374324B00032G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized
auf Bestellung 751 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 153+ | 1 EUR |
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Technische Details 374324B00032G Boyd Corporation
Description: 374324B00032G, Packaging: Bulk, Material: Aluminum, Length: 1.063" (27.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.063" (27.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 1.5W @ 40°C, Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM, Thermal Resistance @ Natural: 30.60°C/W, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote 374324B00032G nach Preis ab 0.96 EUR bis 3.68 EUR
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374324B00032G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6°C/W Black Anodized |
auf Bestellung 751 Stücke: Lieferzeit 14-21 Tag (e) |
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| 374324B00032G | Hersteller : Aavid |
Heat Sinks Heat Sink for Metal/Ceramic BGA Packages, Black, 27x27x10mm, IC=27x27, Tape #32 |
auf Bestellung 1628 Stücke: Lieferzeit 10-14 Tag (e) |
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374324B00032G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 30.6C/W Black Anodized |
Produkt ist nicht verfügbar |
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| 374324B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm Material: aluminium Length: 27mm Colour: black Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 27mm Height: 10mm Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| 374324B00032G | Hersteller : Aavid, Thermal Division of Boyd Corporation |
Description: 374324B00032G Packaging: Bulk Material: Aluminum Length: 1.063" (27.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.063" (27.00mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 1.5W @ 40°C Thermal Resistance @ Forced Air Flow: 9.35°C/W @ 200 LFM Thermal Resistance @ Natural: 30.60°C/W Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
Produkt ist nicht verfügbar |
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| 374324B00032G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm Material: aluminium Length: 27mm Colour: black Application: BGA; FPGA Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Width: 27mm Height: 10mm |
Produkt ist nicht verfügbar |