| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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XCZU4EG-1SFVC784I | AMD |
 Description: IC SOC CORTEX-A53 784FCBGAPackaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-1FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-2SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-L2SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-1FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-2FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-3SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 600MHz, 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-2FBVB900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU4EG-L2FBVB900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XC5206-3TQ144C | AMD |
Description: FPGA, 196 CLBS, 6000 GATES Packaging: Bulk Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 10000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 784 Supplier Device Package: 144-TQFP (20x20) Number of LABs/CLBs: 196 Number of I/O: 117 DigiKey Programmable: Not Verified |
auf Bestellung 20 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3S1000-4FGG320I | AMD |
Description: IC FPGA 221 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 1000000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 17280 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 1920 Total RAM Bits: 442368 Number of I/O: 221 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A75T-2FGG484C | AMD |
Description: IC FPGA 285 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 75520 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 5900 Total RAM Bits: 3870720 Number of I/O: 285 DigiKey Programmable: Not Verified |
auf Bestellung 660 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-U1-VCU118-ES1-G | AMD |
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES Packaging: Box For Use With/Related Products: XCVU9P Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card |
Produkt ist nicht verfügbar |
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XC3S50-4CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1728 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 192 Total RAM Bits: 73728 Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 1090 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3S50-4CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1728 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 192 Total RAM Bits: 73728 Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC3S50-5CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1728 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 192 Total RAM Bits: 73728 Number of I/O: 89 DigiKey Programmable: Not Verified |
auf Bestellung 365 Stücke: Lieferzeit 10-14 Tag (e) |
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XC3S50-5CPG132C | AMD |
Description: IC FPGA 89 I/O 132CSBGA Packaging: Tray Package / Case: 132-TFBGA, CSPBGA Mounting Type: Surface Mount Number of Gates: 50000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 1728 Supplier Device Package: 132-CSPBGA (8x8) Number of LABs/CLBs: 192 Total RAM Bits: 73728 Number of I/O: 89 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC1765ELSO8C | AMD |
Description: IC PROM SER C-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-SOIC DigiKey Programmable: Not Verified |
auf Bestellung 6995 Stücke: Lieferzeit 10-14 Tag (e) |
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XC1765ELVOG8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC1765ELSOG8C | AMD |
Description: IC PROM SERIAL 65K 8-SOIC Packaging: Tray Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-SOIC DigiKey Programmable: Not Verified |
auf Bestellung 6510 Stücke: Lieferzeit 10-14 Tag (e) |
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XC1765ELVO8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
auf Bestellung 4806 Stücke: Lieferzeit 10-14 Tag (e) |
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XC1765EVO8I | AMD |
Description: IC PROM SER I-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
auf Bestellung 3661 Stücke: Lieferzeit 10-14 Tag (e) |
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XC1765ELVO8I | AMD |
Description: IC PROM SER I-TEMP 3.3V 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
auf Bestellung 4820 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU6EG-1FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-1FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-2FFVC900I | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6EG-2FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XC3S1600E-4FGG320I | AMD |
Description: IC FPGA 250 I/O 320FBGA Packaging: Tray Package / Case: 320-BGA Mounting Type: Surface Mount Number of Gates: 1600000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 33192 Supplier Device Package: 320-FBGA (19x19) Number of LABs/CLBs: 3688 Total RAM Bits: 663552 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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A-MA35D-P16G-PQ-G | AMD |
Description: DCAB ALVEO MA35 MEDIA HHHL AIC Power (Watts): 40W Packaging: Bulk Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 55°C Cooling Type: Heat Sink |
auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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| A-U250-P64G-SPQG-016 | AMD |
Description: A-U250-P64G-SPQG-016 Power (Watts): 215W Packaging: Bulk Memory Size: 64GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 77GB/s Cooling Type: Heat Sink LUTs: 1728k |
Produkt ist nicht verfügbar |
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| A-U280-P32G-PQG-905 | AMD |
Description: A-U280-P32G-PQG-905 Power (Watts): 215W Packaging: Bulk Memory Size: 32GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
Produkt ist nicht verfügbar |
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| ADK-U55C | AMD |
Description: ADK-U55C Power (Watts): 115W Packaging: Bulk Memory Size: 16GB Interface: PCI Express Operating Temperature: 0°C ~ 45°C Bandwidth: 460GB/s Cooling Type: Heat Sink LUTs: 1304k |
Produkt ist nicht verfügbar |
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XC7A35T-1FGG484I | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 165 Stücke: Lieferzeit 10-14 Tag (e) |
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EK-VHK158-G | AMD |
Description: VERSAL HBM VHK158 EVALUATION KIT Packaging: Bulk For Use With/Related Products: XCVH1582 Type: FPGA Contents: Board(s) |
Produkt ist nicht verfügbar |
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.jpg "XCV100-5BG256I") |
XCV100-5BG256I | AMD |
Description: IC FPGA 180 I/O 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Number of Gates: 108904 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.375V ~ 2.625V Number of Logic Elements/Cells: 2700 Supplier Device Package: 256-PBGA (27x27) Number of LABs/CLBs: 600 Total RAM Bits: 40960 Number of I/O: 180 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A15T-2CPG236I | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
auf Bestellung 31 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A35T-1CPG236C | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 106 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A15T-1CPG236I | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A15T-2CPG236C | AMD |
Description: IC FPGA 106 I/O 238CSBGA Packaging: Tray Package / Case: 238-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 238-CSBGA (10x10) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 106 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A15T-2FGG484C | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 267 Stücke: Lieferzeit 10-14 Tag (e) |
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| DS-XPA-250K | AMD |
Description: XILINX PRODUCTIVITY ADVANTAGE 1 Packaging: Bulk |
Produkt ist nicht verfügbar |
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| EK-U1-ZCU111-G-J | AMD |
Description: ZYNQUS+ XCZU28DR EVAL BRD JAPAN Packaging: Box For Use With/Related Products: XCZU28DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU111 Japan |
Produkt ist nicht verfügbar |
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| CK-U1-ZCU1285-G-J | AMD |
Description: KIT ZUP RFSOC ZCU1285 W/O PWR SP Packaging: Box For Use With/Related Products: XCZU39DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU1285 Japan |
Produkt ist nicht verfügbar |
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XC7K355T-L2FFV901E | AMD |
Description: IC FPGA 300 I/O 901FCBGA Packaging: Bulk Package / Case: 900-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.03V Number of Logic Elements/Cells: 356160 Supplier Device Package: 901-FCBGA (31x31) Number of LABs/CLBs: 27825 Total RAM Bits: 26357760 Number of I/O: 300 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC2V1500-5BGG575C | AMD |
Description: IC FPGA 392 I/O 575BGA Packaging: Tray Package / Case: 575-BBGA Mounting Type: Surface Mount Number of Gates: 1500000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 575-BGA (31x31) Number of LABs/CLBs: 1920 Total RAM Bits: 884736 Number of I/O: 392 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC2V1500-5BGG575I | AMD |
Description: IC FPGA 392 I/O 575BGA Packaging: Tray Package / Case: 575-BBGA Mounting Type: Surface Mount Number of Gates: 1500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Supplier Device Package: 575-BGA (31x31) Number of LABs/CLBs: 1920 Total RAM Bits: 884736 Number of I/O: 392 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SM-K24-XCL2GC | AMD |
Description: SOM K24 KRIA ZYNQ MPSOC Packaging: Bulk |
auf Bestellung 231 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A15T-L1FTG256I | AMD |
Description: IC FPGA 170 I/O 256FTBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 16640 Supplier Device Package: 256-FTBGA (17x17) Number of LABs/CLBs: 1300 Total RAM Bits: 921600 Number of I/O: 170 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7S75-1FGGA484C | AMD |
Description: IC FPGA 338 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 76800 Supplier Device Package: 484-FPBGA (23x23) Number of LABs/CLBs: 6000 Total RAM Bits: 4331520 Number of I/O: 338 DigiKey Programmable: Not Verified |
auf Bestellung 157 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A35T-2FGG484C | AMD |
Description: IC FPGA 250 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Number of I/O: 250 DigiKey Programmable: Not Verified |
auf Bestellung 1028 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A200T-2SBG484C | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
auf Bestellung 109 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A200T-L1SBG484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-FBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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XC7A200T-3FBG676E | AMD |
Description: IC FPGA 400 I/O 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 400 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A200T-1FB484C | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC7A200T-L1FBG484I | AMD |
Description: IC FPGA 285 I/O 484FCBGA Packaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 215360 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 16825 Total RAM Bits: 13455360 Number of I/O: 285 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
| XCZU4EG-1SFVC784I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-1FBVB900E |
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Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-2SFVC784E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-2SFVC784I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-L2SFVC784E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-1FBVB900I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-2FBVB900E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-3SFVC784E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 600MHz, 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-2FBVB900I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU4EG-L2FBVB900E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XC5206-3TQ144C |
|
Hersteller: AMD
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
Description: FPGA, 196 CLBS, 6000 GATES
Packaging: Bulk
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 10000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 784
Supplier Device Package: 144-TQFP (20x20)
Number of LABs/CLBs: 196
Number of I/O: 117
DigiKey Programmable: Not Verified
auf Bestellung 20 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 106.65 EUR |
| XC3S1000-4FGG320I |
|
Hersteller: AMD
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Description: IC FPGA 221 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1000000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 17280
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 1920
Total RAM Bits: 442368
Number of I/O: 221
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A75T-2FGG484C |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 75520
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 5900
Total RAM Bits: 3870720
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 660 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 264.56 EUR |
| EK-U1-VCU118-ES1-G |
|
Hersteller: AMD
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
Description: KIT VCU118 VIRTEX ULTRASCALE+ ES
Packaging: Box
For Use With/Related Products: XCVU9P
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Virtex UltraScale+ FPGA VCU118 ES1 PCIe Card
Produkt ist nicht verfügbar
| XC3S50-4CPG132C |
|
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1090 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 27+ | 18.07 EUR |
| XC3S50-4CPG132C |
|
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC3S50-5CPG132C |
|
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 365 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 23+ | 20.79 EUR |
| XC3S50-5CPG132C |
|
Hersteller: AMD
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC FPGA 89 I/O 132CSBGA
Packaging: Tray
Package / Case: 132-TFBGA, CSPBGA
Mounting Type: Surface Mount
Number of Gates: 50000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 1728
Supplier Device Package: 132-CSPBGA (8x8)
Number of LABs/CLBs: 192
Total RAM Bits: 73728
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC1765ELSO8C |
|
Hersteller: AMD
Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
auf Bestellung 6995 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 51+ | 9.59 EUR |
| XC1765ELVOG8C |
|
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC1765ELSOG8C |
|
Hersteller: AMD
Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
Description: IC PROM SERIAL 65K 8-SOIC
Packaging: Tray
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-SOIC
DigiKey Programmable: Not Verified
auf Bestellung 6510 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 51+ | 9.59 EUR |
| XC1765ELVO8C |
|
Hersteller: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 4806 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 51+ | 9.68 EUR |
| XC1765EVO8I |
|
Hersteller: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 3661 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 49+ | 9.98 EUR |
| XC1765ELVO8I |
|
Hersteller: AMD
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC PROM SER I-TEMP 3.3V 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
auf Bestellung 4820 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 44+ | 11.26 EUR |
| XCZU6EG-1FFVC900E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-1FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-1FFVC900I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-2FFVC900E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-1FFVB1156I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-2FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-2FFVC900I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6EG-2FFVB1156I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XC3S1600E-4FGG320I |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 320FBGA
Packaging: Tray
Package / Case: 320-BGA
Mounting Type: Surface Mount
Number of Gates: 1600000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 33192
Supplier Device Package: 320-FBGA (19x19)
Number of LABs/CLBs: 3688
Total RAM Bits: 663552
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 414.09 EUR |
| A-MA35D-P16G-PQ-G |
Hersteller: AMD
Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
Description: DCAB ALVEO MA35 MEDIA HHHL AIC
Power (Watts): 40W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 55°C
Cooling Type: Heat Sink
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 3078.2 EUR |
| A-U250-P64G-SPQG-016 |
|
Hersteller: AMD
Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
Description: A-U250-P64G-SPQG-016
Power (Watts): 215W
Packaging: Bulk
Memory Size: 64GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 77GB/s
Cooling Type: Heat Sink
LUTs: 1728k
Produkt ist nicht verfügbar
| A-U280-P32G-PQG-905 |
|
Hersteller: AMD
Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: A-U280-P32G-PQG-905
Power (Watts): 215W
Packaging: Bulk
Memory Size: 32GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Produkt ist nicht verfügbar
| ADK-U55C |
Hersteller: AMD
Description: ADK-U55C
Power (Watts): 115W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Description: ADK-U55C
Power (Watts): 115W
Packaging: Bulk
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 1304k
Produkt ist nicht verfügbar
| XC7A35T-1FGG484I |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 165 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 124.92 EUR |
| EK-VHK158-G |
Hersteller: AMD
Description: VERSAL HBM VHK158 EVALUATION KIT
Packaging: Bulk
For Use With/Related Products: XCVH1582
Type: FPGA
Contents: Board(s)
Description: VERSAL HBM VHK158 EVALUATION KIT
Packaging: Bulk
For Use With/Related Products: XCVH1582
Type: FPGA
Contents: Board(s)
Produkt ist nicht verfügbar
| XCV100-5BG256I |
|
Hersteller: AMD
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 108904
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 2700
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 600
Total RAM Bits: 40960
Number of I/O: 180
DigiKey Programmable: Not Verified
Description: IC FPGA 180 I/O 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Number of Gates: 108904
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 2700
Supplier Device Package: 256-PBGA (27x27)
Number of LABs/CLBs: 600
Total RAM Bits: 40960
Number of I/O: 180
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A15T-2CPG236I |
|
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
auf Bestellung 31 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 90.68 EUR |
| XC7A35T-1CPG236C |
|
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A15T-1CPG236I |
|
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A15T-2CPG236C |
|
Hersteller: AMD
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Description: IC FPGA 106 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 106
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A15T-2FGG484C |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 101.48 EUR |
| DS-XPA-250K |
Produkt ist nicht verfügbar
| EK-U1-ZCU111-G-J |
|
Hersteller: AMD
Description: ZYNQUS+ XCZU28DR EVAL BRD JAPAN
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU111 Japan
Description: ZYNQUS+ XCZU28DR EVAL BRD JAPAN
Packaging: Box
For Use With/Related Products: XCZU28DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU111 Japan
Produkt ist nicht verfügbar
| CK-U1-ZCU1285-G-J |
|
Hersteller: AMD
Description: KIT ZUP RFSOC ZCU1285 W/O PWR SP
Packaging: Box
For Use With/Related Products: XCZU39DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU1285 Japan
Description: KIT ZUP RFSOC ZCU1285 W/O PWR SP
Packaging: Box
For Use With/Related Products: XCZU39DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU1285 Japan
Produkt ist nicht verfügbar
| XC7K355T-L2FFV901E |
Hersteller: AMD
Description: IC FPGA 300 I/O 901FCBGA
Packaging: Bulk
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 356160
Supplier Device Package: 901-FCBGA (31x31)
Number of LABs/CLBs: 27825
Total RAM Bits: 26357760
Number of I/O: 300
DigiKey Programmable: Not Verified
Description: IC FPGA 300 I/O 901FCBGA
Packaging: Bulk
Package / Case: 900-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.03V
Number of Logic Elements/Cells: 356160
Supplier Device Package: 901-FCBGA (31x31)
Number of LABs/CLBs: 27825
Total RAM Bits: 26357760
Number of I/O: 300
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC2V1500-5BGG575C |
|
Hersteller: AMD
Description: IC FPGA 392 I/O 575BGA
Packaging: Tray
Package / Case: 575-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 575-BGA (31x31)
Number of LABs/CLBs: 1920
Total RAM Bits: 884736
Number of I/O: 392
DigiKey Programmable: Not Verified
Description: IC FPGA 392 I/O 575BGA
Packaging: Tray
Package / Case: 575-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 575-BGA (31x31)
Number of LABs/CLBs: 1920
Total RAM Bits: 884736
Number of I/O: 392
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC2V1500-5BGG575I |
|
Hersteller: AMD
Description: IC FPGA 392 I/O 575BGA
Packaging: Tray
Package / Case: 575-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 575-BGA (31x31)
Number of LABs/CLBs: 1920
Total RAM Bits: 884736
Number of I/O: 392
DigiKey Programmable: Not Verified
Description: IC FPGA 392 I/O 575BGA
Packaging: Tray
Package / Case: 575-BBGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Supplier Device Package: 575-BGA (31x31)
Number of LABs/CLBs: 1920
Total RAM Bits: 884736
Number of I/O: 392
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| SM-K24-XCL2GC |
|
auf Bestellung 231 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 512.88 EUR |
| XC7A15T-L1FTG256I |
|
Hersteller: AMD
Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 170
DigiKey Programmable: Not Verified
Description: IC FPGA 170 I/O 256FTBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 256-FTBGA (17x17)
Number of LABs/CLBs: 1300
Total RAM Bits: 921600
Number of I/O: 170
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7S75-1FGGA484C |
|
Hersteller: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 76800
Supplier Device Package: 484-FPBGA (23x23)
Number of LABs/CLBs: 6000
Total RAM Bits: 4331520
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 157 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 166.21 EUR |
| XC7A35T-2FGG484C |
|
Hersteller: AMD
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
Description: IC FPGA 250 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Number of I/O: 250
DigiKey Programmable: Not Verified
auf Bestellung 1028 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 124.92 EUR |
| XC7A200T-2SBG484C |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 109 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 551.43 EUR |
| XC7A200T-L1SBG484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-FBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 608.47 EUR |
| XC7A200T-3FBG676E |
|
Hersteller: AMD
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Description: IC FPGA 400 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 400
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A200T-1FB484C |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC7A200T-L1FBG484I |
|
Hersteller: AMD
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Description: IC FPGA 285 I/O 484FCBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 215360
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 16825
Total RAM Bits: 13455360
Number of I/O: 285
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar