12B2A115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PZU12B2A ZENER DIOD
Description: NOW NEXPERIA PZU12B2A ZENER DIOD
Produkt ist nicht verfügbar
| BUK654R0-75C,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 120A TO220AB
Description: MOSFET N-CH 75V 120A TO220AB
auf Bestellung 3883 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 226+ | 2.26 EUR |
| LPC2220FET144/G,55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
auf Bestellung 1754 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 31+ | 15.69 EUR |
| LPC2880FET180551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 5x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, UART/USART, USB
Peripherals: DMA, I²S, LCD, WDT
Supplier Device Package: 180-TFBGA (10x10)
Part Status: Active
Number of I/O: 85
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
Packaging: Bulk
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 5x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Memory Card, UART/USART, USB
Peripherals: DMA, I²S, LCD, WDT
Supplier Device Package: 180-TFBGA (10x10)
Part Status: Active
Number of I/O: 85
DigiKey Programmable: Not Verified
auf Bestellung 920 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 34+ | 14.88 EUR |
| LPC2220FET144/G518 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 28+ | 17.28 EUR |
| PMDPB70XPE |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMDPB70XPE - SMALL
Description: NOW NEXPERIA PMDPB70XPE - SMALL
Produkt ist nicht verfügbar
| MRFX035H-2MHZ |
|
Hersteller: NXP USA Inc.
Description: MRFX035H REF BRD 54MHZ 35W
Packaging: Bulk
For Use With/Related Products: MRFX035H
Frequency: 1.8MHz ~ 54MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Description: MRFX035H REF BRD 54MHZ 35W
Packaging: Bulk
For Use With/Related Products: MRFX035H
Frequency: 1.8MHz ~ 54MHz
Type: Transistor
Supplied Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| LPC4370FET100K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b SAR; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 282K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0/M0
Data Converters: A/D 3x12b SAR; D/A 1x10b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 998 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.81 EUR |
| 10+ | 17.43 EUR |
| 80+ | 14.72 EUR |
| 520+ | 14.63 EUR |
| N74F74D,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 16 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 125 MHz
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
Description: IC FF D-TYPE DUAL 1BIT 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 16 mA
Current - Output High, Low: 1mA, 20mA
Trigger Type: Positive Edge
Clock Frequency: 125 MHz
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Part Status: Obsolete
Number of Bits per Element: 1
auf Bestellung 42862 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.24 EUR |
| 74LV27D,118 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14SO
Description: IC GATE NOR 3CH 3-INP 14SO
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)| MMG15241HT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 500MHz ~ 2.8GHz
RF Type: W-CDMA
Voltage - Supply: 5V
Gain: 15.9dB
Current - Supply: 85mA
Noise Figure: 1.6dB
P1dB: 24dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Part Status: Active
Description: IC AMP CDMA 500MHZ-2.8GHZ SOT89A
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 500MHz ~ 2.8GHz
RF Type: W-CDMA
Voltage - Supply: 5V
Gain: 15.9dB
Current - Supply: 85mA
Noise Figure: 1.6dB
P1dB: 24dBm
Test Frequency: 2.14GHz
Supplier Device Package: SOT-89A
Part Status: Active
auf Bestellung 2267 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 4.14 EUR |
| 10+ | 3.69 EUR |
| 25+ | 3.32 EUR |
| 100+ | 3.03 EUR |
| 250+ | 2.73 EUR |
| 500+ | 2.6 EUR |
| MMG3006NT1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
Description: IC AMP CELL 400MHZ-2.4GHZ 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 400MHz ~ 2.4GHz
RF Type: Cellular, PCS, PHS, WLL
Voltage - Supply: 5V
Gain: 17.5dB
Current - Supply: 850mA
Noise Figure: 6.6dB
P1dB: 33dBm
Test Frequency: 900MHz
Supplier Device Package: 16-QFN (4x4)
Part Status: Active
auf Bestellung 898 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 15.56 EUR |
| 10+ | 14.27 EUR |
| 25+ | 12.97 EUR |
| 100+ | 11.67 EUR |
| 250+ | 10.7 EUR |
| 500+ | 9.73 EUR |
| PTN3363BSMP |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: HDMI
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
| LPC1813JBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
| SPC5602BK0CLQ4557 |
|
Hersteller: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
Description: POWERPC CORE ARCHITECTURE MPU
auf Bestellung 24260 Stücke:
Lieferzeit 10-14 Tag (e)| SPC5604PEF1MLQ6R528 |
|
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER 32-BIT FLASH, E2
Description: MICROCONTROLLER 32-BIT FLASH, E2
auf Bestellung 18400 Stücke:
Lieferzeit 10-14 Tag (e)| SPC5602BK0VLQ6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 123
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 20.98 EUR |
| SPC5605BK0VLL6557 |
|
Hersteller: NXP USA Inc.
Description: POWERPC CORE ARCHITECTURE MPU
Description: POWERPC CORE ARCHITECTURE MPU
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)| SPC5606BK0VLL6 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCIMX6X4AVM08ACR |
|
Hersteller: NXP USA Inc.
Description: I.MX6SX ROM PERF ENHAN
Description: I.MX6SX ROM PERF ENHAN
Produkt ist nicht verfügbar
| 74LVC1G10GF/S500132 |
|
auf Bestellung 54850 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3909+ | 0.13 EUR |
| 74LVC1G10GM,115 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NAND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC GATE NAND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 203808 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4898+ | 0.097 EUR |
| MK60FN1M0VMD12R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 144MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 58x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 1050 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 39.64 EUR |
| 10+ | 31.67 EUR |
| 100+ | 26.75 EUR |
| 500+ | 26.58 EUR |
| MK60DX256ZVLL10557 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MK60DN512ZVLQ10-NXP |
|
Hersteller: NXP USA Inc.
Description: KINETIS K60: 100MHZ CORTEX-M4 MC
Description: KINETIS K60: 100MHZ CORTEX-M4 MC
Produkt ist nicht verfügbar
| BUK755R2-40B,127 |
|
Hersteller: NXP USA Inc.
Description: PFET, 75A I(D), 40V, 0.0052OHM,
Description: PFET, 75A I(D), 40V, 0.0052OHM,
auf Bestellung 4994 Stücke:
Lieferzeit 10-14 Tag (e)| PCA9560D,112 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Network, Telecom
Supplier Device Package: 20-SO
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 3V ~ 3.6V
Applications: Network, Telecom
Supplier Device Package: 20-SO
Part Status: Obsolete
auf Bestellung 1514 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 485+ | 1 EUR |
| PSMN012-25YLC,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 25V 33A LFPAK56
Description: MOSFET N-CH 25V 33A LFPAK56
auf Bestellung 4847 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1924+ | 0.26 EUR |
| N74F534N,602 |
|
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Description: IC FF D-TYPE SNGL 8BIT 20DIP
Produkt ist nicht verfügbar
| BUK654R8-40C,127 |
|
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 25A, 10V
Power Dissipation (Max): 158W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5200 pF @ 25 V
Qualification: AEC-Q101
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 25A, 10V
Power Dissipation (Max): 158W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5200 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1963 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 398+ | 1.22 EUR |
| SPC5775BDK3MME2R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Description: IC MCU 32BIT 4MB FLASH 416MAPBGA
Produkt ist nicht verfügbar