| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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|---|---|---|---|---|---|---|---|
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XA3S1500-4FGG676I | AMD |
 Description: IC FPGA 487 I/O 676FBGAPackaging: Tray Package / Case: 676-BGA Mounting Type: Surface Mount Number of Gates: 1500000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 29952 Supplier Device Package: 676-FBGA (27x27) Number of LABs/CLBs: 3328 Total RAM Bits: 589824 Grade: Automotive Number of I/O: 487 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| XCVU13P-L2FIGD2104E | AMD |
Description: IC FPGA 676 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Voltage - Supply: 0.698V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 676 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVU13P-2FHGA2104E | AMD |
Description: IC FPGA 832 I/O 2104FCBGA Packaging: Tray Package / Case: 2104-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 3780000 Supplier Device Package: 2104-FCBGA (52.5x52.5) Number of LABs/CLBs: 216000 Total RAM Bits: 514867200 Number of I/O: 832 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC4028XLA-09BGG352C | AMD |
Description: FPGA, 1024 CLBS, 18000 GATES Packaging: Bulk Package / Case: 352-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 352-MBGA (35x35) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 256 DigiKey Programmable: Not Verified |
auf Bestellung 302 Stücke: Lieferzeit 10-14 Tag (e) |
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XC4028XL-3HQ208I | AMD |
Description: IC FPGA 160 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC4008E-3PQ208C | AMD |
Description: IC FPGA 144 I/O 208QFP Packaging: Bulk Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 8000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 770 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 324 Total RAM Bits: 10368 Number of I/O: 144 DigiKey Programmable: Not Verified |
auf Bestellung 337 Stücke: Lieferzeit 10-14 Tag (e) |
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XC4008E-3PQ208C | AMD |
Description: IC FPGA 144 I/O 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Number of Gates: 8000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 770 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 324 Total RAM Bits: 10368 Number of I/O: 144 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XC4044XL-1BG352C | AMD |
Description: IC FPGA 289 I/O 352MBGA Packaging: Bulk Package / Case: 352-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 44000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 3800 Supplier Device Package: 352-MBGA (35x35) Number of LABs/CLBs: 1600 Total RAM Bits: 51200 Number of I/O: 289 DigiKey Programmable: Not Verified |
auf Bestellung 70 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4062XL-1BG432C | AMD |
Description: IC FPGA 352 I/O 432MBGA Packaging: Tray Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 352 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XC4062XL-1BG560C | AMD |
Description: IC FPGA 384 I/O 560MBGA Packaging: Tray Package / Case: 560-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 560-MBGA (42.5x42.5) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 384 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XC4062XL-1BG432I | AMD |
Description: IC FPGA 352 I/O 432MBGA Packaging: Tray Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 352 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XC4062XL-09BG432C | AMD |
Description: IC FPGA 352 I/O 432MBGA Packaging: Tray Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 352 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC4025E-3HQ240I | AMD |
Description: FIELD PROGRAMMABLE GATE ARRAY, 1 Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 25000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Logic Elements/Cells: 2432 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 193 DigiKey Programmable: Not Verified |
auf Bestellung 132 Stücke: Lieferzeit 10-14 Tag (e) |
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XC4004A-6TQ144I | AMD |
Description: FPGA, 144 CLBS, 3200 GATES Packaging: Bulk DigiKey Programmable: Not Verified |
auf Bestellung 85 Stücke: Lieferzeit 10-14 Tag (e) |
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XC4028XL-2HQ208C | AMD |
Description: IC FPGA 160 I/O 208QFP Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 160 DigiKey Programmable: Not Verified |
auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4028XL-3BG352C | AMD |
Description: IC FPGA 256 I/O 352MBGA Packaging: Bulk Package / Case: 352-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 28000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 2432 Supplier Device Package: 352-MBGA (35x35) Number of LABs/CLBs: 1024 Total RAM Bits: 32768 Number of I/O: 256 DigiKey Programmable: Not Verified |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC4062XL-3BG432C | AMD |
Description: IC FPGA 352 I/O 432MBGA Packaging: Tray Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 352 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| XCVM1502-1MSEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1502-1LSEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-1MSIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2MSEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-1MSEVFVC1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-1MLIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-1LSIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2LSEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2MLEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-1LSEVFVC1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2MSIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-2MSEVFVC1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1802-1MSIVFVC1760 | AMD |
Description: IC VERSAL AICORE FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1502-1LLIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 400MHz, 1GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2LLEVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 450MHz, 1.08GHz RAM Size: 256KB Operating Temperature: 0°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2MLIVFVC1760 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1760BGA Packaging: Tray Package / Case: 1760-BFBGA, FCBGA Speed: 600MHz, 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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| XCVM1502-2HSIVFVC1760 | AMD |
Description: XCVM1502-2HSIVFVC1760 Packaging: Bulk Package / Case: 1760-BFBGA, FCBGA Speed: 800MHz, 1.65GHz RAM Size: 256KB Operating Temperature: -40°C ~ 110°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1760-FCBGA (40x40) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
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EK-U1-VCU108-G-J | AMD |
Description: KIT EVAL VIRTEX FPGA VCU108 JP Packaging: Box For Use With/Related Products: XCVU095 Type: FPGA Contents: Board(s), Cable(s) - Power Supply Not Included - Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card |
Produkt ist nicht verfügbar |
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XCAU20P-1FFVB676E | AMD |
Description: IC FPGA ARTIX UP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-1SFVB784E | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-1FFVB676E | AMD |
Description: IC FPGA ARTIX UP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 280 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-1SFVB784E | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-1SFVB784I | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-2FFVB676E | AMD |
Description: IC FPGA ARTIX UP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-L1FFVB676I | AMD |
Description: IC FPGA ARTIX UP LP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 238437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-L1SFVB784I | AMD |
Description: IC FPGA ARTIX UP LP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU20P-2SFVB784E | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 238437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 13625 Total RAM Bits: 7340032 Number of I/O: 228 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-1SFVB784I | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-L1FFVB676I | AMD |
Description: IC FPGA ARTIX UP LP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 308437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 280 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-2FFVB676E | AMD |
Description: IC FPGA ARTIX UP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 280 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-L1SFVB784I | AMD |
Description: IC FPGA ARTIX UP LP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.698V ~ 0.742V Number of Logic Elements/Cells: 308437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-2SFVB784E | AMD |
Description: IC FPGA ARTIX UP 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 784-FCBGA (23x23) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 304 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XCAU25P-2FFVB676I | AMD |
Description: IC FPGA ARTIX UP 676FCBGA Packaging: Tray Package / Case: 676-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.825V ~ 0.876V Number of Logic Elements/Cells: 308437 Supplier Device Package: 676-FCBGA (27x27) Number of LABs/CLBs: 17625 Total RAM Bits: 11010048 Number of I/O: 280 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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XC6SLX150-2FG484I | AMD |
Description: IC FPGA 338 I/O 484FBGA Packaging: Tray Package / Case: 484-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.14V ~ 1.26V Number of Logic Elements/Cells: 147443 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 11519 Total RAM Bits: 4939776 Number of I/O: 338 DigiKey Programmable: Not Verified |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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XCKU040-2FFVA1156I | AMD |
Description: IC FPGA 520 I/O 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.922V ~ 0.979V Number of Logic Elements/Cells: 530250 Supplier Device Package: 1156-FCBGA (35x35) Number of LABs/CLBs: 30300 Total RAM Bits: 21606000 Number of I/O: 520 DigiKey Programmable: Not Verified |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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XCZU6CG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU9CG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6CG-1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU9EG-1FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6CG-2FFVB1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Bulk Package / Case: 1156-BBGA, FCBGA Speed: 533MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU6CG-L1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCZU9CG-1FFVB1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Packaging: Tray Package / Case: 1156-BBGA, FCBGA Speed: 500MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1156-FCBGA (35x35) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
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XCVM1302-2MSENSVF1369 | AMD |
Description: IC VERSALPRIME ACAP FPGA 1369BGA Packaging: Tray Package / Case: 1369-BFBGA Speed: 600MHz, 1.4GHz Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe Supplier Device Package: 1369-BGA (35x35) Architecture: MPU, FPGA |
Produkt ist nicht verfügbar |
| XA3S1500-4FGG676I |
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Hersteller: AMD
Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 487 I/O 676FBGA
Packaging: Tray
Package / Case: 676-BGA
Mounting Type: Surface Mount
Number of Gates: 1500000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 29952
Supplier Device Package: 676-FBGA (27x27)
Number of LABs/CLBs: 3328
Total RAM Bits: 589824
Grade: Automotive
Number of I/O: 487
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| XCVU13P-L2FIGD2104E |
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Hersteller: AMD
Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
Description: IC FPGA 676 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 676
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVU13P-2FHGA2104E |
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Hersteller: AMD
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Description: IC FPGA 832 I/O 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 3780000
Supplier Device Package: 2104-FCBGA (52.5x52.5)
Number of LABs/CLBs: 216000
Total RAM Bits: 514867200
Number of I/O: 832
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4028XLA-09BGG352C |
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Hersteller: AMD
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: FPGA, 1024 CLBS, 18000 GATES
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 302 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 207.47 EUR |
| XC4028XL-3HQ208I |
|
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC FPGA 160 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4008E-3PQ208C |
|
Hersteller: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC FPGA 144 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
auf Bestellung 337 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 246.44 EUR |
| XC4008E-3PQ208C |
|
Hersteller: AMD
Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: IC FPGA 144 I/O 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 770
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Total RAM Bits: 10368
Number of I/O: 144
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4044XL-1BG352C |
|
Hersteller: AMD
Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
Description: IC FPGA 289 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 44000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 3800
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1600
Total RAM Bits: 51200
Number of I/O: 289
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 300.84 EUR |
| XC4062XL-1BG432C |
|
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4062XL-1BG560C |
|
Hersteller: AMD
Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 560MBGA
Packaging: Tray
Package / Case: 560-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 560-MBGA (42.5x42.5)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 384
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4062XL-1BG432I |
|
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4062XL-09BG432C |
|
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC4025E-3HQ240I |
|
Hersteller: AMD
Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
Description: FIELD PROGRAMMABLE GATE ARRAY, 1
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 25000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 193
DigiKey Programmable: Not Verified
auf Bestellung 132 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 366.16 EUR |
| XC4004A-6TQ144I |
|
Hersteller: AMD
Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: FPGA, 144 CLBS, 3200 GATES
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 85 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 62.12 EUR |
| XC4028XL-2HQ208C |
|
Hersteller: AMD
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC FPGA 160 I/O 208QFP
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 23 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 114.11 EUR |
| XC4028XL-3BG352C |
|
Hersteller: AMD
Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC FPGA 256 I/O 352MBGA
Packaging: Bulk
Package / Case: 352-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 28000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 2432
Supplier Device Package: 352-MBGA (35x35)
Number of LABs/CLBs: 1024
Total RAM Bits: 32768
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 373.17 EUR |
| XC4062XL-3BG432C |
|
Hersteller: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Description: IC FPGA 352 I/O 432MBGA
Packaging: Tray
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCVM1502-1MSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-1LSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-1MSIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2MSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-1MSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-1MLIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-1LSIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2LSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2MLEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-1LSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2MSIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-2MSEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1802-1MSIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSAL AICORE FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-1LLIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2LLEVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2MLIVFVC1760 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1760BGA
Packaging: Tray
Package / Case: 1760-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| XCVM1502-2HSIVFVC1760 |
Hersteller: AMD
Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Description: XCVM1502-2HSIVFVC1760
Packaging: Bulk
Package / Case: 1760-BFBGA, FCBGA
Speed: 800MHz, 1.65GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 110°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 1M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1760-FCBGA (40x40)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar
| EK-U1-VCU108-G-J |
|
Hersteller: AMD
Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Description: KIT EVAL VIRTEX FPGA VCU108 JP
Packaging: Box
For Use With/Related Products: XCVU095
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Virtex UltraScale FPGA VCU108 Japan PCIe Card
Produkt ist nicht verfügbar
| XCAU20P-1FFVB676E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-1SFVB784E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-1FFVB676E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-1SFVB784E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-1SFVB784I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-2FFVB676E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-L1FFVB676I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-L1SFVB784I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU20P-2SFVB784E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 238437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 13625
Total RAM Bits: 7340032
Number of I/O: 228
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-1SFVB784I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-L1FFVB676I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP LP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-2FFVB676E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-L1SFVB784I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP LP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-2SFVB784E |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 784-FCBGA (23x23)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 304
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XCAU25P-2FFVB676I |
|
Hersteller: AMD
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Description: IC FPGA ARTIX UP 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 308437
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 17625
Total RAM Bits: 11010048
Number of I/O: 280
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| XC6SLX150-2FG484I |
|
Hersteller: AMD
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
Description: IC FPGA 338 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 147443
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 11519
Total RAM Bits: 4939776
Number of I/O: 338
DigiKey Programmable: Not Verified
auf Bestellung 120 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 731.81 EUR |
| XCKU040-2FFVA1156I |
|
Hersteller: AMD
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
Description: IC FPGA 520 I/O 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 1156-FCBGA (35x35)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Number of I/O: 520
DigiKey Programmable: Not Verified
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 5415.96 EUR |
| XCZU6CG-1FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU9CG-1FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6CG-1FFVB1156I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU9EG-1FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6CG-2FFVB1156E |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Bulk
Package / Case: 1156-BBGA, FCBGA
Speed: 533MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU6CG-L1FFVB1156I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCZU9CG-1FFVB1156I |
|
Hersteller: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 1156FCBGA
Packaging: Tray
Package / Case: 1156-BBGA, FCBGA
Speed: 500MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1156-FCBGA (35x35)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| XCVM1302-2MSENSVF1369 |
|
Hersteller: AMD
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Description: IC VERSALPRIME ACAP FPGA 1369BGA
Packaging: Tray
Package / Case: 1369-BFBGA
Speed: 600MHz, 1.4GHz
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ Prime FPGA, 70k Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1369-BGA (35x35)
Architecture: MPU, FPGA
Produkt ist nicht verfügbar