Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35027) > Seite 541 nach 584
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74HC175N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 89 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Number of Bits per Element: 4 |
auf Bestellung 5587 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT175N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Complementary Mounting Type: Through Hole Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 49 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-DIP Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF Number of Bits per Element: 4 |
auf Bestellung 22342 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC75N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: Differential Mounting Type: Through Hole Circuit: 2:2 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 2 Current - Output High, Low: 5.2mA, 5.2mA Delay Time - Propagation: 11ns Supplier Device Package: 16-DIP |
auf Bestellung 8463 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT151DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT251DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
auf Bestellung 4372 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC08N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: AND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
auf Bestellung 37387 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G125GN,132 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 32mA Supplier Device Package: 6-XSON (0.9x1) |
auf Bestellung 181828 Stücke: Lieferzeit 10-14 Tag (e) |
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PCF8584T/2,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Function: Controller Interface: Parallel Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Current - Supply: 1.5mA Protocol: I2C Supplier Device Package: 20-SO DigiKey Programmable: Not Verified |
auf Bestellung 3480 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC283N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Number of Bits: 4 Logic Type: Binary Full Adder with Fast Carry Operating Temperature: -40°C ~ 125°C Supply Voltage: 2V ~ 6V Supplier Device Package: 16-DIP |
auf Bestellung 5335 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC251N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Circuit: 1 x 8:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-DIP |
auf Bestellung 64654 Stücke: Lieferzeit 10-14 Tag (e) |
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SVF512R3K2CMK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
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SVF532R3K2CMK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
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SVF522R2K2CMK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
Produkt ist nicht verfügbar |
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74LVC00ADB,112 | NXP USA Inc. |
![]() Packaging: Tube |
auf Bestellung 26166 Stücke: Lieferzeit 10-14 Tag (e) |
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MKM33Z64CLH5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MKM33Z128CLL5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x16b, 4x24b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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HEC4069UBT,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 15V Current - Output High, Low: 3.4mA, 3.4mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 4V ~ 12.5V Input Logic Level - Low: 1V ~ 2.5V Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 1 µA |
auf Bestellung 38330 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV90-C3V9,115 | NXP USA Inc. |
![]() Tolerance: ±5% Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 3.9 V Impedance (Max) (Zzt): 90 Ohms Supplier Device Package: SOT-223 Power - Max: 1.5 W Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA Current - Reverse Leakage @ Vr: 3 µA @ 1 V |
auf Bestellung 83000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC574D,652 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 7.8mA, 7.8mA Trigger Type: Positive Edge Clock Frequency: 133 MHz Input Capacitance: 3.5 pF Supplier Device Package: 20-SO Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Number of Bits per Element: 8 |
auf Bestellung 6115 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8313ECVRAGDC | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
auf Bestellung 15 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8315ECVRAGDA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-PBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, PCI, SPI, TDM |
auf Bestellung 17 Stücke: Lieferzeit 10-14 Tag (e) |
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P3T2030CUKAZ | NXP USA Inc. |
![]() Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
Produkt ist nicht verfügbar |
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P3T2030CUKAZ | NXP USA Inc. |
![]() Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
auf Bestellung 6990 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC2109FBD64/01,15 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 4x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 46 DigiKey Programmable: Not Verified |
auf Bestellung 159 Stücke: Lieferzeit 10-14 Tag (e) |
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WLAN7201HCZ | NXP USA Inc. |
Description: WLAN7201HC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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WLAN7202CCZ | NXP USA Inc. |
Description: WLAN7202CC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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WLAN7201CCZ | NXP USA Inc. |
Description: WLAN7201CC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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WLAN7207HY | NXP USA Inc. |
Description: QFN MODULE Packaging: Bulk Package / Case: 18-WFLGA Exposed Pad Frequency: 2.4GHz RF Type: WLAN Supplier Device Package: 18-HWFLGA (2x2.4) |
Produkt ist nicht verfügbar |
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WLAN7207CY | NXP USA Inc. |
Description: QFN MODULE Packaging: Bulk Package / Case: 16-WFLGA Exposed Pad Frequency: 5.15GHz ~ 7.125GHz RF Type: WLAN Supplier Device Package: 16-HWFLGA (2x2) |
Produkt ist nicht verfügbar |
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WLAN7209HY | NXP USA Inc. |
Description: WLAN7209H Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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WLAN7209CY | NXP USA Inc. |
Description: WLAN7209C Packaging: Tape & Reel (TR) Package / Case: 16-WFLGA Exposed Pad Supplier Device Package: 16-HWFLGA (2x2) |
Produkt ist nicht verfügbar |
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WLAN7202CY | NXP USA Inc. |
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ Packaging: Tape & Reel (TR) Package / Case: 16-WFLGA Exposed Pad Frequency: 5GHz ~ 7GHz RF Type: WLAN Supplier Device Package: 16-HWFLGA (2x2) |
Produkt ist nicht verfügbar |
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WLAN7204HMP | NXP USA Inc. |
Description: WI-FI 6 FRONT-END IC, 2.4 GHZ Packaging: Tape & Reel (TR) Package / Case: 18-WFLGA Exposed Pad Frequency: 2.4GHz RF Type: WLAN Supplier Device Package: 18-HWFLGA (2.4x2) |
Produkt ist nicht verfügbar |
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74HC390N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-DIP Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
auf Bestellung 7730 Stücke: Lieferzeit 10-14 Tag (e) |
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FS32V232CKN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V232CKN2VUBR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234BLN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234CMN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234BJN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234CKN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V232BMN2VUB | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234BMN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234CON2VUBR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234CKN2VUBR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V234CTN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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FS32V232CTN2VUB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 621-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A53 Voltage - I/O: 1V, 1.8V, 3.3V Supplier Device Package: 621-FCPBGA (17x17) Ethernet: GbE Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: No Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Additional Interfaces: I2C, SPI, PCI, UART |
Produkt ist nicht verfügbar |
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MC68HC908QY4MDTE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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S9S12G128AVLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 800 Stücke: Lieferzeit 10-14 Tag (e) |
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74HCT32DB,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: OR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
auf Bestellung 22000 Stücke: Lieferzeit 10-14 Tag (e) |
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JN5168/001,515 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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JN5168/001,515 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: ZigbeePRO® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 20 Modulation: O-QPSK RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART DigiKey Programmable: Not Verified |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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S9S08AW16AE0MFT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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N74F126D,623 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 14-SO |
auf Bestellung 27498 Stücke: Lieferzeit 10-14 Tag (e) |
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N74F126D,602 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 14-SO |
auf Bestellung 8007 Stücke: Lieferzeit 10-14 Tag (e) |
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FRDM-MCXN947 | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M33 Utilized IC / Part: N9xx |
auf Bestellung 331 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4094DB,112 | NXP USA Inc. |
![]() Packaging: Tube |
auf Bestellung 1436 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4094PW,118 | NXP USA Inc. |
![]() Packaging: Bulk |
auf Bestellung 31425 Stücke: Lieferzeit 10-14 Tag (e) |
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74LV4094D112 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Tri-State Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel, Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
Produkt ist nicht verfügbar |
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74HCT365N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 6 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 16-DIP |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC365N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 6 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 16-DIP |
auf Bestellung 11874 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC175N,652 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
auf Bestellung 5587 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2219+ | 0.23 EUR |
74HCT175N,652 |
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Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 49 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Number of Bits per Element: 4
Description: IC FF D-TYPE SNGL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 49 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Number of Bits per Element: 4
auf Bestellung 22342 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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620+ | 0.79 EUR |
74HC75N,652 |
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Hersteller: NXP USA Inc.
Description: IC LATCH QUAD BISTABLE 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Differential
Mounting Type: Through Hole
Circuit: 2:2
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Delay Time - Propagation: 11ns
Supplier Device Package: 16-DIP
Description: IC LATCH QUAD BISTABLE 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Differential
Mounting Type: Through Hole
Circuit: 2:2
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 2
Current - Output High, Low: 5.2mA, 5.2mA
Delay Time - Propagation: 11ns
Supplier Device Package: 16-DIP
auf Bestellung 8463 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
784+ | 0.62 EUR |
74HCT151DB,118 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 8-INPUT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC MULTIPLEXER 8-INPUT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1181+ | 0.41 EUR |
74HCT251DB,112 |
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Hersteller: NXP USA Inc.
Description: IC 8-INPUT MUX 3ST 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC 8-INPUT MUX 3ST 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 4372 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1066+ | 0.45 EUR |
74HC08N,652 |
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Hersteller: NXP USA Inc.
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE AND 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
auf Bestellung 37387 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
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1110+ | 0.44 EUR |
74LVC1G125GN,132 |
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Hersteller: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
Description: IC BUFF NON-INVERT 5.5V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 6-XSON (0.9x1)
auf Bestellung 181828 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2882+ | 0.16 EUR |
PCF8584T/2,518 |
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Hersteller: NXP USA Inc.
Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
Description: IC CTRL PARALLEL/I2C BUS 20-SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Supply: 1.5mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
auf Bestellung 3480 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
61+ | 8.08 EUR |
74HC283N,652 |
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Hersteller: NXP USA Inc.
Description: IC 4BIT BINARY FULL ADDER 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Bits: 4
Logic Type: Binary Full Adder with Fast Carry
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 2V ~ 6V
Supplier Device Package: 16-DIP
Description: IC 4BIT BINARY FULL ADDER 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Bits: 4
Logic Type: Binary Full Adder with Fast Carry
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 2V ~ 6V
Supplier Device Package: 16-DIP
auf Bestellung 5335 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
398+ | 1.22 EUR |
74HC251N,652 |
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Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 1 X 8:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
Description: IC MULTIPLEXER 1 X 8:1 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Circuit: 1 x 8:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-DIP
auf Bestellung 64654 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
620+ | 0.79 EUR |
SVF512R3K2CMK4 |
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Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
SVF532R3K2CMK4 |
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Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
SVF522R2K2CMK4 |
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Hersteller: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Produkt ist nicht verfügbar
74LVC00ADB,112 |
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auf Bestellung 26166 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1869+ | 0.26 EUR |
MKM33Z64CLH5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MKM33Z128CLL5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b, 4x24b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
HEC4069UBT,118 |
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Hersteller: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
auf Bestellung 38330 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1776+ | 0.28 EUR |
BZV90-C3V9,115 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV90-C3V9 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Description: NOW NEXPERIA BZV90-C3V9 - ZENER
Tolerance: ±5%
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 3.9 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: SOT-223
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1 V @ 50 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
auf Bestellung 83000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1745+ | 0.28 EUR |
74HC574D,652 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74HC574D - BUS DRIV
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
Description: NOW NEXPERIA 74HC574D - BUS DRIV
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 133 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Number of Bits per Element: 8
auf Bestellung 6115 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1193+ | 0.41 EUR |
MPC8313ECVRAGDC |
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Hersteller: NXP USA Inc.
Description: IC MPU 516TEPBGA
Packaging: Bulk
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU 516TEPBGA
Packaging: Bulk
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6+ | 89.89 EUR |
MPC8315ECVRAGDA |
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Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 400MHZ 620BGA
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-PBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
auf Bestellung 17 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 125.02 EUR |
P3T2030CUKAZ |
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Hersteller: NXP USA Inc.
Description: IC
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Produkt ist nicht verfügbar
P3T2030CUKAZ |
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Hersteller: NXP USA Inc.
Description: IC
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
auf Bestellung 6990 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
12+ | 1.48 EUR |
14+ | 1.3 EUR |
25+ | 1.22 EUR |
100+ | 1 EUR |
250+ | 0.93 EUR |
500+ | 0.79 EUR |
1000+ | 0.63 EUR |
LPC2109FBD64/01,15 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 64KB FLSH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 4x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 46
DigiKey Programmable: Not Verified
auf Bestellung 159 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.59 EUR |
10+ | 20.45 EUR |
WLAN7201HCZ |
Produkt ist nicht verfügbar
WLAN7202CCZ |
Produkt ist nicht verfügbar
WLAN7201CCZ |
Produkt ist nicht verfügbar
WLAN7207HY |
Hersteller: NXP USA Inc.
Description: QFN MODULE
Packaging: Bulk
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2x2.4)
Description: QFN MODULE
Packaging: Bulk
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2x2.4)
Produkt ist nicht verfügbar
WLAN7207CY |
Hersteller: NXP USA Inc.
Description: QFN MODULE
Packaging: Bulk
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Description: QFN MODULE
Packaging: Bulk
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5.15GHz ~ 7.125GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
WLAN7209HY |
Produkt ist nicht verfügbar
WLAN7209CY |
Hersteller: NXP USA Inc.
Description: WLAN7209C
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Supplier Device Package: 16-HWFLGA (2x2)
Description: WLAN7209C
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
WLAN7202CY |
Hersteller: NXP USA Inc.
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5GHz ~ 7GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Description: WI-FI 6E FRONT-END IC, 5-7 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 16-WFLGA Exposed Pad
Frequency: 5GHz ~ 7GHz
RF Type: WLAN
Supplier Device Package: 16-HWFLGA (2x2)
Produkt ist nicht verfügbar
WLAN7204HMP |
Hersteller: NXP USA Inc.
Description: WI-FI 6 FRONT-END IC, 2.4 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Description: WI-FI 6 FRONT-END IC, 2.4 GHZ
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Produkt ist nicht verfügbar
74HC390N,652 |
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Hersteller: NXP USA Inc.
Description: IC DECADE COUNTER DL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DECADE COUNTER DL 4BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-DIP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
auf Bestellung 7730 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
666+ | 0.74 EUR |
FS32V232CKN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V232CKN2VUBR |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234BLN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234CMN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234BJN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234CKN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V232BMN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234BMN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 800MHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234CON2VUBR |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tape & Reel (TR)
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234CKN2VUBR |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Bulk
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V234CTN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
FS32V232CTN2VUB |
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Hersteller: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A53
Voltage - I/O: 1V, 1.8V, 3.3V
Supplier Device Package: 621-FCPBGA (17x17)
Ethernet: GbE
Number of Cores/Bus Width: 2 Core, 32/64-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3, DDR3L, LPDDR2
Graphics Acceleration: No
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Additional Interfaces: I2C, SPI, PCI, UART
Produkt ist nicht verfügbar
MC68HC908QY4MDTE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
S9S12G128AVLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.27 EUR |
10+ | 11.21 EUR |
160+ | 9.28 EUR |
74HCT32DB,118 |
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Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE OR 4CH 2-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
auf Bestellung 22000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1972+ | 0.25 EUR |
JN5168/001,515 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 4.71 EUR |
2000+ | 4.48 EUR |
JN5168/001,515 |
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Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: ZigbeePRO®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 20
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.42 EUR |
10+ | 8.41 EUR |
25+ | 7.57 EUR |
100+ | 6.9 EUR |
250+ | 6.23 EUR |
500+ | 5.59 EUR |
S9S08AW16AE0MFT |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
N74F126D,623 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Bulk
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
auf Bestellung 27498 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2664+ | 0.18 EUR |
N74F126D,602 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
Description: IC BUFFER NON-INVERT 5.5V 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 14-SO
auf Bestellung 8007 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2664+ | 0.18 EUR |
FRDM-MCXN947 |
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Hersteller: NXP USA Inc.
Description: FRDM DEVELOPMENT BOARD FOR MCX
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
Description: FRDM DEVELOPMENT BOARD FOR MCX
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: N9xx
auf Bestellung 331 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 40.94 EUR |
74LV4094DB,112 |
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auf Bestellung 1436 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
408+ | 1.21 EUR |
74LV4094PW,118 |
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auf Bestellung 31425 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2388+ | 0.21 EUR |
74LV4094D112 |
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Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74LV4094D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: NOW NEXPERIA 74LV4094D - SERIAL
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Produkt ist nicht verfügbar
74HCT365N,652 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-DIP
Description: IC BUFFER NON-INVERT 5.5V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 6
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 16-DIP
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)74HC365N,652 |
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Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
Description: IC BUFFER NON-INVERT 6V 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 6
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 16-DIP
auf Bestellung 11874 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
523+ | 0.94 EUR |