Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35275) > Seite 420 nach 588
Foto | Bezeichnung | Hersteller | Beschreibung |
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BLA1011S-200,112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOT-502B Mounting Type: Chassis Mount Frequency: 1.03GHz ~ 1.09GHz Power - Output: 200W Gain: 13dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Obsolete Voltage - Rated: 75 V Voltage - Test: 36 V Current - Test: 150 mA |
auf Bestellung 48 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC1GU04GW/C125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 2.6mA, 2.6mA Number of Inputs: 1 Supplier Device Package: 5-TSSOP Input Logic Level - High: 1.7V ~ 4.8V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 20 µA |
auf Bestellung 359848 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC1GU04GV-Q100125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 2.6mA, 2.6mA Number of Inputs: 1 Supplier Device Package: 5-TSOP Input Logic Level - High: 1.7V ~ 4.8V Input Logic Level - Low: 0.3V ~ 1.2V Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 20 µA |
auf Bestellung 26648 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC1GU04GW-Q100125 | NXP USA Inc. |
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auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS26AEEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Utilized IC / Part: FS2600, KL25Z Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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KITFS26SKTEVM | NXP USA Inc. | Description: FS26 SAFETY SBC SOCKET BOARD |
Produkt ist nicht verfügbar |
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MK20DX256VMC7R | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MK20DX256VLQ10R | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 42x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 100 DigiKey Programmable: Not Verified |
auf Bestellung 999 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX256VMD10557 | NXP USA Inc. | Description: KINETIS K20, F/S USB, MIXED-SIGN |
Produkt ist nicht verfügbar |
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MK20DX256VMC10557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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OM27462CDKP | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: PN7462 Type: Near Field Communication (NFC) Supplied Contents: Board(s), Accessories Part Status: Active |
auf Bestellung 138 Stücke: Lieferzeit 10-14 Tag (e) |
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PNEV7462B | NXP USA Inc. |
Description: NFC DEV BOARD - PN7462 Packaging: Bulk For Use With/Related Products: PN7462 Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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BYV10-600P127 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC144TMB315 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 47 kOhms Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 189900 Stücke: Lieferzeit 10-14 Tag (e) |
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PDTC144EMB315 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: NPN - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 230 MHz Resistor - Base (R1): 47 kOhms Resistor - Emitter Base (R2): 47 kOhms Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 57856 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6815TD/15P,125 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74A, SOT-753 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 35 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 5-TSOP Voltage - Output (Min/Fixed): 1.5V Control Features: Enable PSRR: 75dB (1kHz) Voltage Dropout (Max): 0.25V @ 150mA (Typ) Protection Features: Over Current, Transient Voltage Current - Supply (Max): 150 µA |
auf Bestellung 82957 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1023ASN7KNLB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
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LS1023ASE7MNLB | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LS1043ASN7KNLB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 621-FCPBGA (21x21) Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5) USB: USB 3.0 (3) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
Produkt ist nicht verfügbar |
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BLA6H1011-600,112 | NXP USA Inc. |
Description: TRANS AVIONICS PWR LDMOS SOT539A Packaging: Tube |
auf Bestellung 19 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL24Z64VLH4557 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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S912XEP100W1MALR | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 112LQFP Packaging: Tape & Reel (TR) Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 1MB (1M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Active Number of I/O: 91 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PN7120A0EV/C10801,518 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 453651 Stücke: Lieferzeit 10-14 Tag (e) |
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PN7120A0EV/C10801551 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 8330 Stücke: Lieferzeit 10-14 Tag (e) |
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OM26630FDK | NXP USA Inc. |
Description: EVAL BOARD FOR CLRC663 Packaging: Bulk For Use With/Related Products: CLRC663 Frequency: 13.56MHz Type: RFID Reader Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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CLRC66302HN151 | NXP USA Inc. |
![]() Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1549JBD100K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 24x12b SAR; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
auf Bestellung 684 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1549JBD64 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LPC1549JBD64151 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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LPC1549JBD100551 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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PEMI1QFN/WP,315 | NXP USA Inc. |
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auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2212FBD144/01551 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MK02FN64VFM10R | NXP USA Inc. | Description: IC MCU 32BIT 64KB FLASH 32QFN |
Produkt ist nicht verfügbar |
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MPF5020AMBA0ES | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4051PW/C118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74LV4051PW/C1118 | NXP USA Inc. |
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auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4051PW/AU118 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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74LV4051PW/C4118 | NXP USA Inc. |
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auf Bestellung 5484 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP3G34GT115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 3 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 8-XSON (1.95x1) Part Status: Active |
auf Bestellung 25000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC3G34DP-Q100125 | NXP USA Inc. |
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auf Bestellung 2616 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC3G34GD,125 | NXP USA Inc. |
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auf Bestellung 56414 Stücke: Lieferzeit 10-14 Tag (e) |
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NTS0104GU12115 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MC68306EH16B | NXP USA Inc. |
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auf Bestellung 3863 Stücke: Lieferzeit 10-14 Tag (e) |
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MC68306CEH16B | NXP USA Inc. |
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auf Bestellung 1752 Stücke: Lieferzeit 10-14 Tag (e) |
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NTP53321G0JHKZ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C Type: RFID Reader Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.62V ~ 5.5V Standards: NFC, ISO 15693 Supplier Device Package: 16-XQFN (1.8x2.6) Part Status: Active |
auf Bestellung 3630 Stücke: Lieferzeit 10-14 Tag (e) |
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TEF6901AH/V5S | NXP USA Inc. |
Description: TEF6901AH - INTEGRATED CAR RADIO Packaging: Bulk Part Status: Active |
auf Bestellung 840 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-KV58F220M | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: KV5x Platform: Tower System Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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S9KEAZN8AVTGR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16TSSOP Packaging: Cut Tape (CT) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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FRDM-KEAZN32Q64 | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: KEA Platform: Freedom Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC54016JET100E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 360K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SLN-LOCAL2-IOT | NXP USA Inc. |
![]() Packaging: Bulk Function: Voice Recognition Type: Audio Utilized IC / Part: RT106S Supplied Contents: Board(s), Cable(s) Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106ADVL6B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 179 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT106ACVL5B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 528MHz Program Memory Size: 128KB (128K x 8) RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Supplier Device Package: 196-MAPBGA (10x10) Part Status: Active Number of I/O: 127 DigiKey Programmable: Not Verified |
auf Bestellung 63 Stücke: Lieferzeit 10-14 Tag (e) |
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LS1084AXE7PTA | NXP USA Inc. |
Description: IC MPU QORLQ LS1 1.4GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 + PHY (2) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: DDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART |
Produkt ist nicht verfügbar |
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TDA18204HN/C1 | NXP USA Inc. |
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auf Bestellung 2085 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVC1T45GW-Q100125 | NXP USA Inc. |
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auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVCH1T45GW-Q100125 | NXP USA Inc. |
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auf Bestellung 150944 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1115FET48/303151 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I²C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Part Status: Active Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 186 Stücke: Lieferzeit 10-14 Tag (e) |
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MCIMX6Y1CVK05AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CAN, I2C, SPI, UART |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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PTN5110THQZ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 16HX2QFN Packaging: Cut Tape (CT) Package / Case: 16-XFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C Applications: USB Supplier Device Package: 16-HX2QFN (2.6x2.6) Part Status: Obsolete |
Produkt ist nicht verfügbar |
BLA1011S-200,112 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 36V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Power - Output: 200W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 75 V
Voltage - Test: 36 V
Current - Test: 150 mA
Description: RF MOSFET LDMOS 36V SOT502B
Packaging: Bulk
Package / Case: SOT-502B
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Power - Output: 200W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Obsolete
Voltage - Rated: 75 V
Voltage - Test: 36 V
Current - Test: 150 mA
auf Bestellung 48 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1+ | 630.5 EUR |
74HC1GU04GW/C125 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Description: IC INVERTER 1CH 1-INP 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
auf Bestellung 359848 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7212+ | 0.07 EUR |
74HC1GU04GV-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
Description: IC INVERTER 1CH 1-INP SC74A
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 2.6mA, 2.6mA
Number of Inputs: 1
Supplier Device Package: 5-TSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 18ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 20 µA
auf Bestellung 26648 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5657+ | 0.088 EUR |
74HC1GU04GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5TSSOP
Description: IC INVERTER 1CH 1-INP 5TSSOP
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)KITFS26AEEVM |
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Hersteller: NXP USA Inc.
Description: FS26 SAFETY SBC EVAL BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2600, KL25Z
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
Description: FS26 SAFETY SBC EVAL BOARD
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2600, KL25Z
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 701.04 EUR |
KITFS26SKTEVM |
Hersteller: NXP USA Inc.
Description: FS26 SAFETY SBC SOCKET BOARD
Description: FS26 SAFETY SBC SOCKET BOARD
Produkt ist nicht verfügbar
MK20DX256VMC7R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Produkt ist nicht verfügbar
MK20DX256VLQ10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 100
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 28.88 EUR |
10+ | 23.09 EUR |
100+ | 19.5 EUR |
MK20DX256VMD10557 |
Hersteller: NXP USA Inc.
Description: KINETIS K20, F/S USB, MIXED-SIGN
Description: KINETIS K20, F/S USB, MIXED-SIGN
Produkt ist nicht verfügbar
MK20DX256VMC10557 |
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Hersteller: NXP USA Inc.
Description: MK20DX256VMC10557, KINETIS K20,
Description: MK20DX256VMC10557, KINETIS K20,
Produkt ist nicht verfügbar
OM27462CDKP |
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Hersteller: NXP USA Inc.
Description: NFC DEV KIT - PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
Part Status: Active
Description: NFC DEV KIT - PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Supplied Contents: Board(s), Accessories
Part Status: Active
auf Bestellung 138 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 565.68 EUR |
PNEV7462B |
Hersteller: NXP USA Inc.
Description: NFC DEV BOARD - PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: NFC DEV BOARD - PN7462
Packaging: Bulk
For Use With/Related Products: PN7462
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
BYV10-600P127 |
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Hersteller: NXP USA Inc.
Description: ULTRAFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
Description: ULTRAFAST RECTIFIER DIODE TO 22
Packaging: Bulk
Part Status: Active
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1079+ | 0.45 EUR |
PDTC144TMB315 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 189900 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11225+ | 0.048 EUR |
PDTC144EMB315 |
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Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 57856 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
11225+ | 0.048 EUR |
LD6815TD/15P,125 |
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Hersteller: NXP USA Inc.
Description: IC REG LINEAR 1.5V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.5V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
Description: IC REG LINEAR 1.5V 150MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 35 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.5V
Control Features: Enable
PSRR: 75dB (1kHz)
Voltage Dropout (Max): 0.25V @ 150mA (Typ)
Protection Features: Over Current, Transient Voltage
Current - Supply (Max): 150 µA
auf Bestellung 82957 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3328+ | 0.15 EUR |
LS1023ASN7KNLB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.0GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
LS1023ASE7MNLB |
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Hersteller: NXP USA Inc.
Description: QORIQ 2XCPU 64-BIT ARM ARCH 1.
Description: QORIQ 2XCPU 64-BIT ARM ARCH 1.
Produkt ist nicht verfügbar
LS1043ASN7KNLB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ 1.0GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.0GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Produkt ist nicht verfügbar
BLA6H1011-600,112 |
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 1031.64 EUR |
MKL24Z64VLH4557 |
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Hersteller: NXP USA Inc.
Description: KINETIS KL24: 48MHZ CORTEX-M0+ U
Description: KINETIS KL24: 48MHZ CORTEX-M0+ U
Produkt ist nicht verfügbar
S912XEP100W1MALR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 1MB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PN7120A0EV/C10801,518 |
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Hersteller: NXP USA Inc.
Description: NFC FORUM-COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NFC FORUM-COMPLIANT CONTROLLER W
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 453651 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
56+ | 8.98 EUR |
PN7120A0EV/C10801551 |
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Hersteller: NXP USA Inc.
Description: NFC CONTROLLER, SUPPORTING ALL N
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NFC CONTROLLER, SUPPORTING ALL N
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 8330 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
56+ | 8.98 EUR |
OM26630FDK |
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR CLRC663
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Description: EVAL BOARD FOR CLRC663
Packaging: Bulk
For Use With/Related Products: CLRC663
Frequency: 13.56MHz
Type: RFID Reader
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
CLRC66302HN151 |
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Hersteller: NXP USA Inc.
Description: IC NFC CONTACTLESS TXRX 32HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC NFC CONTACTLESS TXRX 32HVQFN
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1549JBD100K |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
auf Bestellung 684 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 21.23 EUR |
10+ | 16.96 EUR |
90+ | 14.32 EUR |
450+ | 14.24 EUR |
LPC1549JBD64 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC1549JBD64151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Produkt ist nicht verfügbar
LPC1549JBD100551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Produkt ist nicht verfügbar
PEMI1QFN/WP,315 |
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Hersteller: NXP USA Inc.
Description: DATA LINE FILTER
Description: DATA LINE FILTER
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)LPC2212FBD144/01551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Description: IC MCU 16/32B 128KB FLSH 144LQFP
Produkt ist nicht verfügbar
MK02FN64VFM10R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32QFN
Description: IC MCU 32BIT 64KB FLASH 32QFN
Produkt ist nicht verfügbar
MPF5020AMBA0ES |
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Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 10.37 EUR |
10+ | 9.37 EUR |
25+ | 8.94 EUR |
80+ | 7.76 EUR |
230+ | 7.41 EUR |
490+ | 6.76 EUR |
74LV4051PW/C118 |
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Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Description: SINGLE-ENDED MUX, 8 CHANNEL
Produkt ist nicht verfügbar
74LV4051PW/C1118 |
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auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1268+ | 0.39 EUR |
74LV4051PW/AU118 |
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Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Description: SINGLE-ENDED MUX, 8 CHANNEL
Produkt ist nicht verfügbar
74LV4051PW/C4118 |
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Hersteller: NXP USA Inc.
Description: SINGLE-ENDED MUX, 8 CHANNEL
Description: SINGLE-ENDED MUX, 8 CHANNEL
auf Bestellung 5484 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1110+ | 0.43 EUR |
74AUP3G34GT115 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
Part Status: Active
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.95x1)
Part Status: Active
auf Bestellung 25000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2145+ | 0.25 EUR |
74HC3G34DP-Q100125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8TSSOP
Description: IC BUFFER NON-INVERT 6V 8TSSOP
auf Bestellung 2616 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1682+ | 0.32 EUR |
74HC3G34GD,125 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Description: IC BUFFER NON-INVERT 6V 8XSON
auf Bestellung 56414 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1803+ | 0.3 EUR |
NTS0104GU12115 |
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Hersteller: NXP USA Inc.
Description: DUAL SUPPLY TRANSLATING TRANSCEI
Description: DUAL SUPPLY TRANSLATING TRANSCEI
Produkt ist nicht verfügbar
MC68306EH16B |
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Hersteller: NXP USA Inc.
Description: EC000 MICROPROCESSOR IC M683XX 1
Description: EC000 MICROPROCESSOR IC M683XX 1
auf Bestellung 3863 Stücke:
Lieferzeit 10-14 Tag (e)MC68306CEH16B |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, 32-BIT, 16.67MHZ
Description: MICROPROCESSOR, 32-BIT, 16.67MHZ
auf Bestellung 1752 Stücke:
Lieferzeit 10-14 Tag (e)NTP53321G0JHKZ |
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Hersteller: NXP USA Inc.
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
Description: NTAG
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C
Type: RFID Reader
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 5.5V
Standards: NFC, ISO 15693
Supplier Device Package: 16-XQFN (1.8x2.6)
Part Status: Active
auf Bestellung 3630 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 3.1 EUR |
10+ | 2.33 EUR |
25+ | 2.1 EUR |
100+ | 1.81 EUR |
250+ | 1.66 EUR |
500+ | 1.56 EUR |
1000+ | 1.48 EUR |
TEF6901AH/V5S |
Hersteller: NXP USA Inc.
Description: TEF6901AH - INTEGRATED CAR RADIO
Packaging: Bulk
Part Status: Active
Description: TEF6901AH - INTEGRATED CAR RADIO
Packaging: Bulk
Part Status: Active
auf Bestellung 840 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
34+ | 14.84 EUR |
TWR-KV58F220M |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM KV5X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: KV5x
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM KV5X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: KV5x
Platform: Tower System
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 319.84 EUR |
S9KEAZN8AVTGR |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FRDM-KEAZN32Q64 |
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Hersteller: NXP USA Inc.
Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
Description: FREEDOM KEA EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KEA
Platform: Freedom
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 187.7 EUR |
LPC54016JET100E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 360K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SLN-LOCAL2-IOT |
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Hersteller: NXP USA Inc.
Description: DEV KIT I.MX RT106S/RT105S
Packaging: Bulk
Function: Voice Recognition
Type: Audio
Utilized IC / Part: RT106S
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: DEV KIT I.MX RT106S/RT105S
Packaging: Bulk
Function: Voice Recognition
Type: Audio
Utilized IC / Part: RT106S
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 295.82 EUR |
MIMXRT106ADVL6B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 179 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.48 EUR |
10+ | 20.37 EUR |
80+ | 17.2 EUR |
MIMXRT106ACVL5B |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB ROM 196MAPBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Part Status: Active
Number of I/O: 127
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 31.66 EUR |
10+ | 25.31 EUR |
LS1084AXE7PTA |
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LS1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Description: IC MPU QORLQ LS1 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: DDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC, I2C, IFC, PCI, SPI, UART
Produkt ist nicht verfügbar
TDA18204HN/C1 |
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Hersteller: NXP USA Inc.
Description: MICROPROCESSOR CIRCUIT, CMOS, PQ
Description: MICROPROCESSOR CIRCUIT, CMOS, PQ
auf Bestellung 2085 Stücke:
Lieferzeit 10-14 Tag (e)74AVC1T45GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)74AVCH1T45GW-Q100125 |
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Hersteller: NXP USA Inc.
Description: BUS TRANSCEIVER, AVC SERIES
Description: BUS TRANSCEIVER, AVC SERIES
auf Bestellung 150944 Stücke:
Lieferzeit 10-14 Tag (e)LPC1115FET48/303151 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Bulk
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Part Status: Active
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 186 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
98+ | 5.4 EUR |
MCIMX6Y1CVK05AB |
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Hersteller: NXP USA Inc.
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, I2C, SPI, UART
Description: IC MPU I.MX6 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.8V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Part Status: Active
Additional Interfaces: CAN, I2C, SPI, UART
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 26.72 EUR |
10+ | 21.36 EUR |
80+ | 18.04 EUR |
520+ | 17.93 EUR |
PTN5110THQZ |
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Description: IC INTFACE SPECIALIZED 16HX2QFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
Applications: USB
Supplier Device Package: 16-HX2QFN (2.6x2.6)
Part Status: Obsolete
Produkt ist nicht verfügbar