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XC3S50AN-5FTG256C XC3S50AN-5FTG256C AMD kwrFxhQjlUQMgifB9lnihQ Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Obsolete
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S1000L-4FTG256C XC3S1000L-4FTG256C AMD Kmjv2BHpGtvDiWUcZ7B2jg Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 442368
Part Status: Obsolete
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S1400A-5FTG256C XC3S1400A-5FTG256C AMD ds529 Description: IC FPGA 161 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 25344
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 161
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S200A-5FTG256C XC3S200A-5FTG256C AMD ds529 Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4032
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 448
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S400AN-4FTG256I XC3S400AN-4FTG256I AMD ds557 Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
auf Bestellung 3399 Stücke:
Lieferzeit 10-14 Tag (e)
1+115.3 EUR
EK-U1-ZCU106-G-J AMD ug1244-zcu106-eval-bd.pdf Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU106 Japan PCIe Card
Part Status: Active
Produkt ist nicht verfügbar
XC7A25T-2CPG238C XC7A25T-2CPG238C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A12T-1CPG238C XC7A12T-1CPG238C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC17V08PC44C XC17V08PC44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER C-TEMP 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 815 Stücke:
Lieferzeit 10-14 Tag (e)
10+58.63 EUR
Mindestbestellmenge: 10
XC17V02VQ44C XC17V02VQ44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER 2MBIT 3.3V 44-VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 536 Stücke:
Lieferzeit 10-14 Tag (e)
44+12.25 EUR
Mindestbestellmenge: 44
XC17V02PC44C XC17V02PC44C AMD zeVecxGWTzd3iIaH3DvWzg Description: IC PROM SER 2MBIT 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 1912 Stücke:
Lieferzeit 10-14 Tag (e)
44+12.25 EUR
Mindestbestellmenge: 44
XC7A75T-1FGG484C XC7A75T-1FGG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 345 Stücke:
Lieferzeit 10-14 Tag (e)
1+239.03 EUR
XC7A75T-2FGG484I XC7A75T-2FGG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 548 Stücke:
Lieferzeit 10-14 Tag (e)
1+291.83 EUR
XC7A15T-1FGG484I XC7A15T-1FGG484I AMD ds180_7Series_Overview Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
1+103.28 EUR
XC7A15T-1FGG484C XC7A15T-1FGG484C AMD ds180_7Series_Overview Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
1+88.3 EUR
XC7A75T-2FGG676C XC7A75T-2FGG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 214 Stücke:
Lieferzeit 10-14 Tag (e)
1+293.88 EUR
XCV200-5BG256C XCV200-5BG256C AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV200-5BG256I XCV200-5BG256I AMD Virtex_2.5_V.pdf Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AM28F020-200EC AMD Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
Lieferzeit 10-14 Tag (e)
100+3.52 EUR
200+ 3.43 EUR
300+ 3.34 EUR
500+ 3.17 EUR
Mindestbestellmenge: 100
AM29LV160DT-90EC AMD Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2607 Stücke:
Lieferzeit 10-14 Tag (e)
96+4.58 EUR
192+ 4.54 EUR
384+ 4.49 EUR
960+ 4.4 EUR
Mindestbestellmenge: 96
AM29LV160DB-70EI AMD Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
96+4.84 EUR
192+ 4.79 EUR
384+ 4.75 EUR
768+ 4.66 EUR
Mindestbestellmenge: 96
XC3S5000-4FGG1156C XC3S5000-4FGG1156C AMD ds099.pdf?t.download=true&u=ovmfp3 Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Part Status: Active
Number of I/O: 633
DigiKey Programmable: Not Verified
auf Bestellung 429 Stücke:
Lieferzeit 10-14 Tag (e)
2+488.35 EUR
Mindestbestellmenge: 2
XC3S5000-4FG1156C XC3S5000-4FG1156C AMD ds099.pdf?t.download=true&u=ovmfp3 Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Part Status: Active
Number of I/O: 489
DigiKey Programmable: Not Verified
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
3+178.6 EUR
Mindestbestellmenge: 3
XCV400-4HQ240C0729 XCV400-4HQ240C0729 AMD ds022.pdf?t.download=true&u=ovmfp3 Description: FPGA, 2400 CLBS, 468252 GATES, 2
Packaging: Bulk
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
1+653.84 EUR
XCV400-5HQ240I AMD Virtex_2.5_V.pdf Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-5BG560C AMD Virtex_2.5_V.pdf Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-4BG560I AMD Virtex_2.5_V.pdf Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-4HQ240C AMD Virtex_2.5_V.pdf Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AM29DL323GT-90EF AMD Description: FLASH NOR 32 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
96+5.28 EUR
192+ 5.1 EUR
384+ 4.93 EUR
768+ 4.84 EUR
960+ 4.75 EUR
Mindestbestellmenge: 96
AM29DL324GB-70EI AMD Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
auf Bestellung 9600 Stücke:
Lieferzeit 10-14 Tag (e)
960+5.28 EUR
1920+ 5.19 EUR
3840+ 5.1 EUR
9600+ 4.84 EUR
Mindestbestellmenge: 960
XCZU15EG-L2FFVB1156E XCZU15EG-L2FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVC900I XCZU15EG-1FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVB1156E XCZU15EG-2FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVB1156I XCZU15EG-2FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVB1156E XCZU15EG-1FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVC900E XCZU15EG-2FFVC900E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVB1156I XCZU15EG-1FFVB1156I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVC900I XCZU15EG-2FFVC900I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVC900E XCZU15EG-1FFVC900E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-3FFVB1156E XCZU15EG-3FFVB1156E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
AM29LV160DB-70EC AMD Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 218894 Stücke:
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7680+ 3.61 EUR
Mindestbestellmenge: 480
XCZU3CG-1UBVA530I XCZU3CG-1UBVA530I AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XC7A25T-1CPG238I XC7A25T-1CPG238I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40-4BG256C XCS40-4BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40-3BG256C XCS40-3BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-5BG256C XCS40XL-5BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-4BG256C XCS40XL-4BG256C AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-4BG256I XCS40XL-4BG256I AMD ds060 Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A200T-2SBG484I XC7A200T-2SBG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-2FBG676C XC7A200T-2FBG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
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XC7A200T-1FBG484C XC7A200T-1FBG484C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
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XC7A200T-1FBG676C XC7A200T-1FBG676C AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
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1+474.81 EUR
XC7A200T-1FBG484I XC7A200T-1FBG484I AMD ds181_Artix_7_Data_Sheet Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
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1+475.59 EUR
AM29LV160DT-90ED AMD Description: FLASH NOR 16 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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960+ 4.4 EUR
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AM29F400BB-90SE AMD Description: FLASH NOR 4MB 5V PSOP (Btm Bt-Bl
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
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1000+ 7.39 EUR
3000+ 7.22 EUR
5000+ 7.04 EUR
Mindestbestellmenge: 500
XC3S250E-4TQG144C XC3S250E-4TQG144C AMD ds312 Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
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1+84.48 EUR
XC4008E-1PG191C AMD x4000.pdf Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-2PG191C AMD x4000.pdf Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-3PG191C AMD x4000.pdf Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-3PG191I AMD x4000.pdf Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S50AN-5FTG256C kwrFxhQjlUQMgifB9lnihQ
XC3S50AN-5FTG256C
Hersteller: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1584
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 176
Total RAM Bits: 55296
Part Status: Obsolete
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S1000L-4FTG256C Kmjv2BHpGtvDiWUcZ7B2jg
XC3S1000L-4FTG256C
Hersteller: AMD
Description: IC FPGA 173 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 480
Total RAM Bits: 442368
Part Status: Obsolete
Number of I/O: 173
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S1400A-5FTG256C ds529
XC3S1400A-5FTG256C
Hersteller: AMD
Description: IC FPGA 161 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 1400000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 25344
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 2816
Total RAM Bits: 589824
Part Status: Active
Number of I/O: 161
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S200A-5FTG256C ds529
XC3S200A-5FTG256C
Hersteller: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 200000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 4032
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 448
Total RAM Bits: 294912
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC3S400AN-4FTG256I ds557
XC3S400AN-4FTG256I
Hersteller: AMD
Description: IC FPGA 195 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 400000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 8064
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 896
Total RAM Bits: 368640
Part Status: Active
Number of I/O: 195
DigiKey Programmable: Not Verified
auf Bestellung 3399 Stücke:
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Anzahl Preis ohne MwSt
1+115.3 EUR
EK-U1-ZCU106-G-J ug1244-zcu106-eval-bd.pdf
Hersteller: AMD
Description: XILINX ZYNQ ULTRASCALE+ MPSOC ZC
Packaging: Box
For Use With/Related Products: XCZU7EV
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Zynq UltraScale+ MPSoC ZCU106 Japan PCIe Card
Part Status: Active
Produkt ist nicht verfügbar
XC7A25T-2CPG238C ds181_Artix_7_Data_Sheet
XC7A25T-2CPG238C
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A12T-1CPG238C ds181_Artix_7_Data_Sheet
XC7A12T-1CPG238C
Hersteller: AMD
Description: IC FPGA 106 I/O 238BGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC17V08PC44C zeVecxGWTzd3iIaH3DvWzg
XC17V08PC44C
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 8MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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Anzahl Preis ohne MwSt
10+58.63 EUR
Mindestbestellmenge: 10
XC17V02VQ44C zeVecxGWTzd3iIaH3DvWzg
XC17V02VQ44C
Hersteller: AMD
Description: IC PROM SER 2MBIT 3.3V 44-VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 536 Stücke:
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Anzahl Preis ohne MwSt
44+12.25 EUR
Mindestbestellmenge: 44
XC17V02PC44C zeVecxGWTzd3iIaH3DvWzg
XC17V02PC44C
Hersteller: AMD
Description: IC PROM SER 2MBIT 3.3V 44-PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 1912 Stücke:
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Anzahl Preis ohne MwSt
44+12.25 EUR
Mindestbestellmenge: 44
XC7A75T-1FGG484C ds181_Artix_7_Data_Sheet
XC7A75T-1FGG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 345 Stücke:
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Anzahl Preis ohne MwSt
1+239.03 EUR
XC7A75T-2FGG484I ds181_Artix_7_Data_Sheet
XC7A75T-2FGG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 548 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+291.83 EUR
XC7A15T-1FGG484I ds180_7Series_Overview
XC7A15T-1FGG484I
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+103.28 EUR
XC7A15T-1FGG484C ds180_7Series_Overview
XC7A15T-1FGG484C
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Part Status: Active
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 1640 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+88.3 EUR
XC7A75T-2FGG676C ds181_Artix_7_Data_Sheet
XC7A75T-2FGG676C
Hersteller: AMD
Description: IC FPGA 300 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Part Status: Active
Number of I/O: 300
DigiKey Programmable: Not Verified
auf Bestellung 214 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+293.88 EUR
XCV200-5BG256C Virtex_2.5_V.pdf
XCV200-5BG256C
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV200-5BG256I Virtex_2.5_V.pdf
XCV200-5BG256I
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 236666
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 5292
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 1176
Total RAM Bits: 57344
Part Status: Obsolete
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AM28F020-200EC
Hersteller: AMD
Description: FLASH NOR 2MB 12V TSOP 200ns
Packaging: Tube
Package / Case: 32-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 200ns
Memory Interface: Parallel
Access Time: 200 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1935 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
100+3.52 EUR
200+ 3.43 EUR
300+ 3.34 EUR
500+ 3.17 EUR
Mindestbestellmenge: 100
AM29LV160DT-90EC
Hersteller: AMD
Description: FLASH NOR 16MB TSOP Top Blk 3v
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2607 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
96+4.58 EUR
192+ 4.54 EUR
384+ 4.49 EUR
960+ 4.4 EUR
Mindestbestellmenge: 96
AM29LV160DB-70EI
Hersteller: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tube
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
96+4.84 EUR
192+ 4.79 EUR
384+ 4.75 EUR
768+ 4.66 EUR
Mindestbestellmenge: 96
XC3S5000-4FGG1156C ds099.pdf?t.download=true&u=ovmfp3
XC3S5000-4FGG1156C
Hersteller: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Total RAM Bits: 1916928
Part Status: Active
Number of I/O: 633
DigiKey Programmable: Not Verified
auf Bestellung 429 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+488.35 EUR
Mindestbestellmenge: 2
XC3S5000-4FG1156C ds099.pdf?t.download=true&u=ovmfp3
XC3S5000-4FG1156C
Hersteller: AMD
Description: FPGA, 8320 CLBS, 5000000 GATES
Packaging: Bulk
Mounting Type: Surface Mount
Number of Gates: 5000000
Number of Logic Elements/Cells: 74880
Number of LABs/CLBs: 8320
Part Status: Active
Number of I/O: 489
DigiKey Programmable: Not Verified
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+178.6 EUR
Mindestbestellmenge: 3
XCV400-4HQ240C0729 ds022.pdf?t.download=true&u=ovmfp3
XCV400-4HQ240C0729
Hersteller: AMD
Description: FPGA, 2400 CLBS, 468252 GATES, 2
Packaging: Bulk
Part Status: Active
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+653.84 EUR
XCV400-5HQ240I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-5BG560C Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-4BG560I Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 404 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 404
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCV400-4HQ240C Virtex_2.5_V.pdf
Hersteller: AMD
Description: IC FPGA 166 I/O 240QFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 468252
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 10800
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2400
Total RAM Bits: 81920
Part Status: Obsolete
Number of I/O: 166
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AM29DL323GT-90EF
Hersteller: AMD
Description: FLASH NOR 32 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
auf Bestellung 960 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
96+5.28 EUR
192+ 5.1 EUR
384+ 4.93 EUR
768+ 4.84 EUR
960+ 4.75 EUR
Mindestbestellmenge: 96
AM29DL324GB-70EI
Hersteller: AMD
Description: FLASH NOR 32MB 3V (Btm Bt-Blk) 7
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 32Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 4M x 8, 2M x 16
DigiKey Programmable: Not Verified
auf Bestellung 9600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
960+5.28 EUR
1920+ 5.19 EUR
3840+ 5.1 EUR
9600+ 4.84 EUR
Mindestbestellmenge: 960
XCZU15EG-L2FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-L2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVC900E ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVB1156I ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVB1156I
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-2FFVC900I ds891-zynq-ultrascale-plus-overview
XCZU15EG-2FFVC900I
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-1FFVC900E ds891-zynq-ultrascale-plus-overview
XCZU15EG-1FFVC900E
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XCZU15EG-3FFVB1156E ds891-zynq-ultrascale-plus-overview
XCZU15EG-3FFVB1156E
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 600MHz, 667MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
AM29LV160DB-70EC
Hersteller: AMD
Description: FLASH NOR 16MB 3V TSOP (Btm Bt-B
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 218894 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
480+3.96 EUR
960+ 3.87 EUR
3840+ 3.7 EUR
7680+ 3.61 EUR
Mindestbestellmenge: 480
XCZU3CG-1UBVA530I ds891-zynq-ultrascale-plus-overview
XCZU3CG-1UBVA530I
Hersteller: AMD
Description: IC SOC CORTEX-A53 530BGA
Packaging: Tray
Package / Case: 530-WFBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 530-FCBGA (16x9.5)
Architecture: MPU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
XC7A25T-1CPG238I ds181_Artix_7_Data_Sheet
XC7A25T-1CPG238I
Hersteller: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TA)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 23360
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1825
Total RAM Bits: 1658880
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40-4BG256C ds060
XCS40-4BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40-3BG256C ds060
XCS40-3BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-5BG256C ds060
XCS40XL-5BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-4BG256C ds060
XCS40XL-4BG256C
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XCS40XL-4BG256I ds060
XCS40XL-4BG256I
Hersteller: AMD
Description: IC FPGA 205 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 1862
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 784
Total RAM Bits: 25088
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC7A200T-2SBG484I ds181_Artix_7_Data_Sheet
XC7A200T-2SBG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 149 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+633.83 EUR
XC7A200T-2FBG676C ds181_Artix_7_Data_Sheet
XC7A200T-2FBG676C
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+551.43 EUR
XC7A200T-1FBG484C ds181_Artix_7_Data_Sheet
XC7A200T-1FBG484C
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+413.46 EUR
XC7A200T-1FBG676C ds181_Artix_7_Data_Sheet
XC7A200T-1FBG676C
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 400
DigiKey Programmable: Not Verified
auf Bestellung 334 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+474.81 EUR
XC7A200T-1FBG484I ds181_Artix_7_Data_Sheet
XC7A200T-1FBG484I
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Part Status: Active
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 338 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+475.59 EUR
AM29LV160DT-90ED
Hersteller: AMD
Description: FLASH NOR 16 MB TOP BOOT 90NS TS
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-TSOP
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 7488 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
96+4.58 EUR
192+ 4.54 EUR
384+ 4.49 EUR
960+ 4.4 EUR
Mindestbestellmenge: 96
AM29F400BB-90SE
Hersteller: AMD
Description: FLASH NOR 4MB 5V PSOP (Btm Bt-Bl
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 5V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 44-SO
Part Status: Active
Write Cycle Time - Word, Page: 90ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 512K x 8, 256K x 16
DigiKey Programmable: Not Verified
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
500+7.48 EUR
1000+ 7.39 EUR
3000+ 7.22 EUR
5000+ 7.04 EUR
Mindestbestellmenge: 500
XC3S250E-4TQG144C ds312
XC3S250E-4TQG144C
Hersteller: AMD
Description: IC FPGA 108 I/O 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 5508
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 612
Total RAM Bits: 221184
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+84.48 EUR
XC4008E-1PG191C x4000.pdf
Hersteller: AMD
Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-2PG191C x4000.pdf
Hersteller: AMD
Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-3PG191C x4000.pdf
Hersteller: AMD
Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
XC4008E-3PG191I x4000.pdf
Hersteller: AMD
Description: IC FPGA 144 I/O 191CPGA
Packaging: Tray
Package / Case: 191-BCPGA
Mounting Type: Through Hole
Number of Gates: 8000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 770
Supplier Device Package: 191-CPGA (47.24x47.24)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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