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MC908QT1ACDWE MC908QT1ACDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QY1AMDWE MC908QY1AMDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QB4MDWE MC908QB4MDWE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
MCIMX6L8DVN10AB MCIMX6L8DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
14+37.29 EUR
Mindestbestellmenge: 14
MCIMX6L8DVN10AB MCIMX6L8DVN10AB NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6L3DVN10AC MCIMX6L3DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 10386 Stücke:
Lieferzeit 10-14 Tag (e)
13+40.54 EUR
Mindestbestellmenge: 13
MWCT2D16SHT1VPB NXP USA Inc. Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
MWCT2D17SHT1VPBR NXP USA Inc. Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MWCT2D17SHT1VPB NXP USA Inc. Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
MC9S12XD256CAA MC9S12XD256CAA NXP USA Inc. 9S12XDFAMPP.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12XD256VAA MC9S12XD256VAA NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12XD256VAG MC9S12XD256VAG NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC164PW,112 74HC164PW,112 NXP USA Inc. 74HC_HCT164.pdf Description: IC 8BIT SHIFT REGISTER 14-TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-TSSOP
Number of Bits per Element: 8
auf Bestellung 22301 Stücke:
Lieferzeit 10-14 Tag (e)
2404+0.2 EUR
Mindestbestellmenge: 2404
BT151-650L,127 BT151-650L,127 NXP USA Inc. PHGLS18655-1.pdf?t.download=true&u=5oefqw Description: NOW WEEN - BT151-650L - SILICON
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: -40°C ~ 125°C
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 132A
Current - On State (It (AV)) (Max): 7.5 A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Voltage - On State (Vtm) (Max): 1.75 V
Current - Off State (Max): 500 µA
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 650 V
auf Bestellung 109123 Stücke:
Lieferzeit 10-14 Tag (e)
994+0.49 EUR
Mindestbestellmenge: 994
S9S12XS128J1VAA S9S12XS128J1VAA NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BZV55-C8V2,135 BZV55-C8V2,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 8.2V 500MW LLDS
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 430000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
74LVC125ADB,118 74LVC125ADB,118 NXP USA Inc. 74LVC125A.pdf Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Bulk
auf Bestellung 10166 Stücke:
Lieferzeit 10-14 Tag (e)
1990+0.24 EUR
Mindestbestellmenge: 1990
74LVC125ADB,112 74LVC125ADB,112 NXP USA Inc. 74LVC125A.pdf Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Tube
auf Bestellung 17546 Stücke:
Lieferzeit 10-14 Tag (e)
1869+0.26 EUR
Mindestbestellmenge: 1869
N74F38N,602 N74F38N,602 NXP USA Inc. DS_568_74F38.pdf Description: IC GATE NAND 4CH 2-INP 14DIP
Features: Open Collector
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Number of Circuits: 4
Produkt ist nicht verfügbar
MAC97A8/DG,412 MAC97A8/DG,412 NXP USA Inc. PHGLS28890-1.pdf?t.download=true&u=5oefqw Description: TRIAC SENS GATE 400V 0.6A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.8A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 600 mA
Voltage - Off State: 400 V
auf Bestellung 24923 Stücke:
Lieferzeit 10-14 Tag (e)
2777+0.18 EUR
Mindestbestellmenge: 2777
MC12311CHNR MC12311CHNR NXP USA Inc. www.nxp.com Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT04N,652 74HCT04N,652 NXP USA Inc. 74HC_HCT04.pdf Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 16733 Stücke:
Lieferzeit 10-14 Tag (e)
1110+0.44 EUR
Mindestbestellmenge: 1110
74HCT74N,652 74HCT74N,652 NXP USA Inc. 74HC_HCT74.pdf Description: IC FF D-TYPE DUAL 1BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 22454 Stücke:
Lieferzeit 10-14 Tag (e)
1025+0.48 EUR
Mindestbestellmenge: 1025
74HCT164N,652 74HCT164N,652 NXP USA Inc. 74HC%28T%29164_Rev7.pdf Description: IC SHIFT REG 8BIT SI-PO 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-DIP
Number of Bits per Element: 8
auf Bestellung 30398 Stücke:
Lieferzeit 10-14 Tag (e)
620+0.79 EUR
Mindestbestellmenge: 620
MMRF5017HSR5 MMRF5017HSR5 NXP USA Inc. MMRF5017HS.pdf Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
2+398.48 EUR
Mindestbestellmenge: 2
MCF51AG96CLH MCF51AG96CLH NXP USA Inc. MCF51AG128.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 19x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
IP3088CX15,135 NXP USA Inc. PHGLS19967-1.pdf?t.download=true&u=5oefqw Description: IP3088CX15 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 15-WFBGA, WLCSP
Size / Dimension: 0.117" L x 0.050" W (2.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Number of Channels: 6
Current: 30 mA
auf Bestellung 18201 Stücke:
Lieferzeit 10-14 Tag (e)
951+0.51 EUR
Mindestbestellmenge: 951
LH79524N0F100A1 NXP USA Inc. PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.205MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM720T™ RISC
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 6693 Stücke:
Lieferzeit 10-14 Tag (e)
100+8.97 EUR
Mindestbestellmenge: 100
PDTA144TU,115 PDTA144TU,115 NXP USA Inc. 568-2122_schem.jpg Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
auf Bestellung 143980 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA144TT,215 PDTA144TT,215 NXP USA Inc. 31_SOT23.jpg Description: TRANS PNP W/RES 50V SOT-23
Packaging: Bulk
auf Bestellung 102000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA144VM,315 PDTA144VM,315 NXP USA Inc. PDTA144V_SER.pdf Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 140000 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
PDTA144EMB,315 PDTA144EMB,315 NXP USA Inc. PHGLS24726-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 200000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.049 EUR
Mindestbestellmenge: 11225
PDTA144TMB,315 PDTA144TMB,315 NXP USA Inc. PHGLS24961-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
auf Bestellung 169326 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.049 EUR
Mindestbestellmenge: 11225
PDTA144WMB,315 PDTA144WMB,315 NXP USA Inc. PHGLS25680-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
auf Bestellung 149782 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.049 EUR
Mindestbestellmenge: 11225
BZX79-B18,143 BZX79-B18,143 NXP USA Inc. PHGLS19463-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 18V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
auf Bestellung 101203 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.032 EUR
Mindestbestellmenge: 15000
1N4748A,113 1N4748A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 22V 1W DO41
Packaging: Bulk
auf Bestellung 138562 Stücke:
Lieferzeit 10-14 Tag (e)
9072+0.049 EUR
Mindestbestellmenge: 9072
MCIMX6DP7CVT8AA MCIMX6DP7CVT8AA NXP USA Inc. IMX6SRSFS.pdf Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
BTA208-800E,127 NXP USA Inc. bta208-800e.pdf Description: TRIAC SENS GATE 800V 8A TO220AB
Packaging: Bulk
auf Bestellung 4944 Stücke:
Lieferzeit 10-14 Tag (e)
787+0.62 EUR
Mindestbestellmenge: 787
MFS8632BMBA0ES MFS8632BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PDTC143EM,315 PDTC143EM,315 NXP USA Inc. PDTA143E_SERIES_7.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 132903 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
74LV08N,112 74LV08N,112 NXP USA Inc. 74LV08.pdf Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
MK12DX128VLH5 MK12DX128VLH5 NXP USA Inc. K12P64M50SF4.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N74F194D,602 N74F194D,602 NXP USA Inc. DS_568_74F194.pdf Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)
975+0.52 EUR
Mindestbestellmenge: 975
PZU3.3B1,115 PZU3.3B1,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 250614 Stücke:
Lieferzeit 10-14 Tag (e)
10804+0.049 EUR
Mindestbestellmenge: 10804
PZU3.3B2,115 PZU3.3B2,115 NXP USA Inc. PHGLS19743-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 16382 Stücke:
Lieferzeit 10-14 Tag (e)
10804+0.049 EUR
Mindestbestellmenge: 10804
PDTC144EE,135 PDTC144EE,135 NXP USA Inc. PDTC144E_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 25889 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
HEF40373BP,652 HEF40373BP,652 NXP USA Inc. HEF40373B.pdf Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
MKL81Z128VLK7 MKL81Z128VLK7 NXP USA Inc. KNTSKL8XFS.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HAT0VLHR FS32K146HAT0VLHR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HAT0VLHT FS32K146HAT0VLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K148HET0VLQT FS32K148HET0VLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEF8102EN/N1Y NXP USA Inc. Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEF8102EN/N1E NXP USA Inc. Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC573PW,112 74HC573PW,112 NXP USA Inc. 74HC_HCT573.pdf Description: IC LATCH TRANSP OCT D 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-TSSOP
auf Bestellung 9858 Stücke:
Lieferzeit 10-14 Tag (e)
1797+0.28 EUR
Mindestbestellmenge: 1797
AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
Produkt ist nicht verfügbar
AFT20S015NR1 AFT20S015NR1 NXP USA Inc. AFT20S015N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
1+46.62 EUR
10+ 42.99 EUR
25+ 41.05 EUR
100+ 36.71 EUR
250+ 35.02 EUR
MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
MHT1008NT1 MHT1008NT1 NXP USA Inc. MHT1008N.pdf Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
auf Bestellung 3456 Stücke:
Lieferzeit 10-14 Tag (e)
24+21.3 EUR
Mindestbestellmenge: 24
MWCT1001AVLH MWCT1001AVLH NXP USA Inc. MWCT1001AVLH_Web.pdf Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
34+14.48 EUR
Mindestbestellmenge: 34
MC908QT1ACDWE MC68HC908QY4A.pdf
MC908QT1ACDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QY1AMDWE MC68HC908QY4A.pdf
MC908QY1AMDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC908QB4MDWE MC68HC908QB8.pdf
MC908QB4MDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
MCIMX6L8DVN10AB IMX6SLCEC.pdf
MCIMX6L8DVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 162 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
14+37.29 EUR
Mindestbestellmenge: 14
MCIMX6L8DVN10AB IMX6SLCEC.pdf
MCIMX6L8DVN10AB
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Produkt ist nicht verfügbar
MCIMX6L3DVN10AC IMX6SLCEC.pdf
MCIMX6L3DVN10AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Bulk
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
auf Bestellung 10386 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13+40.54 EUR
Mindestbestellmenge: 13
MWCT2D16SHT1VPB
Hersteller: NXP USA Inc.
Description: MWCT2D16S, MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
MWCT2D17SHT1VPBR
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MWCT2D17SHT1VPB
Hersteller: NXP USA Inc.
Description: MWCT2D17S,MAXQFP172
Packaging: Tray
Produkt ist nicht verfügbar
MC9S12XD256CAA 9S12XDFAMPP.pdf
MC9S12XD256CAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12XD256VAA
MC9S12XD256VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S12XD256VAG MC9S12XDP512RMV2.pdf
MC9S12XD256VAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 14K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC164PW,112 74HC_HCT164.pdf
74HC164PW,112
Hersteller: NXP USA Inc.
Description: IC 8BIT SHIFT REGISTER 14-TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-TSSOP
Number of Bits per Element: 8
auf Bestellung 22301 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2404+0.2 EUR
Mindestbestellmenge: 2404
BT151-650L,127 PHGLS18655-1.pdf?t.download=true&u=5oefqw
BT151-650L,127
Hersteller: NXP USA Inc.
Description: NOW WEEN - BT151-650L - SILICON
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
SCR Type: Standard Recovery
Operating Temperature: -40°C ~ 125°C
Current - Hold (Ih) (Max): 20 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 120A, 132A
Current - On State (It (AV)) (Max): 7.5 A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Voltage - On State (Vtm) (Max): 1.75 V
Current - Off State (Max): 500 µA
Supplier Device Package: TO-220AB
Current - On State (It (RMS)) (Max): 12 A
Voltage - Off State: 650 V
auf Bestellung 109123 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
994+0.49 EUR
Mindestbestellmenge: 994
S9S12XS128J1VAA MC9S12XS256RMV1.pdf
S9S12XS128J1VAA
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BZV55-C8V2,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C8V2,135
Hersteller: NXP USA Inc.
Description: DIODE ZENER 8.2V 500MW LLDS
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 8.2 V
Impedance (Max) (Zzt): 15 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 700 nA @ 5 V
auf Bestellung 430000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
74LVC125ADB,118 74LVC125A.pdf
74LVC125ADB,118
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Bulk
auf Bestellung 10166 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1990+0.24 EUR
Mindestbestellmenge: 1990
74LVC125ADB,112 74LVC125A.pdf
74LVC125ADB,112
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SSOP
Packaging: Tube
auf Bestellung 17546 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1869+0.26 EUR
Mindestbestellmenge: 1869
N74F38N,602 DS_568_74F38.pdf
N74F38N,602
Hersteller: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14DIP
Features: Open Collector
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: -, 64mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 12.5ns @ 5V, 50pF
Number of Circuits: 4
Produkt ist nicht verfügbar
MAC97A8/DG,412 PHGLS28890-1.pdf?t.download=true&u=5oefqw
MAC97A8/DG,412
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 400V 0.6A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.8A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 600 mA
Voltage - Off State: 400 V
auf Bestellung 24923 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2777+0.18 EUR
Mindestbestellmenge: 2777
MC12311CHNR www.nxp.com
MC12311CHNR
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
Packaging: Tape & Reel (TR)
Package / Case: 60-VFLGA Exposed Pad
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Memory Size: 32kB Flash, 2kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 17dBm
Current - Receiving: 16mA
Data Rate (Max): 300kbps
Current - Transmitting: 16mA ~ 95mA
Supplier Device Package: 60-VFLGA (8x8)
GPIO: 34
Modulation: FSK, GFSK, GMSK, MSK, OOK
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT04N,652 74HC_HCT04.pdf
74HCT04N,652
Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 19ns @ 4.5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 16733 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1110+0.44 EUR
Mindestbestellmenge: 1110
74HCT74N,652 74HC_HCT74.pdf
74HCT74N,652
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE DUAL 1BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 59 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-DIP
Max Propagation Delay @ V, Max CL: 44ns @ 4.5V, 50pF
Number of Bits per Element: 1
auf Bestellung 22454 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1025+0.48 EUR
Mindestbestellmenge: 1025
74HCT164N,652 74HC%28T%29164_Rev7.pdf
74HCT164N,652
Hersteller: NXP USA Inc.
Description: IC SHIFT REG 8BIT SI-PO 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 14-DIP
Number of Bits per Element: 8
auf Bestellung 30398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
620+0.79 EUR
Mindestbestellmenge: 620
MMRF5017HSR5 MMRF5017HS.pdf
MMRF5017HSR5
Hersteller: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI400
Packaging: Bulk
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 30MHz ~ 2.2GHz
Power - Output: 125W
Gain: 18.4dB
Technology: HEMT
Supplier Device Package: NI-400S-2S
Voltage - Rated: 150 V
Voltage - Test: 50 V
Current - Test: 200 mA
auf Bestellung 375 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+398.48 EUR
Mindestbestellmenge: 2
MCF51AG96CLH MCF51AG128.pdf
MCF51AG96CLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 19x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
IP3088CX15,135 PHGLS19967-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: IP3088CX15 - CONSUMER CIRCUIT
Packaging: Bulk
Package / Case: 15-WFBGA, WLCSP
Size / Dimension: 0.117" L x 0.050" W (2.96mm x 1.28mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: L = 40nH (Total), C = 42pF (Total)
Height: 0.028" (0.70mm)
Attenuation Value: 40dB @ 800MHz ~ 1.5GHz
Filter Order: 5th
Applications: GSM, LAN, PCS, WAN
Technology: LC (Pi)
Center / Cutoff Frequency: 175MHz (Cutoff)
Resistance - Channel (Ohms): 18
ESD Protection: Yes
Number of Channels: 6
Current: 30 mA
auf Bestellung 18201 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
951+0.51 EUR
Mindestbestellmenge: 951
LH79524N0F100A1 PHGLS28978-1.pdf?hkey=86B6989B4B77B8125D7B68A214AD8E2D
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.205MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM720T™ RISC
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
auf Bestellung 6693 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
100+8.97 EUR
Mindestbestellmenge: 100
PDTA144TU,115 568-2122_schem.jpg
PDTA144TU,115
Hersteller: NXP USA Inc.
Description: TRANS PNP W/RES 50V SOT323
Packaging: Bulk
auf Bestellung 143980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA144TT,215 31_SOT23.jpg
PDTA144TT,215
Hersteller: NXP USA Inc.
Description: TRANS PNP W/RES 50V SOT-23
Packaging: Bulk
auf Bestellung 102000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA144VM,315 PDTA144V_SER.pdf
PDTA144VM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW SOT883
Packaging: Bulk
auf Bestellung 140000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
PDTA144EMB,315 PHGLS24726-1.pdf?t.download=true&u=5oefqw
PDTA144EMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 200000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11225+0.049 EUR
Mindestbestellmenge: 11225
PDTA144TMB,315 PHGLS24961-1.pdf?t.download=true&u=5oefqw
PDTA144TMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
auf Bestellung 169326 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11225+0.049 EUR
Mindestbestellmenge: 11225
PDTA144WMB,315 PHGLS25680-1.pdf?t.download=true&u=5oefqw
PDTA144WMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 22 kOhms
auf Bestellung 149782 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11225+0.049 EUR
Mindestbestellmenge: 11225
BZX79-B18,143 PHGLS19463-1.pdf?t.download=true&u=5oefqw
BZX79-B18,143
Hersteller: NXP USA Inc.
Description: DIODE ZENER 18V 400MW ALF2
Packaging: Bulk
Tolerance: ±2%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: ALF2
Power - Max: 400 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 12.6 V
auf Bestellung 101203 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15000+0.032 EUR
Mindestbestellmenge: 15000
1N4748A,113 1N4728A_SER.pdf
1N4748A,113
Hersteller: NXP USA Inc.
Description: DIODE ZENER 22V 1W DO41
Packaging: Bulk
auf Bestellung 138562 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9072+0.049 EUR
Mindestbestellmenge: 9072
MCIMX6DP7CVT8AA IMX6SRSFS.pdf
MCIMX6DP7CVT8AA
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6DP 800MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Produkt ist nicht verfügbar
BTA208-800E,127 bta208-800e.pdf
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 8A TO220AB
Packaging: Bulk
auf Bestellung 4944 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
787+0.62 EUR
Mindestbestellmenge: 787
MFS8632BMBA0ES
MFS8632BMBA0ES
Hersteller: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PDTC143EM,315 PDTA143E_SERIES_7.pdf
PDTC143EM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 132903 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
74LV08N,112 74LV08.pdf
74LV08N,112
Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 0.9V ~ 2V
Input Logic Level - Low: 0.3V ~ 0.8V
Max Propagation Delay @ V, Max CL: 9ns @ 3.3V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Produkt ist nicht verfügbar
MK12DX128VLH5 K12P64M50SF4.pdf
MK12DX128VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N74F194D,602 DS_568_74F194.pdf
N74F194D,602
Hersteller: NXP USA Inc.
Description: IC SHIFT REGISTER 4BIT 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 4
auf Bestellung 975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
975+0.52 EUR
Mindestbestellmenge: 975
PZU3.3B1,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU3.3B1,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 250614 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10804+0.049 EUR
Mindestbestellmenge: 10804
PZU3.3B2,115 PHGLS19743-1.pdf?t.download=true&u=5oefqw
PZU3.3B2,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 3.3V 310MW SOD323F
Packaging: Bulk
auf Bestellung 16382 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
10804+0.049 EUR
Mindestbestellmenge: 10804
PDTC144EE,135 PDTC144E_SER.pdf
PDTC144EE,135
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 47 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 25889 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
HEF40373BP,652 HEF40373B.pdf
HEF40373BP,652
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 15V
Independent Circuits: 1
Delay Time - Propagation: 40ns
Supplier Device Package: 20-DIP
Produkt ist nicht verfügbar
MKL81Z128VLK7 KNTSKL8XFS.pdf
MKL81Z128VLK7
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b; D/A 1x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HAT0VLHR S32K1xx.pdf
FS32K146HAT0VLHR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K146HAT0VLHT S32K1xx.pdf
FS32K146HAT0VLHT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
FS32K148HET0VLQT S32K1xx.pdf
FS32K148HET0VLQT
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEF8102EN/N1Y
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tape & Reel (TR)
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TEF8102EN/N1E
Hersteller: NXP USA Inc.
Description: RADAR
Packaging: Tray
Package / Case: 155-WFBGA
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 135°C (TJ)
Voltage - Supply: 1.045V ~ 1.21V, 1.71V ~ 1.98V, 2.97V ~ 3.63V
Power - Output: 12dBm
Data Rate (Max): 40Mbps
Supplier Device Package: 155-WFBGA (7.5x7.5)
Serial Interfaces: SPI
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HC573PW,112 74HC_HCT573.pdf
74HC573PW,112
Hersteller: NXP USA Inc.
Description: IC LATCH TRANSP OCT D 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-TSSOP
auf Bestellung 9858 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1797+0.28 EUR
Mindestbestellmenge: 1797
AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
Produkt ist nicht verfügbar
AFT20S015NR1 AFT20S015N.pdf
AFT20S015NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 1.5W
Gain: 17.6dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 132 mA
auf Bestellung 397 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+46.62 EUR
10+ 42.99 EUR
25+ 41.05 EUR
100+ 36.71 EUR
250+ 35.02 EUR
MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
Produkt ist nicht verfügbar
MHT1008NT1 MHT1008N.pdf
MHT1008NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS PLD-1.5W
Packaging: Bulk
Package / Case: PLD-1.5W
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 12.5W
Gain: 18.6dB
Technology: LDMOS
Supplier Device Package: PLD-1.5W
Voltage - Rated: 28 V
auf Bestellung 3456 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
24+21.3 EUR
Mindestbestellmenge: 24
MWCT1001AVLH MWCT1001AVLH_Web.pdf
MWCT1001AVLH
Hersteller: NXP USA Inc.
Description: IC DSP MULTI COIL 5W 5V 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Wireless Power Transmitter
Supplier Device Package: 64-LQFP (10x10)
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
34+14.48 EUR
Mindestbestellmenge: 34
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