Technische Details XC3S5000-4FGG900C
Description: IC FPGA 633 I/O 900FBGA, Packaging: Tray, Package / Case: 900-BBGA, Mounting Type: Surface Mount, Number of Gates: 5000000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.26V, Number of Logic Elements/Cells: 74880, Supplier Device Package: 900-FBGA (31x31), Number of LABs/CLBs: 8320, Total RAM Bits: 1916928, Number of I/O: 633, DigiKey Programmable: Not Verified.
Weitere Produktangebote XC3S5000-4FGG900C
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
XC3S5000-4FGG900C | Hersteller : AMD |
Description: IC FPGA 633 I/O 900FBGA Packaging: Tray Package / Case: 900-BBGA Mounting Type: Surface Mount Number of Gates: 5000000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 74880 Supplier Device Package: 900-FBGA (31x31) Number of LABs/CLBs: 8320 Total RAM Bits: 1916928 Number of I/O: 633 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
||
XC3S5000-4FGG900C | Hersteller : AMD / Xilinx | FPGA - Field Programmable Gate Array XC3S5000-4FGG900C |
Produkt ist nicht verfügbar |