Produkte > BOYD LACONIA, LLC > Alle Produkte des Herstellers BOYD LACONIA, LLC (758) > Seite 2 nach 13
Foto | Bezeichnung | Hersteller | Beschreibung |
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342947 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 2.323" (59.00mm) Shape: Rectangular, Fins Type: Top Mount, Skived Width: 2.280" (57.91mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM Thermal Resistance @ Natural: 7.70°C/W Fin Height: 0.433" (11.00mm) Material Finish: AavSHIELD 3C |
Produkt ist nicht verfügbar |
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342948 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 2.717" (69.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 2.756" (70.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM Thermal Resistance @ Natural: 5.60°C/W Fin Height: 0.551" (14.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
Produkt ist nicht verfügbar |
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342948-copper skivfin | Boyd Laconia, LLC |
Description: 342948,REV03(GP) Packaging: Bulk Material: Copper Length: 2.717" (69.00mm) Shape: Rectangular, Fins Type: Board Level Width: 2.756" (70.00mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin, Thermal Material Fin Height: 0.551" (14.00mm) |
Produkt ist nicht verfügbar |
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342949 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 3.150" (80.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.150" (80.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM Thermal Resistance @ Natural: 5.10°C/W Fin Height: 0.472" (12.00mm) Material Finish: AavSHIELD 3C Part Status: Active |
auf Bestellung 158 Stücke: Lieferzeit 10-14 Tag (e) |
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342949-copper skivfin | Boyd Laconia, LLC |
Description: 342949 Packaging: Bulk Material: Copper Length: 3.150" (80.00mm) Shape: Square, Fins Type: Board Level Width: 3.150" (80.00mm) Package Cooled: BGA, FPGA Attachment Method: Push Pin, Thermal Material Fin Height: 0.472" (12.00mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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342950 | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Copper Length: 3.543" (90.00mm) Shape: Square, Fins Type: Top Mount, Skived Width: 3.543" (90.00mm) Package Cooled: BGA Attachment Method: Push Pin Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM Thermal Resistance @ Natural: 4.50°C/W Fin Height: 0.394" (10.00mm) Material Finish: AavSHIELD 3C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
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371824B00032G | Boyd Laconia, LLC |
![]() Packaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1215 Stücke: Lieferzeit 10-14 Tag (e) |
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371924B00032G | Boyd Laconia, LLC |
Description: 371924B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 60°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.551" (14.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
372924M02000G( 10-5597-02G ) | Boyd Laconia, LLC |
Description: 372924M02000G( 10-5597-02G ) Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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373324M00000G | Boyd Laconia, LLC |
![]() Packaging: Box Material: Aluminum Length: 1.472" (37.39mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.472" (37.39mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Fin Height: 0.236" (6.00mm) Material Finish: Green Anodized |
Produkt ist nicht verfügbar |
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374024B00035G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 0.906" (23.01mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.906" (23.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.0W @ 40°C Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM Thermal Resistance @ Natural: 40.00°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 861 Stücke: Lieferzeit 10-14 Tag (e) |
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374024B60024G-MOD W/STAB PAD | Boyd Laconia, LLC |
Description: 374024B60024G-MOD W/STAB PAD Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
374324B00032G | Boyd Laconia, LLC |
Description: 374324B00032G Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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374324B00035G | Boyd Laconia, LLC |
![]() Packaging: Box Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.063" (27.00mm) Package Cooled: BGA, FPGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 90°C Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
Produkt ist nicht verfügbar |
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374324B60023G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.063" (27.00mm) Package Cooled: BGA, FPGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 2752 Stücke: Lieferzeit 10-14 Tag (e) |
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374424B00035G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 4.0W @ 80°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1162 Stücke: Lieferzeit 10-14 Tag (e) |
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374524B00000G | Boyd Laconia, LLC |
Description: 374524B00000G Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
374624B00000G W/3M8810 | Boyd Laconia, LLC |
Description: 374624B00000G W/3M8810 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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374624B00032G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM Thermal Resistance @ Natural: 23.40°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 963 Stücke: Lieferzeit 10-14 Tag (e) |
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374724B00032G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1068 Stücke: Lieferzeit 10-14 Tag (e) |
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374724B00035G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 149 Stücke: Lieferzeit 10-14 Tag (e) |
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374724B60024G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 865 Stücke: Lieferzeit 10-14 Tag (e) |
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374824B00000G | Boyd Laconia, LLC |
Description: 374824B00000G Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
374824B00032G | Boyd Laconia, LLC |
Description: 374824B00032G Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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374924B00032G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 4.0W @ 80°C Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM Thermal Resistance @ Natural: 20.30°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1166 Stücke: Lieferzeit 10-14 Tag (e) |
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3749350-PAM04010-P0 | Boyd Laconia, LLC |
Description: 3749350-PAM04010-P0 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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375024B00032G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM Thermal Resistance @ Natural: 12.00°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 906 Stücke: Lieferzeit 10-14 Tag (e) |
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375124B60024G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Board Level Width: 1.575" (40.01mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 8.0W @ 80°C Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM Thermal Resistance @ Natural: 10.30°C/W Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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3751320-PAH14010-P0 | Boyd Laconia, LLC |
Description: 3751320-PAH14010-P0 Packaging: Bulk Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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3751320-PAM04010-P0 | Boyd Laconia, LLC |
Description: 3751320-PAM04010-P0 Packaging: Bulk Material: Aluminum Alloy Length: 1.575" (40.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.575" (40.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Fin Height: 0.984" (25.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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375424B00034G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Length: 0.598" (15.19mm) Shape: Square, Pin Fins Type: Top Mount Width: 0.598" (15.19mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM Thermal Resistance @ Natural: 62.50°C/W Fin Height: 0.252" (6.40mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1240 Stücke: Lieferzeit 10-14 Tag (e) |
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375424B60023G | Boyd Laconia, LLC |
Description: 375424B60023G Packaging: Bulk |
Produkt ist nicht verfügbar |
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4003G | Boyd Laconia, LLC |
Description: THERM PAD 39.65X26.67MM WHT Packaging: Bulk Color: White Material: Beryllium Oxide Ceramic Shape: Rhombus Thickness: 0.0620" (1.575mm) Type: Insulator Usage: TO-3 Outline: 39.65mm x 26.67mm |
auf Bestellung 1690 Stücke: Lieferzeit 10-14 Tag (e) |
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4028L12B-PF1 | Boyd Laconia, LLC |
![]() Packaging: Bulk Features: Speed Sensor (Tach) Voltage - Rated: 12VDC Size / Dimension: Square - 40mm L x 40mm H Bearing Type: Ball RPM: 6500 RPM Air Flow: 9.5 CFM (0.266m³/min) Width: 28.00mm Operating Temperature: 14 ~ 158°F (-10 ~ 70°C) Termination: 3 Wire Leads Approval Agency: CE, cURus, TUV Fan Type: Tubeaxial Noise: 33.5dB(A) Static Pressure: 0.265 in H2O (66.0 Pa) Power (Watts): 720 mW |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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4103G | Boyd Laconia, LLC |
Description: THERM PAD 39.7X26.67MM Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rhombus Thickness: 0.0750" (1.905mm) Type: Insulator Usage: TO-3 Outline: 39.70mm x 26.67mm |
Produkt ist nicht verfügbar |
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4110G10SB | Boyd Laconia, LLC |
![]() Packaging: Box Features: Stainless Steel Tubing Operating Temperature: 200°C Product Type: Active, Heat Exchanger Fluid Capacity: 131ML (4.4 oz) Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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4120G10SB | Boyd Laconia, LLC |
![]() Packaging: Box Features: Stainless Steel Tubing Operating Temperature: 200°C Product Type: Active, Heat Exchanger Fluid Capacity: 131ML (4.4 oz) Part Status: Active |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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416101U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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416201U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 15.20" L x 7.00" W x 0.64" H (386.1mm x 177.8mm x 16.3mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.010°C/W @ 1.0 GPM |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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416301U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 27.21" L x 7.00" W x 0.64" H (691.1mm x 177.8mm x 16.3mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.006°C/W @ 1.0 GPM |
auf Bestellung 13 Stücke: Lieferzeit 10-14 Tag (e) |
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416401U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.060°C/W @ 1.5 GPM |
auf Bestellung 36 Stücke: Lieferzeit 10-14 Tag (e) |
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416501U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 6.00" L x 5.00" W x 0.60" H (152.4mm x 127.0mm x 15.2mm) Product Type: Passive, Cold Plate Thermal Resistance @ GPM: 0.020°C/W @ 1.0 GPM |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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416601U00000G | Boyd Laconia, LLC |
![]() Packaging: Box Dimensions - Overall: 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm) Product Type: Passive, Cold Plate Part Status: Active |
Produkt ist nicht verfügbar |
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4169G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0620" (1.575mm) Type: Insulator Usage: TO-220 Outline: 19.30mm x 13.97mm |
Produkt ist nicht verfügbar |
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4170G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0701" (1.780mm) Type: Insulator Usage: TO-220 Outline: 19.30mm x 13.97mm |
auf Bestellung 10316 Stücke: Lieferzeit 10-14 Tag (e) |
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4171G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0800" (2.032mm) Type: Insulator Usage: TO-220 Outline: 16.51mm x 12.70mm |
auf Bestellung 4776 Stücke: Lieferzeit 10-14 Tag (e) |
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4177G | Boyd Laconia, LLC |
Description: THERM PAD 17.45MMX14.27MM Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0701" (1.780mm) Type: Insulator Usage: TO-220 Outline: 17.45mm x 14.27mm Part Status: Active |
auf Bestellung 2542 Stücke: Lieferzeit 10-14 Tag (e) |
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4180G | Boyd Laconia, LLC |
![]() Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0800" (2.032mm) Type: Insulator Usage: TO-218, TO-247, TO-3P Outline: 23.24mm x 18.80mm |
auf Bestellung 29279 Stücke: Lieferzeit 10-14 Tag (e) |
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4220G10SB | Boyd Laconia, LLC |
![]() Packaging: Box Features: Stainless Steel Tubing Operating Temperature: 200°C Product Type: Active, Heat Exchanger Fluid Capacity: 131ML (4.4 oz) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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43-05-1G | Boyd Laconia, LLC |
![]() Packaging: Bulk Color: Amber Material: Polyamide Shape: Circular Type: Insulator Height: 0.002" (0.05mm) Usage: TO-5 Diameter - Outside: 0.390" (9.91mm) Diameter - Inside: 0.200" (5.08mm) |
auf Bestellung 6855 Stücke: Lieferzeit 10-14 Tag (e) |
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43-77-20G | Boyd Laconia, LLC |
Description: THERM PAD 23.24MMX18.8MM AMBER Packaging: Bulk Color: Amber Material: Polyamide Shape: Rectangular Thickness: 0.0020" (0.051mm) Type: Pad, Sheet Usage: TO-218, TO-220, TO-3P Outline: 23.24mm x 18.80mm |
Produkt ist nicht verfügbar |
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43-77-6G | Boyd Laconia, LLC |
Description: THERM PAD 20.62MMX14.27MM AMBER Packaging: Bulk Color: Amber Material: Polyamide Shape: Rectangular Thickness: 0.0020" (0.051mm) Type: Pad, Sheet Outline: 20.62mm x 14.27mm Part Status: Active |
Produkt ist nicht verfügbar |
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43-77-9G | Boyd Laconia, LLC |
Description: THERM PAD 18.42MMX13.21MM AMBER Packaging: Bulk Color: Amber Material: Polyamide Shape: Rectangular Thickness: 0.0020" (0.051mm) Type: Pad, Sheet Usage: TO-220 Outline: 18.42mm x 13.21mm |
auf Bestellung 24610 Stücke: Lieferzeit 10-14 Tag (e) |
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439300B00000 | Boyd Laconia, LLC |
Description: STD,439300B00000 Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
4804M REV D-G | Boyd Laconia, LLC |
Description: MOUNTING KIT Packaging: Bulk For Use With/Related Products: TO-3 Accessory Type: Mounting Kit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
4860M | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: DO-4 Accessory Type: Mounting Kit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
4860MG | Boyd Laconia, LLC |
Description: HEATSINK Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||||
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4880G | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: TO-220 Heat Sinks Accessory Type: Mounting Kit |
auf Bestellung 2546 Stücke: Lieferzeit 10-14 Tag (e) |
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4880MG | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: TO-220 Heat Sinks Accessory Type: Mounting Kit |
auf Bestellung 5731 Stücke: Lieferzeit 10-14 Tag (e) |
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4880SG | Boyd Laconia, LLC |
![]() Packaging: Bulk For Use With/Related Products: TO-220 Heat Sinks Accessory Type: Mounting Kit Part Status: Active |
auf Bestellung 3176 Stücke: Lieferzeit 10-14 Tag (e) |
|
342947 |
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Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 57.9X59X11MM
Packaging: Tray
Material: Copper
Length: 2.323" (59.00mm)
Shape: Rectangular, Fins
Type: Top Mount, Skived
Width: 2.280" (57.91mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
342948 |
![]() |
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 70X69X14MM
Packaging: Tray
Material: Copper
Length: 2.717" (69.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 2.756" (70.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.40°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.60°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
342948-copper skivfin |
Hersteller: Boyd Laconia, LLC
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Description: 342948,REV03(GP)
Packaging: Bulk
Material: Copper
Length: 2.717" (69.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 2.756" (70.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.551" (14.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
342949 |
![]() |
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
Description: COPPER HEATSINK 80X80X12MM
Packaging: Tray
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.150" (80.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.10°C/W
Fin Height: 0.472" (12.00mm)
Material Finish: AavSHIELD 3C
Part Status: Active
auf Bestellung 158 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 81.29 EUR |
10+ | 74.87 EUR |
342949-copper skivfin |
Hersteller: Boyd Laconia, LLC
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Description: 342949
Packaging: Bulk
Material: Copper
Length: 3.150" (80.00mm)
Shape: Square, Fins
Type: Board Level
Width: 3.150" (80.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Push Pin, Thermal Material
Fin Height: 0.472" (12.00mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
342950 |
![]() |
Hersteller: Boyd Laconia, LLC
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Description: COPPER HEATSINK 90X90X10MM
Packaging: Tray
Material: Copper
Length: 3.543" (90.00mm)
Shape: Square, Fins
Type: Top Mount, Skived
Width: 3.543" (90.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 1.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.50°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: AavSHIELD 3C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
371824B00032G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Tray
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.275" (7.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1215 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.66 EUR |
10+ | 8.44 EUR |
25+ | 8.25 EUR |
371924B00032G |
Hersteller: Boyd Laconia, LLC
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Description: 371924B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 31.90°C/W
Fin Height: 0.551" (14.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
373324M00000G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Description: HEATSINK BGA W/OUT AD-TAPE
Packaging: Box
Material: Aluminum
Length: 1.472" (37.39mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.472" (37.39mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Fin Height: 0.236" (6.00mm)
Material Finish: Green Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
374024B00035G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 23X23X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 0.906" (23.01mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.906" (23.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 40.00°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 861 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.36 EUR |
10+ | 2.97 EUR |
25+ | 2.83 EUR |
50+ | 2.73 EUR |
100+ | 2.63 EUR |
480+ | 2.42 EUR |
374324B00032G |
Hersteller: Boyd Laconia, LLC
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Description: 374324B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
374324B00035G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 90°C
Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
374324B60023G |
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Hersteller: Boyd Laconia, LLC
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: BGA HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.063" (27.00mm)
Package Cooled: BGA, FPGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 30.60°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2752 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 4.91 EUR |
10+ | 4.33 EUR |
25+ | 4.13 EUR |
50+ | 3.98 EUR |
216+ | 3.82 EUR |
374424B00035G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.063" (27.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.063" (27.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1162 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 5.88 EUR |
10+ | 5.20 EUR |
25+ | 4.96 EUR |
50+ | 4.78 EUR |
100+ | 4.60 EUR |
250+ | 4.38 EUR |
540+ | 4.21 EUR |
1080+ | 4.06 EUR |
374624B00032G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X10MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 1.5W @ 40°C
Thermal Resistance @ Forced Air Flow: 7.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 23.40°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 963 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.92 EUR |
10+ | 6.12 EUR |
25+ | 5.83 EUR |
50+ | 5.62 EUR |
100+ | 5.41 EUR |
250+ | 5.16 EUR |
510+ | 4.97 EUR |
374724B00032G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1068 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.50 EUR |
10+ | 7.54 EUR |
25+ | 7.18 EUR |
50+ | 6.92 EUR |
100+ | 6.67 EUR |
250+ | 6.35 EUR |
672+ | 6.03 EUR |
374724B00035G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA 35X35X18MM W/ADH
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.64 EUR |
10+ | 8.54 EUR |
25+ | 8.13 EUR |
50+ | 7.84 EUR |
100+ | 7.55 EUR |
374724B60024G |
![]() |
Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural: 15.30°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 865 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 9.66 EUR |
10+ | 8.55 EUR |
25+ | 8.15 EUR |
50+ | 7.85 EUR |
168+ | 7.84 EUR |
374824B00032G |
Hersteller: Boyd Laconia, LLC
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 374824B00032G
Packaging: Bulk
Material: Aluminum
Length: 1.378" (35.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.378" (35.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
374924B00032G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 4.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.30°C/W
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1166 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 8.24 EUR |
10+ | 7.28 EUR |
25+ | 6.94 EUR |
50+ | 6.69 EUR |
100+ | 6.45 EUR |
390+ | 6.00 EUR |
780+ | 5.78 EUR |
375024B00032G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK BGA W/ADHESIVE TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.00°C/W
Fin Height: 0.709" (18.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 906 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.63 EUR |
10+ | 4.98 EUR |
25+ | 4.74 EUR |
50+ | 4.57 EUR |
100+ | 4.41 EUR |
450+ | 4.07 EUR |
900+ | 3.92 EUR |
375124B60024G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: HEATSINK BGA W/O SOLDER ANCHORS
Packaging: Bulk
Material: Aluminum
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Board Level
Width: 1.575" (40.01mm)
Package Cooled: BGA
Attachment Method: Solder Anchor
Power Dissipation @ Temperature Rise: 8.0W @ 80°C
Thermal Resistance @ Forced Air Flow: 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.30°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
3751320-PAH14010-P0 |
Hersteller: Boyd Laconia, LLC
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 3751320-PAH14010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
3751320-PAM04010-P0 |
Hersteller: Boyd Laconia, LLC
Description: 3751320-PAM04010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Description: 3751320-PAM04010-P0
Packaging: Bulk
Material: Aluminum Alloy
Length: 1.575" (40.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.575" (40.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
375424B00034G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK PIN-FIN W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.598" (15.19mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.598" (15.19mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 17.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 62.50°C/W
Fin Height: 0.252" (6.40mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1240 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
6+ | 3.27 EUR |
10+ | 2.89 EUR |
25+ | 2.75 EUR |
50+ | 2.65 EUR |
100+ | 2.56 EUR |
250+ | 2.44 EUR |
500+ | 2.35 EUR |
4003G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 39.65X26.67MM WHT
Packaging: Bulk
Color: White
Material: Beryllium Oxide Ceramic
Shape: Rhombus
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-3
Outline: 39.65mm x 26.67mm
Description: THERM PAD 39.65X26.67MM WHT
Packaging: Bulk
Color: White
Material: Beryllium Oxide Ceramic
Shape: Rhombus
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-3
Outline: 39.65mm x 26.67mm
auf Bestellung 1690 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 68.18 EUR |
10+ | 60.33 EUR |
25+ | 57.46 EUR |
50+ | 55.38 EUR |
100+ | 53.37 EUR |
300+ | 50.33 EUR |
4028L12B-PF1 |
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Hersteller: Boyd Laconia, LLC
Description: FAN 12VDC 40X28MM TACH
Packaging: Bulk
Features: Speed Sensor (Tach)
Voltage - Rated: 12VDC
Size / Dimension: Square - 40mm L x 40mm H
Bearing Type: Ball
RPM: 6500 RPM
Air Flow: 9.5 CFM (0.266m³/min)
Width: 28.00mm
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 3 Wire Leads
Approval Agency: CE, cURus, TUV
Fan Type: Tubeaxial
Noise: 33.5dB(A)
Static Pressure: 0.265 in H2O (66.0 Pa)
Power (Watts): 720 mW
Description: FAN 12VDC 40X28MM TACH
Packaging: Bulk
Features: Speed Sensor (Tach)
Voltage - Rated: 12VDC
Size / Dimension: Square - 40mm L x 40mm H
Bearing Type: Ball
RPM: 6500 RPM
Air Flow: 9.5 CFM (0.266m³/min)
Width: 28.00mm
Operating Temperature: 14 ~ 158°F (-10 ~ 70°C)
Termination: 3 Wire Leads
Approval Agency: CE, cURus, TUV
Fan Type: Tubeaxial
Noise: 33.5dB(A)
Static Pressure: 0.265 in H2O (66.0 Pa)
Power (Watts): 720 mW
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
2+ | 12.11 EUR |
10+ | 11.56 EUR |
25+ | 10.87 EUR |
50+ | 10.46 EUR |
100+ | 9.63 EUR |
250+ | 9.01 EUR |
500+ | 8.88 EUR |
4103G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 39.7X26.67MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rhombus
Thickness: 0.0750" (1.905mm)
Type: Insulator
Usage: TO-3
Outline: 39.70mm x 26.67mm
Description: THERM PAD 39.7X26.67MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rhombus
Thickness: 0.0750" (1.905mm)
Type: Insulator
Usage: TO-3
Outline: 39.70mm x 26.67mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
4110G10SB |
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Hersteller: Boyd Laconia, LLC
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 1730.47 EUR |
4120G10SB |
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Hersteller: Boyd Laconia, LLC
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 2095.74 EUR |
416101U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
Description: COLD PLATE HEAT SINK 0.010C/W
Packaging: Box
Dimensions - Overall: 9.19" L x 7.00" W x 0.64" H (233.4mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.5 GPM
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 172.55 EUR |
10+ | 152.66 EUR |
25+ | 145.39 EUR |
416201U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.01C/W
Packaging: Box
Dimensions - Overall: 15.20" L x 7.00" W x 0.64" H (386.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.0 GPM
Description: COLD PLATE HEAT SINK 0.01C/W
Packaging: Box
Dimensions - Overall: 15.20" L x 7.00" W x 0.64" H (386.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.010°C/W @ 1.0 GPM
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 262.19 EUR |
10+ | 244.71 EUR |
25+ | 227.23 EUR |
416301U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.006C/W
Packaging: Box
Dimensions - Overall: 27.21" L x 7.00" W x 0.64" H (691.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.006°C/W @ 1.0 GPM
Description: COLD PLATE HEAT SINK 0.006C/W
Packaging: Box
Dimensions - Overall: 27.21" L x 7.00" W x 0.64" H (691.1mm x 177.8mm x 16.3mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.006°C/W @ 1.0 GPM
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 408.37 EUR |
10+ | 381.15 EUR |
416401U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.06C/W
Packaging: Box
Dimensions - Overall: 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.060°C/W @ 1.5 GPM
Description: COLD PLATE HEAT SINK 0.06C/W
Packaging: Box
Dimensions - Overall: 5.25" L x 2.25" W x 0.60" H (133.4mm x 57.2mm x 15.2mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.060°C/W @ 1.5 GPM
auf Bestellung 36 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 168.45 EUR |
10+ | 157.93 EUR |
25+ | 147.40 EUR |
416501U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK 0.02C/W
Packaging: Box
Dimensions - Overall: 6.00" L x 5.00" W x 0.60" H (152.4mm x 127.0mm x 15.2mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.020°C/W @ 1.0 GPM
Description: COLD PLATE HEAT SINK 0.02C/W
Packaging: Box
Dimensions - Overall: 6.00" L x 5.00" W x 0.60" H (152.4mm x 127.0mm x 15.2mm)
Product Type: Passive, Cold Plate
Thermal Resistance @ GPM: 0.020°C/W @ 1.0 GPM
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 217.68 EUR |
16+ | 187.85 EUR |
32+ | 181.03 EUR |
416601U00000G |
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Hersteller: Boyd Laconia, LLC
Description: COLD PLATE HEAT SINK
Packaging: Box
Dimensions - Overall: 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm)
Product Type: Passive, Cold Plate
Part Status: Active
Description: COLD PLATE HEAT SINK
Packaging: Box
Dimensions - Overall: 15.00" L x 5.00" W x 0.60" H (381.0mm x 127.0mm x 15.2mm)
Product Type: Passive, Cold Plate
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
4169G |
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Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.3MMX13.97MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-220
Outline: 19.30mm x 13.97mm
Description: THERM PAD 19.3MMX13.97MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0620" (1.575mm)
Type: Insulator
Usage: TO-220
Outline: 19.30mm x 13.97mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
4170G |
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Hersteller: Boyd Laconia, LLC
Description: THERM PAD 19.3MMX13.97MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0701" (1.780mm)
Type: Insulator
Usage: TO-220
Outline: 19.30mm x 13.97mm
Description: THERM PAD 19.3MMX13.97MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0701" (1.780mm)
Type: Insulator
Usage: TO-220
Outline: 19.30mm x 13.97mm
auf Bestellung 10316 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
13+ | 1.37 EUR |
15+ | 1.21 EUR |
25+ | 1.16 EUR |
50+ | 1.11 EUR |
100+ | 1.07 EUR |
250+ | 1.02 EUR |
500+ | 0.99 EUR |
1000+ | 0.95 EUR |
5000+ | 0.87 EUR |
4171G |
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Hersteller: Boyd Laconia, LLC
Description: THERM PAD 16.51MMX12.7MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0800" (2.032mm)
Type: Insulator
Usage: TO-220
Outline: 16.51mm x 12.70mm
Description: THERM PAD 16.51MMX12.7MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0800" (2.032mm)
Type: Insulator
Usage: TO-220
Outline: 16.51mm x 12.70mm
auf Bestellung 4776 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.60 EUR |
13+ | 1.42 EUR |
25+ | 1.35 EUR |
50+ | 1.30 EUR |
100+ | 1.25 EUR |
250+ | 1.19 EUR |
500+ | 1.15 EUR |
1000+ | 1.11 EUR |
4177G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 17.45MMX14.27MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0701" (1.780mm)
Type: Insulator
Usage: TO-220
Outline: 17.45mm x 14.27mm
Part Status: Active
Description: THERM PAD 17.45MMX14.27MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0701" (1.780mm)
Type: Insulator
Usage: TO-220
Outline: 17.45mm x 14.27mm
Part Status: Active
auf Bestellung 2542 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
12+ | 1.48 EUR |
13+ | 1.40 EUR |
25+ | 1.36 EUR |
50+ | 1.32 EUR |
100+ | 1.30 EUR |
4180G |
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Hersteller: Boyd Laconia, LLC
Description: THERM PAD 23.24MMX18.8MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0800" (2.032mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 23.24mm x 18.80mm
Description: THERM PAD 23.24MMX18.8MM
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0800" (2.032mm)
Type: Insulator
Usage: TO-218, TO-247, TO-3P
Outline: 23.24mm x 18.80mm
auf Bestellung 29279 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
10+ | 1.88 EUR |
11+ | 1.66 EUR |
25+ | 1.58 EUR |
50+ | 1.53 EUR |
100+ | 1.47 EUR |
250+ | 1.40 EUR |
500+ | 1.35 EUR |
1000+ | 1.30 EUR |
5000+ | 1.19 EUR |
4220G10SB |
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Hersteller: Boyd Laconia, LLC
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
Description: HEAT EXCHANGER
Packaging: Box
Features: Stainless Steel Tubing
Operating Temperature: 200°C
Product Type: Active, Heat Exchanger
Fluid Capacity: 131ML (4.4 oz)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
1+ | 2856.37 EUR |
43-05-1G |
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Hersteller: Boyd Laconia, LLC
Description: INSULATOR CIRCULAR TO5 0.002"
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Circular
Type: Insulator
Height: 0.002" (0.05mm)
Usage: TO-5
Diameter - Outside: 0.390" (9.91mm)
Diameter - Inside: 0.200" (5.08mm)
Description: INSULATOR CIRCULAR TO5 0.002"
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Circular
Type: Insulator
Height: 0.002" (0.05mm)
Usage: TO-5
Diameter - Outside: 0.390" (9.91mm)
Diameter - Inside: 0.200" (5.08mm)
auf Bestellung 6855 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
11+ | 1.71 EUR |
12+ | 1.51 EUR |
25+ | 1.44 EUR |
50+ | 1.38 EUR |
100+ | 1.33 EUR |
250+ | 1.27 EUR |
500+ | 1.22 EUR |
1000+ | 1.18 EUR |
5000+ | 1.08 EUR |
43-77-20G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 23.24MMX18.8MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-3P
Outline: 23.24mm x 18.80mm
Description: THERM PAD 23.24MMX18.8MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Usage: TO-218, TO-220, TO-3P
Outline: 23.24mm x 18.80mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
43-77-6G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 20.62MMX14.27MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Outline: 20.62mm x 14.27mm
Part Status: Active
Description: THERM PAD 20.62MMX14.27MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Outline: 20.62mm x 14.27mm
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
43-77-9G |
Hersteller: Boyd Laconia, LLC
Description: THERM PAD 18.42MMX13.21MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
Description: THERM PAD 18.42MMX13.21MM AMBER
Packaging: Bulk
Color: Amber
Material: Polyamide
Shape: Rectangular
Thickness: 0.0020" (0.051mm)
Type: Pad, Sheet
Usage: TO-220
Outline: 18.42mm x 13.21mm
auf Bestellung 24610 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
13+ | 1.46 EUR |
14+ | 1.29 EUR |
25+ | 1.23 EUR |
50+ | 1.19 EUR |
100+ | 1.14 EUR |
250+ | 1.09 EUR |
500+ | 1.05 EUR |
1000+ | 1.01 EUR |
5000+ | 0.93 EUR |
4804M REV D-G |
Hersteller: Boyd Laconia, LLC
Description: MOUNTING KIT
Packaging: Bulk
For Use With/Related Products: TO-3
Accessory Type: Mounting Kit
Description: MOUNTING KIT
Packaging: Bulk
For Use With/Related Products: TO-3
Accessory Type: Mounting Kit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
4860M |
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Hersteller: Boyd Laconia, LLC
Description: MOUNTING KIT
Packaging: Bulk
For Use With/Related Products: DO-4
Accessory Type: Mounting Kit
Description: MOUNTING KIT
Packaging: Bulk
For Use With/Related Products: DO-4
Accessory Type: Mounting Kit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
4880G |
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Hersteller: Boyd Laconia, LLC
Description: MOUNTING KIT TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
Description: MOUNTING KIT TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
auf Bestellung 2546 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.76 EUR |
10+ | 5.09 EUR |
25+ | 4.85 EUR |
50+ | 4.67 EUR |
100+ | 4.50 EUR |
250+ | 4.29 EUR |
500+ | 4.13 EUR |
1000+ | 3.98 EUR |
4880MG |
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Hersteller: Boyd Laconia, LLC
Description: MICA INSULATOR TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
Description: MICA INSULATOR TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
auf Bestellung 5731 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
4+ | 5.65 EUR |
10+ | 4.99 EUR |
25+ | 4.75 EUR |
50+ | 4.58 EUR |
100+ | 4.42 EUR |
250+ | 4.21 EUR |
500+ | 4.06 EUR |
1000+ | 3.91 EUR |
4880SG |
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Hersteller: Boyd Laconia, LLC
Description: THERMASIL3 THERMAL PAD TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
Part Status: Active
Description: THERMASIL3 THERMAL PAD TO-220
Packaging: Bulk
For Use With/Related Products: TO-220 Heat Sinks
Accessory Type: Mounting Kit
Part Status: Active
auf Bestellung 3176 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis |
---|---|
3+ | 6.04 EUR |
10+ | 5.34 EUR |
25+ | 5.09 EUR |
50+ | 4.90 EUR |
100+ | 4.73 EUR |
250+ | 4.50 EUR |
500+ | 4.34 EUR |
3000+ | 3.94 EUR |