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KW45B41Z-LOC NXP USA Inc. KW45.pdf Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
MC32PF1550A4EPR2 MC32PF1550A4EPR2 NXP USA Inc. Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC9S08LC60LH MC9S08LC60LH NXP USA Inc. MC9S08LC60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SL2S2602FTBX SL2S2602FTBX NXP USA Inc. SL2S2602.pdf Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 9966 Stücke:
Lieferzeit 10-14 Tag (e)
22+0.81 EUR
25+ 0.71 EUR
28+ 0.64 EUR
100+ 0.56 EUR
250+ 0.5 EUR
500+ 0.44 EUR
1000+ 0.35 EUR
Mindestbestellmenge: 22
BC849CW,135 BC849CW,135 NXP USA Inc. PHGLS10001-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC849CW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 465317 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.033 EUR
Mindestbestellmenge: 13172
BC849CW,115 BC849CW,115 NXP USA Inc. PHGLS10001-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC849CW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 15352 Stücke:
Lieferzeit 10-14 Tag (e)
15352+0.033 EUR
Mindestbestellmenge: 15352
NX5DV330DS,118 NX5DV330DS,118 NXP USA Inc. NX5DV330.pdf Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
477+1.03 EUR
Mindestbestellmenge: 477
MPC7410VS500LE MPC7410VS500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
74AHC164BQ,115 74AHC164BQ,115 NXP USA Inc. 74AHC_AHCT164.pdf Description: IC 8BIT SRLIN/PAROUT RG 14DHVQFN
Packaging: Bulk
auf Bestellung 13409 Stücke:
Lieferzeit 10-14 Tag (e)
1924+0.26 EUR
Mindestbestellmenge: 1924
MCF5481CVR166 MCF5481CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMX8MM6DVTLZAAR MIMX8MM6DVTLZAAR NXP USA Inc. IMX8MMCEC.pdf Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
1+67.6 EUR
10+ 54.21 EUR
100+ 46.29 EUR
S9KEAZN32AVLH S9KEAZN32AVLH NXP USA Inc. Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BYV34-600,127 BYV34-600,127 NXP USA Inc. PHGLS15015-1.pdf?t.download=true&u=5oefqw Description: DIODE ARRAY GP 600V 20A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-220AB
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 10486 Stücke:
Lieferzeit 10-14 Tag (e)
394+1.24 EUR
Mindestbestellmenge: 394
MR-CANHUBK344MIN NXP USA Inc. Description: IC
Packaging: Box
Produkt ist nicht verfügbar
MR-CANHUBK3 NXP USA Inc. Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
74HCT138D,652 74HCT138D,652 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECODER/DEMUX 3-8 LINE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 7916 Stücke:
Lieferzeit 10-14 Tag (e)
2133+0.23 EUR
Mindestbestellmenge: 2133
74HCT138PW,112 74HCT138PW,112 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
Lieferzeit 10-14 Tag (e)
2009+0.25 EUR
Mindestbestellmenge: 2009
IMXEBOOKDC5 NXP USA Inc. IMXEBOOKDC5-UM.pdf Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+1326.14 EUR
MC7410VU500LE MC7410VU500LE NXP USA Inc. DS_568_MPC7410.pdf Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447AHX600NB MC7447AHX600NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447AHX867NB MC7447AHX867NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447ATHX1000NB MC7447ATHX1000NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MIMX8ML8DVNLZCB NXP USA Inc. MIMX8ML.pdf Description: IC
Packaging: Tray
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Architecture: DSP, MCU, MPU
Produkt ist nicht verfügbar
MIMX8ML8DVNLZDB NXP USA Inc. MIMX8ML.pdf Description: IC
Packaging: Tray
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Architecture: DSP, MCU, MPU
Produkt ist nicht verfügbar
LFBGAMU3A NXP USA Inc. Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
LFK77CINTPWC NXP USA Inc. Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
74HC107D,652 74HC107D,652 NXP USA Inc. 74HC_HCT107.pdf Description: IC JK TYPE NEG TRG DUAL 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
auf Bestellung 5727 Stücke:
Lieferzeit 10-14 Tag (e)
1597+0.31 EUR
Mindestbestellmenge: 1597
PMP4501G,115 PMP4501G,115 NXP USA Inc. PMP4501V_G_Y.pdf Description: TRANS 2NPN 45V 0.1A 5TSSOP
Packaging: Bulk
auf Bestellung 49076 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.081 EUR
Mindestbestellmenge: 6662
PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
PESD3V3V4UG,115 PESD3V3V4UG,115 NXP USA Inc. PESDXV4UF_G_W.pdf Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
74HC652D,112 74HC652D,112 NXP USA Inc. 74HC(T)652.pdf Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
PBLS6021D,115 PBLS6021D,115 NXP USA Inc. PBLS6021D.pdf Description: TRANS NPN PREBIAS/PNP 6TSOP
Packaging: Bulk
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
2439+0.2 EUR
Mindestbestellmenge: 2439
PCA9482UKZ NXP USA Inc. Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
BC847W,135 BC847W,135 NXP USA Inc. PHGLS30472-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BC847W - SMALL SIGN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 650000 Stücke:
Lieferzeit 10-14 Tag (e)
15000+0.033 EUR
Mindestbestellmenge: 15000
LD6806CX4/25P,315 LD6806CX4/25P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17750 Stücke:
Lieferzeit 10-14 Tag (e)
3328+0.15 EUR
Mindestbestellmenge: 3328
NCK2912AHN/T0B/UY NCK2912AHN/T0B/UY NXP USA Inc. Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ABT241D,623 74ABT241D,623 NXP USA Inc. DS_568_74ABT241.pdf Description: IC BUFF NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
LPC55S69JBD64Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.79 EUR
10+ 10.86 EUR
25+ 10.63 EUR
50+ 10.59 EUR
100+ 9.51 EUR
250+ 9.22 EUR
500+ 8.77 EUR
Mindestbestellmenge: 2
LPC55S69JEV98Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1977 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.58 EUR
10+ 11.59 EUR
25+ 11.35 EUR
50+ 11.31 EUR
100+ 10.15 EUR
250+ 9.84 EUR
500+ 9.36 EUR
1000+ 9.03 EUR
Mindestbestellmenge: 2
LPC55S69JBD100Y LPC55S69JBD100Y NXP USA Inc. LPC55S6x.pdf Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
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1+17.92 EUR
10+ 14.08 EUR
100+ 11.66 EUR
74LVCH244APW,112 74LVCH244APW,112 NXP USA Inc. 74LVC_LVCH244A.pdf Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 55144 Stücke:
Lieferzeit 10-14 Tag (e)
1426+0.34 EUR
Mindestbestellmenge: 1426
74LVC1G332GXZ 74LVC1G332GXZ NXP USA Inc. 74LVC1G332.pdf Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 128700 Stücke:
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74LVC1G332GF,132 74LVC1G332GF,132 NXP USA Inc. PHGLS23885-1.pdf?t.download=true&u=5oefqw Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 329005 Stücke:
Lieferzeit 10-14 Tag (e)
2613+0.18 EUR
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MW7IC2240NR1 MW7IC2240NR1 NXP USA Inc. MW7IC2040N.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXHZ6400A6T1 NXP USA Inc. MPXH6400A.pdf Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
BZV90-C36,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 36V 1.5W SC73
Packaging: Bulk
auf Bestellung 73031 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C15,115 BZV90-C15,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 15V 1.5W SC73
Packaging: Bulk
auf Bestellung 59952 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C68,115 BZV90-C68,115 NXP USA Inc. BZV90.pdf Description: DIODE ZENER 68V 1.5W SC73
Packaging: Bulk
auf Bestellung 12940 Stücke:
Lieferzeit 10-14 Tag (e)
1745+0.28 EUR
Mindestbestellmenge: 1745
MIMXRT1021CAG4BR NXP USA Inc. IMXRT1020IEC.pdf Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.22 EUR
10+ 14.01 EUR
25+ 13.72 EUR
50+ 13.67 EUR
100+ 12.26 EUR
250+ 11.89 EUR
Mindestbestellmenge: 2
74HCU04PW,112 74HCU04PW,112 NXP USA Inc. 74HCU04.pdf Description: IC INVERT HEX 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 27895 Stücke:
Lieferzeit 10-14 Tag (e)
2542+0.2 EUR
Mindestbestellmenge: 2542
74ALVC14PW,112 74ALVC14PW,112 NXP USA Inc. 74ALVC14.pdf Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6987 Stücke:
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2153+0.23 EUR
Mindestbestellmenge: 2153
PCA9534PW,112 PCA9534PW,112 NXP USA Inc. PCA9534.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
Lieferzeit 10-14 Tag (e)
333+1.48 EUR
Mindestbestellmenge: 333
PDTC144VM,315 PDTC144VM,315 NXP USA Inc. PDTC144V_SER.pdf Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 109980 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
S912XEG256BVALR S912XEG256BVALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XET256W1VALR S912XET256W1VALR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384BVALR S912XEG384BVALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384J2VALR S912XEG384J2VALR NXP USA Inc. Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR S912XEQ512BVALR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
KW45B41Z-LOC KW45.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: KW45B41Z
Produkt ist nicht verfügbar
MC32PF1550A4EPR2
MC32PF1550A4EPR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Produkt ist nicht verfügbar
MC9S08LC60LH MC9S08LC60.pdf
MC9S08LC60LH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SL2S2602FTBX SL2S2602.pdf
SL2S2602FTBX
Hersteller: NXP USA Inc.
Description: ICODE
Packaging: Cut Tape (CT)
Package / Case: 3-XDFN
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: ISO 15693
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 1.3V
Standards: ISO 15693, ISO 18000-3
Supplier Device Package: 3-XSON (1x1.45)
auf Bestellung 9966 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
22+0.81 EUR
25+ 0.71 EUR
28+ 0.64 EUR
100+ 0.56 EUR
250+ 0.5 EUR
500+ 0.44 EUR
1000+ 0.35 EUR
Mindestbestellmenge: 22
BC849CW,135 PHGLS10001-1.pdf?t.download=true&u=5oefqw
BC849CW,135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC849CW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 465317 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.033 EUR
Mindestbestellmenge: 13172
BC849CW,115 PHGLS10001-1.pdf?t.download=true&u=5oefqw
BC849CW,115
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC849CW - SMALL SIG
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 15352 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15352+0.033 EUR
Mindestbestellmenge: 15352
NX5DV330DS,118 NX5DV330.pdf
NX5DV330DS,118
Hersteller: NXP USA Inc.
Description: IC VIDEO MUX/DEMUX 1X2 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Video
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4V ~ 5.5V
Multiplexer/Demultiplexer Circuit: 2:1
Number of Channels: 4
auf Bestellung 318919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
477+1.03 EUR
Mindestbestellmenge: 477
MPC7410VS500LE DS_568_MPC7410.pdf
MPC7410VS500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
74AHC164BQ,115 74AHC_AHCT164.pdf
74AHC164BQ,115
Hersteller: NXP USA Inc.
Description: IC 8BIT SRLIN/PAROUT RG 14DHVQFN
Packaging: Bulk
auf Bestellung 13409 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1924+0.26 EUR
Mindestbestellmenge: 1924
MCF5481CVR166 MCF5485EC.pdf
MCF5481CVR166
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MIMX8MM6DVTLZAAR IMX8MMCEC.pdf
MIMX8MM6DVTLZAAR
Hersteller: NXP USA Inc.
Description: IC MPU I.MX8MM 1.8GHZ 486LFBGA
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: I2C, I2S, eMMC/SDIO, PCIe, SPI, UART
auf Bestellung 970 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+67.6 EUR
10+ 54.21 EUR
100+ 46.29 EUR
S9KEAZN32AVLH
S9KEAZN32AVLH
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BYV34-600,127 PHGLS15015-1.pdf?t.download=true&u=5oefqw
BYV34-600,127
Hersteller: NXP USA Inc.
Description: DIODE ARRAY GP 600V 20A TO220AB
Packaging: Bulk
Package / Case: TO-220-3
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 60 ns
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 20A
Supplier Device Package: TO-220AB
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.48 V @ 20 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 10486 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
394+1.24 EUR
Mindestbestellmenge: 394
MR-CANHUBK344MIN
Hersteller: NXP USA Inc.
Description: IC
Packaging: Box
Produkt ist nicht verfügbar
MR-CANHUBK3
Hersteller: NXP USA Inc.
Description: MOBILE ROBOTICS S32K3 T1 6XCAN H
Packaging: Bulk
Produkt ist nicht verfügbar
74HCT138D,652 74HC_HCT138.pdf
74HCT138D,652
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 3-8 LINE 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 7916 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2133+0.23 EUR
Mindestbestellmenge: 2133
74HCT138PW,112 74HC_HCT138.pdf
74HCT138PW,112
Hersteller: NXP USA Inc.
Description: IC DECOD/DEMUX 3-8 LINE 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
auf Bestellung 15435 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2009+0.25 EUR
Mindestbestellmenge: 2009
IMXEBOOKDC5 IMXEBOOKDC5-UM.pdf
Hersteller: NXP USA Inc.
Description: EPD DISPLAY PARALLEL INTERFACE
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+1326.14 EUR
MC7410VU500LE DS_568_MPC7410.pdf
MC7410VU500LE
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447AHX600NB MPC7447AEC.pdf
MC7447AHX600NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447AHX867NB MPC7447AEC.pdf
MC7447AHX867NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MC7447ATHX1000NB MPC7447AEC.pdf
MC7447ATHX1000NB
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Produkt ist nicht verfügbar
MIMX8ML8DVNLZCB MIMX8ML.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Architecture: DSP, MCU, MPU
Produkt ist nicht verfügbar
MIMX8ML8DVNLZDB MIMX8ML.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tray
Speed: 1.8GHz, 800MHz
RAM Size: 868KB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP
Connectivity: CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Peripherals: DMA, PWM, WDT
Architecture: DSP, MCU, MPU
Produkt ist nicht verfügbar
LFBGAMU3A
Hersteller: NXP USA Inc.
Description: 324 PIN 1.0MM PGA SOCKET SPACER
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Produkt ist nicht verfügbar
LFK77CINTPWC
Hersteller: NXP USA Inc.
Description: NXP MPC5777C 300MHZ416-PIN 1.0
Packaging: Bulk
Produkt ist nicht verfügbar
74HC107D,652 74HC_HCT107.pdf
74HC107D,652
Hersteller: NXP USA Inc.
Description: IC JK TYPE NEG TRG DUAL 14SOIC
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 85 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 1
auf Bestellung 5727 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1597+0.31 EUR
Mindestbestellmenge: 1597
PMP4501G,115 PMP4501V_G_Y.pdf
PMP4501G,115
Hersteller: NXP USA Inc.
Description: TRANS 2NPN 45V 0.1A 5TSSOP
Packaging: Bulk
auf Bestellung 49076 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6662+0.081 EUR
Mindestbestellmenge: 6662
PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
PESD3V3V4UG,115 PESDXV4UF_G_W.pdf
PESD3V3V4UG,115
Hersteller: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC 5TSSOP
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 15pF @ 1MHz
Current - Peak Pulse (10/1000µs): 1.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: 5-TSSOP
Unidirectional Channels: 4
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 16W
Power Line Protection: No
Produkt ist nicht verfügbar
74HC652D,112 74HC(T)652.pdf
74HC652D,112
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 6V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 24-SO
Produkt ist nicht verfügbar
PBLS6021D,115 PBLS6021D.pdf
PBLS6021D,115
Hersteller: NXP USA Inc.
Description: TRANS NPN PREBIAS/PNP 6TSOP
Packaging: Bulk
auf Bestellung 162000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2439+0.2 EUR
Mindestbestellmenge: 2439
PCA9482UKZ
Hersteller: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C, USB
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 42-WLCSP (3.02x2.72)
Charge Current - Max: 7A
Programmable Features: Current, Timer, Voltage
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 20V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Produkt ist nicht verfügbar
BC847W,135 PHGLS30472-1.pdf?t.download=true&u=5oefqw
BC847W,135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BC847W - SMALL SIGN
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 110 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 200 mW
Qualification: AEC-Q101
auf Bestellung 650000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15000+0.033 EUR
Mindestbestellmenge: 15000
LD6806CX4/25P,315 LD6806_Series.pdf
LD6806CX4/25P,315
Hersteller: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
auf Bestellung 17750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3328+0.15 EUR
Mindestbestellmenge: 3328
NCK2912AHN/T0B/UY
NCK2912AHN/T0B/UY
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 48HVQFN
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74ABT241D,623 DS_568_74ABT241.pdf
74ABT241D,623
Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-SO
Produkt ist nicht verfügbar
LPC55S69JBD64Y LPC55S6x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+11.79 EUR
10+ 10.86 EUR
25+ 10.63 EUR
50+ 10.59 EUR
100+ 9.51 EUR
250+ 9.22 EUR
500+ 8.77 EUR
Mindestbestellmenge: 2
LPC55S69JEV98Y LPC55S6x.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH
Packaging: Cut Tape (CT)
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
auf Bestellung 1977 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.58 EUR
10+ 11.59 EUR
25+ 11.35 EUR
50+ 11.31 EUR
100+ 10.15 EUR
250+ 9.84 EUR
500+ 9.36 EUR
1000+ 9.03 EUR
Mindestbestellmenge: 2
LPC55S69JBD100Y LPC55S6x.pdf
LPC55S69JBD100Y
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+17.92 EUR
10+ 14.08 EUR
100+ 11.66 EUR
74LVCH244APW,112 74LVC_LVCH244A.pdf
74LVCH244APW,112
Hersteller: NXP USA Inc.
Description: IC BUFF/DVR TRI-ST DUAL 20TSSOP
Packaging: Bulk
auf Bestellung 55144 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1426+0.34 EUR
Mindestbestellmenge: 1426
74LVC1G332GXZ 74LVC1G332.pdf
74LVC1G332GXZ
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6X2SON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 128700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4543+0.12 EUR
Mindestbestellmenge: 4543
74LVC1G332GF,132 PHGLS23885-1.pdf?t.download=true&u=5oefqw
74LVC1G332GF,132
Hersteller: NXP USA Inc.
Description: IC GATE OR 1CH 3-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 329005 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2613+0.18 EUR
Mindestbestellmenge: 2613
MW7IC2240NR1 MW7IC2040N.pdf
MW7IC2240NR1
Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 32V
Gain: 30dB
Current - Supply: 420mA
P1dB: 46dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
MPXHZ6400A6T1 MPXH6400A.pdf
MPXHZ6400A6T1
Hersteller: NXP USA Inc.
Description: SENSOR 58.02PSIA 4.8V 8SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.8 V
Operating Pressure: 2.9PSI ~ 58.02PSI (20kPa ~ 400kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.64V ~ 5.36V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 232.06PSI (1600kPa)
Produkt ist nicht verfügbar
BZV90-C36,115 BZV90.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 36V 1.5W SC73
Packaging: Bulk
auf Bestellung 73031 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C15,115 BZV90.pdf
BZV90-C15,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 15V 1.5W SC73
Packaging: Bulk
auf Bestellung 59952 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
BZV90-C68,115 BZV90.pdf
BZV90-C68,115
Hersteller: NXP USA Inc.
Description: DIODE ZENER 68V 1.5W SC73
Packaging: Bulk
auf Bestellung 12940 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1745+0.28 EUR
Mindestbestellmenge: 1745
MIMXRT1021CAG4BR IMXRT1020IEC.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.3V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
auf Bestellung 449 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.22 EUR
10+ 14.01 EUR
25+ 13.72 EUR
50+ 13.67 EUR
100+ 12.26 EUR
250+ 11.89 EUR
Mindestbestellmenge: 2
74HCU04PW,112 74HCU04.pdf
74HCU04PW,112
Hersteller: NXP USA Inc.
Description: IC INVERT HEX 6CH 1-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.8V
Input Logic Level - Low: 0.3V ~ 1.2V
Max Propagation Delay @ V, Max CL: 12ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
auf Bestellung 27895 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2542+0.2 EUR
Mindestbestellmenge: 2542
74ALVC14PW,112 74ALVC14.pdf
74ALVC14PW,112
Hersteller: NXP USA Inc.
Description: IC HEX INV SCHMITT TRIG 14TSSOP
Packaging: Bulk
auf Bestellung 6987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2153+0.23 EUR
Mindestbestellmenge: 2153
PCA9534PW,112 PCA9534.pdf
PCA9534PW,112
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 1089 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
333+1.48 EUR
Mindestbestellmenge: 333
PDTC144VM,315 PDTC144V_SER.pdf
PDTC144VM,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW SOT883
Packaging: Bulk
auf Bestellung 109980 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
S912XEG256BVALR
S912XEG256BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XET256W1VALR
S912XET256W1VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384BVALR
S912XEG384BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEG384J2VALR
S912XEG384J2VALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S912XEQ512BVALR MC9S12XEPB.pdf
S912XEQ512BVALR
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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