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A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+87.33 EUR
Mindestbestellmenge: 1000
A5M35TG140-TCT1 NXP USA Inc. A5M35TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1050 Stücke:
Lieferzeit 10-14 Tag (e)
1+112.68 EUR
10+ 107.05 EUR
25+ 104.23 EUR
100+ 96.49 EUR
A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
A5M36TG140-TCT1 NXP USA Inc. A5M36TG140-TC.pdf Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 969 Stücke:
Lieferzeit 10-14 Tag (e)
1+120.58 EUR
10+ 114.54 EUR
25+ 111.53 EUR
100+ 103.24 EUR
BTA204X-1000C,127 NXP USA Inc. bta204x-1000c.pdf Description: TRIAC 1KV 4A TO220F
Packaging: Bulk
auf Bestellung 1875 Stücke:
Lieferzeit 10-14 Tag (e)
1049+0.48 EUR
Mindestbestellmenge: 1049
BZV55-C9V1,135 BZV55-C9V1,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 9.1V 500MW LLDS
Packaging: Bulk
auf Bestellung 105000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
MPC8309VMAGDCA NXP USA Inc. FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
auf Bestellung 3371 Stücke:
Lieferzeit 10-14 Tag (e)
9+57.5 EUR
Mindestbestellmenge: 9
NX3V1G66GM,132 NX3V1G66GM,132 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
74AHC541PW,112 74AHC541PW,112 NXP USA Inc. 74AHC_AHCT541.pdf Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
1817+0.28 EUR
Mindestbestellmenge: 1817
MRF8S9170NR3 MRF8S9170NR3 NXP USA Inc. MRF8S9170NR3.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 50W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
N74F280BD,623 N74F280BD,623 NXP USA Inc. N74F280B.pdf Description: IC PARITY GEN/CHKER 9-BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Number of Circuits: 9-Bit
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 85°C
Current - Output High, Low: 1mA, 20mA
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
74HCT366DB,118 74HCT366DB,118 NXP USA Inc. 74HC_HCT366.pdf Description: IC HEX BUFFER/LINE DVR 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
939+0.52 EUR
Mindestbestellmenge: 939
NAFE11388-EVB NXP USA Inc. Description: LOW PWR PLC I/O GEN1 REF DESIGN
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
NAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
KITNAFE13388-EVB NXP USA Inc. Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
KITNAFE11388-EVB NXP USA Inc. UM11565.pdf Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
MKM14Z128ACHH5R MKM14Z128ACHH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM14Z128ACHH5R MKM14Z128ACHH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLH5R MKM33Z64ACLH5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLL5R MKM33Z64ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLL5R MKM33Z64ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z128ACLL5R MKM33Z128ACLL5R NXP USA Inc. MKMxxZxxACxx5.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768W1MAGR S912XEP768W1MAGR NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768W1MAG S912XEP768W1MAG NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC4074FBD144,551 LPC4074FBD144,551 NXP USA Inc. LPC408X_7X.pdf Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP2G132GD,125 74AUP2G132GD,125 NXP USA Inc. 74AUP2G132.pdf Description: IC GATE NAND 2CH 2-INP 8-XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 537102 Stücke:
Lieferzeit 10-14 Tag (e)
2049+0.24 EUR
Mindestbestellmenge: 2049
S9S12G192F0MLL S9S12G192F0MLL NXP USA Inc. Description: IC MCU 16BIT 192KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MF3ICD2101DUD/05,0 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
auf Bestellung 15815 Stücke:
Lieferzeit 10-14 Tag (e)
15815+1.51 EUR
Mindestbestellmenge: 15815
MF3ICD4101DUD/05,0 NXP USA Inc. MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
auf Bestellung 16261 Stücke:
Lieferzeit 10-14 Tag (e)
16261+1.99 EUR
Mindestbestellmenge: 16261
PEMI1QFN/HR,315 PEMI1QFN/HR,315 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHM/21PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
3806+0.13 EUR
Mindestbestellmenge: 3806
74HC393N,652 74HC393N,652 NXP USA Inc. 74HC_HCT393.pdf Description: IC BINARY COUNTER DL 4BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 107 MHz
Number of Bits per Element: 4
auf Bestellung 9952 Stücke:
Lieferzeit 10-14 Tag (e)
666+0.74 EUR
Mindestbestellmenge: 666
TDA18275HN/C1Y TDA18275HN/C1Y NXP USA Inc. TDA18275_SDS.pdf Description: IC VIDEO SILICON TUNER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
Produkt ist nicht verfügbar
TDA18275HN/C1Y TDA18275HN/C1Y NXP USA Inc. TDA18275_SDS.pdf Description: IC VIDEO SILICON TUNER 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
auf Bestellung 24699 Stücke:
Lieferzeit 10-14 Tag (e)
364+1.33 EUR
Mindestbestellmenge: 364
74AHC2G241DC,125 74AHC2G241DC,125 NXP USA Inc. 74AHC_AHCT2G241.pdf Description: IC BUFF DVR TRI-ST DL 8VSSOP
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
1982+0.24 EUR
Mindestbestellmenge: 1982
P2010NSN2HFC P2010NSN2HFC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
BUK7535-55A,127 BUK7535-55A,127 NXP USA Inc. PHGLS22228-1.pdf?t.download=true&u=5oefqw Description: PFET, 35A I(D), 55V, 0.035OHM, 1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 20A, 10V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 872 pF @ 25 V
auf Bestellung 9896 Stücke:
Lieferzeit 10-14 Tag (e)
1066+0.45 EUR
Mindestbestellmenge: 1066
BUK753R8-80E,127 BUK753R8-80E,127 NXP USA Inc. BUK753R8-80E.pdf Description: TRANSISTOR >30MHZ
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 169 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12030 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1749 Stücke:
Lieferzeit 10-14 Tag (e)
256+1.92 EUR
Mindestbestellmenge: 256
74LVC2G00GM,125 74LVC2G00GM,125 NXP USA Inc. 74LVC2G00.pdf Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 35378 Stücke:
Lieferzeit 10-14 Tag (e)
3394+0.15 EUR
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MK82FN256VLL15 MK82FN256VLL15 NXP USA Inc. K82P121M150SF5.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCXA142VLH MCXA142VLH NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CR 64KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.69 EUR
10+ 5.23 EUR
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MCXA143VLH MCXA143VLH NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 48MHZ SGL CR 128KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 150 Stücke:
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3+7.52 EUR
10+ 5.87 EUR
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MCXA152VLH MCXA152VLH NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CR 64KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.15 EUR
10+ 7.14 EUR
160+ 5.85 EUR
Mindestbestellmenge: 2
MCXA153VLH MCXA153VLH NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCX 96MHZ SGL CR 128KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
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BZX84-C2V4,235 BZX84-C2V4,235 NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 2.4V 250MW TO236AB
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
auf Bestellung 150000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
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MCXN546VDFT MCXN546VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1290 Stücke:
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1+29.11 EUR
10+ 23.27 EUR
80+ 19.65 EUR
440+ 19.53 EUR
MCXN546VNLT MCXN546VNLT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 74
Produkt ist nicht verfügbar
MCX-N9XX-EVK MCX-N9XX-EVK NXP USA Inc. MCX-N9XX-EVK.pdf Description: EVALUATION KIT FOR MCX N94 MCUS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
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MCX-N5XX-EVK MCX-N5XX-EVK NXP USA Inc. MCX-N5XX-EVK.pdf Description: EVALUATION KIT FOR MCX N54 MCUS
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
auf Bestellung 40 Stücke:
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1+256.2 EUR
MCXN946VNLT MCXN946VNLT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 78
Produkt ist nicht verfügbar
MCXN547VNLT MCXN547VNLT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 74
Produkt ist nicht verfügbar
MCXN947VNLT MCXN947VNLT NXP USA Inc. Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Produkt ist nicht verfügbar
MCXN547VDFT MCXN547VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
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1+30.41 EUR
10+ 24.31 EUR
80+ 20.53 EUR
440+ 20.4 EUR
MCXN946VDFT MCXN946VDFT NXP USA Inc. MCXNx4xDS.pdf Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.89 EUR
10+ 25.5 EUR
80+ 21.53 EUR
440+ 21.4 EUR
MCXN947VDFT MCXN947VDFT NXP USA Inc. MCXN23x.pdf Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
Produkt ist nicht verfügbar
S9S08RNA8W2MLF S9S08RNA8W2MLF NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1171DVMAAR MIMXRT1171DVMAAR NXP USA Inc. IMXRT1170CEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT1171DVMAAR MIMXRT1171DVMAAR NXP USA Inc. IMXRT1170CEC.pdf Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT117CDVMAA NXP USA Inc. IMXRT1170IEC.pdf Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT1172CVM8AR NXP USA Inc. IMXRT1170IEC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
Produkt ist nicht verfügbar
MIMXRT1172CVM8AR NXP USA Inc. IMXRT1170IEC.pdf Description: IC
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
Produkt ist nicht verfügbar
A5M35TG140-TCT1 A5M35TG140-TC.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+87.33 EUR
Mindestbestellmenge: 1000
A5M35TG140-TCT1 A5M35TG140-TC.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.4dB
P1dB: 49.9dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 1050 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+112.68 EUR
10+ 107.05 EUR
25+ 104.23 EUR
100+ 96.49 EUR
A5M36TG140-TCT1 A5M36TG140-TC.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Tape & Reel (TR)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
Produkt ist nicht verfügbar
A5M36TG140-TCT1 A5M36TG140-TC.pdf
Hersteller: NXP USA Inc.
Description: AIRFAST POWER AMPLIFIER MODULE,
Packaging: Cut Tape (CT)
Package / Case: 30-LGA Module
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: 5G, LTE, TDD
Voltage - Supply: 4.75V ~ 5.25V, 38V ~ 55V
Gain: 31.9dB
P1dB: 49.3dBm
Test Frequency: 3.6GHz
Supplier Device Package: 30-PLGA (14x10)
auf Bestellung 969 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+120.58 EUR
10+ 114.54 EUR
25+ 111.53 EUR
100+ 103.24 EUR
BTA204X-1000C,127 bta204x-1000c.pdf
Hersteller: NXP USA Inc.
Description: TRIAC 1KV 4A TO220F
Packaging: Bulk
auf Bestellung 1875 Stücke:
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Anzahl Preis ohne MwSt
1049+0.48 EUR
Mindestbestellmenge: 1049
BZV55-C9V1,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C9V1,135
Hersteller: NXP USA Inc.
Description: DIODE ZENER 9.1V 500MW LLDS
Packaging: Bulk
auf Bestellung 105000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
MPC8309VMAGDCA FSCL-S-A0000128317-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: POWERQUICC POWER ARCH SOC, 400MH
Packaging: Bulk
auf Bestellung 3371 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9+57.5 EUR
Mindestbestellmenge: 9
NX3V1G66GM,132 NX3V1G66.pdf
NX3V1G66GM,132
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
auf Bestellung 5000 Stücke:
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Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
74AHC541PW,112 74AHC_AHCT541.pdf
74AHC541PW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
Packaging: Bulk
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1817+0.28 EUR
Mindestbestellmenge: 1817
MRF8S9170NR3 MRF8S9170NR3.pdf
MRF8S9170NR3
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 920MHz
Power - Output: 50W
Gain: 19.3dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 1 A
Produkt ist nicht verfügbar
N74F280BD,623 N74F280B.pdf
N74F280BD,623
Hersteller: NXP USA Inc.
Description: IC PARITY GEN/CHKER 9-BIT 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Number of Circuits: 9-Bit
Mounting Type: Surface Mount
Logic Type: Parity Generator/Checker
Operating Temperature: -40°C ~ 85°C
Current - Output High, Low: 1mA, 20mA
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Produkt ist nicht verfügbar
74HCT366DB,118 74HC_HCT366.pdf
74HCT366DB,118
Hersteller: NXP USA Inc.
Description: IC HEX BUFFER/LINE DVR 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-SSOP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
939+0.52 EUR
Mindestbestellmenge: 939
NAFE11388-EVB
Hersteller: NXP USA Inc.
Description: LOW PWR PLC I/O GEN1 REF DESIGN
Packaging: Box
Function: Analog Front End (AFE)
Type: Power Management
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Embedded: No
Produkt ist nicht verfügbar
NAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
KITNAFE13388-EVB
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE13388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
KITNAFE11388-EVB UM11565.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Function: Analog Front End (AFE)
Type: Interface
Utilized IC / Part: NAFE11388
Supplied Contents: Board(s)
Primary Attributes: 8-Channel (Octal)
Embedded: No
Produkt ist nicht verfügbar
MKM14Z128ACHH5R MKMxxZxxACxx5.pdf
MKM14Z128ACHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Tape & Reel (TR)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM14Z128ACHH5R MKMxxZxxACxx5.pdf
MKM14Z128ACHH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 44MAPLGA
Packaging: Cut Tape (CT)
Package / Case: 44-VFLGA Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 5x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 44-MAPLGA (5x5)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLH5R MKMxxZxxACxx5.pdf
MKM33Z64ACLH5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLL5R MKMxxZxxACxx5.pdf
MKM33Z64ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z64ACLL5R MKMxxZxxACxx5.pdf
MKM33Z64ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z128ACLL5R MKMxxZxxACxx5.pdf
MKM33Z128ACLL5R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 24b SAR, Sigma; D/A 4x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768W1MAGR
S912XEP768W1MAGR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEP768W1MAG
S912XEP768W1MAG
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC4074FBD144,551 LPC408X_7X.pdf
LPC4074FBD144,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74AUP2G132GD,125 74AUP2G132.pdf
74AUP2G132GD,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 8-XSON (2x3)
Input Logic Level - High: 0.6V ~ 2.29V
Input Logic Level - Low: 0.1V ~ 0.88V
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Number of Circuits: 2
Current - Quiescent (Max): 500 nA
auf Bestellung 537102 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2049+0.24 EUR
Mindestbestellmenge: 2049
S9S12G192F0MLL
S9S12G192F0MLL
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 192KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MF3ICD2101DUD/05,0 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
auf Bestellung 15815 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15815+1.51 EUR
Mindestbestellmenge: 15815
MF3ICD4101DUD/05,0 MF3ICDX21_41_81_Dec9%2C2015_Rev3.2_SDS.pdf
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
auf Bestellung 16261 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
16261+1.99 EUR
Mindestbestellmenge: 16261
PEMI1QFN/HR,315 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI1QFN/HR,315
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/21PF SMD
Packaging: Bulk
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3806+0.13 EUR
Mindestbestellmenge: 3806
74HC393N,652 74HC_HCT393.pdf
74HC393N,652
Hersteller: NXP USA Inc.
Description: IC BINARY COUNTER DL 4BIT 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 107 MHz
Number of Bits per Element: 4
auf Bestellung 9952 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
666+0.74 EUR
Mindestbestellmenge: 666
TDA18275HN/C1Y TDA18275_SDS.pdf
TDA18275HN/C1Y
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
Produkt ist nicht verfügbar
TDA18275HN/C1Y TDA18275_SDS.pdf
TDA18275HN/C1Y
Hersteller: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C
auf Bestellung 24699 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
364+1.33 EUR
Mindestbestellmenge: 364
74AHC2G241DC,125 74AHC_AHCT2G241.pdf
74AHC2G241DC,125
Hersteller: NXP USA Inc.
Description: IC BUFF DVR TRI-ST DL 8VSSOP
Packaging: Bulk
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1982+0.24 EUR
Mindestbestellmenge: 1982
P2010NSN2HFC QP20XXFS.pdf
P2010NSN2HFC
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
BUK7535-55A,127 PHGLS22228-1.pdf?t.download=true&u=5oefqw
BUK7535-55A,127
Hersteller: NXP USA Inc.
Description: PFET, 35A I(D), 55V, 0.035OHM, 1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 35mOhm @ 20A, 10V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 872 pF @ 25 V
auf Bestellung 9896 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1066+0.45 EUR
Mindestbestellmenge: 1066
BUK753R8-80E,127 BUK753R8-80E.pdf
BUK753R8-80E,127
Hersteller: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 25A, 10V
Power Dissipation (Max): 349W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 169 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12030 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1749 Stücke:
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Anzahl Preis ohne MwSt
256+1.92 EUR
Mindestbestellmenge: 256
74LVC2G00GM,125 74LVC2G00.pdf
74LVC2G00GM,125
Hersteller: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XQFN
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 8-XQFN (1.6x1.6)
Input Logic Level - High: 1.07V ~ 3.85V
Input Logic Level - Low: 0.58V ~ 1.65V
Max Propagation Delay @ V, Max CL: 3.3ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA
auf Bestellung 35378 Stücke:
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Anzahl Preis ohne MwSt
3394+0.15 EUR
Mindestbestellmenge: 3394
MK82FN256VLL15 K82P121M150SF5.pdf
MK82FN256VLL15
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b; D/A 2x6b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MCXA142VLH MCXAP64M96FS3.pdf
MCXA142VLH
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CR 64KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+6.69 EUR
10+ 5.23 EUR
Mindestbestellmenge: 3
MCXA143VLH MCXAP64M96FS3.pdf
MCXA143VLH
Hersteller: NXP USA Inc.
Description: IC MCX 48MHZ SGL CR 128KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.52 EUR
10+ 5.87 EUR
Mindestbestellmenge: 3
MCXA152VLH MCXAP64M96FS3.pdf
MCXA152VLH
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CR 64KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.15 EUR
10+ 7.14 EUR
160+ 5.85 EUR
Mindestbestellmenge: 2
MCXA153VLH MCXAP64M96FS3.pdf
MCXA153VLH
Hersteller: NXP USA Inc.
Description: IC MCX 96MHZ SGL CR 128KB LQFP64
Packaging: Tray
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
auf Bestellung 152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.96 EUR
10+ 7.78 EUR
Mindestbestellmenge: 2
BZX84-C2V4,235 PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C2V4,235
Hersteller: NXP USA Inc.
Description: DIODE ZENER 2.4V 250MW TO236AB
Packaging: Bulk
Tolerance: ±5%
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
auf Bestellung 150000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
MCXN546VDFT MCXNx4xDS.pdf
MCXN546VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1290 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.11 EUR
10+ 23.27 EUR
80+ 19.65 EUR
440+ 19.53 EUR
MCXN546VNLT MCXNx4xDS.pdf
MCXN546VNLT
Hersteller: NXP USA Inc.
Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 74
Produkt ist nicht verfügbar
MCX-N9XX-EVK MCX-N9XX-EVK.pdf
MCX-N9XX-EVK
Hersteller: NXP USA Inc.
Description: EVALUATION KIT FOR MCX N94 MCUS
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+248.44 EUR
MCX-N5XX-EVK MCX-N5XX-EVK.pdf
MCX-N5XX-EVK
Hersteller: NXP USA Inc.
Description: EVALUATION KIT FOR MCX N54 MCUS
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
auf Bestellung 40 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+256.2 EUR
MCXN946VNLT MCXNx4xDS.pdf
MCXN946VNLT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 78
Produkt ist nicht verfügbar
MCXN547VNLT MCXNx4xDS.pdf
MCXN547VNLT
Hersteller: NXP USA Inc.
Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 74
Produkt ist nicht verfügbar
MCXN947VNLT
MCXN947VNLT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Produkt ist nicht verfügbar
MCXN547VDFT MCXNx4xDS.pdf
MCXN547VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N54 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 1x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+30.41 EUR
10+ 24.31 EUR
80+ 20.53 EUR
440+ 20.4 EUR
MCXN946VDFT MCXNx4xDS.pdf
MCXN946VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
auf Bestellung 1300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+31.89 EUR
10+ 25.5 EUR
80+ 21.53 EUR
440+ 21.4 EUR
MCXN947VDFT MCXN23x.pdf
MCXN947VDFT
Hersteller: NXP USA Inc.
Description: IC MCX N94 150MHZ DUAL CORE NPU
Packaging: Tray
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 2x16b; D/A 2x12b, 1x14b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CAN, Ethernet, Flexcomm, FlexSPI, I3C, SAI, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 184-VFBGA (9x9)
Number of I/O: 124
Produkt ist nicht verfügbar
S9S08RNA8W2MLF
S9S08RNA8W2MLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMXRT1171DVMAAR IMXRT1170CEC.pdf
MIMXRT1171DVMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT1171DVMAAR IMXRT1170CEC.pdf
MIMXRT1171DVMAAR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT117CDVMAA IMXRT1170IEC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
RAM Size: 2M x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 13
Produkt ist nicht verfügbar
MIMXRT1172CVM8AR IMXRT1170IEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
Produkt ist nicht verfügbar
MIMXRT1172CVM8AR IMXRT1170IEC.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 289-LFBGA
Speed: 800MHz
RAM Size: 2MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM Cortex-M7
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 289-LFBGA (14x14)
Architecture: MPU
Produkt ist nicht verfügbar
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