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Technische Details XCZU4EG-1FBVB900I AMD / Xilinx
Description: IC SOC CORTEX-A53 900FCBGA, Packaging: Tray, Package / Case: 900-BBGA, FCBGA, Speed: 500MHz, 600MHz, 1.2GHz, RAM Size: 256KB, Operating Temperature: -40°C ~ 100°C (TJ), Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Peripherals: DMA, WDT, Supplier Device Package: 900-FCBGA (31x31), Architecture: MCU, FPGA.
Weitere Produktangebote XCZU4EG-1FBVB900I
Foto | Bezeichnung | Hersteller | Beschreibung |
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XCZU4EG-1FBVB900I | Hersteller : AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA |
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