371824B00032G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized
auf Bestellung 3846 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 55+ | 2.86 EUR |
| 100+ | 2.31 EUR |
| 1000+ | 2.2 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 371824B00032G Boyd Corporation
Description: HEATSINK BGA W/ADHESIVE TAPE, Packaging: Tray, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 1.5W @ 50°C, Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 31.90°C/W, Fin Height: 0.275" (7.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 371824B00032G nach Preis ab 3.56 EUR bis 12.11 EUR
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371824B00032G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9°C/W Black Anodized |
auf Bestellung 3846 Stücke: Lieferzeit 14-21 Tag (e) |
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371824B00032G | Hersteller : Aavid |
Heat Sinks The factory is currently not accepting orders for this product. |
auf Bestellung 1540 Stücke: Lieferzeit 10-14 Tag (e) |
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371824B00032G | Hersteller : Boyd Laconia, LLC |
 Description: HEATSINK BGA W/ADHESIVE TAPEPackaging: Tray Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 50°C Thermal Resistance @ Forced Air Flow: 9.70°C/W @ 200 LFM Thermal Resistance @ Natural: 31.90°C/W Fin Height: 0.275" (7.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 447 Stücke: Lieferzeit 10-14 Tag (e) |
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371824B00032G | Hersteller : BOYD |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 31.9C/W Black Anodized |
Produkt ist nicht verfügbar |
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| 371824B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm Colour: black Material: aluminium Length: 35mm Width: 35mm Height: 7mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| 371824B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm Colour: black Material: aluminium Length: 35mm Width: 35mm Height: 7mm Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized |
Produkt ist nicht verfügbar |