374724B60024G Boyd Corporation
Hersteller: Boyd CorporationHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
auf Bestellung 5582 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 61+ | 2.57 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 374724B60024G Boyd Corporation
Description: HEATSINK BGA W/O SOLDER ANCHORS, Packaging: Bulk, Material: Aluminum, Length: 1.378" (35.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.378" (35.00mm), Package Cooled: BGA, Attachment Method: Solder Anchor, Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM, Thermal Resistance @ Natural: 15.30°C/W, Fin Height: 0.709" (18.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 374724B60024G nach Preis ab 2.57 EUR bis 8.08 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
374724B60024G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized |
auf Bestellung 5582 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||
 |
374724B60024G | Hersteller : Boyd Laconia, LLC |
Description: HEATSINK BGA W/O SOLDER ANCHORS Packaging: Bulk Material: Aluminum Length: 1.378" (35.00mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.378" (35.00mm) Package Cooled: BGA Attachment Method: Solder Anchor Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 5.20°C/W @ 200 LFM Thermal Resistance @ Natural: 15.30°C/W Fin Height: 0.709" (18.00mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 854 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
|
374724B60024G | Hersteller : Boyd Corporation |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized |
auf Bestellung 168 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||
 |
374724B60024G | Hersteller : Aavid |
Heat Sinks Heat Sink with BGA Solder Anchor, 35x35x18mm, Black, 2 Anchors, IC Pkg=35 x 35 |
auf Bestellung 1049 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
 |
374724B60024G | Hersteller : Aavid Thermalloy |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3C/W Black Anodized |
auf Bestellung 168 Stücke: Lieferzeit 14-21 Tag (e) |
|||||||||||||||
| 374724B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Width: 35mm Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
||||||||||||||||
| 374724B60024G | Hersteller : BOYD CORP |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm Colour: black Material: aluminium Height: 18mm Length: 35mm Application: BGA Width: 35mm Type of heatsink: extruded Heatsink shape: grilled Material finishing: anodized |
Produkt ist nicht verfügbar |