Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35031) > Seite 204 nach 584
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OM13039,598 | NXP USA Inc. |
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OM13040,598 | NXP USA Inc. |
![]() Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: LPC4357 Part Status: Active |
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MK10DN512ZVLK10R | NXP USA Inc. |
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MK50DX256ZCLQ10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 41x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 96 DigiKey Programmable: Not Verified |
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MK51DN512ZCLL10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 35x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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MC9S08PA32VLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 57 DigiKey Programmable: Not Verified |
auf Bestellung 700 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08PA60VLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 57 DigiKey Programmable: Not Verified |
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AFT05MS031NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 31W Gain: 17.7dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 10 mA |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09MS031NR1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 31W Gain: 17.2dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 500 mA |
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P1022NXN2LFB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.067GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI |
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MK10DN512ZVLK10R | NXP USA Inc. |
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AFT05MS031NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 520MHz Power - Output: 31W Gain: 17.7dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 10 mA |
auf Bestellung 1732 Stücke: Lieferzeit 10-14 Tag (e) |
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AFT09MS031NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 870MHz Power - Output: 31W Gain: 17.2dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 40 V Voltage - Test: 13.6 V Current - Test: 500 mA |
auf Bestellung 384 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DN512ZVLK10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Part Status: Not For New Designs Number of I/O: 52 DigiKey Programmable: Not Verified |
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MK10DX128VFM5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I²C, IrDA, SPI, UART/USART Peripherals: DMA, I²S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 24 DigiKey Programmable: Not Verified |
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MK20DX128VFM5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 6x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Part Status: Active Number of I/O: 20 DigiKey Programmable: Not Verified |
auf Bestellung 1233 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VMP5 | NXP USA Inc. |
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auf Bestellung 144 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VLH5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 13x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 40 DigiKey Programmable: Not Verified |
auf Bestellung 768 Stücke: Lieferzeit 10-14 Tag (e) |
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MK20DX128VLF5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 11x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Active Number of I/O: 29 DigiKey Programmable: Verified |
auf Bestellung 437 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-K40D100M | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s), LCD Core Processor: ARM® Cortex®-M4 Board Type: Evaluation Platform Utilized IC / Part: K40 Platform: Tower System Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TWR-K20D72M | NXP USA Inc. |
Description: TOWER SYSTEM K20 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM® Cortex®-M4 Utilized IC / Part: K20 Platform: Tower System |
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SSL21151T/1,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 50.5kHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 700mA (Switch) Internal Switch(s): Yes Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 8-SOIC Voltage - Supply (Max): 35V Part Status: Discontinued at Digi-Key |
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SSL21153T/1,118 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads Mounting Type: Surface Mount Number of Outputs: 1 Frequency: 50.5kHz Type: DC DC Regulator Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 1.5A (Switch) Internal Switch(s): Yes Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost) Supplier Device Package: 7-SOIC Voltage - Supply (Max): 35V |
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SSL2109T/1,118 | NXP USA Inc. |
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MW7IC2020NT1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 2.4W Gain: 32.6dB Technology: LDMOS Supplier Device Package: 24-PQFN (8x8) Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 40 mA |
Produkt ist nicht verfügbar |
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MW7IC2020NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 2.14GHz Power - Output: 2.4W Gain: 32.6dB Technology: LDMOS Supplier Device Package: 24-PQFN (8x8) Part Status: Active Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 40 mA |
auf Bestellung 930 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXH6300AC6T1 | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.3 V ~ 4.9 V Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.74V ~ 5.46V Port Size: Male - 0.13" (3.3mm) Tube Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: Barbless Maximum Pressure: 174.05PSI (1200kPa) Part Status: Active |
auf Bestellung 896 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXV7002DPT1 | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.5 V ~ 4.5 V Operating Pressure: ±0.29PSI (±2kPa) Pressure Type: Differential Accuracy: ±5% Operating Temperature: 10°C ~ 60°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Port Size: Male - 0.13" (3.3mm) Tube, Dual Applications: Board Mount Supplier Device Package: 8-SOP Port Style: Barbed Maximum Pressure: ±10.88PSI (±75kPa) Part Status: Active |
auf Bestellung 5376 Stücke: Lieferzeit 10-14 Tag (e) |
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MC13783VK5R2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 247-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Handheld/Mobile Devices Supplier Device Package: 247-MAPBGA (10x10) |
Produkt ist nicht verfügbar |
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MC33886PVWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 40V Applications: General Purpose Technology: CMOS Voltage - Load: 5V ~ 40V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active |
auf Bestellung 9806 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33887APVWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Motor Type - AC, DC: Brushed DC Part Status: Active |
auf Bestellung 367 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33926PNBR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-PowerQFN Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 5A Interface: Parallel Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Applications: Automotive Technology: CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 32-PQFN (8x8) Motor Type - AC, DC: Brushed DC Part Status: Active |
Produkt ist nicht verfügbar |
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MC33972ATEWR2 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC Part Status: Active |
auf Bestellung 3800 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9RS08KA2CSCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 10MHz Program Memory Size: 2KB (2K x 8) RAM Size: 63 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Peripherals: LVD, POR, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Verified |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08QD4CSCR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Verified |
auf Bestellung 14313 Stücke: Lieferzeit 10-14 Tag (e) |
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MC9S08SH8CTJR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 17 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MPX2300DT1 | NXP USA Inc. |
![]() Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 4-SSIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 3.006 mV (6V) Operating Pressure: 5.8PSI (40kPa) Pressure Type: Differential Accuracy: ±1.5% Operating Temperature: 15°C ~ 40°C Termination Style: PC Pin Voltage - Supply: 6V ~ 10V Applications: Board Mount Port Style: No Port Maximum Pressure: 125PSI (861.84kPa) Part Status: Active |
auf Bestellung 11600 Stücke: Lieferzeit 10-14 Tag (e) |
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MPXM2010GST1 | NXP USA Inc. |
![]() ![]() Features: Temperature Compensated Packaging: Cut Tape (CT) Package / Case: 5-SMD Module, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 25 mV (10V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Vented Gauge Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.12" (2.97mm) Tube Applications: Board Mount Supplier Device Package: 5-MPAK Port Style: Barbless Maximum Pressure: 10.88PSI (75kPa) Part Status: Active |
auf Bestellung 11621 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF1535NT1 | NXP USA Inc. |
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MRF1550NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272AA Current Rating (Amps): 12A Mounting Type: Chassis Mount Frequency: 175MHz Power - Output: 50W Gain: 14.5dB Technology: LDMOS Supplier Device Package: TO-272-6 Voltage - Rated: 40 V Voltage - Test: 12.5 V Current - Test: 500 mA |
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MRF1570FNT1 | NXP USA Inc. |
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MRF6S18060NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 1.99GHz Power - Output: 60W Gain: 15dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 26 V Current - Test: 600 mA |
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MRF6S20010GNR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 2.17GHz Power - Output: 10W Gain: 15.5dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Obsolete Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 130 mA |
auf Bestellung 158 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6S21050LR3 | NXP USA Inc. |
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MRF6V12250HR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 1.03GHz Power - Output: 275W Gain: 20.3dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 100 V Voltage - Test: 50 V Current - Test: 100 mA |
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MRF6V2010NR1 | NXP USA Inc. |
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auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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MRF6V2150NBR1 | NXP USA Inc. |
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MRF6V2300NBR1 | NXP USA Inc. |
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MRF6V3090NBR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 860MHz Power - Output: 18W Gain: 22dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 350 mA |
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MRF6VP2600HR6 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 225MHz Configuration: Dual Power - Output: 125W Gain: 25dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 2.6 A |
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MRFE6S9125NR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
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MRFE6VP61K25HR6 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 230MHz Configuration: Dual Power - Output: 1250W Gain: 24dB Technology: LDMOS Supplier Device Package: NI-1230 Part Status: Active Voltage - Rated: 133 V Voltage - Test: 50 V Current - Test: 100 mA |
auf Bestellung 208 Stücke: Lieferzeit 10-14 Tag (e) |
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MW6S010GNR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-270BA Mounting Type: Surface Mount Frequency: 960MHz Power - Output: 10W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 GULL Part Status: Active Voltage - Rated: 68 V Voltage - Test: 28 V Current - Test: 125 mA |
Produkt ist nicht verfügbar |
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MW7IC008NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 100MHz ~ 1GHz RF Type: General Purpose Voltage - Supply: 32V Gain: 23.5dB Current - Supply: 75mA P1dB: 40.4dBm Test Frequency: 100MHz Supplier Device Package: 24-PQFN (8x8) Part Status: Not For New Designs |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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MW7IC18100NBR1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MW7IC2040NBR1 | NXP USA Inc. |
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Produkt ist nicht verfügbar |
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MW7IC2725NBR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.7GHz RF Type: WiMax Voltage - Supply: 32V Gain: 28.5dB Current - Supply: 275mA P1dB: 44dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MW7IC915NT1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 24-PowerQFN Mounting Type: Surface Mount Frequency: 728MHz ~ 960MHz RF Type: W-CDMA Voltage - Supply: 28V Gain: 38dB P1dB: 15.5W Supplier Device Package: 24-PQFN (8x8) Part Status: Active |
auf Bestellung 2827 Stücke: Lieferzeit 10-14 Tag (e) |
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MWE6IC9100NBR1 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 960MHz RF Type: GSM, EDGE Voltage - Supply: 28V Gain: 33.5dB Supplier Device Package: TO-272 WB-14 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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S9S08SG8E2VTJR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Part Status: Active Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
OM13040,598 |
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Hersteller: NXP USA Inc.
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Description: LPC4357 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: LPC4357
Part Status: Active
Produkt ist nicht verfügbar
MK10DN512ZVLK10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
MK50DX256ZCLQ10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 41x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK51DN512ZCLL10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MC9S08PA32VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
auf Bestellung 700 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.86 EUR |
10+ | 4.58 EUR |
160+ | 3.76 EUR |
480+ | 3.68 EUR |
MC9S08PA60VLH |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 57
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
AFT05MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
500+ | 15.78 EUR |
1000+ | 14.48 EUR |
AFT09MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
P1022NXN2LFB |
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Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.067GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.067GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, I2S, MMC/SD, SPI
Produkt ist nicht verfügbar
MK10DN512ZVLK10R |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Produkt ist nicht verfügbar
AFT05MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 31W
Gain: 17.7dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 10 mA
auf Bestellung 1732 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.86 EUR |
10+ | 21.01 EUR |
25+ | 20.14 EUR |
100+ | 17.74 EUR |
250+ | 16.87 EUR |
AFT09MS031NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 13.6V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 870MHz
Power - Output: 31W
Gain: 17.2dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 40 V
Voltage - Test: 13.6 V
Current - Test: 500 mA
auf Bestellung 384 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.9 EUR |
10+ | 21.04 EUR |
25+ | 20.17 EUR |
100+ | 17.77 EUR |
250+ | 16.9 EUR |
MK20DN512ZVLK10 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Part Status: Not For New Designs
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK10DX128VFM5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I²C, IrDA, SPI, UART/USART
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MK20DX128VFM5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 6x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
auf Bestellung 1233 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 14.48 EUR |
10+ | 11.38 EUR |
80+ | 9.42 EUR |
980+ | 8.22 EUR |
MK20DX128VMP5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64BGA
Description: IC MCU 32BIT 128KB FLASH 64BGA
auf Bestellung 144 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 18.44 EUR |
10+ | 16.11 EUR |
MK20DX128VLH5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 13x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 768 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.96 EUR |
10+ | 12.55 EUR |
160+ | 10.39 EUR |
MK20DX128VLF5 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 11x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 29
DigiKey Programmable: Verified
auf Bestellung 437 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.01 EUR |
10+ | 11.79 EUR |
80+ | 9.76 EUR |
TWR-K40D100M |
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Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
Description: TOWER SYSTEM K40 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: K40
Platform: Tower System
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 198.53 EUR |
TWR-K20D72M |
Hersteller: NXP USA Inc.
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Description: TOWER SYSTEM K20 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: K20
Platform: Tower System
Produkt ist nicht verfügbar
SSL21151T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Description: IC LED DRIVER RGLTR 700MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 700mA (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 8-SOIC
Voltage - Supply (Max): 35V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
SSL21153T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Description: IC LED DRIVER RGLTR 1.5A 7SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width), 7 Leads
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 50.5kHz
Type: DC DC Regulator
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 1.5A (Switch)
Internal Switch(s): Yes
Topology: Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: 7-SOIC
Voltage - Supply (Max): 35V
Produkt ist nicht verfügbar
SSL2109T/1,118 |
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Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL SWITCHER 8SO
Description: IC LED DRIVER OFFL SWITCHER 8SO
Produkt ist nicht verfügbar
MW7IC2020NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Produkt ist nicht verfügbar
MW7IC2020NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
Description: RF MOSFET LDMOS 28V 24PQFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 2.14GHz
Power - Output: 2.4W
Gain: 32.6dB
Technology: LDMOS
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 40 mA
auf Bestellung 930 Stücke:
Lieferzeit 10-14 Tag (e)MPXH6300AC6T1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
Description: SENSOR 44.09PSIA 0.13" 4.9V SSOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 44.09PSI (20kPa ~ 304kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.74V ~ 5.46V
Port Size: Male - 0.13" (3.3mm) Tube
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: Barbless
Maximum Pressure: 174.05PSI (1200kPa)
Part Status: Active
auf Bestellung 896 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.66 EUR |
10+ | 28.24 EUR |
25+ | 26.75 EUR |
100+ | 23.03 EUR |
MPXV7002DPT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
Description: SENSOR 0.29PSID 0.13" 4.5V 8SOP
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-BSOP (0.475", 12.06mm Width) Dual Ports, Same Side
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.5 V ~ 4.5 V
Operating Pressure: ±0.29PSI (±2kPa)
Pressure Type: Differential
Accuracy: ±5%
Operating Temperature: 10°C ~ 60°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: Barbed
Maximum Pressure: ±10.88PSI (±75kPa)
Part Status: Active
auf Bestellung 5376 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 35.08 EUR |
10+ | 29.23 EUR |
25+ | 25.89 EUR |
MC13783VK5R2 |
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Hersteller: NXP USA Inc.
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Description: IC PWR MNGMNT ATLAS 3G 247MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
Produkt ist nicht verfügbar
MC33886PVWR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: IC MOTOR DRIVER 5V-40V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 40V
Applications: General Purpose
Technology: CMOS
Voltage - Load: 5V ~ 40V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 9806 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 17.3 EUR |
10+ | 15.63 EUR |
25+ | 14.9 EUR |
100+ | 12.94 EUR |
250+ | 12.36 EUR |
MC33887APVWR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: IC MOTOR DRIVER 5V-28V 20HSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Motor Type - AC, DC: Brushed DC
Part Status: Active
auf Bestellung 367 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.37 EUR |
10+ | 20.56 EUR |
25+ | 19.71 EUR |
100+ | 17.37 EUR |
250+ | 16.51 EUR |
MC33926PNBR2 |
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Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: Automotive
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Description: IC MOTOR DRIVER 5V-28V 32PQFN
Packaging: Cut Tape (CT)
Package / Case: 32-PowerQFN
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: Automotive
Technology: CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 32-PQFN (8x8)
Motor Type - AC, DC: Brushed DC
Part Status: Active
Produkt ist nicht verfügbar
MC33972ATEWR2 |
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Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Part Status: Active
auf Bestellung 3800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.87 EUR |
10+ | 8.88 EUR |
25+ | 8.39 EUR |
100+ | 7.27 EUR |
250+ | 6.9 EUR |
500+ | 6.19 EUR |
MC9RS08KA2CSCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.64 EUR |
10+ | 2.85 EUR |
MC9S08QD4CSCR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
auf Bestellung 14313 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.44 EUR |
10+ | 4.25 EUR |
100+ | 3.48 EUR |
500+ | 3.41 EUR |
1000+ | 2.87 EUR |
MC9S08SH8CTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MPX2300DT1 |
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Hersteller: NXP USA Inc.
Description: SENSOR 5.8PSID .003006V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
Description: SENSOR 5.8PSID .003006V
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 4-SSIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 3.006 mV (6V)
Operating Pressure: 5.8PSI (40kPa)
Pressure Type: Differential
Accuracy: ±1.5%
Operating Temperature: 15°C ~ 40°C
Termination Style: PC Pin
Voltage - Supply: 6V ~ 10V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 125PSI (861.84kPa)
Part Status: Active
auf Bestellung 11600 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 15.28 EUR |
10+ | 12.21 EUR |
25+ | 11.3 EUR |
100+ | 9.77 EUR |
500+ | 9.16 EUR |
MPXM2010GST1 | ![]() |
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Hersteller: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Description: SENSOR 1.45PSIG 0.12" .025V MPAK
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 5-SMD Module, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.12" (2.97mm) Tube
Applications: Board Mount
Supplier Device Package: 5-MPAK
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
auf Bestellung 11621 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 22.32 EUR |
10+ | 17.66 EUR |
25+ | 16.73 EUR |
100+ | 14.41 EUR |
MRF1535NT1 |
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Hersteller: NXP USA Inc.
Description: FET RF 40V 520MHZ TO272-6 WRAP
Description: FET RF 40V 520MHZ TO272-6 WRAP
Produkt ist nicht verfügbar
MRF1550NT1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Description: RF MOSFET LDMOS 12.5V TO272-6
Packaging: Cut Tape (CT)
Package / Case: TO-272AA
Current Rating (Amps): 12A
Mounting Type: Chassis Mount
Frequency: 175MHz
Power - Output: 50W
Gain: 14.5dB
Technology: LDMOS
Supplier Device Package: TO-272-6
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 500 mA
Produkt ist nicht verfügbar
MRF1570FNT1 |
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Hersteller: NXP USA Inc.
Description: FET RF 40V 470MHZ TO272-8
Description: FET RF 40V 470MHZ TO272-8
Produkt ist nicht verfügbar
MRF6S18060NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Description: RF MOSFET LDMOS 26V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 1.99GHz
Power - Output: 60W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 600 mA
Produkt ist nicht verfügbar
MRF6S20010GNR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 2.17GHz
Power - Output: 10W
Gain: 15.5dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Obsolete
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 130 mA
auf Bestellung 158 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 75.38 EUR |
10+ | 70.33 EUR |
25+ | 67.38 EUR |
100+ | 61.07 EUR |
MRF6S21050LR3 |
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Hersteller: NXP USA Inc.
Description: FET RF 68V 2.16GHZ NI-400
Description: FET RF 68V 2.16GHZ NI-400
Produkt ist nicht verfügbar
MRF6V12250HR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 100V 1.03GHZ NI-780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: FET RF 100V 1.03GHZ NI-780
Packaging: Cut Tape (CT)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 1.03GHz
Power - Output: 275W
Gain: 20.3dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 100 mA
Produkt ist nicht verfügbar
MRF6V2010NR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO270-2
Description: FET RF 110V 220MHZ TO270-2
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)MRF6V2150NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
MRF6V2300NBR1 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
MRF6V3090NBR5 |
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Hersteller: NXP USA Inc.
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Description: FET RF 110V 860MHZ TO272-4
Packaging: Cut Tape (CT)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 860MHz
Power - Output: 18W
Gain: 22dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
MRF6VP2600HR6 |
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Hersteller: NXP USA Inc.
Description: FET RF 2CH 110V 225MHZ NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Description: FET RF 2CH 110V 225MHZ NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
MRFE6S9125NR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Cut Tape (CT)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Produkt ist nicht verfügbar
MRFE6VP61K25HR6 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 1250W
Gain: 24dB
Technology: LDMOS
Supplier Device Package: NI-1230
Part Status: Active
Voltage - Rated: 133 V
Voltage - Test: 50 V
Current - Test: 100 mA
auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 354.31 EUR |
10+ | 339.32 EUR |
25+ | 331.84 EUR |
MW6S010GNR1 |
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Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270BA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2 GULL
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
MW7IC008NT1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
Description: IC RF AMP GPS 100MHZ-1GHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 100MHz ~ 1GHz
RF Type: General Purpose
Voltage - Supply: 32V
Gain: 23.5dB
Current - Supply: 75mA
P1dB: 40.4dBm
Test Frequency: 100MHz
Supplier Device Package: 24-PQFN (8x8)
Part Status: Not For New Designs
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 25.43 EUR |
10+ | 23.01 EUR |
25+ | 21.19 EUR |
100+ | 19.38 EUR |
250+ | 18.17 EUR |
500+ | 16.95 EUR |
MW7IC18100NBR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GSM 1.805-2.05GHZ TO272
Description: IC AMP GSM 1.805-2.05GHZ TO272
Produkt ist nicht verfügbar
MW7IC2040NBR1 |
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Hersteller: NXP USA Inc.
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
Description: IC AMP GP 100MHZ-1GHZ TO272 WB16
Produkt ist nicht verfügbar
MW7IC2725NBR1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC RF AMP WIMAX 2.7GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.7GHz
RF Type: WiMax
Voltage - Supply: 32V
Gain: 28.5dB
Current - Supply: 275mA
P1dB: 44dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Produkt ist nicht verfügbar
MW7IC915NT1 |
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Hersteller: NXP USA Inc.
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
Description: IC AMP W-CDMA 728-960MHZ 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-PowerQFN
Mounting Type: Surface Mount
Frequency: 728MHz ~ 960MHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 38dB
P1dB: 15.5W
Supplier Device Package: 24-PQFN (8x8)
Part Status: Active
auf Bestellung 2827 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 49.09 EUR |
10+ | 45.32 EUR |
25+ | 41.54 EUR |
100+ | 38.39 EUR |
250+ | 36.5 EUR |
MWE6IC9100NBR1 |
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Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
S9S08SG8E2VTJR |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar