| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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|---|---|---|---|---|---|---|---|
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XC3S200-5FTG256C | AMD |
 Description: IC FPGA 173 I/O 256FTBGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 200000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 4320 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 480 Total RAM Bits: 221184 Number of I/O: 173 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FGG676C | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG676I | AMD |
Description: IC FPGA 489 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG676I | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FG676C | AMD |
Description: IC FPGA 489 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 489 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FGG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FGG900I | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-4FG900I | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S5000-5FG900C | AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Bulk Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| EFR-DI-AES-IP-WW | AMD |
Description: LOGICORE, ADVANCED ENCRYPTION ST Packaging: Bulk |
Produkt ist nicht verfügbar |
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| EFR-DI-ERNIC-WW | AMD |
Description: DEV RNIC SITE LICENSE RENEWAL WW Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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XC18V01PC20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01PCG20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01SO20C0100 | AMD |
Description: RE-PROGRAMMABLE 1MB PROM Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-SOIC DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC18V01VQG44C0100 | AMD |
Description: XC18V01VQG44C0100 Packaging: Tape & Reel (TR) Package / Case: 44-TQFP Mounting Type: Surface Mount Memory Size: 1Mb Programmable Type: In System Programmable Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 44-VQFP (10x10) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A35T-1FGG484C | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 246 Stücke: Lieferzeit 10-14 Tag (e) |
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| EFR-DI-FLASH-LDPC-SITE | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Site Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EFR-DI-FLASH-LDPC-WW | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year Renewal License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EF-DI-FLASH-LDPC-SITE | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Site Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| EF-DI-FLASH-LDPC-WW | AMD |
Description: LOGICORE, FLASH MEMORY LDPC ERRO Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: License License Length: 1 Year License - User Details: Worldwide Media Delivery Type: Electronically Delivered |
Produkt ist nicht verfügbar |
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| XCVP1402-1LSEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-1LSIVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-2LSEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-2LLEVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVP1402-1LLIVSVA3340 | AMD |
Description: IC VERSAL PREM ACAP FPGA 3340BGA Packaging: Tray Package / Case: 3340-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 3340-FCBGA (55x55) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVU57P-1FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-2FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-L2FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP LP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCVU57P-3FSVK2892E | AMD |
Description: IC FPGA VIRTEX-UP 2892BGA Packaging: Tray Package / Case: 2892-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.873V ~ 0.927V Number of Logic Elements/Cells: 2851800 Supplier Device Package: 2892-FCBGA (55x55) Number of LABs/CLBs: 162960 Total RAM Bits: 74344038 Number of I/O: 624 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XAZU1EG-1SFVA625Q | AMD |
Description: IC ZUP MPSOC A53 FPGA Q 625BGA Packaging: Tray Package / Case: 625-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 625-FCBGA (21x21) Architecture: MPU, FPGA |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A15T-1CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 210 DigiKey Programmable: Not Verified |
auf Bestellung 406 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A15T-3CSG324E | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 210 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| DS-XPA-500K | AMD |
Description: XILINX PRODUCTIVITY ADVANTAGE 1 Packaging: Bulk Type: Design Software Applications: Programming |
Produkt ist nicht verfügbar |
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| EK-XRF4-3342-V1-G | AMD |
Description: XRF4 RF ACCESSORY KIT Packaging: Bulk For Use With/Related Products: ZCU208, ZCU670 Accessory Type: Accessory Kit |
Produkt ist nicht verfügbar |
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XC3S250E-4PQG208C | AMD |
Description: IC FPGA 158 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 250000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 5508 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 612 Total RAM Bits: 221184 Number of I/O: 158 DigiKey Programmable: Not Verified |
auf Bestellung 324 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3S200-4VQ100I | AMD |
Description: IC FPGA 63 I/O 100VQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Number of Gates: 200000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 4320 Supplier Device Package: 100-VQFP (14x14) Number of LABs/CLBs: 480 Total RAM Bits: 221184 Number of I/O: 63 DigiKey Programmable: Not Verified |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
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| XCVU160-H1FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 1.030V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU190-2FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2349900 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 134280 Total RAM Bits: 150937600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU190-2FLGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 2349900 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 134280 Total RAM Bits: 150937600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU160-3FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 2026500 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 115800 Total RAM Bits: 130969600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU11P-1FLGB2104I | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Number of I/O: 572 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-1FHGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU190-3FLGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 2349900 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 134280 Total RAM Bits: 150937600 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU11P-L2FLGB2104E | AMD |
Description: IC FPGA 572 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 2835000 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of LABs/CLBs: 162000 Total RAM Bits: 396150400 Number of I/O: 572 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-1FHGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-2FHGB2104E | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-2FHGB2104I | AMD |
Description: IC FPGA 702 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 702 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-L2FHGB2104E | AMD |
Description: IC FPGA 832 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 832 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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 |
XC7S75-1FGGA676Q | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 6000 Total RAM Bits: 4331520 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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|
XA7S75-2FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 6000 Total RAM Bits: 3317760 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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|
XC7S100-L1FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FPBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.92V ~ 0.98V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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|
|
XA7S100-2FGGA676I | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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|
|
XA7S100-1FGGA676Q | AMD |
Description: IC FPGA 400 I/O 676FBGA Packaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 102400 Supplier Device Package: 676-FPBGA (27x27) Number of LABs/CLBs: 8000 Total RAM Bits: 4423680 Grade: Automotive Number of I/O: 400 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||
 |
XCKU040-L1FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.880V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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|
|
XCKU040-2FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||
|
|
XCKU040-3FBVA676E | AMD |
Description: IC FPGA 312 I/O 676FCBGA Packaging: Bulk Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.970V ~ 1.030V Number of Logic Elements/Cells: 530250 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 312 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||
 |
DK-U1-KCU1500-A-G | AMD |
Description: KINTEX ULTRASCALE FPGA KCU1500 Packaging: Box For Use With/Related Products: XCKU115 Type: FPGA Contents: Board(s), Cable(s) Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card |
Produkt ist nicht verfügbar |
| XC3S200-5FTG256C |
|
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 173
DigiKey Programmable: Not Verified
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FGG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG676I |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG676I |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FG676C |
|
Hersteller: AMD
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Description: IC FPGA 489 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 489
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FGG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FGG900I |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Tray
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-4FG900I |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S5000-5FG900C |
|
Hersteller: AMD
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Description: IC FPGA 633 I/O 900FBGA
Packaging: Bulk
Package / Case: 900-BBGA
Mounting Type: Surface Mount
Number of Gates: 5000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Supplier Device Package: 900-FBGA (31x31)
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Number of I/O: 633
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| EFR-DI-AES-IP-WW |
|
Produkt ist nicht verfügbar
| EFR-DI-ERNIC-WW |
Hersteller: AMD
Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: DEV RNIC SITE LICENSE RENEWAL WW
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| XC18V01PC20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01PCG20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01SO20C0100 |
|
Hersteller: AMD
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
Description: RE-PROGRAMMABLE 1MB PROM
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-SOIC
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC18V01VQG44C0100 |
|
Hersteller: AMD
Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Description: XC18V01VQG44C0100
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 1Mb
Programmable Type: In System Programmable
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A35T-1FGG484C |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 246 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 108.56 EUR |
| EFR-DI-FLASH-LDPC-SITE |
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EFR-DI-FLASH-LDPC-WW |
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year Renewal
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EF-DI-FLASH-LDPC-SITE |
|
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Site
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| EF-DI-FLASH-LDPC-WW |
|
Hersteller: AMD
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Description: LOGICORE, FLASH MEMORY LDPC ERRO
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: License
License Length: 1 Year
License - User Details: Worldwide
Media Delivery Type: Electronically Delivered
Produkt ist nicht verfügbar
| XCVP1402-1LSEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-1LSIVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-2LSEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-2LLEVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVP1402-1LLIVSVA3340 |
|
Hersteller: AMD
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Description: IC VERSAL PREM ACAP FPGA 3340BGA
Packaging: Tray
Package / Case: 3340-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Premium FPGA, 2.2M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 3340-FCBGA (55x55)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVU57P-1FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-2FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-L2FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP LP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU57P-3FSVK2892E |
|
Hersteller: AMD
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Description: IC FPGA VIRTEX-UP 2892BGA
Packaging: Tray
Package / Case: 2892-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 2851800
Supplier Device Package: 2892-FCBGA (55x55)
Number of LABs/CLBs: 162960
Total RAM Bits: 74344038
Number of I/O: 624
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XAZU1EG-1SFVA625Q |
|
Hersteller: AMD
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
Description: IC ZUP MPSOC A53 FPGA Q 625BGA
Packaging: Tray
Package / Case: 625-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 82K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 625-FCBGA (21x21)
Architecture: MPU, FPGA
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 1067.46 EUR |
| XC7A15T-1CSG324I |
|
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
auf Bestellung 406 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 82.23 EUR |
| XC7A15T-3CSG324E |
|
Hersteller: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 210
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| DS-XPA-500K |
Hersteller: AMD
Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Description: XILINX PRODUCTIVITY ADVANTAGE 1
Packaging: Bulk
Type: Design Software
Applications: Programming
Produkt ist nicht verfügbar
| EK-XRF4-3342-V1-G |
|
Hersteller: AMD
Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Description: XRF4 RF ACCESSORY KIT
Packaging: Bulk
For Use With/Related Products: ZCU208, ZCU670
Accessory Type: Accessory Kit
Produkt ist nicht verfügbar
| XC3S250E-4PQG208C |
|
Hersteller: AMD
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC FPGA 158 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 158
DigiKey Programmable: Not Verified
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 416.45 EUR |
| XC3S200-4VQ100I |
|
Hersteller: AMD
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC FPGA 63 I/O 100VQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4320
Supplier Device Package: 100-VQFP (14x14)
Number of LABs/CLBs: 480
Total RAM Bits: 221184
Number of I/O: 63
DigiKey Programmable: Not Verified
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 79.6 EUR |
| XCVU160-H1FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU190-2FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU190-2FLGB2104I |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU160-3FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2026500
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 115800
Total RAM Bits: 130969600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU11P-1FLGB2104I |
|
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-1FHGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU190-3FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 2349900
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 134280
Total RAM Bits: 150937600
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU11P-L2FLGB2104E |
|
Hersteller: AMD
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Description: IC FPGA 572 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 2835000
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 162000
Total RAM Bits: 396150400
Number of I/O: 572
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-1FHGB2104I |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-2FHGB2104E |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-2FHGB2104I |
|
Hersteller: AMD
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Description: IC FPGA 702 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 702
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-L2FHGB2104E |
|
Hersteller: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7S75-1FGGA676Q |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XA7S75-2FGGA676I |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 6000
Total RAM Bits: 3317760
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| XC7S100-L1FGGA676I |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FPBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.92V ~ 0.98V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XA7S100-2FGGA676I |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| XA7S100-1FGGA676Q |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 400 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 102400
Supplier Device Package: 676-FPBGA (27x27)
Number of LABs/CLBs: 8000
Total RAM Bits: 4423680
Grade: Automotive
Number of I/O: 400
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| XCKU040-L1FBVA676I |
|
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.880V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCKU040-2FBVA676I |
|
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCKU040-3FBVA676E |
|
Hersteller: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Bulk
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.970V ~ 1.030V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 312
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| DK-U1-KCU1500-A-G |
|
Hersteller: AMD
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Description: KINTEX ULTRASCALE FPGA KCU1500
Packaging: Box
For Use With/Related Products: XCKU115
Type: FPGA
Contents: Board(s), Cable(s)
Platform: Kintex UltraScale FPGA KCU1500 Acceleration PCIe Card
Produkt ist nicht verfügbar