Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35439) > Seite 417 nach 591
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LPC11A14JBD48/30QL | NXP USA Inc. | Description: IC MCU 32BIT 32KB FLASH 48LQFP |
auf Bestellung 8470 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT08DB,112 | NXP USA Inc. |
 Description: IC GATE AND 4CH 2-INP 14SSOPPackaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 15mA, 20mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF Part Status: Active Number of Circuits: 4 Current - Quiescent (Max): 50 µA |
auf Bestellung 1659 Stücke: Lieferzeit 10-14 Tag (e) |
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74ABT08PW,118 | NXP USA Inc. |
Description: IC GATE AND 4CH 2-INP 14-TSSOP Packaging: Bulk |
auf Bestellung 956 Stücke: Lieferzeit 10-14 Tag (e) |
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MKS20FN128VLH12 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 128KB (128K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 1x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKS22FN128VLL12 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFP |
Produkt ist nicht verfügbar |
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PDTD143ET215 | NXP USA Inc. | Description: NOW NEXPERIA SMALL SIGNAL BIPOLA |
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TEA2016AAT/1J | NXP USA Inc. |
Description: RESONANT POWER SUPPLY WITH PFC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 2.35V ~ 4.5V Applications: Digital Power Controller Supplier Device Package: 16-SO Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCZ33903C3EKR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Bulk Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905DS3EKR2,518 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V Packaging: Bulk Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Current - Supply: 2.8mA Supplier Device Package: 32-HSOP Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 949 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33905CD5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 54SOIC Packaging: Tube Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 54-SOIC-EP |
auf Bestellung 114 Stücke: Lieferzeit 10-14 Tag (e) |
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MCZ33903D5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Bulk Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
auf Bestellung 2606 Stücke: Lieferzeit 10-14 Tag (e) |
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| SA58672UK027 | NXP USA Inc. |
Description: AUDIO AMPLIFIER 3W |
Produkt ist nicht verfügbar |
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SA58672UK,027 | NXP USA Inc. |
Description: IC AMP CLASS D MONO 3W 9WLCSP Packaging: Cut Tape (CT) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 9-UFBGA, WLCSP Output Type: 1-Channel (Mono) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2V ~ 5.5V Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm Supplier Device Package: 9-WLCSP (1.66x1.71) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SA58637BS,118 | NXP USA Inc. |
Description: IC AMP CLSS AB STER 2.2W 20HVQFN |
Produkt ist nicht verfügbar |
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LPC43S20FBD144551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Bulk Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 204MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 83 |
Produkt ist nicht verfügbar |
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| 74HC4050PW118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 16TSSOP |
Produkt ist nicht verfügbar |
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MKS22FN256VLH12557 | NXP USA Inc. |
Description: KINETIS S 32-BIT MCU, ARM CORTEX |
auf Bestellung 171 Stücke: Lieferzeit 10-14 Tag (e) |
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MKS20FN256VLL12557 | NXP USA Inc. |
Description: KINETIS S 32-BIT MCU, ARM CORTEX |
auf Bestellung 720 Stücke: Lieferzeit 10-14 Tag (e) |
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| PESD5V0C1USF315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0V2BM315 | NXP USA Inc. |
Description: TVS DIODE |
auf Bestellung 1730000 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0C1BSF315 | NXP USA Inc. |
Description: TVS DIODE |
Produkt ist nicht verfügbar |
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PESD5V0R1BSF315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Type: Zener Operating Temperature: -40°C ~ 125°C (TA) Applications: General Purpose Capacitance @ Frequency: 0.1pF @ 2.5GHz Current - Peak Pulse (10/1000µs): 4.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DSN0603-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 6V Voltage - Clamping (Max) @ Ipp: 5V Power Line Protection: No |
auf Bestellung 3054553 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0X2UMB315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TA) Capacitance @ Frequency: 0.5pF @ 1MHz Current - Peak Pulse (10/1000µs): 1.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006B-3 Unidirectional Channels: 2 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 14V Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 2355334 Stücke: Lieferzeit 10-14 Tag (e) |
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PESD5V0X2UAMB315 | NXP USA Inc. |
Description: TVS DIODE Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Type: Zener Operating Temperature: 150°C (TJ) Applications: Telecom Capacitance @ Frequency: 0.8pF @ 1MHz Current - Peak Pulse (10/1000µs): 2.5A (8/20µs) Voltage - Reverse Standoff (Typ): 5V (Max) Supplier Device Package: DFN1006B-3 Unidirectional Channels: 1 Voltage - Breakdown (Min): 7.5V Voltage - Clamping (Max) @ Ipp: 14V Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1401019 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G02DP-Q100125 | NXP USA Inc. |
Description: IC GATE NOR 2CH 2-INP 8TSSOP Packaging: Bulk Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 8-TSSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 20 µA Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G04GV-Q100125 | NXP USA Inc. |
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP Packaging: Bulk Features: Schmitt Trigger Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 6-TSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF Part Status: Active Number of Circuits: 2 Current - Quiescent (Max): 1 µA Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74HC2G86DP-Q100125 | NXP USA Inc. |
Description: IC GATE XOR 2CH 2-INP 8TSSOP |
auf Bestellung 62100 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G66DP-Q100125 | NXP USA Inc. |
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HC2G126GD,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 1 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 8-XSON, SOT996-2 (2x3) Part Status: Obsolete |
auf Bestellung 105210 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC2G125GD125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 6V 8XSON |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860PCZQ50D4-NXP | NXP USA Inc. |
Description: IC MPU MPC86XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Active |
Produkt ist nicht verfügbar |
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MPC850DSLCZQ50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC855TZQ50D4-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk |
auf Bestellung 1433 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860TZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 154 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC860DPZQ50D4557-NXP | NXP USA Inc. |
Description: IC MPU MPC86XX 50MHZ 357BGA Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MPC850CZQ50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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SVF521R3K2CMK4 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 364LFBGA Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
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| T2080NSE8TTB | NXP USA Inc. |
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA Packaging: Tray Package / Case: 896-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Supplier Device Package: 896-FCPBGA (25x25) Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) |
Produkt ist nicht verfügbar |
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MCIMX537CVP8C2R2 | NXP USA Inc. |
Description: IC MPU I.MX53 800MHZ 529FBGA Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD, LVDS Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Part Status: Active Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
Produkt ist nicht verfügbar |
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74LVC573ADB,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 1.5ns Supplier Device Package: 20-SSOP |
auf Bestellung 85536 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC573ABXX | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN Packaging: Bulk Package / Case: 20-XFQFN Exposed Pad Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.2V ~ 3.6V Independent Circuits: 1 Current - Output High, Low: 24mA, 24mA Delay Time - Propagation: 1.5ns Supplier Device Package: 20-DHXQFN (4.5x2.5) |
auf Bestellung 261900 Stücke: Lieferzeit 10-14 Tag (e) |
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| 74HCT7540N112 | NXP USA Inc. | Description: IC BUFFER INVERT 5.5V 20DIP |
Produkt ist nicht verfügbar |
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NX7002BKMB315 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk |
Produkt ist nicht verfügbar |
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NX7002BKXB147 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk |
auf Bestellung 1459345 Stücke: Lieferzeit 10-14 Tag (e) |
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NX7002BKS115 | NXP USA Inc. |
Description: MOSFET Packaging: Bulk |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AVC4T245PW-Q100118 | NXP USA Inc. |
Description: IC TRANSLATION TXRX 3.6V 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Translation Transceiver Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 2 Current - Output High, Low: 12mA, 12mA Supplier Device Package: 16-TSSOP Part Status: Active |
auf Bestellung 968 Stücke: Lieferzeit 10-14 Tag (e) |
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TEA1998TS/1115 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
Produkt ist nicht verfügbar |
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TEA1993TS/1 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
Produkt ist nicht verfügbar |
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TEA1993TS/1125 | NXP USA Inc. |
Description: GREENCHIP SYNCHRONOUS RECTIFIER |
Produkt ist nicht verfügbar |
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TEA2208T/1J | NXP USA Inc. |
Description: BRIDGE RECTIFIER CONTROLLER S014 Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
Produkt ist nicht verfügbar |
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TEA2208T/1J | NXP USA Inc. |
Description: BRIDGE RECTIFIER CONTROLLER S014 Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0V ~ 440V Applications: Desktop, Notebook PCs Current - Supply: 2mA Supplier Device Package: 14-SO |
auf Bestellung 2725 Stücke: Lieferzeit 10-14 Tag (e) |
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74AXP1G11GSH | NXP USA Inc. |
Description: IC GATE AND 1CH 3-INP 6XSON Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: AND Gate Operating Temperature: -40°C ~ 85°C Voltage - Supply: 0.7V ~ 2.75V Current - Output High, Low: 8mA, 8mA Number of Inputs: 3 Supplier Device Package: 6-XSON, SOT1202 (1x1) Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF Part Status: Active Number of Circuits: 1 Current - Quiescent (Max): 600 nA |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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IP3348CX20,135 | NXP USA Inc. |
Description: FILTER LC(PI) 15NH/25PF ESD SMD Packaging: Bulk Package / Case: 20-UFBGA, WLCSP Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 15nH (Total), C = 25pF (Total) Height: 0.026" (0.65mm) Attenuation Value: 40dB @ 1GHz ~ 3GHz Filter Order: 3rd Applications: Data Lines for Mobile Devices Technology: LC (Pi) Center / Cutoff Frequency: 350MHz (Cutoff) Resistance - Channel (Ohms): 10 ESD Protection: Yes Part Status: Obsolete Number of Channels: 8 Current: 20 mA |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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| IP3088CX20,135 | NXP USA Inc. |
Description: IP3088CX20 - CONSUMER CIRCUIT Packaging: Bulk Package / Case: 20-WFBGA, WLCSP Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: L = 40nH (Total), C = 42pF (Total) Height: 0.028" (0.70mm) Attenuation Value: 40dB @ 800MHz ~ 1.5GHz Filter Order: 5th Applications: GSM, LAN, PCS, WAN Technology: LC (Pi) Center / Cutoff Frequency: 175MHz (Cutoff) Resistance - Channel (Ohms): 18 ESD Protection: Yes Part Status: Active Number of Channels: 8 Current: 30 mA |
auf Bestellung 19902 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1225FBD48/301EL | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 45MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
auf Bestellung 1062 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1225FBD48/301151 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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LPC1225FBD48/321151 | NXP USA Inc. |
Description: IC MCU 32BIT 80KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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BLF7G10L-250,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V LDMOST Packaging: Tube Package / Case: SOT-502A Frequency: 920MHz ~ 960MHz Power - Output: 60W Gain: 19.5dB Technology: LDMOS Supplier Device Package: LDMOST Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
auf Bestellung 78 Stücke: Lieferzeit 10-14 Tag (e) |
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BLF7G10LS-250,112 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V SOT502B Packaging: Tube Package / Case: SOT-502B Current Rating (Amps): 5µA Mounting Type: Chassis Mount Frequency: 869MHz ~ 960MHz Power - Output: 250W Gain: 19.5dB Technology: LDMOS Supplier Device Package: SOT502B Part Status: Active Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 1.8 A |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33FS4500LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP LINEAR 0.5A V |
Produkt ist nicht verfügbar |
| LPC11A14JBD48/30QL |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Description: IC MCU 32BIT 32KB FLASH 48LQFP
auf Bestellung 8470 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 100+ | 5.35 EUR |
| 74ABT08DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
Description: IC GATE AND 4CH 2-INP 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 15mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 3.4ns @ 5V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 50 µA
auf Bestellung 1659 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 523+ | 0.9 EUR |
| 74ABT08PW,118 |
|
auf Bestellung 956 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 956+ | 0.6 EUR |
| MKS20FN128VLH12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 1x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKS22FN128VLL12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Produkt ist nicht verfügbar
| PDTD143ET215 |
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Description: NOW NEXPERIA SMALL SIGNAL BIPOLA
Produkt ist nicht verfügbar
| TEA2016AAT/1J |
|
Hersteller: NXP USA Inc.
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Description: RESONANT POWER SUPPLY WITH PFC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 2.35V ~ 4.5V
Applications: Digital Power Controller
Supplier Device Package: 16-SO
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCZ33903C3EKR2 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 68+ | 7.03 EUR |
| MCZ33905DS3EKR2,518 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Qualification: AEC-Q101
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 56+ | 8.68 EUR |
| MCZ33905CD5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
Description: IC INTERFACE SPECIALIZED 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 54-SOIC-EP
auf Bestellung 114 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 53+ | 9.34 EUR |
| MCZ33903D5EK |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
auf Bestellung 2606 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 66+ | 7.38 EUR |
| SA58672UK,027 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D MONO 3W 9WLCSP
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 5.5V
Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.66x1.71)
Part Status: Obsolete
Description: IC AMP CLASS D MONO 3W 9WLCSP
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 9-UFBGA, WLCSP
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 5.5V
Max Output Power x Channels @ Load: 3W x 1 @ 4Ohm
Supplier Device Package: 9-WLCSP (1.66x1.71)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA58637BS,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
| LPC43S20FBD144551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
| 74HC4050PW118 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16TSSOP
Description: IC BUFFER NON-INVERT 6V 16TSSOP
Produkt ist nicht verfügbar
| MKS22FN256VLH12557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 171 Stücke:
Lieferzeit 10-14 Tag (e)| MKS20FN256VLL12557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS S 32-BIT MCU, ARM CORTEX
Description: KINETIS S 32-BIT MCU, ARM CORTEX
auf Bestellung 720 Stücke:
Lieferzeit 10-14 Tag (e)| PESD5V0C1USF315 |
|
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8768+ | 0.053 EUR |
| PESD5V0V2BM315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE
Description: TVS DIODE
auf Bestellung 1730000 Stücke:
Lieferzeit 10-14 Tag (e)| PESD5V0R1BSF315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
Description: TVS DIODE
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 0.1pF @ 2.5GHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 5V
Power Line Protection: No
auf Bestellung 3054553 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 7693+ | 0.064 EUR |
| PESD5V0X2UMB315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Capacitance @ Frequency: 0.5pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 2
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 2355334 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3566+ | 0.13 EUR |
| PESD5V0X2UAMB315 |
|
Hersteller: NXP USA Inc.
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: 150°C (TJ)
Applications: Telecom
Capacitance @ Frequency: 0.8pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 5V (Max)
Supplier Device Package: DFN1006B-3
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.5V
Voltage - Clamping (Max) @ Ipp: 14V
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1401019 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4046+ | 0.11 EUR |
| 74HC2G02DP-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Grade: Automotive
Qualification: AEC-Q100
Description: IC GATE NOR 2CH 2-INP 8TSSOP
Packaging: Bulk
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 8-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 20 µA
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1972+ | 0.24 EUR |
| 74HC2G04GV-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Grade: Automotive
Qualification: AEC-Q100
Description: IC INVERT SCHMITT 2CH 2INP 6TSOP
Packaging: Bulk
Features: Schmitt Trigger
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 13ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 2
Current - Quiescent (Max): 1 µA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 74HC2G86DP-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 2CH 2-INP 8TSSOP
Description: IC GATE XOR 2CH 2-INP 8TSSOP
auf Bestellung 62100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2263+ | 0.22 EUR |
| 74HC2G66DP-Q100125 |
|
Hersteller: NXP USA Inc.
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Description: 74HC2G66DP-Q100 - SPST, 2 FUNC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| 74HC2G126GD,125 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
Description: IC BUFFER NON-INVERT 6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 8-XSON, SOT996-2 (2x3)
Part Status: Obsolete
auf Bestellung 105210 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.25 EUR |
| 74HC2G125GD125 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 8XSON
Description: IC BUFFER NON-INVERT 6V 8XSON
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1697+ | 0.31 EUR |
| MPC860PCZQ50D4-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Active
Produkt ist nicht verfügbar
| MPC850DSLCZQ50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 61.73 EUR |
| MPC855TZQ50D4-NXP |
|
auf Bestellung 1433 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 222.45 EUR |
| MPC860TZQ50D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 154 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 237.34 EUR |
| MPC860DPZQ50D4557-NXP |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC86XX 50MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Produkt ist nicht verfügbar
| MPC850CZQ50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Description: IC MPU MPC8XX 50MHZ 256BGA
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 67.04 EUR |
| SVF521R3K2CMK4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
| T2080NSE8TTB |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Produkt ist nicht verfügbar
| MCIMX537CVP8C2R2 |
Hersteller: NXP USA Inc.
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 800MHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD, LVDS
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Part Status: Active
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
| 74LVC573ADB,112 |
|
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-SSOP
Description: IC D-TYPE TRANSP SGL 8:8 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-SSOP
auf Bestellung 85536 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1247+ | 0.39 EUR |
| 74LVC573ABXX |
|
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
Description: IC D-TYPE TRANSP SGL 8:8 20HXQFN
Packaging: Bulk
Package / Case: 20-XFQFN Exposed Pad
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.2V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 24mA, 24mA
Delay Time - Propagation: 1.5ns
Supplier Device Package: 20-DHXQFN (4.5x2.5)
auf Bestellung 261900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1567+ | 0.31 EUR |
| 74HCT7540N112 |
Hersteller: NXP USA Inc.
Description: IC BUFFER INVERT 5.5V 20DIP
Description: IC BUFFER INVERT 5.5V 20DIP
Produkt ist nicht verfügbar
| NX7002BKXB147 |
|
auf Bestellung 1459345 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5495+ | 0.081 EUR |
| NX7002BKS115 |
|
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8242+ | 0.065 EUR |
| 74AVC4T245PW-Q100118 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
Description: IC TRANSLATION TXRX 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 2
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 16-TSSOP
Part Status: Active
auf Bestellung 968 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 968+ | 0.63 EUR |
| TEA1998TS/1115 |
|
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
| TEA1993TS/1 |
|
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
| TEA1993TS/1125 |
|
Hersteller: NXP USA Inc.
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Description: GREENCHIP SYNCHRONOUS RECTIFIER
Produkt ist nicht verfügbar
| TEA2208T/1J |
|
Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Produkt ist nicht verfügbar
| TEA2208T/1J |
|
Hersteller: NXP USA Inc.
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
Description: BRIDGE RECTIFIER CONTROLLER S014
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0V ~ 440V
Applications: Desktop, Notebook PCs
Current - Supply: 2mA
Supplier Device Package: 14-SO
auf Bestellung 2725 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.37 EUR |
| 10+ | 9.37 EUR |
| 25+ | 8.93 EUR |
| 100+ | 7.76 EUR |
| 250+ | 7.41 EUR |
| 500+ | 6.75 EUR |
| 1000+ | 5.88 EUR |
| 74AXP1G11GSH |
|
Hersteller: NXP USA Inc.
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
Description: IC GATE AND 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.7V ~ 2.75V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 3
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Max Propagation Delay @ V, Max CL: 3.2ns @ 2.5V, 5pF
Part Status: Active
Number of Circuits: 1
Current - Quiescent (Max): 600 nA
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3249+ | 0.15 EUR |
| IP3348CX20,135 |
|
Hersteller: NXP USA Inc.
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
Description: FILTER LC(PI) 15NH/25PF ESD SMD
Packaging: Bulk
Package / Case: 20-UFBGA, WLCSP
Size / Dimension: 0.124" L x 0.042" W (3.16mm x 1.06mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 15nH (Total), C = 25pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 40dB @ 1GHz ~ 3GHz
Filter Order: 3rd
Applications: Data Lines for Mobile Devices
Technology: LC (Pi)
Center / Cutoff Frequency: 350MHz (Cutoff)
Resistance - Channel (Ohms): 10
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8
Current: 20 mA
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2049+ | 0.25 EUR |
| IP3088CX20,135 |
|
Hersteller: NXP USA Inc.
Description: IP3088CX20 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
Description: IP3088CX20 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 20-WFBGA, WLCSP
Size / Dimension: 0.156" L x 0.050" W (3.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Part Status: Active
Number of Channels: 8
Current: 30 mA
auf Bestellung 19902 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 807+ | 0.6 EUR |
| LPC1225FBD48/301EL |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 45MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1062 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 11.99 EUR |
| 10+ | 8.19 EUR |
| 25+ | 7.21 EUR |
| 80+ | 6.26 EUR |
| 250+ | 5.58 EUR |
| 500+ | 5.25 EUR |
| 1000+ | 4.98 EUR |
| LPC1225FBD48/301151 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Produkt ist nicht verfügbar
| LPC1225FBD48/321151 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Description: IC MCU 32BIT 80KB FLASH 48LQFP
Produkt ist nicht verfügbar
| BLF7G10L-250,112 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V LDMOST
Packaging: Tube
Package / Case: SOT-502A
Frequency: 920MHz ~ 960MHz
Power - Output: 60W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
auf Bestellung 78 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 179.92 EUR |
| BLF7G10LS-250,112 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
Description: RF MOSFET LDMOS 30V SOT502B
Packaging: Tube
Package / Case: SOT-502B
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 869MHz ~ 960MHz
Power - Output: 250W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: SOT502B
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 1.8 A
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 157.44 EUR |
| MC33FS4500LAER2 |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
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