Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35274) > Seite 413 nach 588
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MMA8205KEG | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MMA8205KEGR2 | NXP USA Inc. |
Description: IC SENSOR ACCEL X-AXIS SOIC16 Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X or Y Acceleration Range: ±50g Voltage - Supply: 6.3V ~ 30V Supplier Device Package: 16-SOIC Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| A7001CMHN1/T1AGB39 | NXP USA Inc. |
 Description: SECURE AUTHENTICATION MICROCONTR |
Produkt ist nicht verfügbar |
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| A7002CMHN1/T1AGB39 | NXP USA Inc. | Description: SECURE AUTHENTICATION MICROCONTR |
auf Bestellung 1098 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX84-B22/DG/B3215 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk |
auf Bestellung 114000 Stücke: Lieferzeit 10-14 Tag (e) |
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BFS540,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SOT323-3 Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz Supplier Device Package: SC-70 |
Produkt ist nicht verfügbar |
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BFS540,115 | NXP USA Inc. |
Description: RF TRANS NPN 15V 9GHZ SOT323-3 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 500mW Current - Collector (Ic) (Max): 120mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz Supplier Device Package: SC-70 |
Produkt ist nicht verfügbar |
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PMF63UN,115 | NXP USA Inc. |
Description: MOSFET N-CH 20V 1.8A SOT323-3 Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta) Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V Power Dissipation (Max): 275mW (Ta), 1.785W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: SC-70 Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V |
auf Bestellung 24542 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMXB120EPE147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
auf Bestellung 648598 Stücke: Lieferzeit 10-14 Tag (e) |
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PMXB75UPE147 | NXP USA Inc. |
Description: P-CHANNEL MOSFET Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
auf Bestellung 4088434 Stücke: Lieferzeit 10-14 Tag (e) |
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PMXB75UPE/M5147 | NXP USA Inc. |
Description: P-CHANNEL MOSFET Packaging: Bulk Package / Case: 3-XDFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V Power Dissipation (Max): 317mW (Ta), 8.33W (Tc) Vgs(th) (Max) @ Id: 1V @ 250µA Supplier Device Package: DFN1010D-3 Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V Vgs (Max): ±8V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V |
auf Bestellung 45000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMZB200UNE315 | NXP USA Inc. |
Description: SMALL SIGNAL N-CHANNEL MOSFET Packaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Supplier Device Package: DFN1006B-3 |
auf Bestellung 156850 Stücke: Lieferzeit 10-14 Tag (e) |
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| PMXB56EN147 | NXP USA Inc. |
Description: SMALL SIGNAL FET |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BF904215 | NXP USA Inc. |
Description: RF SMALL SIGNAL FIELD-EFFECT TRA Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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MKS20FN256VFT12 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48QFN |
Produkt ist nicht verfügbar |
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MKL81Z128CBH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64WLCSP Packaging: Tape & Reel (TR) Package / Case: 64-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-WLCSP (3.48x3.38) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
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MKL81Z128CBH7R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64WLCSP Packaging: Cut Tape (CT) Package / Case: 64-XFBGA, WLCSP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x16b; D/A 1x6b, 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 64-WLCSP (3.48x3.38) Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
auf Bestellung 1753 Stücke: Lieferzeit 10-14 Tag (e) |
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MKL81Z128VMC7557 | NXP USA Inc. |
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S |
auf Bestellung 144344 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1166DVM6A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 121 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1166XVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1160-EVK | NXP USA Inc. |
Description: EVAL KIT I.MX RT1160 Packaging: Bulk Mounting Type: Fixed Type: MCU Contents: Board(s) Core Processor: ARM® Cortex®-M4, Cortex®-M7 Board Type: Evaluation Platform Utilized IC / Part: i.MX RT1160 Platform: EdgeVerse™ Part Status: Active |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165DVM6A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 600MHz RAM Size: 1M x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165CVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 127 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1166CVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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MIMXRT1165XVM5A | NXP USA Inc. |
Description: IC MCU 32BIT EXT MEM 289LFBGA Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 500MHz RAM Size: 1M x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M4/M7 Data Converters: A/D 2x12b; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 289-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 152 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA2213AP/N1112 | NXP USA Inc. |
Description: IC DVR HALF BRIDGE CFL 8DIP |
auf Bestellung 5967 Stücke: Lieferzeit 10-14 Tag (e) |
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UBA20270T/1518 | NXP USA Inc. |
Description: IC CFL LAMP DVR 600V 16-SOIC Packaging: Bulk |
auf Bestellung 5000 Stücke: Lieferzeit 10-14 Tag (e) |
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| PDTC114EMB315 | NXP USA Inc. |
Description: NOW NEXPERIA PDTC114EMB - SMALL Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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| BAS21LD315 | NXP USA Inc. |
Description: BAS21LD - HIGH-VOLTAGE SWITCHING |
Produkt ist nicht verfügbar |
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| MIMX8QX1AVLFZAC | NXP USA Inc. | Description: I.MX 8QUADXPLUS 21X21 |
Produkt ist nicht verfügbar |
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LPC1111FHN33/203 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1111FHN33/102K | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN Packaging: Tray Package / Case: 32-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 8KB (8K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 32-HVQFN (7x7) Part Status: Active Number of I/O: 28 DigiKey Programmable: Not Verified |
auf Bestellung 1300 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1111FHN33/103K | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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LPC1111FHN33/2025 | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 32HVQFN |
Produkt ist nicht verfügbar |
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A2I20D040GNR1 | NXP USA Inc. |
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG Packaging: Tape & Reel (TR) Package / Case: TO-270-17 Variant, Gull Wing Mounting Type: Surface Mount Frequency: 1.4GHz ~ 2.2GHz Voltage - Supply: 28V Gain: 32.7dB Current - Supply: 220mA P1dB: 36.3W Test Frequency: 1.8GHz ~ 2.2GHz Supplier Device Package: TO-270WBG-17 |
Produkt ist nicht verfügbar |
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| MCIMX515DJM8CR2 | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGA Packaging: Bulk Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Part Status: Active |
auf Bestellung 15532 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32K148HAT0MLQR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP |
Produkt ist nicht verfügbar |
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74AXP2G14GN125 | NXP USA Inc. |
Description: INVERTER, AXP SERIES |
auf Bestellung 4500 Stücke: Lieferzeit 10-14 Tag (e) |
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| MIMX8UX5AVLFZAC | NXP USA Inc. | Description: I.MX8 QXP 21X21 |
Produkt ist nicht verfügbar |
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MIMX8DX5AVLFZAB | NXP USA Inc. |
Description: I.MX8 QXP 21X21 REV B0 Packaging: Tray Part Status: Active |
Produkt ist nicht verfügbar |
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| MIMX8DX5AVLFZAC | NXP USA Inc. | Description: I.MX 8DUALXPLUS 21X21 |
Produkt ist nicht verfügbar |
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| MIMX8QX5AVLFZAC | NXP USA Inc. | Description: I.MX 8QUADXPLUS 21X21 |
Produkt ist nicht verfügbar |
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PMN30UN115 | NXP USA Inc. |
Description: N-CHANNEL, MOSFET |
auf Bestellung 597000 Stücke: Lieferzeit 10-14 Tag (e) |
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PMN30UNE115 | NXP USA Inc. |
Description: NOW NEXPERIA PMN30UNE SMALL SIGN |
auf Bestellung 531000 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2378FBD144K | NXP USA Inc. |
Description: IC MCU 16/32B 512KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 58K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b SAR; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Active Number of I/O: 104 DigiKey Programmable: Not Verified |
auf Bestellung 512 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G17GV-Q100125 | NXP USA Inc. |
Description: BUFFER, LVC/LCX/Z SERIES Packaging: Bulk Part Status: Active |
Produkt ist nicht verfügbar |
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74AHC1GU04GW-Q100125 | NXP USA Inc. |
Description: INVERTER, AHC/VHC/H/U/V SERIES |
auf Bestellung 902345 Stücke: Lieferzeit 10-14 Tag (e) |
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| OM40000,598 | NXP USA Inc. |
Description: LPCXPRESSO LPC802 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: LPC802 Platform: LPCXpresso™ |
Produkt ist nicht verfügbar |
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LPC802M001JDH16J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC802M001JDH20J | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 15MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 17 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MKE14F256VLH16,557 | NXP USA Inc. | Description: RISC MICROCONTROLLER, CMOS |
Produkt ist nicht verfügbar |
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MKE14Z32VFP4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE14Z32VLD4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z32VFP4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I²C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKE14Z64VFP4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 40HVQFN Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 11x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 490 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z32VLD4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFP |
Produkt ist nicht verfügbar |
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MKE14Z64VLD4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z32VLF4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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MKE15Z64VLD4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKE15Z64VLF4 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 42 DigiKey Programmable: Not Verified |
auf Bestellung 1250 Stücke: Lieferzeit 10-14 Tag (e) |
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| MMA8205KEG |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| MMA8205KEGR2 |
Hersteller: NXP USA Inc.
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Description: IC SENSOR ACCEL X-AXIS SOIC16
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X or Y
Acceleration Range: ±50g
Voltage - Supply: 6.3V ~ 30V
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Produkt ist nicht verfügbar
| A7001CMHN1/T1AGB39 |
|
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
Produkt ist nicht verfügbar
| A7002CMHN1/T1AGB39 |
Hersteller: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Description: SECURE AUTHENTICATION MICROCONTR
auf Bestellung 1098 Stücke:
Lieferzeit 10-14 Tag (e)| BZX84-B22/DG/B3215 |
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auf Bestellung 114000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15000+ | 0.033 EUR |
| BFS540,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 15V 9GHZ SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Produkt ist nicht verfügbar
| BFS540,115 |
|
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 15V 9GHZ SOT323-3
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.7dB @ 9MHz
Supplier Device Package: SC-70
Produkt ist nicht verfügbar
| PMF63UN,115 |
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Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
Description: MOSFET N-CH 20V 1.8A SOT323-3
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 74mOhm @ 1.8A, 4.5V
Power Dissipation (Max): 275mW (Ta), 1.785W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 3.3 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 185 pF @ 10 V
auf Bestellung 24542 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4438+ | 0.11 EUR |
| PMXB120EPE147 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
auf Bestellung 648598 Stücke:
Lieferzeit 10-14 Tag (e)| PMXB75UPE147 |
|
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
auf Bestellung 4088434 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4729+ | 0.097 EUR |
| PMXB75UPE/M5147 |
|
Hersteller: NXP USA Inc.
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
Description: P-CHANNEL MOSFET
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.9A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2.9A, 4.5V
Power Dissipation (Max): 317mW (Ta), 8.33W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: DFN1010D-3
Drive Voltage (Max Rds On, Min Rds On): 1.2V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 608 pF @ 10 V
auf Bestellung 45000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3328+ | 0.14 EUR |
| PMZB200UNE315 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
Description: SMALL SIGNAL N-CHANNEL MOSFET
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Supplier Device Package: DFN1006B-3
auf Bestellung 156850 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4522+ | 0.12 EUR |
| PMXB56EN147 |
|
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL FET
Description: SMALL SIGNAL FET
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)| BF904215 |
Hersteller: NXP USA Inc.
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Description: RF SMALL SIGNAL FIELD-EFFECT TRA
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| MKS20FN256VFT12 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48QFN
Description: IC MCU 32BIT 256KB FLASH 48QFN
Produkt ist nicht verfügbar
| MKL81Z128CBH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKL81Z128CBH7R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Cut Tape (CT)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64WLCSP
Packaging: Cut Tape (CT)
Package / Case: 64-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 64-WLCSP (3.48x3.38)
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
auf Bestellung 1753 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 23.88 EUR |
| 10+ | 18.76 EUR |
| 100+ | 15.53 EUR |
| 1000+ | 13.55 EUR |
| MKL81Z128VMC7557 |
|
Hersteller: NXP USA Inc.
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
Description: KINETIS KL81: 72MHZ CORTEX-M0+ S
auf Bestellung 144344 Stücke:
Lieferzeit 10-14 Tag (e)| MIMXRT1166DVM6A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 26.79 EUR |
| 10+ | 21.41 EUR |
| MIMXRT1166XVM5A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 33.81 EUR |
| 10+ | 27.04 EUR |
| 25+ | 24.74 EUR |
| 80+ | 22.1 EUR |
| MIMXRT1160-EVK |
|
Hersteller: NXP USA Inc.
Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
Description: EVAL KIT I.MX RT1160
Packaging: Bulk
Mounting Type: Fixed
Type: MCU
Contents: Board(s)
Core Processor: ARM® Cortex®-M4, Cortex®-M7
Board Type: Evaluation Platform
Utilized IC / Part: i.MX RT1160
Platform: EdgeVerse™
Part Status: Active
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 279.88 EUR |
| MIMXRT1165DVM6A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 600MHz
RAM Size: 1M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 35.66 EUR |
| 10+ | 28.49 EUR |
| 152+ | 24.07 EUR |
| MIMXRT1165CVM5A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 127 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 38.12 EUR |
| 10+ | 30.46 EUR |
| MIMXRT1166CVM5A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.84 EUR |
| 10+ | 30.35 EUR |
| 152+ | 25.92 EUR |
| MIMXRT1165XVM5A |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 500MHz
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M4/M7
Data Converters: A/D 2x12b; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 289-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.84 EUR |
| 10+ | 30.35 EUR |
| 152+ | 25.92 EUR |
| UBA2213AP/N1112 |
|
Hersteller: NXP USA Inc.
Description: IC DVR HALF BRIDGE CFL 8DIP
Description: IC DVR HALF BRIDGE CFL 8DIP
auf Bestellung 5967 Stücke:
Lieferzeit 10-14 Tag (e)| UBA20270T/1518 |
|
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 310+ | 1.57 EUR |
| PDTC114EMB315 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PDTC114EMB - SMALL
Packaging: Bulk
Part Status: Active
Description: NOW NEXPERIA PDTC114EMB - SMALL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
| BAS21LD315 |
|
Hersteller: NXP USA Inc.
Description: BAS21LD - HIGH-VOLTAGE SWITCHING
Description: BAS21LD - HIGH-VOLTAGE SWITCHING
Produkt ist nicht verfügbar
| MIMX8QX1AVLFZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Description: I.MX 8QUADXPLUS 21X21
Produkt ist nicht verfügbar
| LPC1111FHN33/203 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1111FHN33/102K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.77 EUR |
| 10+ | 2.94 EUR |
| 80+ | 2.37 EUR |
| 520+ | 2.24 EUR |
| 1040+ | 1.96 EUR |
| LPC1111FHN33/103K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| LPC1111FHN33/2025 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Description: IC MCU 32BIT 8KB FLASH 32HVQFN
Produkt ist nicht verfügbar
| A2I20D040GNR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
Voltage - Supply: 28V
Gain: 32.7dB
Current - Supply: 220mA
P1dB: 36.3W
Test Frequency: 1.8GHz ~ 2.2GHz
Supplier Device Package: TO-270WBG-17
Description: IC RF AMP 1.4GHZ-2.2GHZ TO270WBG
Packaging: Tape & Reel (TR)
Package / Case: TO-270-17 Variant, Gull Wing
Mounting Type: Surface Mount
Frequency: 1.4GHz ~ 2.2GHz
Voltage - Supply: 28V
Gain: 32.7dB
Current - Supply: 220mA
P1dB: 36.3W
Test Frequency: 1.8GHz ~ 2.2GHz
Supplier Device Package: TO-270WBG-17
Produkt ist nicht verfügbar
| MCIMX515DJM8CR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Part Status: Active
auf Bestellung 15532 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 110.14 EUR |
| FS32K148HAT0MLQR |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Produkt ist nicht verfügbar
| 74AXP2G14GN125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AXP SERIES
Description: INVERTER, AXP SERIES
auf Bestellung 4500 Stücke:
Lieferzeit 10-14 Tag (e)| MIMX8DX5AVLFZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8DUALXPLUS 21X21
Description: I.MX 8DUALXPLUS 21X21
Produkt ist nicht verfügbar
| MIMX8QX5AVLFZAC |
Hersteller: NXP USA Inc.
Description: I.MX 8QUADXPLUS 21X21
Description: I.MX 8QUADXPLUS 21X21
Produkt ist nicht verfügbar
| PMN30UN115 |
|
Hersteller: NXP USA Inc.
Description: N-CHANNEL, MOSFET
Description: N-CHANNEL, MOSFET
auf Bestellung 597000 Stücke:
Lieferzeit 10-14 Tag (e)| PMN30UNE115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA PMN30UNE SMALL SIGN
Description: NOW NEXPERIA PMN30UNE SMALL SIGN
auf Bestellung 531000 Stücke:
Lieferzeit 10-14 Tag (e)| LPC2378FBD144K |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 512KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b SAR; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 104
DigiKey Programmable: Not Verified
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 37.19 EUR |
| 10+ | 29.82 EUR |
| 120+ | 25.47 EUR |
| 480+ | 25.13 EUR |
| 74AHC1GU04GW-Q100125 |
|
Hersteller: NXP USA Inc.
Description: INVERTER, AHC/VHC/H/U/V SERIES
Description: INVERTER, AHC/VHC/H/U/V SERIES
auf Bestellung 902345 Stücke:
Lieferzeit 10-14 Tag (e)| OM40000,598 |
Hersteller: NXP USA Inc.
Description: LPCXPRESSO LPC802 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC802
Platform: LPCXpresso™
Description: LPCXPRESSO LPC802 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC802
Platform: LPCXpresso™
Produkt ist nicht verfügbar
| LPC802M001JDH16J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC802M001JDH20J |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKE14F256VLH16,557 |
Hersteller: NXP USA Inc.
Description: RISC MICROCONTROLLER, CMOS
Description: RISC MICROCONTROLLER, CMOS
Produkt ist nicht verfügbar
| MKE14Z32VFP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.44 EUR |
| 10+ | 5.04 EUR |
| 80+ | 4.13 EUR |
| 490+ | 4.04 EUR |
| MKE14Z32VLD4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 6.65 EUR |
| 10+ | 5.19 EUR |
| 160+ | 4.25 EUR |
| 480+ | 4.16 EUR |
| MKE15Z32VFP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I²C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKE14Z64VFP4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 11x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.09 EUR |
| 10+ | 5.54 EUR |
| 80+ | 4.54 EUR |
| 490+ | 4.44 EUR |
| MKE15Z32VLD4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Produkt ist nicht verfügbar
| MKE14Z64VLD4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.3 EUR |
| 10+ | 5.7 EUR |
| 160+ | 4.67 EUR |
| 480+ | 4.58 EUR |
| MKE15Z32VLF4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.2 EUR |
| 10+ | 5.63 EUR |
| 80+ | 4.61 EUR |
| 500+ | 4.51 EUR |
| 1000+ | 3.81 EUR |
| MKE15Z64VLD4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MKE15Z64VLF4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 7.85 EUR |
| 10+ | 6.13 EUR |
| 80+ | 5.02 EUR |
| 500+ | 4.92 EUR |
| 1000+ | 4.15 EUR |