Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35275) > Seite 418 nach 588
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| NT3H1201W0FHK125 | NXP USA Inc. |
 Description: NTAG I2C 1K - ENERGY HARVESTINGPackaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 3400 Stücke: Lieferzeit 10-14 Tag (e) |
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| SL3S4021FHK125 | NXP USA Inc. |
Description: UCODE I2C UHF RFID Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| NT3H1101W0FHK125 | NXP USA Inc. |
Description: NTAG I2C 1K - ENERGY HARVESTING Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51JF64VHS | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 9x12b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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| SAF4000EL/101S233Y | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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| SAF4000EL/101S233K | NXP USA Inc. |
Description: SOFTWARE DEFINED RADIO Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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MK66FN2M0VLQ18R,528 | NXP USA Inc. |
Description: KINETIS K66, RISC MICROCONTROLLE |
Produkt ist nicht verfügbar |
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16 Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
auf Bestellung 30000 Stücke: Lieferzeit 10-14 Tag (e) |
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CBTU02044HEJ | NXP USA Inc. |
Description: SWITCH 1-2 PCIE GEN4 HUQFN16 Packaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Applications: PCIe On-State Resistance (Max): 14Ohm -3db Bandwidth: 17GHz Supplier Device Package: 16-HUQFN (1.6x2.4) Voltage - Supply, Single (V+): 1.62V ~ 3.63V Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 1:2 Part Status: Active Number of Channels: 2 |
auf Bestellung 38815 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1311FHN33 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1313FHN33/01551 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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| LPC1313FBD48/01 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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| AFT09MS031NR1528 | NXP USA Inc. |
Description: RF POWER LDMOS TRANSISTOR |
auf Bestellung 1139 Stücke: Lieferzeit 10-14 Tag (e) |
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BTA330-800BT127 | NXP USA Inc. |
Description: 3 QUADRANT TRIAC TO 220AB Packaging: Bulk Part Status: Active |
auf Bestellung 3891 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1111FDH20/002518 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 20TSSOP |
Produkt ist nicht verfügbar |
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BAV99QA147 | NXP USA Inc. |
Description: RECTIFIER DIODE Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 170mA (DC) Supplier Device Package: DFN1010D-3 Operating Temperature - Junction: 150°C (Max) Part Status: Active Voltage - DC Reverse (Vr) (Max): 90 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 500 nA @ 80 V |
Produkt ist nicht verfügbar |
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LD6806CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 200MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.1V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6816CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 150MA 4WLCSP |
auf Bestellung 27000 Stücke: Lieferzeit 10-14 Tag (e) |
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LD6836CX4/20P,315 | NXP USA Inc. |
Description: IC REG LINEAR 2V 300MA 4WLCSP Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 2V Control Features: Enable Part Status: Obsolete PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
auf Bestellung 18000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT4852PW-Q100118 | NXP USA Inc. |
Description: DIFFERENTIAL MUX, 4 CHANNEL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HCT4851BQ-Q100115 | NXP USA Inc. |
Description: 74HCT4851 - SINGLE-ENDED MUX Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HCT4851PW/C4118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNEL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HCT4851PW-Q100118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNEL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74HCT4851PW/S400118 | NXP USA Inc. |
Description: SINGLE-ENDED MUX, 8 CHANNEL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC32PW653 | NXP USA Inc. |
Description: IC GATE OR Packaging: Bulk |
auf Bestellung 7500 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-C3V0/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk |
Produkt ist nicht verfügbar |
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| BUK7226-75A118 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Part Status: Active |
auf Bestellung 13044 Stücke: Lieferzeit 10-14 Tag (e) |
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BUK7516-55A,127 | NXP USA Inc. |
Description: PFET, 65.7A I(D), 55V, 0.016OHM, Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc) Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V Power Dissipation (Max): 138W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-220AB Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 55 V Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V |
auf Bestellung 4353 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5744BFK1ACKU2 | NXP USA Inc. | Description: IC MCU 32BIT 1.5MB FLASH 176LQFP |
Produkt ist nicht verfügbar |
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| SPC5744BFK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| SPC5745BFK1AVKU6 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PMFPB8040XP,115 | NXP USA Inc. |
Description: MOSFET P-CH 20V 2.7A HUSON6 Packaging: Bulk Package / Case: 6-UFDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.7A (Ta) Rds On (Max) @ Id, Vgs: 102mOhm @ 2.7A, 4.5V FET Feature: Schottky Diode (Isolated) Power Dissipation (Max): 485mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: 6-HUSON (2x2) Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 8.6 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 550 pF @ 10 V |
auf Bestellung 161589 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA8035H/C1157 | NXP USA Inc. |
Description: HIGH INTEGRATED AND LOW POWER SM Packaging: Bulk Part Status: Active |
auf Bestellung 1519 Stücke: Lieferzeit 10-14 Tag (e) |
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TDA8007BHL/C4,118 | NXP USA Inc. |
Description: IC INTERFACE CARD MP 48LQFP |
auf Bestellung 9477 Stücke: Lieferzeit 10-14 Tag (e) |
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| TDA8026ET/C3/S1518 | NXP USA Inc. |
Description: MULTIPLE SMART CARD SLOT INTERFA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| TDA8026ET/C2518 | NXP USA Inc. |
Description: IC SMART CARD SLOT 64TFBGA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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TDA8763M/4/C4,112 | NXP USA Inc. |
Description: IC ADC 10BIT SIGMA-DELTA 28SSOP Packaging: Bulk Package / Case: 28-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Bits: 10 Configuration: ADC Data Interface: Parallel Reference Type: Internal Operating Temperature: -40°C ~ 85°C Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Sampling Rate (Per Second): 40M Input Type: Single Ended Number of Inputs: 1 Supplier Device Package: 28-SSOP Architecture: Sigma-Delta Part Status: Obsolete Number of A/D Converters: 1 |
auf Bestellung 658 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08DZ32F2CLC | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| LPC3220FET296/01551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 296TFBGA Packaging: Bulk Package / Case: 296-TFBGA Mounting Type: Surface Mount Speed: 266MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM926EJ-S Data Converters: A/D 3x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT Supplier Device Package: 296-TFBGA (15x15) Part Status: Active Number of I/O: 51 |
Produkt ist nicht verfügbar |
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| OM11079598 | NXP USA Inc. |
Description: SOMDIMM-LPC3250 - MODULAR LPC325 Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MC33FS6600M2ES | NXP USA Inc. |
Description: SAFETY SBC FOR S32S2 MCU Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Applications: Safety Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive |
auf Bestellung 255 Stücke: Lieferzeit 10-14 Tag (e) |
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| BUK724R5-30C118 | NXP USA Inc. |
Description: N-CHANNEL POWER MOSFET Packaging: Bulk Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V Power Dissipation (Max): 157W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: DPAK Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V |
auf Bestellung 8878 Stücke: Lieferzeit 10-14 Tag (e) |
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BT234-600D,127 | NXP USA Inc. |
Description: TRIAC 600V 4A TO220AB Packaging: Bulk Package / Case: TO-220-3 Mounting Type: Through Hole Triac Type: Standard Configuration: Single Operating Temperature: 125°C (TJ) Current - Hold (Ih) (Max): 6 mA Current - Gate Trigger (Igt) (Max): 10 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz Voltage - Gate Trigger (Vgt) (Max): 1 V Supplier Device Package: TO-220AB Current - On State (It (RMS)) (Max): 4 A Voltage - Off State: 600 V |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BT236X-600,127 | NXP USA Inc. |
Description: TRIAC 600V 6A TO-220F Packaging: Bulk |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BT236X-800G,127 | NXP USA Inc. |
Description: TRIAC 800V 6A TO-220F Packaging: Bulk |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BT236X-800,127 | NXP USA Inc. |
Description: TRIAC 800V 6A TO-220F Packaging: Bulk |
auf Bestellung 1150 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1752FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
auf Bestellung 482 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1756FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
auf Bestellung 128 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1759FBD80K | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b SAR; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Part Status: Active Number of I/O: 52 DigiKey Programmable: Not Verified |
auf Bestellung 147 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08EL32F1MTLR | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Part Status: Active Number of I/O: 22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| PXLS84422AESR2 | NXP USA Inc. |
Description: 2 AXIS MED/MED XZ Packaging: Tape & Reel (TR) Part Status: Active |
Produkt ist nicht verfügbar |
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| FS32V234CON1VUB/PHS | NXP USA Inc. |
Description: ARM CORTEX-A53 64-BIT CPU |
Produkt ist nicht verfügbar |
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| FS32V232CKN1VUB | NXP USA Inc. | Description: ISP CSE 1GHZ DUAL CORE |
Produkt ist nicht verfügbar |
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FS32V234BMN1VUB | NXP USA Inc. |
Description: ISP GPU NO CSE 800MHZ |
Produkt ist nicht verfügbar |
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FS32V234BLN1VUB | NXP USA Inc. |
Description: ISP, NO GPU, CSE , LOW P |
Produkt ist nicht verfügbar |
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| FS32V234CON1VUBR | NXP USA Inc. |
Description: ISP GPU CSE 1GHZ 4 CO |
Produkt ist nicht verfügbar |
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| FS32V234CKN1VUBR | NXP USA Inc. |
Description: ISP CSE 1GHZ 4 CORES |
Produkt ist nicht verfügbar |
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74AHCT1G86GV-Q100125 | NXP USA Inc. |
Description: IC GATE XOR Packaging: Bulk Part Status: Active Package / Case: SC-74A, SOT-753 Mounting Type: Surface Mount Logic Type: XOR (Exclusive OR) Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 2 Supplier Device Package: 5-TSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF Grade: Automotive Number of Circuits: 1 Current - Quiescent (Max): 1 µA Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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74LVC1G86GN,132 | NXP USA Inc. |
Description: IC GATE XOR 1CH 2-INP 6XSON |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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LX2160XE72029B | NXP USA Inc. |
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72 Voltage - I/O: 1.2V, 1.8V, 3.3V Supplier Device Package: 1517-FCPBGA (40x40) Ethernet: 100Gbps (2) USB: USB 3.0 (2) + PHY (2) Number of Cores/Bus Width: 16 Core, 64-Bit RAM Controllers: DDR4 Graphics Acceleration: Yes Security Features: Secure Boot, TrustZone® SATA: SATA 3.0 (4) Part Status: Active Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART |
auf Bestellung 52 Stücke: Lieferzeit 10-14 Tag (e) |
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| NT3H1201W0FHK125 |
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Hersteller: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 3400 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 384+ | 1.37 EUR |
| SL3S4021FHK125 |
Hersteller: NXP USA Inc.
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: UCODE I2C UHF RFID
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| NT3H1101W0FHK125 |
Hersteller: NXP USA Inc.
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: NTAG I2C 1K - ENERGY HARVESTING
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF51JF64VHS |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 9x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.2 EUR |
| 10+ | 10.37 EUR |
| 80+ | 8.58 EUR |
| SAF4000EL/101S233Y |
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Description: SOFTWARE DEFINED RADIO
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| SAF4000EL/101S233K |
Produkt ist nicht verfügbar
| MK66FN2M0VLQ18R,528 |
|
Hersteller: NXP USA Inc.
Description: KINETIS K66, RISC MICROCONTROLLE
Description: KINETIS K66, RISC MICROCONTROLLE
Produkt ist nicht verfügbar
| CBTU02044HEJ |
|
Hersteller: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 10000+ | 1.4 EUR |
| CBTU02044HEJ |
|
Hersteller: NXP USA Inc.
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
Description: SWITCH 1-2 PCIE GEN4 HUQFN16
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: PCIe
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 17GHz
Supplier Device Package: 16-HUQFN (1.6x2.4)
Voltage - Supply, Single (V+): 1.62V ~ 3.63V
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 1:2
Part Status: Active
Number of Channels: 2
auf Bestellung 38815 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 2.34 EUR |
| 10+ | 2.11 EUR |
| 25+ | 1.99 EUR |
| 100+ | 1.7 EUR |
| 250+ | 1.59 EUR |
| 500+ | 1.4 EUR |
| LPC1311FHN33 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1313FHN33/01551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Description: IC MCU 32BIT 32KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1313FBD48/01 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
| AFT09MS031NR1528 |
|
Hersteller: NXP USA Inc.
Description: RF POWER LDMOS TRANSISTOR
Description: RF POWER LDMOS TRANSISTOR
auf Bestellung 1139 Stücke:
Lieferzeit 10-14 Tag (e)| BTA330-800BT127 |
|
auf Bestellung 3891 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 407+ | 1.22 EUR |
| LPC1111FDH20/002518 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Description: IC MCU 32BIT 8KB FLASH 20TSSOP
Produkt ist nicht verfügbar
| BAV99QA147 |
|
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 170mA (DC)
Supplier Device Package: DFN1010D-3
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 90 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
| LD6806CX4/20P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.15 EUR |
| LD6816CX4/20P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 150MA 4WLCSP
Description: IC REG LINEAR 2V 150MA 4WLCSP
auf Bestellung 27000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3606+ | 0.15 EUR |
| LD6836CX4/20P,315 |
|
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
Part Status: Obsolete
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 18000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2885+ | 0.17 EUR |
| 74AHC32PW653 |
|
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.14 EUR |
| BUK7226-75A118 |
|
auf Bestellung 13044 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 951+ | 0.56 EUR |
| BUK7516-55A,127 |
|
Hersteller: NXP USA Inc.
Description: PFET, 65.7A I(D), 55V, 0.016OHM,
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V
Description: PFET, 65.7A I(D), 55V, 0.016OHM,
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 65.7A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 25A, 10V
Power Dissipation (Max): 138W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 2245 pF @ 25 V
auf Bestellung 4353 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 740+ | 0.68 EUR |
| SPC5744BFK1ACKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Produkt ist nicht verfügbar
| SPC5744BFK1AVKU2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SPC5745BFK1AVKU6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PMFPB8040XP,115 |
|
Hersteller: NXP USA Inc.
Description: MOSFET P-CH 20V 2.7A HUSON6
Packaging: Bulk
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.7A (Ta)
Rds On (Max) @ Id, Vgs: 102mOhm @ 2.7A, 4.5V
FET Feature: Schottky Diode (Isolated)
Power Dissipation (Max): 485mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 8.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 550 pF @ 10 V
Description: MOSFET P-CH 20V 2.7A HUSON6
Packaging: Bulk
Package / Case: 6-UFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.7A (Ta)
Rds On (Max) @ Id, Vgs: 102mOhm @ 2.7A, 4.5V
FET Feature: Schottky Diode (Isolated)
Power Dissipation (Max): 485mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 8.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 550 pF @ 10 V
auf Bestellung 161589 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1567+ | 0.32 EUR |
| TDA8035H/C1157 |
|
Hersteller: NXP USA Inc.
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
Part Status: Active
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
Part Status: Active
auf Bestellung 1519 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 436+ | 1.21 EUR |
| TDA8007BHL/C4,118 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE CARD MP 48LQFP
Description: IC INTERFACE CARD MP 48LQFP
auf Bestellung 9477 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 82+ | 6.5 EUR |
| TDA8026ET/C3/S1518 |
|
Hersteller: NXP USA Inc.
Description: MULTIPLE SMART CARD SLOT INTERFA
Packaging: Bulk
Part Status: Active
Description: MULTIPLE SMART CARD SLOT INTERFA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| TDA8026ET/C2518 |
|
Produkt ist nicht verfügbar
| TDA8763M/4/C4,112 |
|
Hersteller: NXP USA Inc.
Description: IC ADC 10BIT SIGMA-DELTA 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Architecture: Sigma-Delta
Part Status: Obsolete
Number of A/D Converters: 1
Description: IC ADC 10BIT SIGMA-DELTA 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Bits: 10
Configuration: ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 40M
Input Type: Single Ended
Number of Inputs: 1
Supplier Device Package: 28-SSOP
Architecture: Sigma-Delta
Part Status: Obsolete
Number of A/D Converters: 1
auf Bestellung 658 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 20+ | 27.37 EUR |
| S9S08DZ32F2CLC |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC3220FET296/01551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Bulk
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Active
Number of I/O: 51
Produkt ist nicht verfügbar
| OM11079598 |
Hersteller: NXP USA Inc.
Description: SOMDIMM-LPC3250 - MODULAR LPC325
Packaging: Bulk
Part Status: Active
Description: SOMDIMM-LPC3250 - MODULAR LPC325
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MC33FS6600M2ES |
Hersteller: NXP USA Inc.
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Description: SAFETY SBC FOR S32S2 MCU
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Applications: Safety
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
auf Bestellung 255 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 18.22 EUR |
| 10+ | 16.74 EUR |
| 25+ | 16.05 EUR |
| 80+ | 14.14 EUR |
| BUK724R5-30C118 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 25A, 10V
Power Dissipation (Max): 157W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: DPAK
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
auf Bestellung 8878 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 683+ | 0.77 EUR |
| BT234-600D,127 |
|
Hersteller: NXP USA Inc.
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 6 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
Description: TRIAC 600V 4A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 6 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A @ 50Hz
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1095+ | 0.44 EUR |
| BT236X-600,127 |
|
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 846+ | 0.58 EUR |
| BT236X-800G,127 |
|
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 846+ | 0.58 EUR |
| BT236X-800,127 |
|
auf Bestellung 1150 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 846+ | 0.58 EUR |
| LPC1752FBD80K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 482 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 13.27 EUR |
| 10+ | 10.43 EUR |
| 119+ | 8.64 EUR |
| LPC1756FBD80K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 128 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 22.18 EUR |
| 10+ | 17.43 EUR |
| 119+ | 14.43 EUR |
| LPC1759FBD80K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b SAR; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 52
DigiKey Programmable: Not Verified
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.62 EUR |
| 10+ | 19.67 EUR |
| 119+ | 16.61 EUR |
| S9S08EL32F1MTLR |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| PXLS84422AESR2 |
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/MED XZ
Packaging: Tape & Reel (TR)
Part Status: Active
Description: 2 AXIS MED/MED XZ
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
| FS32V234CON1VUB/PHS |
|
Hersteller: NXP USA Inc.
Description: ARM CORTEX-A53 64-BIT CPU
Description: ARM CORTEX-A53 64-BIT CPU
Produkt ist nicht verfügbar
| FS32V232CKN1VUB |
Hersteller: NXP USA Inc.
Description: ISP CSE 1GHZ DUAL CORE
Description: ISP CSE 1GHZ DUAL CORE
Produkt ist nicht verfügbar
| FS32V234BMN1VUB |
|
Hersteller: NXP USA Inc.
Description: ISP GPU NO CSE 800MHZ
Description: ISP GPU NO CSE 800MHZ
Produkt ist nicht verfügbar
| FS32V234BLN1VUB |
|
Hersteller: NXP USA Inc.
Description: ISP, NO GPU, CSE , LOW P
Description: ISP, NO GPU, CSE , LOW P
Produkt ist nicht verfügbar
| FS32V234CON1VUBR |
|
Hersteller: NXP USA Inc.
Description: ISP GPU CSE 1GHZ 4 CO
Description: ISP GPU CSE 1GHZ 4 CO
Produkt ist nicht verfügbar
| FS32V234CKN1VUBR |
|
Hersteller: NXP USA Inc.
Description: ISP CSE 1GHZ 4 CORES
Description: ISP CSE 1GHZ 4 CORES
Produkt ist nicht verfügbar
| 74AHCT1G86GV-Q100125 |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Description: IC GATE XOR
Packaging: Bulk
Part Status: Active
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Logic Type: XOR (Exclusive OR)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 2
Supplier Device Package: 5-TSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 7.9ns @ 5V, 50pF
Grade: Automotive
Number of Circuits: 1
Current - Quiescent (Max): 1 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 74LVC1G86GN,132 |
|
Hersteller: NXP USA Inc.
Description: IC GATE XOR 1CH 2-INP 6XSON
Description: IC GATE XOR 1CH 2-INP 6XSON
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3206+ | 0.14 EUR |
| LX2160XE72029B |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Part Status: Active
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
auf Bestellung 52 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 894.26 EUR |